[go: up one dir, main page]

WO2003104929A3 - USE OF OVERLAY DIAGNOSTICS TO IMPROVE AUTOMATIC PROCESS CONTROLS - Google Patents

USE OF OVERLAY DIAGNOSTICS TO IMPROVE AUTOMATIC PROCESS CONTROLS Download PDF

Info

Publication number
WO2003104929A3
WO2003104929A3 PCT/US2003/017899 US0317899W WO03104929A3 WO 2003104929 A3 WO2003104929 A3 WO 2003104929A3 US 0317899 W US0317899 W US 0317899W WO 03104929 A3 WO03104929 A3 WO 03104929A3
Authority
WO
WIPO (PCT)
Prior art keywords
target
overlay
metric
image information
noise
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2003/017899
Other languages
French (fr)
Other versions
WO2003104929A2 (en
Inventor
Joel L Seligson
Mark Ghinovker
Pavel Izikson
Boris Simkin
John Robinson
Michael E Adel
David Tulipman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Tencor Technologies Corp
Original Assignee
KLA Tencor Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/438,962 external-priority patent/US6928628B2/en
Priority claimed from US10/438,963 external-priority patent/US7111256B2/en
Application filed by KLA Tencor Technologies Corp filed Critical KLA Tencor Technologies Corp
Priority to EP03736896A priority Critical patent/EP1512112A4/en
Priority to JP2004511937A priority patent/JP4677231B2/en
Publication of WO2003104929A2 publication Critical patent/WO2003104929A2/en
Publication of WO2003104929A3 publication Critical patent/WO2003104929A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

L'invention porte sur un procédé et un appareil d'analyse de cibles à recouvrement, et dans une exécution, sur un procédé d'extraction de données provenant d'une cible à recouvrement. On acquiert d'abord une information d'image ou un ou plusieurs signaux d'intensité à partir de la cible, puis on obtient une erreur de superposition à partir de la cible en analysant l'information d'image ou le ou les signaux d'intensité de la cible. On peut également obtenir un métrique d'erreur systématique à partir de la cible en analysant l'information d'image ou le ou les signaux d'intensité en provenant. L'erreur systématique peut indiquer la présence d'un métrique asymétrique dans une ou plusieurs parties de la cible. On peut en outre obtenir un métrique de bruit à partir de la cible en appliquant un modèle statistique à l'information d'image ou au ou aux signaux d'intensité en provenant. Les métriques de bruit caractérisent le bruit, par exemple un fond granuleux associé à la cible. Dans d'autres exécutions, on effectue une procédure d'analyse par recouvrement et/ou pas à pas en fonction du métrique d'erreur systématique et/ou du métrique de bruit, ainsi que des données de recouvrement.A method and apparatus for analyzing overlapping targets, and in one embodiment, a method for extracting data from an overlapping target. First acquire image information or one or more intensity signals from the target, then obtain an overlay error from the target by analyzing the image information or the signal (s). intensity of the target. One can also obtain a systematic error metric from the target by analyzing the image information or the intensity signal or signals from it. Systematic error can indicate the presence of an asymmetric metric in one or more parts of the target. In addition, a noise metric can be obtained from the target by applying a statistical model to the image information or to the intensity signal or signals from it. Noise metrics characterize noise, for example a grainy background associated with the target. In other embodiments, an overlay and / or stepwise analysis procedure is carried out as a function of the systematic error metric and / or the noise metric, as well as overlay data.

PCT/US2003/017899 2002-06-05 2003-06-05 Use of overlay diagnostics for enhanced automatic process control Ceased WO2003104929A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP03736896A EP1512112A4 (en) 2002-06-05 2003-06-05 Use of overlay diagnostics for enhanced automatic process control
JP2004511937A JP4677231B2 (en) 2002-06-05 2003-06-05 Using overlay diagnostics for improved automated process control.

