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WO2004066197A1 - Plastic product comprising an integrated low-cost chip - Google Patents

Plastic product comprising an integrated low-cost chip Download PDF

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Publication number
WO2004066197A1
WO2004066197A1 PCT/EP2004/000215 EP2004000215W WO2004066197A1 WO 2004066197 A1 WO2004066197 A1 WO 2004066197A1 EP 2004000215 W EP2004000215 W EP 2004000215W WO 2004066197 A1 WO2004066197 A1 WO 2004066197A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic product
electronic component
plastic
product according
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2004/000215
Other languages
German (de)
French (fr)
Inventor
Wolfgang Clemens
Werner Eberlein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE112004000012T priority Critical patent/DE112004000012B4/en
Publication of WO2004066197A1 publication Critical patent/WO2004066197A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources

Definitions

  • the invention relates to a plastic product or the housing of a plastic product with a low-cost chip, for example visible or invisible, integrated in the housing, preferably an organic-based one.
  • An RFID tag based on organic electronics which is constructed on a flexible plastic substrate, can be, for example, a chip or electronic component.
  • Plastic products are known in which labels or “labels” are applied by means of so-called in-mold labeling, which are not fused to the plastic product or can only be fused with difficulty. This results in beautiful plastic products, the labels of which are stably fixed and which are disposed of without elaborate separation With the in-mold-labeling technique as well as with the in-mold-decoration technique, labels are presented (eg for decorative purposes) and the plastic product is then melted onto it.
  • the object of the present invention is to create a plastic product which contains an electronic component, such as a chip, which is inexpensive and suitable for mass production.
  • the invention relates to a plastic product with an electronic component, the electronic component being molded labeling is not connected to the plastic product or is difficult to remove.
  • the electronics can be integrated completely or partially within the plastic, or can be firmly connected to the surface.
  • An organic-based chip is advantageously used as the electronic component. It is particularly advantageous if an electronic component is used on a flexible substrate.
  • an electronic component can be a combination of electronics with other elements such as input elements (e.g. buttons) and / or output elements (e.g. display elements, loudspeakers) and / or with a device for energy supply (e.g. solar cell, battery, contact, coil, antenna) ) and / or with a sensor element (eg for temperature, pressure, humidity).
  • input elements e.g. buttons
  • output elements e.g. display elements, loudspeakers
  • a device for energy supply e.g. solar cell, battery, contact, coil, antenna
  • a sensor element eg for temperature, pressure, humidity
  • An organic circuit can be built on flexible plastic films. These can also be printed for decorative purposes at the same time.
  • This film can now be used like an in-mold label film in a corresponding system.
  • RFID radio frequency ident
  • the invention is described in more detail below with reference to two figures which make the process of in-mold labeling clear.
  • FIG. 1 shows the process of in-mold labeling: the two parts of an outer housing 1 and 2 are pressed against one another, so that a closed cavity, 3, in the form of the later component is created in between.
  • the label 4 to be introduced is attached to the wall to the housing 1.
  • the liquefied base material for the housing is pressed into the cavity 3 through a hole 5 in the housing 1 in the direction of arrow 6. This now fills up, then the material cools and solidifies.
  • the label 4 is integrated in the newly created housing of the plastic product.
  • the housing part 2 is moved apart in the direction of arrow 7 and the new plastic product is released.
  • FIG. 2 shows the finished new plastic product 8 with the integrated Label4.
  • plastic parts come into consideration as plastic products. From containers for food to housings of household machines, from medical devices and small devices such as syringes and bottles to X-ray housings, cans of cassettes, all kinds of furniture, sports equipment and many more.
  • Electronics such as an RFID tag are integrated directly in the housing, without additional space requirement, externally or internally, visible or invisible.
  • This RFID tag can pass on information to a corresponding reader without contact, even without visual contact.
  • This can be used for automation in production, for identification, right up to information about the correct recycling route. Nature- Any other information can be transferred.
  • Other electronics that perform logical functions are also conceivable. Only the power supply and signal transmission need to be guaranteed here, for example via appropriate electrical contacts.
  • an electronic label e.g. for marketing purposes in the consumer goods and food sector.
  • a label can also be used to display (e.g. based on electrochromic materials, liquid-crystalline displays (LCD), organic or inorganic light-emitting diodes), and to supply energy (e.g. organic or inorganic solar cells, batteries, antennas, contacts) and sensors and / or input elements (eg for light, temperature, pressure, humidity, chemical elements, pressure) and buttons for an input.
  • display e.g. based on electrochromic materials, liquid-crystalline displays (LCD), organic or inorganic light-emitting diodes
  • energy e.g. organic or inorganic solar cells, batteries, antennas, contacts
  • sensors and / or input elements eg for light, temperature, pressure, humidity, chemical elements, pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a plastic product or the housing of a plastic product comprising a low-cost chip, preferably with an organic basis, which is integrated, for example into the housing, in a visible or invisible manner. Labels (e.g. for decoration purposes) are inserted into the mould, according to the in-mould technology, and the plastic product is melted thereover.

