[go: up one dir, main page]

WO2004047510A3 - A method of supporting electronic components and an electronic device with elastic support for an electronic component - Google Patents

A method of supporting electronic components and an electronic device with elastic support for an electronic component Download PDF

Info

Publication number
WO2004047510A3
WO2004047510A3 PCT/EP2003/011458 EP0311458W WO2004047510A3 WO 2004047510 A3 WO2004047510 A3 WO 2004047510A3 EP 0311458 W EP0311458 W EP 0311458W WO 2004047510 A3 WO2004047510 A3 WO 2004047510A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic
pcb
electronic component
electronic device
elastic support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2003/011458
Other languages
French (fr)
Other versions
WO2004047510A2 (en
Inventor
Per Holmberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Mobile Communications AB
Original Assignee
Sony Ericsson Mobile Communications AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP02388071A external-priority patent/EP1422985B1/en
Application filed by Sony Ericsson Mobile Communications AB filed Critical Sony Ericsson Mobile Communications AB
Priority to BR0316301-6A priority Critical patent/BR0316301A/en
Priority to AU2003294695A priority patent/AU2003294695A1/en
Priority to CN2003801035474A priority patent/CN101189928B/en
Priority to JP2004552476A priority patent/JP4713154B2/en
Priority to MXPA05005356A priority patent/MXPA05005356A/en
Publication of WO2004047510A2 publication Critical patent/WO2004047510A2/en
Anticipated expiration legal-status Critical
Publication of WO2004047510A3 publication Critical patent/WO2004047510A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

A method of providing support for an electronic component (17) in an electronic device comprising a PCB (printed circuit board) (14) and a structural element (15) covering at least a part of the PCB (14). The method comprises the steps of mounting the electronic component (17) on the PCB (14), applying an elastically compressible and shock-absorbing material (18) to the structural element (15) at an area (22) thereof that is adapted to cover the component (17), and assembling the PCB (14) and the structural element (15) in such manner that the elastically compressible and shock-absorbing material (18) exerts a pressure on the electronic component (17) towards the PCB (14). An electronic device comprising an elastically compressible and shock-absorbing material between the structural element and the PCB is also disclosed.
PCT/EP2003/011458 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component Ceased WO2004047510A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
BR0316301-6A BR0316301A (en) 2002-11-19 2003-10-14 Method for providing support for an electronic component in an electronic device, and, electronic device
AU2003294695A AU2003294695A1 (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component
CN2003801035474A CN101189928B (en) 2002-11-19 2003-10-14 Method of supporting electronic component and electronic device having elastic support for electronic component
JP2004552476A JP4713154B2 (en) 2002-11-19 2003-10-14 Method for elastically supporting electronic components
MXPA05005356A MXPA05005356A (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02388071A EP1422985B1 (en) 2002-11-19 2002-11-19 A method of supporting electronic components and an electronic device with elestic support for an electronic component
EP02388071.9 2002-11-19
US42837502P 2002-11-22 2002-11-22
US60/428,375 2002-11-22

Publications (2)

Publication Number Publication Date
WO2004047510A2 WO2004047510A2 (en) 2004-06-03
WO2004047510A3 true WO2004047510A3 (en) 2007-12-21

Family

ID=32327865

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/011458 Ceased WO2004047510A2 (en) 2002-11-19 2003-10-14 A method of supporting electronic components and an electronic device with elastic support for an electronic component

Country Status (7)

