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WO2004062761A2 - Procede pour purifier le gaz de processus d'un four a braser, four a braser et systeme de purification pour la mise en oeuvre dudit procede - Google Patents

Procede pour purifier le gaz de processus d'un four a braser, four a braser et systeme de purification pour la mise en oeuvre dudit procede Download PDF

Info

Publication number
WO2004062761A2
WO2004062761A2 PCT/DE2003/004234 DE0304234W WO2004062761A2 WO 2004062761 A2 WO2004062761 A2 WO 2004062761A2 DE 0304234 W DE0304234 W DE 0304234W WO 2004062761 A2 WO2004062761 A2 WO 2004062761A2
Authority
WO
WIPO (PCT)
Prior art keywords
process gas
soldering furnace
cleaned
gas
condensate trap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/004234
Other languages
German (de)
English (en)
Other versions
WO2004062761A3 (fr
Inventor
Hartmut Meier
Bernd Müller
Ulrich Wittreich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Rehm Thermal Systems GmbH
Siemens Corp
Original Assignee
Siemens AG
Rehm Thermal Systems GmbH
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Rehm Thermal Systems GmbH, Siemens Corp filed Critical Siemens AG
Publication of WO2004062761A2 publication Critical patent/WO2004062761A2/fr
Publication of WO2004062761A3 publication Critical patent/WO2004062761A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D5/00—Condensation of vapours; Recovering volatile solvents by condensation
    • B01D5/0033—Other features
    • B01D5/0036—Multiple-effect condensation; Fractional condensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means