Description

Beschreibungdescription

Kunststoffprodukt mit integriertem low-cost-ChipPlastic product with an integrated low-cost chip

Die Erfindung betrifft ein Kunststoffprodukt oder das Gehäuse eines Kunststoffproduktes mit einem beispielsweise im Gehäuse sichtbar oder unsichtbar integrierten low-cost-Chip, vorzugsweise einem auf organischer Basis. Als Chip oder Elektronikbauteil kann beispielsweise ein auf organischer Elektronik basiertes RFID-Tag sein, das auf einem flexiblen Kunststoffsubstrat aufgebaut ist.The invention relates to a plastic product or the housing of a plastic product with a low-cost chip, for example visible or invisible, integrated in the housing, preferably an organic-based one. An RFID tag based on organic electronics, which is constructed on a flexible plastic substrate, can be, for example, a chip or electronic component.

Bekannt sind Kunststoffprodukte, bei denen durch sogenanntes in-mold-labeling Etiketten oder „Labels" aufgebracht werden, die mit dem Kunststoffprodukt nicht oder nur schlecht lösbar verschmolzen werden. Dadurch entstehen schöne Kunststoffprodukte, deren Etiketten stabil fixiert sind und die ohne aufwendige Trennung entsorgt werden können. Bei der in-mold- labeling Technik sowie bei der in-mold-decoration Technik werden Label (z.B. für Dekorationszwecke) vorgelegt und das Kunststoffprodukt wird dann daraufgeschmolzen.Plastic products are known in which labels or “labels” are applied by means of so-called in-mold labeling, which are not fused to the plastic product or can only be fused with difficulty. This results in beautiful plastic products, the labels of which are stably fixed and which are disposed of without elaborate separation With the in-mold-labeling technique as well as with the in-mold-decoration technique, labels are presented (eg for decorative purposes) and the plastic product is then melted onto it.

Diese Art der Integration von Elektronik in Kunststoffprodukte ist bisher nicht möglich. Üblicherweise werden Elektronik- bauteile auf Platinen aufgebaut, die dann an den Kunststoff- Produkten und/oder in den Gehäusen befestigt werden. Somit wird extra Platz hierfür benötigt. Eine Alternative zur Identifikation der Produkte ist das Aufkleben oder Aufdrucken eines Labels, z.B. versehen mit einem Strichcode.This type of integration of electronics in plastic products has not been possible until now. Electronic components are usually built on circuit boards, which are then attached to the plastic products and / or in the housings. So extra space is needed for this. An alternative to identifying the products is sticking or printing on a label, e.g. provided with a barcode.

Aufgabe der vorliegenden Erfindung ist es, ein Kunststoffprodukt zu schaffen, das billig und massenfertigungstauglich ein Elektronikbauteil wie einen Chip integriert enthält.The object of the present invention is to create a plastic product which contains an electronic component, such as a chip, which is inexpensive and suitable for mass production.

