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WO2003034483A1 - Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme - Google Patents

Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme Download PDF

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Publication number
WO2003034483A1
WO2003034483A1 PCT/JP2002/010682 JP0210682W WO03034483A1 WO 2003034483 A1 WO2003034483 A1 WO 2003034483A1 JP 0210682 W JP0210682 W JP 0210682W WO 03034483 A1 WO03034483 A1 WO 03034483A1
Authority
WO
WIPO (PCT)
Prior art keywords
treatment subject
elevating mechanism
space
push
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/010682
Other languages
English (en)
French (fr)
Inventor
Hachishiro Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to US10/492,979 priority Critical patent/US20050000450A1/en
Priority to JP2003537113A priority patent/JP4260630B2/ja
Publication of WO2003034483A1 publication Critical patent/WO2003034483A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Treatment Of Fiber Materials (AREA)
PCT/JP2002/010682 2001-10-16 2002-10-15 Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme Ceased WO2003034483A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/492,979 US20050000450A1 (en) 2001-10-16 2002-10-15 Treatment subject elevating mechanism, and treating device using the same
JP2003537113A JP4260630B2 (ja) 2001-10-16 2002-10-15 被処理体の昇降機構及びこれを用いた処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001/318636 2001-10-16
JP2001318636 2001-10-16

Publications (1)

Publication Number Publication Date
WO2003034483A1 true WO2003034483A1 (fr) 2003-04-24

Family

ID=19136302

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/010682 Ceased WO2003034483A1 (fr) 2001-10-16 2002-10-15 Mecanisme elevateur d'element a traiter et dispositif de traitement utilisant ce mecanisme

Country Status (5)

