WO2003101889A1 - Mthod of producing micro component - Google Patents
Mthod of producing micro component Download PDFInfo
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- WO2003101889A1 WO2003101889A1 PCT/JP2003/006475 JP0306475W WO03101889A1 WO 2003101889 A1 WO2003101889 A1 WO 2003101889A1 JP 0306475 W JP0306475 W JP 0306475W WO 03101889 A1 WO03101889 A1 WO 03101889A1
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- micro component
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/035—Microgears
Definitions
- the present invention relates to a method for manufacturing a micro component constituting a micro machine.
- micro components that make up a micromachine are generally manufactured by a Lithographie Galvanoformung Abformung (LIGA) process using semiconductor manufacturing technology.
- LIGA Lithographie Galvanoformung Abformung
- the LIGA process is a technology that combines X-ray lithography, electroplating, and molding. Using a method based on a normal semiconductor manufacturing process, the height of the manufactured object is limited to several to several tens of jum. On the other hand, when the LIGA process is used, it is possible to manufacture a three-dimensional object having a height of several hundreds / m and an aspect ratio of several tens or more.
- a resist 21 is applied on one surface of a flat substrate 20. Then, X-rays are irradiated from above the mask 22 and projected onto the resist 21 through the lens 23 to be exposed, whereby the mask pattern formed on the mask 22 is transferred.
- the exposed resist 21 is developed, the exposed portion is removed by exposure to light.
- the portion removed in this way is filled with nickel, for example, by plating, and the remaining resist 21 and substrate 20 are removed by etching, whereby a component having a shape transferred by nickel is formed.
- a mold is formed by the same method, a minute part can be manufactured using the mold.
- the micro parts to be manufactured In addition to the need to manufacture individual masks corresponding to different shapes and the need for various lithography equipment such as steppers and etching equipment, equipment costs are high and economical efficiency is lacking. is there.
- the masking pattern transferred by X-ray lithography has a problem that it is difficult to process it into a complex shape because its side faces are composed of vertical faces.
- the present invention provides a resin base forming step of forming a resin base that can be dissolved using a solvent, and forming a concave portion having a shape corresponding to the shape of a micro component to be manufactured by applying a physical external force to the resin base. Consisting of a recess forming step to form a recess, a metal filling step of filling the recess with metal, a metal removing step of polishing and removing excess metal, and a base melting step of melting the resin base with a solvent.
- the physical external force includes any one of laser beam, ultrasonic wave, cutting blade, and polishing grindstone. Filling recesses by plating, micro parts are molds used to manufacture parts or parts that make up the micromachine, metal is nickel, resin is ABS resin, and solvent is acetate. Additional requirements.
- a concave portion having a shape of the micro component to be manufactured is formed on the base by a physical external force, and the base is removed after filling the metal into the concave portion.
- FIG. 1 is a perspective view showing a base formed by a base forming step.
- FIG. 2 is a perspective view showing a state in which a concave portion is formed on the base in the concave portion forming step.
- FIG. 3 is a perspective view showing a state in which the recess is filled with metal in the metal filling step.
- FIG. 4 is a perspective view showing a state where excess metal has been removed in a metal removing step.
- FIG. 5 is a perspective view showing a micro component formed by the base melting step.
- FIG. 6 is a cross-sectional view showing a state where a concave portion whose side surface is a tapered surface is formed.
- FIG. 7 is a perspective view showing a lithography technique in a conventional method. BEST MODE FOR CARRYING OUT THE INVENTION
- a resin base 1 having a thickness greater than a gear to be manufactured using resin is formed (resin base forming step).
- the resin used for molding the resin base 1 needs to be capable of being dissolved later by a chemical reaction using a solvent.
- a solvent for example, an ABS resin can be used.
- a concave portion 3 which is a cavity having the same shape as the gear to be manufactured is formed (a concave portion forming step).
- a concave portion forming step As the physical external force, an ultrasonic wave, a cutting blade, or the like can be used in addition to the laser beam. Also, depending on the shape of the micro component to be manufactured, a grinding wheel can be used.
- the laser beam 2 is used as in the example in Fig. 2
- the laser beam is irradiated while moving the irradiation unit 4 or the resin base 1 according to the shape of the gear to be manufactured, so that the gear-shaped recess 3 can be formed.
- the concave portion 3 is filled with a metal 5 serving as a material of a micro component as shown in FIG. 3 (metal filling step).