Gegenstand der Erfindung ist ein Kunststoffprodukt mit einem Elektronikbauteil, wobei das Elektronikbauteil durch in-mold- labeling mit dem Kunststoffprodukt nicht oder schlecht lösbar verbunden ist.The invention relates to a plastic product with an electronic component, the electronic component being molded labeling is not connected to the plastic product or is difficult to remove.

Die Elektronik kann dabei sowohl komplett oder teilweise in- nerhalb des. Kunststoffes integriert sein, als auch fest an der Oberfläche verbunden sein.The electronics can be integrated completely or partially within the plastic, or can be firmly connected to the surface.

Vorteilhafterweise wird als Elektronikbauteil ein Chip auf organischer Basis eingesetzt. Insbesondere vorteilhaft ist es, wenn ein Elektronikbauteil auf einem flexiblen Substrat eingesetzt wird.An organic-based chip is advantageously used as the electronic component. It is particularly advantageous if an electronic component is used on a flexible substrate.

Im Kunststoffprodukt kann ein Elektronikbauteil eine Kombination einer Elektronik mit anderen Elementen wie Eingabeele- mente (z.B. Taster)- und/oder Ausgabeelementen (z.B. Anzeigeelemente, Lautsprecher) und/oder mit einer Vorrichtung zur Energieversorgung (z.B. Solarzelle, Batterie, Kontakt, Spule, Antenne) und/oder mit einem Sensorelement (z.B. für Temperatur, Druck, Feuchtigkeit) umfassen.In the plastic product, an electronic component can be a combination of electronics with other elements such as input elements (e.g. buttons) and / or output elements (e.g. display elements, loudspeakers) and / or with a device for energy supply (e.g. solar cell, battery, contact, coil, antenna) ) and / or with a sensor element (eg for temperature, pressure, humidity).

Eine organische Schaltung lässt sich auf flexiblen Kunststoffolien aufbauen. Diese können gleichzeitig auch noch für dekorative Zwecke bedruckt werden. Diese Folie kann nun wie ei- ne In-mold-Label Folie in einer entsprechenden Anlage verwendet werden. Somit ist es möglich, Elektronik, speziell sogenannte Radio-Frequenz-Ident (RFID) Tags direkt in ein Kunststoff-Gehäuse zu integrieren. Es kann sowohl sichtbar als auch vollkommen abgedeckt sein. Auch ist es möglich, eventu- eil benötigte Kontakte nach außen zu führen. Es ist zu beachten, dass beim Mold-Vorgang erhöhte Temperaturen entstehen. Dies könnte die organischen Schaltungen beeinträchtigen bis zerstören. Deswegen sind besondere Vorkehrungen z-u treffen, beispielsweise durch eine möglichst kurze Einwirkung der ho- hen Temperatur oder einer speziellen Kühlung des Mold-Gehäu- ses oder auch durch eine entsprechende Beschichtung des Labels . Im folgenden wird die Erfindung noch anhand zweier Figuren, die den Vorgang des in-mold-labeling deutlich machen, näher beschrieben.An organic circuit can be built on flexible plastic films. These can also be printed for decorative purposes at the same time. This film can now be used like an in-mold label film in a corresponding system. This makes it possible to integrate electronics, specifically so-called radio frequency ident (RFID) tags, directly into a plastic housing. It can be both visible and completely covered. It is also possible to lead any contacts you may need to the outside. It should be noted that elevated temperatures arise during the molding process. This could impair or destroy the organic circuits. For this reason, special precautions have to be taken, for example by exposure to the high temperature for as short a time as possible or by special cooling of the mold housing or also by a corresponding coating of the label. The invention is described in more detail below with reference to two figures which make the process of in-mold labeling clear.