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US38628502P 2002-06-05 2002-06-05
US60/386,285 2002-06-05
US39584702P 2002-07-11 2002-07-11
US60/395,847 2002-07-11
US45668103P 2003-03-19 2003-03-19
US60/456,681 2003-03-19
US10/438,962 2003-05-14
US10/438,962 US6928628B2 (en) 2002-06-05 2003-05-14 Use of overlay diagnostics for enhanced automatic process control
US10/438,963 2003-05-14
US10/438,963 US7111256B2 (en) 2002-06-05 2003-05-14 Use of overlay diagnostics for enhanced automatic process control

Publications (2)

Publication Number Publication Date
WO2003104929A2 WO2003104929A2 (en) 2003-12-18
WO2003104929A3 true WO2003104929A3 (en) 2004-06-24

Family

ID=29741145

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/017899 Ceased WO2003104929A2 (en) 2002-06-05 2003-06-05 Use of overlay diagnostics for enhanced automatic process control

Country Status (3)

Country Link
EP (1) EP1512112A4 (en)
JP (1) JP4677231B2 (en)
WO (1) WO2003104929A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060117293A1 (en) * 2004-11-30 2006-06-01 Nigel Smith Method for designing an overlay mark
JP5036429B2 (en) * 2007-07-09 2012-09-26 キヤノン株式会社 Position detection apparatus, exposure apparatus, device manufacturing method, and adjustment method
US7873585B2 (en) * 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
NL2004815A (en) 2009-06-17 2010-12-20 Asml Netherlands Bv Method of overlay measurement, lithographic apparatus, inspection apparatus, processing apparatus and lithographic processing cell.
NL2007088A (en) * 2010-07-19 2012-01-23 Asml Netherlands Bv Method and apparatus for determining an overlay error.
US11372340B2 (en) 2011-04-06 2022-06-28 Kla Corporation Method and system for providing a quality metric for improved process control
KR101609652B1 (en) * 2012-07-10 2016-04-06 에이에스엠엘 네델란즈 비.브이. Lithographic cluster system, method for calibrating a positioning device of a lithographic apparatus
KR102287757B1 (en) * 2015-05-26 2021-08-09 삼성전자주식회사 Methods of Revising an Overlay Correction Data
WO2017148759A1 (en) * 2016-03-04 2017-09-08 Asml Netherlands B.V. Method for characterizing distortions in a lithographic process, lithographic apparatus, lithographic cell and computer program
JP2020519932A (en) * 2017-04-28 2020-07-02 エーエスエムエル ネザーランズ ビー．ブイ． Optimization of the manufacturing process sequence for the product unit
US11378451B2 (en) 2017-08-07 2022-07-05 Kla Corporation Bandgap measurements of patterned film stacks using spectroscopic metrology
EP3454126A1 (en) * 2017-09-08 2019-03-13 ASML Netherlands B.V. Method for estimating overlay
CN113574643B (en) * 2019-03-21 2024-12-03 科磊股份有限公司 Improved parametrically stable misalignment measurements in semiconductor devices
US11604063B2 (en) 2021-06-24 2023-03-14 Kla Corporation Self-calibrated overlay metrology using a skew training sample
KR102541500B1 (en) * 2022-11-14 2023-06-13 (주)오로스테크놀로지 System for centering position of overlay key based on correlation and method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030115556A1 (en) * 2001-12-13 2003-06-19 International Business Machines Corporation Feed-forward lithographic overlay offset method and system
US6612159B1 (en) * 1999-08-26 2003-09-02 Schlumberger Technologies, Inc. Overlay registration error measurement made simultaneously for more than two semiconductor wafer layers
US20030223630A1 (en) * 2002-02-15 2003-12-04 Kla-Tencor Corporation Overlay metrology and control method
US6664121B2 (en) * 2002-05-20 2003-12-16 Nikon Precision, Inc. Method and apparatus for position measurement of a pattern formed by a lithographic exposure tool