- the filling of the metal can be performed by, for example, spraying the metal by sputtering and then performing electrolytic plating. Nickel, copper, or the like is used as the metal.
- metal removal step polishing can be performed using a polishing wheel, or can be performed using CMP technology.
- the gear 7 as a micro component shown in FIG. 5 is formed (base melting step).
- the resin base 1 is made of ABS resin
- acetone is used as a solvent.
- a concave portion 10 having a tapered surface 9 is formed by irradiating a laser beam 8 obliquely as shown in the figure. be able to. Then, the recess 10 is filled with metal. Then, a micro component having a side surface corresponding to the tapered surface 9 is formed. In this way, it is possible to manufacture a micro component having a shape that cannot be manufactured by the conventional method using one lithography technique.
- micro component itself constituting the micro machine but also a mold such as a mold for molding the micro component can be manufactured.
- a recess having the shape of a micro component to be manufactured by a physical external force is formed on a base, and the recess is filled with metal.
- a laser beam is used as a physical external force, a micro component having a side surface that is not a vertical surface can be easily manufactured. Can be manufactured.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
明 細 書 マイクロ部品の製造方法 技術分野 Description Manufacturing method of micro parts Technical field
本発明は、 マイクロマシンを構成するマイクロ部品の製造方法に関する。 背景技術 The present invention relates to a method for manufacturing a micro component constituting a micro machine. Background art
マイクロマシンを構成するマイクロ部品は、 半導体製造技術を利用した L I G A (Lithographie Galvanoformung Abformung) プロセスによって製造されるのが、 一般的である。 The micro components that make up a micromachine are generally manufactured by a Lithographie Galvanoformung Abformung (LIGA) process using semiconductor manufacturing technology.
L I G Aプロセスは、 X線リソグラフィー、 電気めつき、 モールディングを組 み合わせた技術であり、 通常の半導体製造プロセスに基づく方法では、 製造され る物の高さが数/ m〜数十 ju mに限られるのに対し、 L I G Aプロセスを用いた 場合には、 高さ数百/ m、 アスペクト比数十以上の三次元的の物を製造すること が可能となる。 The LIGA process is a technology that combines X-ray lithography, electroplating, and molding.Using a method based on a normal semiconductor manufacturing process, the height of the manufactured object is limited to several to several tens of jum. On the other hand, when the LIGA process is used, it is possible to manufacture a three-dimensional object having a height of several hundreds / m and an aspect ratio of several tens or more.
L I G Aプロセスにおいては、 第 7図に示すように、 まず最初に平坦なサブス トレー卜 2 0の上に一面にレジスト 2 1を塗布する。 そして、 マスク 2 2の上方 から X線を照射し、 レンズ 2 3を介してレジスト 2 1に投射して感光させると、 マスク 2 2に形成されたマスクパターンが転写される。 In the LIGA process, as shown in FIG. 7, first, a resist 21 is applied on one surface of a flat substrate 20. Then, X-rays are irradiated from above the mask 22 and projected onto the resist 21 through the lens 23 to be exposed, whereby the mask pattern formed on the mask 22 is transferred.
次に、感光したレジスト 2 1を現像すると、感光して変質部分が取り除かれる。 こうして取り除かれた部分に例えばメツキによってニッケルを充填し、 残ってい るレジス卜 2 1及びサブス卜レート 2 0をエッチングによリ除去すると、 ニッケ ルによって転写された形状の部品が形成される。 また、 同様の方法により金型を 形成した場合は、 その金型を使用して微少な部品を製造することができる。 Next, when the exposed resist 21 is developed, the exposed portion is removed by exposure to light. The portion removed in this way is filled with nickel, for example, by plating, and the remaining resist 21 and substrate 20 are removed by etching, whereby a component having a shape transferred by nickel is formed. When a mold is formed by the same method, a minute part can be manufactured using the mold.
しかしながら L I G Aプロセスにおいては、 製造しょうとするマイクロ部品 の形状に対応させたマスクを個々に製造しなければならないと共に、 ステツパ、 エッチング装置等の種々のリソグラフィ一装置が必要であるため、 設備費等が高 額になり、 経済性に欠けるという問題がある。 また、 X線リソグラフィ一により 転写されたマスキングパターンは、 その側面が垂直面で構成されるため、 複雑な 形状に加工することは困難であるという問題もある。 However, in the LIGA process, the micro parts to be manufactured In addition to the need to manufacture individual masks corresponding to different shapes and the need for various lithography equipment such as steppers and etching equipment, equipment costs are high and economical efficiency is lacking. is there. In addition, the masking pattern transferred by X-ray lithography has a problem that it is difficult to process it into a complex shape because its side faces are composed of vertical faces.