Country Link
US (1) US20050000450A1 (ja)
JP (1) JP4260630B2 (ja)
KR (1) KR100666764B1 (ja)
CN (1) CN1331208C (ja)
WO (1) WO2003034483A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086427A (ja) * 2004-09-17 2006-03-30 Nikon Corp 基板保持方法とその装置及び露光装置
JP2008004575A (ja) * 2006-06-20 2008-01-10 Tokyo Ohka Kogyo Co Ltd 支持ピン
WO2010032750A1 (ja) * 2008-09-16 2010-03-25 東京エレクトロン株式会社 基板処理装置および基板載置台
JP2010073751A (ja) * 2008-09-16 2010-04-02 Tokyo Electron Ltd プラズマ処理装置および基板載置台
JP2015023041A (ja) * 2013-07-16 2015-02-02 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2021111783A (ja) * 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー チャネル付きリフトピン
JP2023137547A (ja) * 2022-03-18 2023-09-29 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法
JP2024062970A (ja) * 2022-10-25 2024-05-10 ウォニク アイピーエス カンパニー リミテッド 基板支持モジュール及びそれを含む基板処理装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101847574B (zh) * 2006-01-31 2012-11-07 东京毅力科创株式会社 基板处理装置和暴露于等离子体的部件
DE102007022431A1 (de) * 2007-05-09 2008-11-13 Leybold Optics Gmbh Behandlungssystem für flache Substrate
KR101406172B1 (ko) * 2013-01-08 2014-06-12 (주)에스티아이 반도체 웨이퍼의 연속 처리 장치 및 방법
KR102097109B1 (ko) * 2013-01-21 2020-04-10 에이에스엠 아이피 홀딩 비.브이. 증착 장치
US10857655B2 (en) * 2013-03-13 2020-12-08 Applied Materials, Inc. Substrate support plate with improved lift pin sealing
US9991153B2 (en) * 2013-03-14 2018-06-05 Applied Materials, Inc. Substrate support bushing
US10163676B2 (en) * 2013-06-27 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and system for preventing backside peeling defects on semiconductor wafers
DE102016212780A1 (de) * 2016-07-13 2018-01-18 Siltronic Ag Vorrichtung zur Handhabung einer Halbleiterscheibe in einem Epitaxie-Reaktor und Verfahren zur Herstellung einer Halbleiterscheibe mit epitaktischer Schicht
GB201709446D0 (en) * 2017-06-14 2017-07-26 Semblant Ltd Plasma processing apparatus
KR102058034B1 (ko) 2017-11-30 2019-12-20 피에스케이홀딩스 (주) 리프트 핀 유닛 및 이를 구비하는 기판 지지 유닛
CN114008734A (zh) * 2019-06-19 2022-02-01 朗姆研究公司 在传送衬底期间使用真空
JP7270049B2 (ja) * 2019-09-17 2023-05-09 株式会社Kokusai Electric 基板処理装置、サセプタカバー、半導体装置の製造方法、及び基板処理方法
JP2021097162A (ja) * 2019-12-18 2021-06-24 東京エレクトロン株式会社 基板処理装置及び載置台
CN113764329A (zh) * 2020-06-02 2021-12-07 拓荆科技股份有限公司 具有压力平衡机制之支撑销、基板载台及基板处理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142829A (ja) * 1986-12-05 1988-06-15 Nippon Telegr & Teleph Corp <Ntt> 基板吸着固定装置
EP0623947A1 (en) * 1993-05-05 1994-11-09 Applied Materials, Inc. Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing
JPH0722496A (ja) * 1993-06-29 1995-01-24 Nikon Corp 基板の吸着保持装置
JPH07263523A (ja) * 1994-03-24 1995-10-13 Kawasaki Steel Corp ウェーハ載置台
JPH0982594A (ja) * 1995-09-18 1997-03-28 Kokusai Electric Co Ltd 半導体製造装置における室内減圧方法
JP2001024047A (ja) * 1999-07-07 2001-01-26 Applied Materials Inc 基板支持装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5273588A (en) * 1992-06-15 1993-12-28 Materials Research Corporation Semiconductor wafer processing CVD reactor apparatus comprising contoured electrode gas directing means
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
JP3602324B2 (ja) * 1998-02-17 2004-12-15 アルプス電気株式会社 プラズマ処理装置
JP2000286242A (ja) * 1999-03-31 2000-10-13 Tokyo Electron Ltd プラズマ処理装置
JP3398936B2 (ja) * 1999-04-09 2003-04-21 日本エー・エス・エム株式会社 半導体処理装置
JP3459790B2 (ja) * 1999-05-18 2003-10-27 山形日本電気株式会社 除電機能付静電チャック及び静電チャックの除電方法
JP4418051B2 (ja) * 1999-06-16 2010-02-17 平田機工株式会社 熱処理装置
JP2001240247A (ja) * 2000-03-01 2001-09-04 Ishikawajima Harima Heavy Ind Co Ltd コンテナヤードにおけるコンテナの管理装置および管理方法
JP3736264B2 (ja) * 2000-02-29 2006-01-18 セイコーエプソン株式会社 プラズマ処理装置およびプラズマ処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63142829A (ja) * 1986-12-05 1988-06-15 Nippon Telegr & Teleph Corp <Ntt> 基板吸着固定装置
EP0623947A1 (en) * 1993-05-05 1994-11-09 Applied Materials, Inc. Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing
JPH0722496A (ja) * 1993-06-29 1995-01-24 Nikon Corp 基板の吸着保持装置
JPH07263523A (ja) * 1994-03-24 1995-10-13 Kawasaki Steel Corp ウェーハ載置台
JPH0982594A (ja) * 1995-09-18 1997-03-28 Kokusai Electric Co Ltd 半導体製造装置における室内減圧方法
JP2001024047A (ja) * 1999-07-07 2001-01-26 Applied Materials Inc 基板支持装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006086427A (ja) * 2004-09-17 2006-03-30 Nikon Corp 基板保持方法とその装置及び露光装置
JP2008004575A (ja) * 2006-06-20 2008-01-10 Tokyo Ohka Kogyo Co Ltd 支持ピン
WO2010032750A1 (ja) * 2008-09-16 2010-03-25 東京エレクトロン株式会社 基板処理装置および基板載置台
JP2010073751A (ja) * 2008-09-16 2010-04-02 Tokyo Electron Ltd プラズマ処理装置および基板載置台
JP2015023041A (ja) * 2013-07-16 2015-02-02 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2021111783A (ja) * 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー チャネル付きリフトピン
JP7636892B2 (ja) 2020-01-06 2025-02-27 エーエスエム・アイピー・ホールディング・ベー・フェー チャネル付きリフトピン
JP2023137547A (ja) * 2022-03-18 2023-09-29 東京エレクトロン株式会社 基板載置台、基板処理装置及び基板処理方法
JP2024062970A (ja) * 2022-10-25 2024-05-10 ウォニク アイピーエス カンパニー リミテッド 基板支持モジュール及びそれを含む基板処理装置
JP7781834B2 (ja) 2022-10-25 2025-12-08 ウォニク アイピーエス カンパニー リミテッド 基板支持モジュール及びそれを含む基板処理装置

Also Published As

Publication number Publication date
JPWO2003034483A1 (ja) 2005-02-03
CN1605125A (zh) 2005-04-06
KR100666764B1 (ko) 2007-01-09
KR20050036858A (ko) 2005-04-20
US20050000450A1 (en) 2005-01-06
CN1331208C (zh) 2007-08-08
JP4260630B2 (ja) 2009-04-30

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