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WO2003104351A1 - Poudre d'oxyde metallique pour polissage de haute precision et procede de preparation associe - Google Patents

Poudre d'oxyde metallique pour polissage de haute precision et procede de preparation associe Download PDF

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Publication number
WO2003104351A1
WO2003104351A1 PCT/KR2003/001085 KR0301085W WO03104351A1 WO 2003104351 A1 WO2003104351 A1 WO 2003104351A1 KR 0301085 W KR0301085 W KR 0301085W WO 03104351 A1 WO03104351 A1 WO 03104351A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal oxide
powder
cohesive
oxide powder
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2003/001085
Other languages
English (en)
Inventor
Hyukjin Kwon
Myungho Ahn
Youngkwon Joung
Inyeon Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Precision Materials Co Ltd
Original Assignee
Samsung Corning Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Corning Co Ltd filed Critical Samsung Corning Co Ltd
Priority to DE10392703T priority Critical patent/DE10392703B4/de
Priority to AU2003241192A priority patent/AU2003241192A1/en
Priority to JP2004511413A priority patent/JP4178222B2/ja
Publication of WO2003104351A1 publication Critical patent/WO2003104351A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G1/00—Methods of preparing compounds of metals not covered by subclasses C01B, C01C, C01D, or C01F, in general
    • C01G1/02—Oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/04—Particle morphology depicted by an image obtained by TEM, STEM, STM or AFM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Definitions

  • a method for preparing said metal oxide powder comprising mixing a diluent with a metal oxide precursor to produce a mixture having a diluent content in the range of 40 to 70 wt%, and milling the mixture, calcining the milled mixture, and removing the diluent from the calcined mixture by water washing. 5
  • FIG. 4 a TEM photograph of the inventive powder sample prepared in Example 2.
  • ceria powder sample (1-2) in accordance with the present invention exhibits aggregates having an average primary particle coordination number of 2.4, while the aggregates of sample (1-4) have an average primary particle coordination number of 4 or more.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)

Abstract

L'invention concerne une poudre d'oxyde métallique pour polissage de haute précision et sa préparation, comprenant des agrégats formés par la cohésion de particules primaires, possédant un degré de cohésion (α) compris entre 1,1 et 2,0 et une échelle de cohésion (β) comprise entre 3 et 10, le degré (α) et l'échelle (β) de cohésion étant définis par les formules (I) et (II), respectivement: ¥A = 6 / (S ¥Ñ d(XRD)) (I) et ¥A = diamètre de particule moyen en poids / d(XRD) (II) dans lesquelles S représente la surface spécifique de la poudre, ¥Ñ représente la densité, et d(XRD) représente le diamètre des particules de la poudre déterminé par une analyse de diffraction aux rayons X. Selon l'invention, il est possible d'obtenir une vitesse élevée de polissage et une réduction des rayures.
PCT/KR2003/001085 2002-06-05 2003-06-03 Poudre d'oxyde metallique pour polissage de haute precision et procede de preparation associe Ceased WO2003104351A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10392703T DE10392703B4 (de) 2002-06-05 2003-06-03 Metalloxidpulver für Hochpräzisionspolieren und ein Verfahren zur Herstellung desselben
AU2003241192A AU2003241192A1 (en) 2002-06-05 2003-06-03 Metal oxide powder for high precision polishing and method of preparation thereof
JP2004511413A JP4178222B2 (ja) 2002-06-05 2003-06-03 研磨材

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20020031526 2002-06-05
KR10-2002-0031526 2002-06-05

Publications (1)

Publication Number Publication Date
WO2003104351A1 true WO2003104351A1 (fr) 2003-12-18

Family

ID=29707716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2003/001085 Ceased WO2003104351A1 (fr) 2002-06-05 2003-06-03 Poudre d'oxyde metallique pour polissage de haute precision et procede de preparation associe

Country Status (8)

Country Link
US (1) US7090821B2 (fr)
JP (1) JP4178222B2 (fr)
KR (1) KR100560223B1 (fr)
CN (1) CN1295292C (fr)
AU (1) AU2003241192A1 (fr)
DE (1) DE10392703B4 (fr)
TW (1) TW593652B (fr)
WO (1) WO2003104351A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006011764A1 (fr) 2004-07-29 2006-02-02 Lg Chem, Ltd. Poudre d'oxyde de cerium et son procede de production
US8620059B2 (en) 2007-12-13 2013-12-31 Fpinnovations Characterizing wood furnish by edge pixelated imaging