このように、 マイクロ部品の製造においては、 経済性を向上させると共に、 複 雑な形状の部品の製造をも可能とすることに課題を有している。 発明の開示 As described above, there is a problem in the production of micro parts, while improving the economical efficiency and enabling the production of parts having complicated shapes. Disclosure of the invention
本発明は、 溶剤を用いて溶解可能な樹脂基台を成形する樹脂基台成形工程と、 樹脂基台に物理的外力を作用させて製造しょうとするマイクロ部品の形状に相当 する形状の凹部を形成する凹部形成工程と、 凹部に金属を充填する金属充填工程 と、 余剰の金属を研磨して除去する金属除去工程と、 樹脂基台を溶剤を用いて溶 解させる基台溶解工程とから構成されるマイクロ部品の製造方法を提供する。 そしてこのマイクロ部品の製造方法は、物理的外力にはレーザー光線、超音波、 切削ブレード、 研磨砥石のいずれかを含むこと、 金属充填工程においては、 パッ タリングによって凹部に金属を散布し、 その後、 電解めつきによって凹部を充填 すること、 マイクロ部品は、 マイクロマシンを構成する部品または部品の製造に 用いる型枠であること、 金属はニッケルであり、 樹脂は A B S樹脂であり、 溶剤 はァセトンであることを付加的な要件とする。 The present invention provides a resin base forming step of forming a resin base that can be dissolved using a solvent, and forming a concave portion having a shape corresponding to the shape of a micro component to be manufactured by applying a physical external force to the resin base. Consisting of a recess forming step to form a recess, a metal filling step of filling the recess with metal, a metal removing step of polishing and removing excess metal, and a base melting step of melting the resin base with a solvent. To provide a method for manufacturing a micro component. The manufacturing method of this micro component is that the physical external force includes any one of laser beam, ultrasonic wave, cutting blade, and polishing grindstone. Filling recesses by plating, micro parts are molds used to manufacture parts or parts that make up the micromachine, metal is nickel, resin is ABS resin, and solvent is acetate. Additional requirements.
このように構成されるマイクロ部品の製造方法によれば、物理的外力によって、 製造しょうとするマイクロ部品の形状の凹部を基台に形成し、 その凹部に金属を 充填した後に基台を除去するようにしたため、 従来のようにマスクの製造やリソ グラフィー技術によるマスクパターンの転写等が不要となる。 According to the manufacturing method of the micro component configured as described above, a concave portion having a shape of the micro component to be manufactured is formed on the base by a physical external force, and the base is removed after filling the metal into the concave portion. This eliminates the necessity of manufacturing a mask or transferring a mask pattern by lithography technology as in the related art.
また、 物理的外力としてレーザー光線を用いた場合には、 側面が垂直面でない 形状のマイクロ部品も容易に製造することができる。 図面の簡単な説明 In addition, when a laser beam is used as a physical external force, it is possible to easily manufacture a micro component whose side surface is not a vertical surface. BRIEF DESCRIPTION OF THE FIGURES
第 1図は、 基台成形工程により成形された基台を示す斜視図である。 FIG. 1 is a perspective view showing a base formed by a base forming step.
第 2図は、 凹部形成工程により基台に凹部が形成された状態を示す斜視図であ る。 FIG. 2 is a perspective view showing a state in which a concave portion is formed on the base in the concave portion forming step.
第 3図は、 金属充填工程により凹部に金属が充填された状態を示す斜視図であ る。 FIG. 3 is a perspective view showing a state in which the recess is filled with metal in the metal filling step.