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329334A (en) * 1993-03-02 1994-07-12 Lsi Logic Corporation Integrated circuit test reticle and alignment mark optimization method
JP2985587B2 (en) * 1993-07-06 1999-12-06 松下電器産業株式会社 Alignment method and semiconductor device manufacturing apparatus
JP3248580B2 (en) * 1999-02-16 2002-01-21 日本電気株式会社 Registration accuracy measurement mark and registration accuracy measurement method
JP2002025882A (en) * 2000-06-30 2002-01-25 Hitachi Electronics Eng Co Ltd Apparatus and method for measuring pattern overlay error
JP2002124458A (en) * 2000-10-18 2002-04-26 Nikon Corp Overlay inspection apparatus and overlay inspection method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612159B1 (en) * 1999-08-26 2003-09-02 Schlumberger Technologies, Inc. Overlay registration error measurement made simultaneously for more than two semiconductor wafer layers
US20030115556A1 (en) * 2001-12-13 2003-06-19 International Business Machines Corporation Feed-forward lithographic overlay offset method and system
US20030223630A1 (en) * 2002-02-15 2003-12-04 Kla-Tencor Corporation Overlay metrology and control method
US6664121B2 (en) * 2002-05-20 2003-12-16 Nikon Precision, Inc. Method and apparatus for position measurement of a pattern formed by a lithographic exposure tool

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1512112A4 *

Also Published As

Publication number Publication date
JP2005529488A (en) 2005-09-29
WO2003104929A2 (en) 2003-12-18
EP1512112A4 (en) 2006-11-02
EP1512112A2 (en) 2005-03-09
JP4677231B2 (en) 2011-04-27

Similar Documents

Publication Publication Date Title
WO2003104929A3 (en) USE OF OVERLAY DIAGNOSTICS TO IMPROVE AUTOMATIC PROCESS CONTROLS
DE602004020765D1 (en) Bandwidth extension of band-limited tone signals
US8784311B2 (en) Systems and methods of screening for medical states using speech and other vocal behaviors
US20120195433A1 (en) Detection of audio channel configuration
Hicks et al. From Goals to Theory.
DE602005019769D1 (en) TUNG SYSTEM
Bashar et al. Developing a novel noise artifact detection algorithm for smartphone PPG signals: Preliminary results
RU2009102245A (en) MULTI-PARAMETER CLASSIFICATION OF CARDIOVASCULAR TONES
CA2445241A1 (en) Device for assistance in the analysis of adventitious sounds
JP2005066045A (en) Sound data processor and program
CN109922268B (en) Video shooting method, device, equipment and storage medium
DE502005001685D1 (en) DEVICE AND METHOD FOR ANALYZING AN INFORMATION SIGNAL
CN109785460A (en) Vehicle trouble recognition methods, device, computer equipment and storage medium
US10956792B2 (en) Methods and apparatus to analyze time series data
US12106766B2 (en) Systems and methods for pre-filtering audio content based on prominence of frequency content
US20190142350A1 (en) Biomarker Change Indicator for Behavioral Health
KR20040015092A (en) Chaos-theoretical human factor evaluation apparatus
EP1693799A3 (en) Method and device for image selection and output
EP3729419A1 (en) Method and apparatus for emotion recognition from speech
US20080281599A1 (en) Processing audio data
CN118171040A (en) AIGC-based brain wave psychological detection system
JP6467044B2 (en) Shunt sound analysis device, shunt sound analysis method, computer program, and recording medium
US12488806B2 (en) System and method for real-time detection of user's attention sound based on neural signals, and audio output device using the same
CN105336325A (en) Speech signal recognition and processing method and device
KR20220145216A (en) Diagnosis of the degree of disability by crying, facial temperature, iris measurement, accuracy of verbal expression, etc. of mentally handicapped and autistic children

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004511937

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 2003736896

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2003736896

Country of ref document: EP