Figur 1 zeigt den Ablauf eines in-mold-labelings : Die beiden Teile eines äußeren Gehäuses 1 und 2 sind gegeneinander ge- presst, so dass in dazwischen ein geschlossener Hohlraum, 3, in Form des späteren Bauteils entsteht. In diesen Hohlraum, z.B. an der Wand zum Gehäuse 1, ist das einzubringende Label 4, befestigt. Durch ein Loch 5 im Gehäuse 1 wird in Pfeilrichtung 6 das verflüssigte Grundmaterial für das Gehäuse in den Hohlraum 3 eingepresst. Dieser füllt sich nun aus, anschließend kühlt das Material ab und erstarrt. Dadurch ist das Label 4 im neu entstandenen Gehäuse des Kunststoffproduktes integriert. Dann wird das Gehäuseteil 2 in Pfeilrichtung 7 auseinandergefahren und das neue Kunststoffprodukt freigegeben.FIG. 1 shows the process of in-mold labeling: the two parts of an outer housing 1 and 2 are pressed against one another, so that a closed cavity, 3, in the form of the later component is created in between. In this cavity, e.g. the label 4 to be introduced is attached to the wall to the housing 1. The liquefied base material for the housing is pressed into the cavity 3 through a hole 5 in the housing 1 in the direction of arrow 6. This now fills up, then the material cools and solidifies. As a result, the label 4 is integrated in the newly created housing of the plastic product. Then the housing part 2 is moved apart in the direction of arrow 7 and the new plastic product is released.

Auf der Abbildung 2 sieht man dann das fertige neue Kunst- stoffprodukt 8, mit dem integrierten Label4.Figure 2 shows the finished new plastic product 8 with the integrated Label4.

Als Kunststoffprodukte kommen quasi alle denkbaren Kunststoffteile in Betracht. Von Behältern für Lebensmittel bis Gehäuse von Haushaltsmaschinen, von medizinischen Geräten und Kleingeräten wie Spritzen und Flaschen bis Röntgenstrahlungsgehäuse, Dosen Kassetten, Möbel aller Art, Sportgeräte und vielen mehr.All conceivable plastic parts come into consideration as plastic products. From containers for food to housings of household machines, from medical devices and small devices such as syringes and bottles to X-ray housings, cans of cassettes, all kinds of furniture, sports equipment and many more.

Durch die Erfindung ergeben sich folgende Vorteile: Es ist eine Elektronik wie z.B. ein RFID-Tag direkt im Gehäuse integriert, ohne zusätzlichen Platzbedarf, außen oder innen, sichtbar oder unsichtbar. Dieses RFID-Tag kann kontaktlos Informationen an ein entsprechendes Lesegerät weitergeben, auch ohne Sichtkontakt. Somit kann dies für eine Automatisierung bei der Fertigung, zur Identi izierung, bis hin zur Information über den richtigen Recyclingweg verwendet werden. Natur- lieh lassen sich beliebige andere Informationen übertragen. Auch eine andere Elektronik, die logische Funktionen übernimmt ist denkbar. Hier muss nur die Energieversorgung sowie die Signalübertragung gewährleistet sein, beispielsweise über entsprechende elektrische Kontakte.The following advantages result from the invention: Electronics such as an RFID tag are integrated directly in the housing, without additional space requirement, externally or internally, visible or invisible. This RFID tag can pass on information to a corresponding reader without contact, even without visual contact. This can be used for automation in production, for identification, right up to information about the correct recycling route. Nature- Any other information can be transferred. Other electronics that perform logical functions are also conceivable. Only the power supply and signal transmission need to be guaranteed here, for example via appropriate electrical contacts.