第 4図は、金属除去工程により余剰の金属を除去した状態を示す斜視図である。 第 5図は、 基台溶解工程により形成されたマイクロ部品を示す斜視図である。 第 6図は、 側面がテーパ面である凹部を形成する様子を示す断面図である。 第 7図は、 従来の方法におけるリソグラフィー技術を示す斜視図である。 発明を実施するための最良の形態 FIG. 4 is a perspective view showing a state where excess metal has been removed in a metal removing step. FIG. 5 is a perspective view showing a micro component formed by the base melting step. FIG. 6 is a cross-sectional view showing a state where a concave portion whose side surface is a tapered surface is formed. FIG. 7 is a perspective view showing a lithography technique in a conventional method. BEST MODE FOR CARRYING OUT THE INVENTION
本発明の実施の形態として、 マイクロ部品として使用される歯車を製造する場 合を例に挙げて説明する。 As an embodiment of the present invention, a case where a gear used as a micro component is manufactured will be described as an example.
第 1図に示すように、 まず最初に、 樹脂を用いて製造しょうとする歯車より厚 さのある樹脂基台 1を成形する （樹脂基台成型工程） 。 樹脂基台 1の成形に用い る樹脂は、 後に溶剤を用いて化学反応により溶解させることができるものである ことが必要であリ、 例えば A B S樹脂を使用することができる。 As shown in FIG. 1, first, a resin base 1 having a thickness greater than a gear to be manufactured using resin is formed (resin base forming step). The resin used for molding the resin base 1 needs to be capable of being dissolved later by a chemical reaction using a solvent. For example, an ABS resin can be used.
この基台に、 従来のようなレジストの塗布及び X線リソグラフィ一による現像 による方法ではなく、 レジストを塗布せずに、 樹脂基台 1に対して物理的外力を 加えること、 例えばレーザー光線 2を照射することによって、 第 2図に示すよう に、 製造しょうとする歯車と同一形状のキヤビティである凹部 3を形成する （凹 部形成工程） 。 物理的外力としては、 レーザー光線のほかに、 超音波、 切削ブレ —ド等を用いることができる。 また、 製造しょうとするマイクロ部品の形状によ つては研磨砥石を用いることもできる。 第 2図の例のようにレーザー光線 2を用いる場合は、 製造しょうとする歯車の 形状に合わせて照射部 4若しくは樹脂基台 1を移動させながらレーザー光線を照 射することによって、 歯車の形状の凹部 3を形成することができる。 Applying a physical external force to the resin base 1 without applying the resist, instead of applying the resist and developing using X-ray lithography as in the conventional method, to this base, for example, irradiating a laser beam 2 As a result, as shown in FIG. 2, a concave portion 3 which is a cavity having the same shape as the gear to be manufactured is formed (a concave portion forming step). As the physical external force, an ultrasonic wave, a cutting blade, or the like can be used in addition to the laser beam. Also, depending on the shape of the micro component to be manufactured, a grinding wheel can be used. When the laser beam 2 is used as in the example in Fig. 2, the laser beam is irradiated while moving the irradiation unit 4 or the resin base 1 according to the shape of the gear to be manufactured, so that the gear-shaped recess 3 can be formed.
上記のようにして所望の形状の凹部 3が形成された後は、第 3図に示すように、 その凹部 3にマイクロ部品の材料となる金属 5を充填する （金属充填工程） 。 金 属の充填は、 例えばスパッタリングによって金属を散布し、 その後、 電解めつき を施す方法によって行うことができる。金属としては、ニッケル、銅等を用いる。 凹部 3に金属を充填した後は、 樹脂基台 1の上に余剰の金属が堆積するため、 その余剰の金属を研磨により除去する （金属除去工程） 。 研磨は研磨砥石を用い て行うこともできるし、 C M P技術を利用して行うこともできる。 研磨により余 剰の金属を除去すると、 第 4図に示すように、 凹部 3に充填され、 凹部 3の形状 となった金属 6が露出すると共に、 金属 6の露出面が平坦化される。 After the concave portion 3 having a desired shape is formed as described above, the concave portion 3 is filled with a metal 5 serving as a material of a micro component as shown in FIG. 3 (metal filling step). The filling of the metal can be performed by, for example, spraying the metal by sputtering and then performing electrolytic plating. Nickel, copper, or the like is used as the metal. After the recess 3 is filled with metal, excess metal is deposited on the resin base 1 and the excess metal is removed by polishing (metal removal step). Polishing can be performed using a polishing wheel, or can be performed using CMP technology. When the excess metal is removed by polishing, as shown in FIG. 4, the metal 6 filled in the concave portion 3 and having the shape of the concave portion 3 is exposed, and the exposed surface of the metal 6 is flattened.
