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WO2003036737A8 - Structures micro-usinees a surface renforcee, et procede de fabrication - Google Patents

Structures micro-usinees a surface renforcee, et procede de fabrication Download PDF

Info

Publication number
WO2003036737A8
WO2003036737A8 PCT/US2002/033351 US0233351W WO03036737A8 WO 2003036737 A8 WO2003036737 A8 WO 2003036737A8 US 0233351 W US0233351 W US 0233351W WO 03036737 A8 WO03036737 A8 WO 03036737A8
Authority
WO
WIPO (PCT)
Prior art keywords
silicon nitride
silicon
devices
substrate
same
Prior art date
Application number
PCT/US2002/033351
Other languages
English (en)
Other versions
WO2003036737A2 (fr
WO2003036737A3 (fr
Inventor
David L Dickensheets
Todd J Kaiser
Philip A Himmer
Jeffrey Lutzenberger
Robert A Friholm
Original Assignee
Univ Montana State
David L Dickensheets
Todd J Kaiser
Philip A Himmer
Jeffrey Lutzenberger
Robert A Friholm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Montana State, David L Dickensheets, Todd J Kaiser, Philip A Himmer, Jeffrey Lutzenberger, Robert A Friholm filed Critical Univ Montana State
Priority to AU2002343537A priority Critical patent/AU2002343537A1/en
Priority to JP2003539116A priority patent/JP2005506909A/ja
Priority to EP02780484A priority patent/EP1438256A2/fr
Priority to US10/493,140 priority patent/US20090065429A9/en
Publication of WO2003036737A2 publication Critical patent/WO2003036737A2/fr
Publication of WO2003036737A3 publication Critical patent/WO2003036737A3/fr
Publication of WO2003036737A8 publication Critical patent/WO2003036737A8/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

L'invention concerne des structures micro-usinées à surface renforcée, et un procédé de fabrication correspondant. Un substrat en silicium (10) est d'abord attaqué, donnant un moule qui contient plusieurs tranchées ou rainures (14) à configuration en treillis. On développe ensuite de l'oxyde sacrifié (15) sur le substrat (10), puis un élément de renforcement (16) au nitrure de silicium est déposé à la surface du substrat, remplissant les rainures de nitrure de silicium. Une fois mis en forme, ce nitrure de silicium donne des éléments mécaniques, et on dépose alors du métal (40), également mis en forme pour la constitution des conducteurs et des condensateurs nécessaires à l'actionnement électrostatique des éléments mécaniques en question. Enfin, on élimine le silicium sous-jacent et l'oxyde sacrifié en attaquant le moule par le dessous des dispositifs micro-usinés ainsi réalisés, laissant apparaître des dispositifs au nitrure de silicium se dressant librement et dotés de nervures verticales. Les dispositifs considérés ont une rigidité accrue de courbure hors plan en raison de la présence des nervures verticales de renforcement. L'invention concerne également des miroirs de pointage bi-axial au nitrure de silicium, équipés de ces nervures.
PCT/US2002/033351 2001-10-22 2002-10-21 Structures micro-usinees a surface renforcee, et procede de fabrication WO2003036737A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002343537A AU2002343537A1 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same
JP2003539116A JP2005506909A (ja) 2001-10-22 2002-10-21 補強面微細加工構造物およびその製造方法
EP02780484A EP1438256A2 (fr) 2001-10-22 2002-10-21 Structures micro-usinees a surface renforcee, et procede de fabrication
US10/493,140 US20090065429A9 (en) 2001-10-22 2002-10-21 Stiffened surface micromachined structures and process for fabricating the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US33043501P 2001-10-22 2001-10-22
US33043301P 2001-10-22 2001-10-22
US60/330,435 2001-10-22
US60/330,433 2001-10-22

Publications (3)

Publication Number Publication Date
WO2003036737A2 WO2003036737A2 (fr) 2003-05-01
WO2003036737A3 WO2003036737A3 (fr) 2003-11-20
WO2003036737A8 true WO2003036737A8 (fr) 2008-12-31

Family

ID=23289754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/033351 WO2003036737A2 (fr) 2001-10-22 2002-10-21 Structures micro-usinees a surface renforcee, et procede de fabrication

Country Status (4)

Country Link
EP (1) EP1438256A2 (fr)
JP (1) JP2005506909A (fr)
AU (1) AU2002343537A1 (fr)
WO (1) WO2003036737A2 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6912082B1 (en) * 2004-03-11 2005-06-28 Palo Alto Research Center Incorporated Integrated driver electronics for MEMS device using high voltage thin film transistors
DE112007003051B4 (de) * 2007-01-23 2012-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanisches Bauelement mit erhöhter Steifigkeit und Verfahren zum Herstellen desselben
US8888252B2 (en) 2008-07-09 2014-11-18 Hewlett-Packard Development Company, L.P. Print head slot ribs
DE102009026629B4 (de) * 2009-06-02 2017-09-21 Robert Bosch Gmbh Mikromechanisches System mit einer vergrabenen dünnen strukturierten Polysiliziumschicht und Verfahren zu dessen Herstellung
JP5630015B2 (ja) * 2009-12-28 2014-11-26 株式会社ニコン 空間光変調器、露光装置およびそれらの製造方法
WO2011080883A1 (fr) * 2009-12-28 2011-07-07 株式会社ニコン Convertisseur électromécanique, modulateur optique spatial, dispositif d'exposition, et leurs procédés de fabrication
JP6188692B2 (ja) * 2011-07-29 2017-08-30 ノヴァンタ コーポレーション 化学エッチングを行って高剛性且つ低慣性のミラーを提供するシステム及び方法
US9409763B2 (en) 2012-04-04 2016-08-09 Infineon Technologies Ag MEMS device and method of making a MEMS device
JP2013255975A (ja) * 2012-06-14 2013-12-26 Fujitsu Ltd 電子装置
US9212045B1 (en) * 2014-07-31 2015-12-15 Infineon Technologies Ag Micro mechanical structure and method for fabricating the same
DE102019111634A1 (de) * 2019-05-06 2020-11-12 Lpkf Laser & Electronics Ag Verfahren zur Herstellung von Mikrostrukturen in einem Glassubstrat
US11460688B2 (en) * 2019-08-23 2022-10-04 Tohoku University Mirror device, scanning laser device and scanning laser display including same mirror device, and method for manufacturing mirror device
CN115140703B (zh) * 2022-07-08 2024-09-17 山东大学 一种预应变辅助的褶皱形式微纳结构制造装置及方法
DE102023132557A1 (de) * 2023-11-22 2025-05-22 Tdk Electronics Ag Mikroelektromechanischer Spiegel, Verfahren zum Betrieb eines mikroelektromechanischen Spiegels, Projektionsvorrichtung und Verfahren zur Herstellung eines mikromechanischen Spiegels

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660680A (en) * 1994-03-07 1997-08-26 The Regents Of The University Of California Method for fabrication of high vertical aspect ratio thin film structures
US5628917A (en) * 1995-02-03 1997-05-13 Cornell Research Foundation, Inc. Masking process for fabricating ultra-high aspect ratio, wafer-free micro-opto-electromechanical structures
US6411754B1 (en) * 2000-08-25 2002-06-25 Corning Incorporated Micromechanical optical switch and method of manufacture

Also Published As

Publication number Publication date
JP2005506909A (ja) 2005-03-10
AU2002343537A8 (en) 2009-01-29
AU2002343537A1 (en) 2003-05-06
EP1438256A2 (fr) 2004-07-21
WO2003036737A2 (fr) 2003-05-01
WO2003036737A3 (fr) 2003-11-20

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