Eine weitere vorteilhafte Anwendung ist ein elektronisches Label z.B. für Marketingzwecke im Konsumgüter- und Lebensmittelbereich. Solch ein Label kann neben der reinen Elektronik auch eine Anzeige (z.B. basierend auf elektrochromen Materialien, flüssigkristallinen Anzeigen (LCD) , organischen oder - anorganischen Leuchtdioden), und eine Energieversorgung (z.B. organische oder anorganische Solarzelle, Batterie, Antenne, Kontakte), sowie Sensor und/oder Eingabeelemente (z.B. für Licht, Temperatur, Druck, Feuchtigkeit, chemische Elemente, Druck) und Taster für eine Eingabe. Another advantageous application is an electronic label e.g. for marketing purposes in the consumer goods and food sector. In addition to pure electronics, such a label can also be used to display (e.g. based on electrochromic materials, liquid-crystalline displays (LCD), organic or inorganic light-emitting diodes), and to supply energy (e.g. organic or inorganic solar cells, batteries, antennas, contacts) and sensors and / or input elements (eg for light, temperature, pressure, humidity, chemical elements, pressure) and buttons for an input.

Claims

Patentansprüche claims 1. Kunststoffprodukt mit einem Elektronikbauteil, wobei das Elektronikbauteil durch in-mold-labeling mit dem Kunst- stoffprodukt nicht oder schlecht lösbar verbunden ist.1. Plastic product with an electronic component, the electronic component not being connected to the plastic product or being difficult to detach by in-mold labeling. 2. Kunststoffprodukt nach Anspruch 1, wobei das Elektronikbauteil zumindest eine Funktionsschicht aus organischem Material umfasst.2. Plastic product according to claim 1, wherein the electronic component comprises at least one functional layer made of organic material. 3. Kunststoffprodukt nach einem der vorstehenden Ansprüche, wobei das Elektronikbauteil auf einem flexiblen Substrat aufgebaut ist.3. Plastic product according to one of the preceding claims, wherein the electronic component is constructed on a flexible substrate. 4. Kunststoffprodukt nach einem der vorstehenden Ansprüche, wobei das Elektronikbauteil durch eine spezielle Beschichtung vor Beschädigung während des in-mold-label- Vorgangs geschützt ist.4. Plastic product according to one of the preceding claims, wherein the electronic component is protected by a special coating against damage during the in-mold-label process. 5. Kunststoffprodukt nach einem der vorstehenden Ansprüche, bei dem das Elektronikbauteil ein Radio-Frequenz- Identifikations-tag (RFID - tag) ist.5. Plastic product according to one of the preceding claims, wherein the electronic component is a radio frequency identification tag (RFID - tag). 6. Kunststoffprodukt nach einem der vorstehenden Ansprüche, bei dem das Elektronikbauteil eine Kombination einer E- lektronik mit anderen Elementen wie ein Eingabeelement und/oder ein Ausgabeelement und/oder mit einer Vorrichtung zur Energieversorgung und/oder mit einem Sensorelement umfasst.6. Plastic product according to one of the preceding claims, in which the electronic component comprises a combination of electronics with other elements such as an input element and / or an output element and / or with a device for energy supply and / or with a sensor element. 7. Verfahren zur Herstellung eines Kunststoffproduktes mit Elektronikbauteil nach einem der vorstehenden Ansprüche 1 bis 4, wobei während des in-mold-labelings eine Kühlung vorgesehen ist und/oder eine extrem kurze Verweilzeit des geschmolzenen Kunststoffs auf dem Elektronikbauteil eingestellt wird, so dass das Elektronikbauteil während der Verschmelzung keinen Schaden erleidet. 7. A method for producing a plastic product with an electronic component according to one of the preceding claims 1 to 4, wherein cooling is provided during in-mold labeling and / or an extremely short residence time of the molten plastic on the electronic component is set, so that the electronic component does not suffer any damage during the merger.
PCT/EP2004/000215 2003-01-21 2004-01-14 Plastic product comprising an integrated low-cost chip Ceased WO2004066197A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004000012T DE112004000012B4 (en) 2003-01-21 2004-01-14 Plastic product with integrated organic electronic component, method of manufacturing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10302148.5 2003-01-21
DE10302148 2003-01-21

Publications (1)