最後に、 溶剤を用いて樹脂基台 1を構成する樹脂を溶解させることにより、 第 5図に示すマイクロ部品である歯車 7が形成される （基台溶解工程） 。 ここで、 樹脂基台 1が A B S樹脂によって形成されている場合には、 溶剤としてァセトン を用いる。 Finally, by dissolving the resin constituting the resin base 1 using a solvent, the gear 7 as a micro component shown in FIG. 5 is formed (base melting step). Here, when the resin base 1 is made of ABS resin, acetone is used as a solvent.
このようにしてマイクロ部品を形成すると、 ステツパ等の高価なリソグラフィ 一装置が不要であり、形状の異なる部品ごとにマスクを製造する必要もないため、 製造コス卜を大幅に低減することができる。 When the micro component is formed in this manner, an expensive lithography apparatus such as a stepper is not required, and it is not necessary to manufacture a mask for each component having a different shape, so that the manufacturing cost can be significantly reduced.
第 1図〜第 5図に示した例においては、 側面が垂直面となっている歯車を製造 する場合について説明したが、 レーザ一光線を照射する角度を調整することによ リ、 側面が垂直面ではなく傾斜している場合等、 複雑な形状の部品も製造するこ とができる。 In the example shown in FIGS. 1 to 5, the case where a gear having a vertical side surface is manufactured has been described, but by adjusting the angle at which one laser beam is irradiated, the side surface becomes vertical. Parts with complex shapes can be manufactured, such as when the surface is not a surface but is inclined.
例えば、 第 6図に示すように、 側面がテーパ状に形成されるマイクロ部品の場 合には、 図示のようにレーザー光線 8を斜めに照射することによってテーパ面 9 を有する凹部 1 0を形成することができる。 そして、 この凹部 1 0に金属を充填 すれば、 テーパ面 9に対応した側面を有するマイクロ部品が形成される。 このよ うに、 リソグラフィ一技術によリ従来の方法では製造することができない形状の マイクロ部品も製造することができる。 For example, as shown in FIG. 6, in the case of a micro component having a tapered side surface, a concave portion 10 having a tapered surface 9 is formed by irradiating a laser beam 8 obliquely as shown in the figure. be able to. Then, the recess 10 is filled with metal. Then, a micro component having a side surface corresponding to the tapered surface 9 is formed. In this way, it is possible to manufacture a micro component having a shape that cannot be manufactured by the conventional method using one lithography technique.
また、 本発明によれば、 マイクロマシンを構成するマイクロ部品そのものだけ でなく、 マイクロ部品を成形するための金型等の型枠を製造することもできる。 産業上の利用可能性 Further, according to the present invention, not only the micro component itself constituting the micro machine but also a mold such as a mold for molding the micro component can be manufactured. Industrial applicability
以上説明したように、 本発明に係るマイクロ部品の製造方法によれば、 物理的 外力によって製造しょうとするマイクロ部品の形状の凹部を基台に形成し、 その 凹部に金属を充填した後に基台を除去するようにしたため、 従来のようにマスク の製造ゃリソグラフィー技術によるマスクパターンの転写等が不要となる。 従つ て、設備費を大幅に低減することができ、製造コス卜の低減を図ることができる。 また、 物理的外力としてレーザー光線を用いた場合には、 側面が垂直面でない 形状のマイクロ部品も容易に製造することができるため、 従来製造が困難であつ た複雑な形状のマイクロ部品も容易かつ安価に製造することができる。 As described above, according to the method for manufacturing a micro component according to the present invention, a recess having the shape of a micro component to be manufactured by a physical external force is formed on a base, and the recess is filled with metal. This eliminates the need for mask manufacturing and mask pattern transfer by lithography technology as in the past. Therefore, equipment costs can be significantly reduced, and manufacturing costs can be reduced. In addition, when a laser beam is used as a physical external force, a micro component having a side surface that is not a vertical surface can be easily manufactured. Can be manufactured.