Country Link
JP (1) JP5404667B2 (en)
KR (1) KR20050085013A (en)
AU (1) AU2003294695A1 (en)
BR (1) BR0316301A (en)
MX (1) MXPA05005356A (en)
RU (1) RU2328841C2 (en)
WO (1) WO2004047510A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413323B1 (en) 2015-02-06 2022-06-27 엘지전자 주식회사 Mobile terminal
WO2016144039A1 (en) 2015-03-06 2016-09-15 Samsung Electronics Co., Ltd. Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof
SE540653C2 (en) 2016-03-29 2018-10-09 Atlas Copco Airpower Nv Arrangement arranged to enclose a circuit board comprising electronic components and a tool comprising the arrangement
US10477737B2 (en) 2016-05-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method of a hollow shielding structure for circuit elements
US10477687B2 (en) 2016-08-04 2019-11-12 Samsung Electronics Co., Ltd. Manufacturing method for EMI shielding structure
KR102551657B1 (en) 2016-12-12 2023-07-06 삼성전자주식회사 EMI shielding structure and manufacturing method for the same
US10594020B2 (en) 2017-07-19 2020-03-17 Samsung Electronics Co., Ltd. Electronic device having antenna element and method for manufacturing the same
KR102373931B1 (en) 2017-09-08 2022-03-14 삼성전자주식회사 Electromagnetic interference shielding structure
CN114900950A (en) * 2022-05-25 2022-08-12 广东江粉高科技产业园有限公司 Bending crack-resistant flexible circuit board and design method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5390083A (en) * 1993-09-30 1995-02-14 Honeywell Inc. Apparatus and method for stiffening circuit card assemblies
EP0696880A2 (en) * 1994-08-10 1996-02-14 DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter Plastic housing having a vibration damped mounting of a bondable element
EP1085799A1 (en) * 1999-09-14 2001-03-21 Sagem Sa Protection device for electronic components
JP2001326492A (en) * 2000-05-17 2001-11-22 Casio Comput Co Ltd Heat and electromagnetic noise combined countermeasure parts and electronic equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1511868A1 (en) * 1988-02-19 1989-09-30 Предприятие П/Я В-2634 Electronic module
EP0340959B1 (en) * 1988-05-06 1994-12-28 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
FI106826B (en) * 1994-09-16 2001-04-12 Nokia Mobile Phones Ltd installing Carpet
RU2133082C1 (en) * 1997-12-15 1999-07-10 Общество с ограниченной ответственностью "Научно-производственное предприятие ЭЛКАР" Electronic unit used, for example, to control internal combustion engines of vehicles
JP2001177345A (en) * 1999-12-15 2001-06-29 Murata Mfg Co Ltd Piezoelectric oscillator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5390083A (en) * 1993-09-30 1995-02-14 Honeywell Inc. Apparatus and method for stiffening circuit card assemblies
EP0696880A2 (en) * 1994-08-10 1996-02-14 DODUCO GMBH + Co Dr. Eugen DÀ¼rrwächter Plastic housing having a vibration damped mounting of a bondable element
EP1085799A1 (en) * 1999-09-14 2001-03-21 Sagem Sa Protection device for electronic components
JP2001326492A (en) * 2000-05-17 2001-11-22 Casio Comput Co Ltd Heat and electromagnetic noise combined countermeasure parts and electronic equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 03 3 April 2002 (2002-04-03) *

Also Published As

Publication number Publication date
JP2011124598A (en) 2011-06-23
MXPA05005356A (en) 2005-08-26
AU2003294695A8 (en) 2004-06-15
RU2328841C2 (en) 2008-07-10
WO2004047510A2 (en) 2004-06-03
KR20050085013A (en) 2005-08-29
BR0316301A (en) 2005-09-27
AU2003294695A1 (en) 2004-06-15
RU2005119195A (en) 2006-01-20
JP5404667B2 (en) 2014-02-05

Similar Documents

Publication Publication Date Title
WO2002035903A3 (en) Electronic component, component mounting equipment, and component mounting method
WO2001084898A3 (en) Electronic control module for a vehicle
AU2003222851A1 (en) Screening device for electronic subsassemblies on a printed circuit board
EP1239719A3 (en) Method, apparatus, system, method and device for data creating, and program for mounting electronic component
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
EP1237400A3 (en) Printed circuit board mounting facility
WO2008014325A3 (en) An assembly for mounting electronic components, methods of use and manfacture thereof
SG108931A1 (en) Mounting board and electronic device using the same
EP1513379A3 (en) Compact radio equipment and method of mounting the same
DK0797379T3 (en) Circuit board and method for mounting and soldering electronic components in exact position on the circuit board surface
CA2303318A1 (en) Cover member for sealed circuit board assembly
EP0929209A3 (en) Method of supporting printed circuitboard and method of mounting electric components
GB2304470B (en) Device mounting a component on a printed circuit board
EP0459831A3 (en) Method and device for mounting components on a printed circuit board
WO2004098247A3 (en) Electronic control module for a removable connector and methods of assembling same
WO2004047510A3 (en) A method of supporting electronic components and an electronic device with elastic support for an electronic component
NL194147B (en) Replacement nozzle for a vacuum propeller shaft and device for carrying out the replacement. Recording and placement device for mounting electronic components on a printed circuit board, as well as nozzle magazine herein.
EP0344793A3 (en) Device for mounting and/or soldering or gluing electronic components, particularly smd-components on printed circuit boards
EP1289353A4 (en) SURFACE MOUNT TYPE ELECTRONIC COMPONENT
SG106125A1 (en) Fixing adhesive sheet for flexible printed circuit board and method for mounting electronic parts in flexible printed circuit board
MY122954A (en) Methods for retaining assembled components
EP0957665A3 (en) Electronic device
DE60238844D1 (en) Method for supporting electronic components and electronic device and elastic holding device for an electronic component
TW200608861A (en) Holding fixture, component mounting method, electronic circuit unit and electronic apparatus
WO1998048197A3 (en) Vibration control system, especially for circuit boards

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004552476

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1634/DELNP/2005

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 1020057008826

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20038A35474

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: PA/a/2005/005356

Country of ref document: MX

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

ENP Entry into the national phase

Ref document number: 2005119195

Country of ref document: RU

Kind code of ref document: A

WWP Wipo information: published in national office

Ref document number: 1020057008826

Country of ref document: KR

ENP Entry into the national phase

Ref document number: PI0316301

Country of ref document: BR

122 Ep: pct application non-entry in european phase