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WO2004066197A1 true WO2004066197A1 (en) 2004-08-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1748402A1 (en) * 2005-07-26 2007-01-31 Supreme Technic Package Co., Ltd. Label to be attached on a plastic product formed in a mold and identifiable by a detecting device
DE102005047638A1 (en) * 2005-10-05 2007-04-12 Schaeffler Kg Application of RFID transponder for component e.g. hydraulic valve of motor vehicle, which is moved by production line or assembly line
WO2015035970A1 (en) 2013-09-11 2015-03-19 Kiefel Gmbh Method for producing a product by means of a thermoforming or joining system, and a thermoforming or joining system

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EP0350179A1 (en) * 1988-06-21 1990-01-10 Gec Avery Limited Manufacturing portable electronic tokens
US5569879A (en) * 1991-02-19 1996-10-29 Gemplus Card International Integrated circuit micromodule obtained by the continuous assembly of patterned strips
EP1052594A1 (en) * 1999-05-14 2000-11-15 Sokymat S.A. Transponder and molding die, and their method of manufacture
EP1134694A1 (en) * 2000-03-16 2001-09-19 Infineon Technologies AG Document with integrated electronic circuit
WO2002015264A2 (en) * 2000-08-18 2002-02-21 Siemens Aktiengesellschaft Encapsulated organic-electronic component, method for producing the same and use thereof
WO2003069552A1 (en) * 2002-02-14 2003-08-21 Upm Rafsec Oy Smart label

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DE19619462C1 (en) * 1996-05-14 1997-07-10 Hans Auer In-mould-labelling of objects to produce fine, reflective finish over included label
FR2760998B1 (en) * 1997-03-21 1999-05-21 Equisecurite Sa METHOD OF INCLUDING AN ELECTRONIC LABEL IN AN OBJECT MADE OF PLASTIC, AT THE TIME OF THE MANUFACTURE OF THE OBJECT
DE59900131D1 (en) * 1999-01-23 2001-07-26 Ident Gmbh X RFID transponder with printable surface
DE10045192A1 (en) * 2000-09-13 2002-04-04 Siemens Ag Organic data storage, RFID tag with organic data storage, use of an organic data storage
DE10151440C1 (en) * 2001-10-18 2003-02-06 Siemens Ag Organic electronic component for implementing an encapsulated partially organic electronic component has components like a flexible foil as an antenna, a diode or capacitor and an organic transistor.

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0350179A1 (en) * 1988-06-21 1990-01-10 Gec Avery Limited Manufacturing portable electronic tokens
US5569879A (en) * 1991-02-19 1996-10-29 Gemplus Card International Integrated circuit micromodule obtained by the continuous assembly of patterned strips
EP1052594A1 (en) * 1999-05-14 2000-11-15 Sokymat S.A. Transponder and molding die, and their method of manufacture
EP1134694A1 (en) * 2000-03-16 2001-09-19 Infineon Technologies AG Document with integrated electronic circuit
WO2002015264A2 (en) * 2000-08-18 2002-02-21 Siemens Aktiengesellschaft Encapsulated organic-electronic component, method for producing the same and use thereof
WO2003069552A1 (en) * 2002-02-14 2003-08-21 Upm Rafsec Oy Smart label

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1748402A1 (en) * 2005-07-26 2007-01-31 Supreme Technic Package Co., Ltd. Label to be attached on a plastic product formed in a mold and identifiable by a detecting device
DE102005047638A1 (en) * 2005-10-05 2007-04-12 Schaeffler Kg Application of RFID transponder for component e.g. hydraulic valve of motor vehicle, which is moved by production line or assembly line
WO2015035970A1 (en) 2013-09-11 2015-03-19 Kiefel Gmbh Method for producing a product by means of a thermoforming or joining system, and a thermoforming or joining system

Also Published As

Publication number Publication date
DE112004000012B4 (en) 2012-06-14
DE112004000012D2 (en) 2006-02-02

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