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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DE10343728A1 (de) * 2003-09-22 2005-04-21 Degussa Zinkoxidpulver
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
KR100638317B1 (ko) * 2004-07-28 2006-10-25 주식회사 케이씨텍 연마용 슬러리 및 이의 제조 방법 및 기판 연마 방법
US20060140878A1 (en) * 2004-12-23 2006-06-29 Cornelius John M Classified silica for improved cleaning and abrasion in dentifrices
US20060140877A1 (en) * 2004-12-23 2006-06-29 Mcgill Patrick D Methods of producing improved cleaning abrasives for dentifrices
KR100694648B1 (ko) * 2005-12-16 2007-03-13 양희성 전선 접속단자
KR100840218B1 (ko) * 2007-02-09 2008-06-23 한국기계연구원 ＮａＣｌ이나 소금으로 코팅된 산화물을 볼밀링하여 13.9 ㎡／ｇ 이상의 비표면적을 갖는 산화물의 제조방법 및 그 사용방법
CN100469531C (zh) * 2007-09-14 2009-03-18 中国科学院上海光学精密机械研究所 氧化锌单晶衬底级基片的抛光方法
JP5179205B2 (ja) * 2008-01-24 2013-04-10 三井住友建設株式会社 金属製部材切断方法と金属製部材切断装置
CN101977873A (zh) 2008-02-12 2011-02-16 圣戈本陶瓷及塑料股份有限公司 二氧化铈及其形成方法
JP5499556B2 (ja) * 2008-11-11 2014-05-21 日立化成株式会社 スラリ及び研磨液セット並びにこれらから得られるｃｍｐ研磨液を用いた基板の研磨方法及び基板
JP2013203640A (ja) * 2012-03-29 2013-10-07 Admatechs Co Ltd 複合酸化物粉末の製造方法
US10421890B2 (en) * 2016-03-31 2019-09-24 Versum Materials Us, Llc Composite particles, method of refining and use thereof
CN106271898A (zh) * 2016-08-18 2017-01-04 广西华银铝业有限公司 一种石英片的清洁方法
CN114383983B (zh) * 2021-12-02 2024-06-18 湖北亿纬动力有限公司 测定正极材料一次颗粒粒径的方法

Citations (4)

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WO1997029510A1 (fr) * 1996-02-07 1997-08-14 Hitachi Chemical Company, Ltd. Abrasif d'oxyde de cerium, microplaquette semi-conductrice, dispositif semi-conducteur, procede pour les produire et procede pour polir les substrats
JP2000345144A (ja) * 1999-03-31 2000-12-12 Tokuyama Corp 研磨剤及び研磨方法
WO2001045838A1 (fr) * 1999-12-21 2001-06-28 W.R. Grace & Co.-Conn. Composites d"oxyde d"aluminium a volume de pore et surface eleves, derives de trihydrate d"alumine, procedes de preparations et utilisations associes
JP2002114968A (ja) * 2000-08-04 2002-04-16 Maruo Calcium Co Ltd 研磨材及び該研磨材を用いた研磨方法

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DE4427137B4 (de) * 1993-10-07 2007-08-23 Degussa Gmbh Fällungskieselsäure
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
ATE200236T1 (de) * 1995-08-28 2001-04-15 Advanced Nano Technologies Pty Verfahren zur herstellung ultrafeiner teilchen
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AUPP355798A0 (en) * 1998-05-15 1998-06-11 University Of Western Australia, The Process for the production of ultrafine powders
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997029510A1 (fr) * 1996-02-07 1997-08-14 Hitachi Chemical Company, Ltd. Abrasif d'oxyde de cerium, microplaquette semi-conductrice, dispositif semi-conducteur, procede pour les produire et procede pour polir les substrats
JP2000345144A (ja) * 1999-03-31 2000-12-12 Tokuyama Corp 研磨剤及び研磨方法
WO2001045838A1 (fr) * 1999-12-21 2001-06-28 W.R. Grace & Co.-Conn. Composites d"oxyde d"aluminium a volume de pore et surface eleves, derives de trihydrate d"alumine, procedes de preparations et utilisations associes
JP2002114968A (ja) * 2000-08-04 2002-04-16 Maruo Calcium Co Ltd 研磨材及び該研磨材を用いた研磨方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006011764A1 (fr) 2004-07-29 2006-02-02 Lg Chem, Ltd. Poudre d'oxyde de cerium et son procede de production
JP2008508175A (ja) * 2004-07-29 2008-03-21 エルジー・ケム・リミテッド 酸化セリウム粉末及びその製造方法
EP1778587B1 (fr) * 2004-07-29 2017-04-05 LG Chem Ltd. Procede de production de poudre d'oxyde de cerium
US8620059B2 (en) 2007-12-13 2013-12-31 Fpinnovations Characterizing wood furnish by edge pixelated imaging

Also Published As

Publication number Publication date
KR20030094078A (ko) 2003-12-11
CN1659252A (zh) 2005-08-24
US7090821B2 (en) 2006-08-15
JP4178222B2 (ja) 2008-11-12
DE10392703T5 (de) 2005-07-28
DE10392703B4 (de) 2008-07-10
US20030228248A1 (en) 2003-12-11
JP2005529053A (ja) 2005-09-29
TW593652B (en) 2004-06-21
TW200402463A (en) 2004-02-16
CN1295292C (zh) 2007-01-17
AU2003241192A1 (en) 2003-12-22
KR100560223B1 (ko) 2006-03-10

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