Definitions

  • the invention relates to a method for cleaning process gas of a soldering furnace, in which the process gas to be cleaned is removed from the soldering furnace and then the process gas is passed through a condensate trap and where the process gas is cooled with the condensation and retention of impurities.
  • a condensate trap equipped with a heat exchanger is connected with its entrance to a heating zone of a soldering furnace and with its output to a cooling zone of the soldering furnace.
  • the process gas to be cleaned is thus removed from the heating zone and passed through the heat exchanger, so that the process gas to be cleaned emits heat to the heat exchanger and, in the process, impurities in the process gas condense.
  • the cleaned and cooled process gas is then fed to the cooling zone of the soldering furnace.
  • the object of the invention is to provide a method for cleaning process gas of a soldering furnace, with which a condensate trap can be adapted to different operating states in the soldering furnace.
  • the process gas to be cleaned is set on the way from the soldering furnace to the condensate trap in terms of its temperature and its volume flow in such a way that condensation of the contaminants to be retained is ensured in the condensate trap.
  • the temperature and the Volume flow of the process gas to be cleaned is set so that the condensation temperature for the contaminants is reached by cooling the process gas to be cleaned in the condensate trap. If the process gas to be cleaned has an excessively high temperature, the cooling capacity of the condensate trap is not sufficient to reach the condensation temperature for the contaminants.
  • the volume flow of the process gas to be cleaned cannot be increased arbitrarily, since the individual particles of the process gas then have a shorter residence time in the condensate trap, which is associated with less cooling of the process gas to be cleaned.
  • care must be taken to ensure that, given the maximum possible cooling capacity of the condensate trap, they behave antiproportionally with regard to their permissible maximum values, i.e. the higher the volume flow, the lower the maximum permissible temperature of the process gas to be cleaned and vice versa.
  • the setting of temperature and volume flow of the process gas to be cleaned on the way from the soldering furnace to the condensate trap has the great advantage that the condensate trap can be operated with optimal deposition conditions regardless of the process conditions of the soldering process. Therefore, the condensate trap can advantageously be designed with a comparatively low cooling capacity, which is associated with a comparatively low cooling of the process gas to be cleaned during operation of the condensate trap.
  • the process gas to be cleaned should be adjusted with respect to its temperature and its volume flow in such a way that the Process gas in the condensate trap is as small as possible.
  • those parameter pairs are set in which the amount of heat extracted from the process gas by the condensate trap is optimally small.
  • the cleaned process gas is returned to the soldering furnace.
  • This advantageously creates a circuit for cleaning the process gas, so that the cleaned process gas can be used again for the soldering process.
  • the entire system consisting of a cleaning system and a soldering furnace, can advantageously be operated with low energy consumption.
  • a further embodiment of the invention provides that the process gas to be cleaned is removed from a heating zone of the soldering furnace and, after having passed through the condensate trap, is returned to a cooling zone of the soldering furnace as cleaned process gas.
  • This advantageously ensures that the heat extraction, which can be minimized but cannot be avoided due to the functioning of the condensate trap, is used specifically to supply the cleaned process gas to the soldering furnace in an area in which lower temperatures are required for the process gas anyway.
  • a subsequent heating of the cleaned process gas can thus advantageously be omitted, through which the associated energy expenditure can advantageously be saved.
  • Another embodiment of the invention provides that gas is added to the process gas to be cleaned on the way from the soldering furnace to the condensate trap.
  • a supply of process gas to the soldering process is necessary anyway, since the soldering furnace cannot be made absolutely gas-tight due to the supply or removal of components to be soldered, and the resulting leakage losses in process gas must be compensated for.
  • the supply of process gas can therefore advantageously be used according to the invention for the admixture of gas to the process gas to be cleaned, as a result of which temperature and volume flow can advantageously be influenced in the sense of the invention.
  • the gas supplied can be heated with the process gas depending on the required temperature of the mixture. In general, a supply of gas at room temperature is particularly advantageous in order to cool the process gas to be cleaned before it enters the condensate trap.
  • the gas to be mixed is removed from the soldering furnace at a point where the temperature is different from the point at which the process gas to be cleaned is removed. Due to the different temperature of the gas to be mixed, the temperature of the process gas to be cleaned can in particular be influenced in a targeted manner.
  • the process gas to be cleaned is passed through a heat exchanger before removal from the soldering furnace, which is in a
  • the cooler area of the soldering furnace is arranged in comparison to the temperature of the process gases passed through.
  • Another aspect of the invention provides that the cleaned process gas is brought to a predetermined temperature before being returned to the soldering furnace. This advantageously prevents a disturbance in the process in the soldering furnace at the return point of the cleaned process gas.
  • the cleaned process gas can be heated or cooled as required. In the case of heating, the energy supplied is advantageously not lost to the soldering process due to the subsequent return of the cleaned process gas.
  • the cleaned process gas is brought to a predetermined cooler temperature in such a way that the cooling capacity of the condensate trap is specifically increased beyond the cooling capacity required for cleaning the process gas.
  • This measure is to be regarded as particularly advantageous if a lower temperature is required at the supply point of the cleaned process gas in the soldering furnace than that required for the operation of the condensate trap due to its function of separating contaminants.
  • the condensate trap can be deliberately oversized, by advantageously designed as a separate unit
  • Cooler can be saved. Instead of overdimensioning, operating points of the condensate trap can also be set, which ensure cooling of the process gas to the temperature required at the supply point.
  • the invention further relates to a cleaning system for the process gas of a soldering furnace with a removal line for process gas to be cleaned which can be connected to the soldering furnace and which opens into a condensate trap for impurities in the process gas.
  • a cleaning system for the process gas of a soldering furnace with a removal line for process gas to be cleaned which can be connected to the soldering furnace and which opens into a condensate trap for impurities in the process gas.
  • the object of the invention is to provide a cleaning system for the
  • this further object is achieved in that a control element for adjusting the temperature and / or volume flow of the process gas to be cleaned is provided in the extraction line.
  • the volume flow can be controlled, for example, by a throttle in the extraction line.
  • the cleaning system has a return line for cleaned process gas, which is connected to the condensate trap the soldering furnace can be connected.
  • a return line can ensure that the cleaning system can advantageously also be operated in a circuit with the soldering furnace, so that the cleaned process gas can be reused in the soldering furnace.