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10392431T DE10392431T5 (en) | 2002-06-03 | 2003-05-23 | Production process for microcomponents |
| AU2003242436A AU2003242436A1 (en) | 2002-06-03 | 2003-05-23 | Mthod of producing micro component |
| KR10-2004-7015921A KR20040111494A (en) | 2002-06-03 | 2003-05-23 | Method of producing micro component |
| US10/506,015 US20050103635A1 (en) | 2002-06-03 | 2003-05-23 | Method of producing micro component |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-161389 | 2002-06-03 | ||
| JP2002161389A JP2004009144A (en) | 2002-06-03 | 2002-06-03 | Manufacturing method of micro parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003101889A1 true WO2003101889A1 (en) | 2003-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2003/006475 Ceased WO2003101889A1 (en) | 2002-06-03 | 2003-05-23 | Mthod of producing micro component |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20050103635A1 (en) |
| JP (1) | JP2004009144A (en) |
| KR (1) | KR20040111494A (en) |
| AU (1) | AU2003242436A1 (en) |
| DE (1) | DE10392431T5 (en) |
| WO (1) | WO2003101889A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10161493C5 (en) * | 2001-12-14 | 2008-09-18 | Micromotion Gmbh | Gearbox according to the voltage wave principle with hollow shafts |
| DE06405114T1 (en) * | 2006-03-15 | 2008-04-24 | Doniar S.A. | LIGA Process for producing a single or multilayer metallic structure and structure produced therewith |
| JP4526556B2 (en) * | 2007-09-18 | 2010-08-18 | 株式会社木村鋳造所 | Manufacturing method of micro parts |
| US8216697B2 (en) | 2009-02-13 | 2012-07-10 | Global Oled Technology Llc | OLED with fluoranthene-macrocyclic materials |
| EP3034461B1 (en) * | 2014-12-19 | 2020-07-01 | Rolex Sa | Production of a multi-level clock component |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10168591A (en) * | 1996-12-11 | 1998-06-23 | Yaskawa Electric Corp | Manufacturing method of micro mechanical parts |
| JPH10202757A (en) * | 1997-01-24 | 1998-08-04 | Fuji Xerox Co Ltd | Microstructure, and manufacture and device therefor |
| JP2002307398A (en) * | 2001-04-18 | 2002-10-23 | Mitsui Chemicals Inc | Manufacturing method of microstructure |
| JP2003200396A (en) * | 2001-10-29 | 2003-07-15 | Sumitomo Electric Ind Ltd | Manufacturing method of metal microstructure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159681A (en) * | 1997-05-28 | 2000-12-12 | Syntrix Biochip, Inc. | Light-mediated method and apparatus for the regional analysis of biologic material |
| US20020119079A1 (en) * | 1999-12-10 | 2002-08-29 | Norbert Breuer | Chemical microreactor and microreactor made by process |
| JP3865989B2 (en) * | 2000-01-13 | 2007-01-10 | 新光電気工業株式会社 | Multilayer wiring board, wiring board, multilayer wiring board manufacturing method, wiring board manufacturing method, and semiconductor device |
| US7855342B2 (en) * | 2000-09-25 | 2010-12-21 | Ibiden Co., Ltd. | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| US6422528B1 (en) * | 2001-01-17 | 2002-07-23 | Sandia National Laboratories | Sacrificial plastic mold with electroplatable base |
-
2002
- 2002-06-03 JP JP2002161389A patent/JP2004009144A/en not_active Withdrawn
-
2003
- 2003-05-23 KR KR10-2004-7015921A patent/KR20040111494A/en not_active Ceased
- 2003-05-23 WO PCT/JP2003/006475 patent/WO2003101889A1/en not_active Ceased
- 2003-05-23 AU AU2003242436A patent/AU2003242436A1/en not_active Abandoned
- 2003-05-23 DE DE10392431T patent/DE10392431T5/en not_active Withdrawn
- 2003-05-23 US US10/506,015 patent/US20050103635A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10168591A (en) * | 1996-12-11 | 1998-06-23 | Yaskawa Electric Corp | Manufacturing method of micro mechanical parts |
| JPH10202757A (en) * | 1997-01-24 | 1998-08-04 | Fuji Xerox Co Ltd | Microstructure, and manufacture and device therefor |
| JP2002307398A (en) * | 2001-04-18 | 2002-10-23 | Mitsui Chemicals Inc | Manufacturing method of microstructure |
| JP2003200396A (en) * | 2001-10-29 | 2003-07-15 | Sumitomo Electric Ind Ltd | Manufacturing method of metal microstructure |
Also Published As
| Publication number | Publication date |
|---|---|
| US20050103635A1 (en) | 2005-05-19 |
| AU2003242436A1 (en) | 2003-12-19 |
| JP2004009144A (en) | 2004-01-15 |
| KR20040111494A (en) | 2004-12-31 |
| DE10392431T5 (en) | 2005-06-30 |
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