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WO2003038862A3 - Pads for cmp and polishing substrates - Google Patents

Pads for cmp and polishing substrates Download PDF

Info

Publication number
WO2003038862A3
WO2003038862A3 PCT/US2002/034617 US0234617W WO03038862A3 WO 2003038862 A3 WO2003038862 A3 WO 2003038862A3 US 0234617 W US0234617 W US 0234617W WO 03038862 A3 WO03038862 A3 WO 03038862A3
Authority
WO
WIPO (PCT)
Prior art keywords
pads
cmp
substrates
polishing substrates
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/034617
Other languages
French (fr)
Other versions
WO2003038862A2 (en
Inventor
Thomas West
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomas West Inc
Original Assignee
Thomas West Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas West Inc filed Critical Thomas West Inc
Priority to JP2003541020A priority Critical patent/JP2005518286A/en
Priority to EP02776348A priority patent/EP1465753A2/en
Priority to AU2002342182A priority patent/AU2002342182A1/en
Publication of WO2003038862A2 publication Critical patent/WO2003038862A2/en
Publication of WO2003038862A3 publication Critical patent/WO2003038862A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Nonwoven Fabrics (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)

Abstract

Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads are substantially porous and substantially hard for improved polishing and planarization properties. Pads according to some embodiments of the present invention have beneficial properties like those of standard technology porous pads and beneficial properties like those of standard technology hard pads.
PCT/US2002/034617 2001-10-29 2002-10-29 Pads for cmp and polishing substrates Ceased WO2003038862A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003541020A JP2005518286A (en) 2001-10-29 2002-10-29 CMP and substrate polishing pad
EP02776348A EP1465753A2 (en) 2001-10-29 2002-10-29 Pads for cmp and polishing substrates
AU2002342182A AU2002342182A1 (en) 2001-10-29 2002-10-29 Pads for cmp and polishing substrates

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US34081901P 2001-10-29 2001-10-29
US60/340,819 2001-10-29
US10/020,082 US20030100250A1 (en) 2001-10-29 2001-12-11 Pads for CMP and polishing substrates
US10/020,082 2001-12-11

Publications (2)

Publication Number Publication Date
WO2003038862A2 WO2003038862A2 (en) 2003-05-08
WO2003038862A3 true WO2003038862A3 (en) 2004-03-11

Family

ID=26692987

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/034617 Ceased WO2003038862A2 (en) 2001-10-29 2002-10-29 Pads for cmp and polishing substrates

Country Status (6)

Country Link
US (1) US20030100250A1 (en)
EP (1) EP1465753A2 (en)
JP (1) JP2005518286A (en)
KR (1) KR20050040838A (en)
AU (1) AU2002342182A1 (en)
WO (1) WO2003038862A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7425172B2 (en) 2003-03-25 2008-09-16 Nexplanar Corporation Customized polish pads for chemical mechanical planarization
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
WO2005035194A2 (en) * 2003-10-09 2005-04-21 Thomas West, Inc. Stacked pad and method of use
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
US20070049169A1 (en) * 2005-08-02 2007-03-01 Vaidya Neha P Nonwoven polishing pads for chemical mechanical polishing
KR100723959B1 (en) * 2006-08-29 2007-06-04 주식회사 디스텍 CMP polishing pad whose main material is bast fiber and its manufacturing method
EP2123400B1 (en) * 2007-02-01 2012-10-10 Kuraray Co., Ltd. Polishing pad and process for production of polishing pad
EP2316614B1 (en) 2008-08-08 2019-07-17 Kuraray Co., Ltd. Polishing pad and method for manufacturing the polishing pad
JP6220378B2 (en) 2013-02-12 2017-10-25 株式会社クラレ Hard sheet and method for manufacturing hard sheet
KR102129665B1 (en) 2018-07-26 2020-07-02 에스케이씨 주식회사 Polishing pad, preparation method thereof, and polishing method applying of the same
JP7370342B2 (en) 2018-12-27 2023-10-27 株式会社クラレ polishing pad
US11628535B2 (en) 2019-09-26 2023-04-18 Skc Solmics Co., Ltd. Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5394655A (en) * 1993-08-31 1995-03-07 Texas Instruments Incorporated Semiconductor polishing pad
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US6099954A (en) * 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6712681B1 (en) * 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US4954141A (en) * 1988-01-28 1990-09-04 Showa Denko Kabushiki Kaisha Polishing pad for semiconductor wafers
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods

Also Published As

Publication number Publication date
KR20050040838A (en) 2005-05-03
WO2003038862A2 (en) 2003-05-08
EP1465753A2 (en) 2004-10-13
US20030100250A1 (en) 2003-05-29
AU2002342182A1 (en) 2003-05-12
JP2005518286A (en) 2005-06-23

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