  • control element is a mixer which has at least one connection for the admixture of gas into the extraction line.
  • connection is connected to a bypass line for the direct removal of process gas from the soldering furnace.
  • Another embodiment of the cleaning system provides that a heat exchanger is provided in the extraction line, which can be arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger releases heat to the process gas located in the soldering furnace.
  • the heat extracted from the process gas to be cleaned thus remains available for the soldering process, as a result of which the advantages already described in connection with the method according to the invention are achieved.
  • the invention also relates to a soldering furnace with a removal connection and a return connection for connecting a cleaning system for the process gas of the soldering furnace.
  • a soldering furnace is also described in the above-mentioned US Pat. No. 5,611,476.
  • the object of the invention is furthermore to provide a soldering furnace with a removal connection for removing process gas to be cleaned, which enables the process gas to be cleaned with a comparatively low heat loss.
  • a soldering furnace in which a heat exchanger is connected upstream of the removal connection and is arranged in the soldering furnace in such a way that the process gas passed through the heat exchanger gives off heat to the process gas located in the soldering furnace. It is hereby advantageously achieved that the amount of heat removed by the heat exchanger from the process gas to be cleaned remains in the soldering furnace and the process gas to be cleaned has a reduced temperature outside the soldering furnace. As a result, heat losses resulting from the difference in heat between the process gas to be cleaned and the environment of the cleaning system used can also be reduced. If a condensate trap is used as the cleaning device, the temperature of the process gas to be cleaned and fed to the condensate trap can advantageously also be adjusted. The advantages associated with this have already been explained in connection with the method according to the invention.
  • a removal part for the process gas and the heat exchanger is arranged in different heating stages of a multi-stage heating zone of the soldering furnace, the heating stage with the removal point being warmer than the heating stage with the heat exchanger.
  • This constructive measure advantageously takes into account the customary structure of soldering furnaces which have several heating levels in the heating zone.
  • the temperature of the component to be soldered is gradually increased, so that it is possible to remove in particular the heavily contaminated process gas from the hottest heating stage (also known as the peak zone) and pass it through the colder heating stages, which means that the process gas to be cleaned is the cooler process gas warms up in the upstream heating stages.
  • a soldering furnace 11 designed as a reflow soldering furnace has a heating zone 12 and a cooling zone 13, the heating zone consisting of individual heating stages 14a, 14b, 14c and 14d and the cooling zone consisting of cooling stages 15a, 15b.
  • the heating levels or cooling levels are shown in a highly schematic form as simple boxes.
  • a conveyor belt (not shown) runs through these stages, on which the components to be soldered are placed and thus exposed to the respective temperatures in the individual stages.
  • the assemblies to be soldered enter and exit through locks 16 in the soldering furnace.
  • the soldering furnace has a removal connection 17 and two return connections 18, to each of which a removal line 19 and return lines 20 of a cleaning system 21 can be connected.
  • the process gas to be cleaned is removed from the soldering furnace 11 via the removal connection 17 and the removal line 19 and fed to a mixer 22.
  • the mixer has connections 23 to which feed lines 24 for the supply of additional process gas into the mixer and a bypass line 25 are connected. Via the connections 23, the process gas to be cleaned from the extraction line 19 can thus be mixed with further process gas, as a result of which the volume flow and the temperature of the process gas to be cleaned can be influenced.
  • the volume flow can also be influenced via an adjustable throttle 26 in the extraction line 19.
  • Process gas at room temperature for example, for cooling the process gas removed from the soldering furnace or else preheated process gas, which only influences the volume flow, can be supplied via the feed lines 24.
  • the bypass line 25 ultimately represents a short circuit in the circuit formed by the soldering furnace 11 and the cleaning system 21 for the process gas.
  • the bypass line 25 can be used to supply the cooling stage 15a with process gas at a lower temperature than the temperature of the process gas to be cleaned, so that the mixture of the two gas streams leads to cooling of the process gas to be cleaned.
  • the bypass lines indicated by the dotted arrows 27 can also be provided.
  • the removal line 19 After passing through the mixer 22, the removal line 19 opens into a condensate trap 28, in which the impurities in the process gas to be cleaned are condensed by a cooling coil 29.
  • the cooling shock is connected to a coolant circuit 30.
  • Various tapping points 31 for the process gas to be cleaned are arranged in the individual heating stages 14a, 14b, 14c, 14d. These are connected to a heat exchanger 32, which allows the process gas to be cleaned to be passed through colder heating stages of the soldering furnace.
  • the heat exchanger is a line with good heat conductivity trained.
  • the heat exchanger which is connected, for example, to the extraction point 31 in the heating stage 14d, first passes through the somewhat cooler heating stage 14c and then through the somewhat cooler heating stages 14b and 14a in the direction of flow of the process gas to be cleaned, the process gas circulating in each of the heating stages insofar acts as a cooling medium that the process gas to be cleaned releases its heat to the process gas in the heating stage.
  • a heat exchanger based on the direct current principle is thus implemented.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé pour purifier le gaz de processus d'un four à braser, consistant à influer sur la température et le débit volumétrique dudit gaz sur le parcours entre des points de prélèvement (31) dans le four à braser (11) et un purgeur de condensats (28), de façon à garantir un fonctionnement du purgeur de condensats et, en particulier, à optimiser ledit purgeur de condensats par rapport à la quantité de chaleur extraite du gaz de processus par ce dernier. A cet effet, on peut influer de manière ciblée sur la température et/ou le débit volumétrique au moyen d'un étrangleur (26), d'un échangeur de chaleur (32), situé à l'intérieur de la machine à braser, ou d'un mélangeur (22). Le bilan énergétique du processus de brasage et de purification peut être optimisé par une minimisation de la quantité de chaleur extraite par le purgeur de condensats, ce qui permet une économie d'énergie avantageuse. De plus, il est possible de faire fonctionner le purgeur de condensats à un rendement optimal, de façon à permettre une conception du purgeur de condensats avec une capacité comparativement faible. Ladite invention concerne également un four à braser (11) comprenant un échangeur de chaleur (32), installé à l'intérieur dudit four et destiné au gaz de processus à purifier, ainsi qu'un système de purification (21) équipé d'un organe de commande servant à régler la température et/ou le débit volumétrique du gaz à purifier.
PCT/DE2003/004234 2003-01-08 2003-12-16 Procede pour purifier le gaz de processus d'un four a braser, four a braser et systeme de purification pour la mise en oeuvre dudit procede Ceased WO2004062761A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10301102.1 2003-01-08
DE2003101102 DE10301102B3 (de) 2003-01-08 2003-01-08 Verfahren zum Reinigen von Prozessgas eines Lötofens, sowie Lötofen und Reinigungssystem zur Durchführung des Verfahrens

