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WO2003037985A1 - Compositions de resine epoxyde reticulables et procede de production associe - Google Patents

Compositions de resine epoxyde reticulables et procede de production associe Download PDF

Info

Publication number
WO2003037985A1
WO2003037985A1 PCT/JP2002/011395 JP0211395W WO03037985A1 WO 2003037985 A1 WO2003037985 A1 WO 2003037985A1 JP 0211395 W JP0211395 W JP 0211395W WO 03037985 A1 WO03037985 A1 WO 03037985A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curable epoxy
production
resin composition
mechanical properties
Prior art date
Application number
PCT/JP2002/011395
Other languages
English (en)
French (fr)
Inventor
Kazutoshi Haraguchi
Akira Ohbayashi
Original Assignee
Kawamura Institute Of Chemical Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Institute Of Chemical Research filed Critical Kawamura Institute Of Chemical Research
Priority to EP02778022A priority Critical patent/EP1441008B1/en
Priority to US10/492,194 priority patent/US7378461B2/en
Priority to DE60235183T priority patent/DE60235183D1/de
Publication of WO2003037985A1 publication Critical patent/WO2003037985A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006—Pressing and sintering powders, granules or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/JP2002/011395 2001-10-31 2002-10-31 Compositions de resine epoxyde reticulables et procede de production associe WO2003037985A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02778022A EP1441008B1 (en) 2001-10-31 2002-10-31 Curable epoxy resin compositions and process for production thereof
US10/492,194 US7378461B2 (en) 2001-10-31 2002-10-31 Curable epoxy resin compositions and process for production thereof
DE60235183T DE60235183D1 (de) 2001-10-31 2002-10-31 Härtbare epoxidharzzusammensetzungen und herstellungsverfahren dafür

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-334477 2001-10-31
JP2001334477 2001-10-31

Publications (1)

Publication Number Publication Date
WO2003037985A1 true WO2003037985A1 (fr) 2003-05-08

Family

ID=19149597

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/011395 WO2003037985A1 (fr) 2001-10-31 2002-10-31 Compositions de resine epoxyde reticulables et procede de production associe

Country Status (5)

Country Link
US (1) US7378461B2 (ja)
EP (1) EP1441008B1 (ja)
CN (1) CN1274760C (ja)
DE (1) DE60235183D1 (ja)
WO (1) WO2003037985A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1652869A4 (en) * 2003-08-05 2006-08-02 Kawamura Inst Chem Res EPOXY RESIN COMPOSITION AND METHOD FOR PRODUCING HEAT RESISTANT SHEET
JP4574234B2 (ja) * 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
JP2009521562A (ja) * 2005-12-22 2009-06-04 ダウ グローバル テクノロジーズ インコーポレイティド 混合触媒系を含む硬化性エポキシ樹脂組成物およびそれから作られた積層体
EP1985616A1 (en) * 2006-01-27 2008-10-29 Idemitsu Kosan Co., Ltd. Adamantane derivative, resin composition containing same, and optoelectronic member and sealing agent for electronic circuit using those
KR20100058521A (ko) * 2007-08-02 2010-06-03 다우 글로벌 테크놀로지스 인크. 열경화된 완충재
JP5762140B2 (ja) * 2010-07-23 2015-08-12 ダンロップスポーツ株式会社 ゴルフボール
JP2014523451A (ja) * 2011-05-02 2014-09-11 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂中のホウ酸トリメチル
RU2587169C1 (ru) * 2014-12-15 2016-06-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Состав эпоксибисмалеимидной смолы и способ ее получения
CN111602010B (zh) 2017-12-06 2021-12-07 A.O.史密斯公司 具有有机聚合物涂层的热水器
US12305067B2 (en) * 2020-06-15 2025-05-20 Bortigin Llc Additive material composition and products made therefrom

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255560A (en) * 1991-02-19 1992-11-11 Pilkington Plc Fire resistant compositions and laminates
JPH0673156A (ja) * 1992-06-24 1994-03-15 Shikoku Chem Corp 潜在性エポキシ硬化剤及びその製造方法並びにエポキシ樹脂組成物
JP2002338787A (ja) * 2001-05-15 2002-11-27 Kawamura Inst Of Chem Res エポキシ樹脂組成物及びその硬化物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704229A (en) * 1968-12-26 1972-11-28 Toka Shikiso Chem Ind Epoxy resin curing agent
SU514004A1 (ru) 1974-07-24 1976-05-15 Всесоюзный научно-исследовательский институт гидромеханизации, санитарно-технических и специальных строительных работ Борсодержаща эпоксидна композици
US4529467A (en) * 1983-10-25 1985-07-16 Ppg Industries, Inc. Fire protective intumescent mastic composition and method employing same
JP2756630B2 (ja) 1992-10-05 1998-05-25 四国化成工業株式会社 エポキシ樹脂組成物
US5464910A (en) * 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
US5834551A (en) * 1994-06-10 1998-11-10 Dainippon Ink And Chemicals, Inc. Composite of thermosetting resin with metallic oxide and process for the preparation thereof
JP3584501B2 (ja) * 1994-09-30 2004-11-04 大日本インキ化学工業株式会社 エポキシ樹脂と金属酸化物の複合体及びその製造法
JP3476994B2 (ja) * 1996-03-29 2003-12-10 四国化成工業株式会社 エポキシ樹脂組成物
JPH1025334A (ja) 1996-07-09 1998-01-27 Shinko Kagaku Kogyo Kk 潜在性硬化型樹脂組成物及びこれを用いて形成した潜在性硬化型接着性シート
JP2001213938A (ja) * 2000-01-31 2001-08-07 Nippon Paint Co Ltd アミノポリエーテル変性エポキシおよびこれを含有するカチオン電着塗料組成物
US20060280949A1 (en) * 2005-06-13 2006-12-14 Shinsuke Shirakawa Method for making amine-modified epoxy resin and cationic electrodeposition coating composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255560A (en) * 1991-02-19 1992-11-11 Pilkington Plc Fire resistant compositions and laminates
JPH0673156A (ja) * 1992-06-24 1994-03-15 Shikoku Chem Corp 潜在性エポキシ硬化剤及びその製造方法並びにエポキシ樹脂組成物
JP2002338787A (ja) * 2001-05-15 2002-11-27 Kawamura Inst Of Chem Res エポキシ樹脂組成物及びその硬化物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1441008A4 *

Also Published As

Publication number Publication date
DE60235183D1 (de) 2010-03-11
US7378461B2 (en) 2008-05-27
EP1441008B1 (en) 2010-01-20
EP1441008A1 (en) 2004-07-28
CN1274760C (zh) 2006-09-13
US20040254328A1 (en) 2004-12-16
CN1578809A (zh) 2005-02-09
EP1441008A4 (en) 2006-03-22

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