Publications (2)

Publication Number Publication Date
WO2004062761A2 true WO2004062761A2 (fr) 2004-07-29
WO2004062761A3 WO2004062761A3 (fr) 2004-09-30

Family

ID=31896383

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/004234 Ceased WO2004062761A2 (fr) 2003-01-08 2003-12-16 Procede pour purifier le gaz de processus d'un four a braser, four a braser et systeme de purification pour la mise en oeuvre dudit procede

Country Status (2)

Country Link
DE (1) DE10301102B3 (fr)
WO (1) WO2004062761A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031713B3 (de) * 2004-06-30 2005-12-22 Fujitsu Siemens Computers Gmbh Verfahren zum Reinigen einer Reinigunsvorrichtung eines Lötofen und Lötofen zur Durchführung des Verfahrens
DE102010046545A1 (de) * 2010-09-27 2012-03-29 Elino Industrie-Ofenbau Gmbh Verfahren und Vorrichtung zum Verlöten
DK2771145T3 (en) 2011-10-25 2017-04-10 Air Liquide PROCEDURE AND DEVICE FOR COOLING PUNCHED PRINTING PLATES
PL2604373T3 (pl) * 2011-12-15 2015-08-31 Air Liquide Sposób i urządzenie do kondensacji zanieczyszczeń atmosfery w instalacji lutowniczej przy wykorzystaniu gazu do chłodzenia radiatora
DE102014117617B4 (de) 2014-12-01 2022-11-24 Seho Vermögensverwaltungs Gmbh & Co. Kg Lötvorrichtung
EP4032648A1 (fr) * 2021-01-25 2022-07-27 Infineon Technologies AG Agencement pour la formation d'une connexion

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
US3334686A (en) * 1965-02-26 1967-08-08 Joy Mfg Co Gas purifying apparatus
US4850117A (en) * 1987-08-06 1989-07-25 Northern Telecom Limited Condensation and recovery of solvent and other vapors
KR910005959B1 (ko) * 1988-01-19 1991-08-09 니혼 덴네쯔 게이기 가부시끼가이샤 리플로우 납땜 방법 및 그 장치
JP2794958B2 (ja) * 1991-02-14 1998-09-10 松下電器産業株式会社 リフロー装置
US5611476C1 (en) * 1996-01-18 2002-02-26 Btu Int Solder reflow convection furnace employing flux handling and gas densification systems
US5993500A (en) * 1997-10-16 1999-11-30 Speedline Technololies, Inc. Flux management system
US6146448A (en) * 1998-11-02 2000-11-14 Soltec B.V. Flux management system for a solder reflow oven
DE19925967C2 (de) * 1999-05-31 2001-05-10 Siemens Ag Verfahren zum Reinigen eines einen Fremdstoff enthaltenden Gases
GB2410204B (en) * 2001-05-30 2005-10-19 Btu Internat Inc Filtering apparatus

Also Published As

Publication number Publication date
DE10301102B3 (de) 2004-03-25
WO2004062761A3 (fr) 2004-09-30

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