WO2003034475A1 - Method and device for gas displacement, mask protective device, mask, and method and device for exposure - Google Patents
Method and device for gas displacement, mask protective device, mask, and method and device for exposure Download PDFInfo
- Publication number
- WO2003034475A1 WO2003034475A1 PCT/JP2002/010552 JP0210552W WO03034475A1 WO 2003034475 A1 WO2003034475 A1 WO 2003034475A1 JP 0210552 W JP0210552 W JP 0210552W WO 03034475 A1 WO03034475 A1 WO 03034475A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas
- space
- mask
- gas replacement
- pellicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003537107A JPWO2003034475A1 (en) | 2001-10-10 | 2002-10-10 | Gas replacement method and apparatus, mask protection apparatus, mask, exposure method and apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313136 | 2001-10-10 | ||
| JP2001-313136 | 2001-10-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003034475A1 true WO2003034475A1 (en) | 2003-04-24 |
Family
ID=19131676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2002/010552 Ceased WO2003034475A1 (en) | 2001-10-10 | 2002-10-10 | Method and device for gas displacement, mask protective device, mask, and method and device for exposure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2003034475A1 (en) |
| WO (1) | WO2003034475A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005010700A (en) * | 2003-06-23 | 2005-01-13 | Toppan Printing Co Ltd | Exposure plate inspection apparatus and inspection method |
| JP2009182339A (en) * | 2004-12-07 | 2009-08-13 | Asml Netherlands Bv | Lithographic apparatus, reticle exchange unit, and device manufacturing method |
| US7619718B2 (en) | 2003-10-07 | 2009-11-17 | Asml Holding N.V. | Method and system for active purging of pellicle volumes |
| JP2013539559A (en) * | 2010-09-08 | 2013-10-24 | アデイクセン・バキユーム・プロダクト | Method and apparatus for removing contamination of reticle with pellicle |
| US9403196B2 (en) | 2010-06-29 | 2016-08-02 | Adixen Vacuum Products | Treatment device for transport and storage boxes |
| US9779972B2 (en) | 2009-12-18 | 2017-10-03 | Adixen Vacuum Products | Method and device for controlling the manufacture of semiconductor by measuring contamination |
| US11868041B2 (en) * | 2017-05-10 | 2024-01-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106233201A (en) * | 2014-05-02 | 2016-12-14 | 三井化学株式会社 | Protecting film component blocks, protecting film assembly and manufacture method thereof, exposure master and the manufacture method of manufacture method, exposure device and semiconductor device thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0627644A (en) * | 1992-07-08 | 1994-02-04 | Seiko Epson Corp | Pellicle and production of pellicle |
| JP2001267200A (en) * | 2000-03-14 | 2001-09-28 | Nikon Corp | Gas replacement method and apparatus, and exposure method and apparatus |
| JP2002033258A (en) * | 2000-07-17 | 2002-01-31 | Nikon Corp | Exposure apparatus, mask apparatus, pattern protection apparatus, and device manufacturing method |
| JP2002372777A (en) * | 2001-06-18 | 2002-12-26 | Canon Inc | Gas replacement method and exposure apparatus |
-
2002
- 2002-10-10 WO PCT/JP2002/010552 patent/WO2003034475A1/en not_active Ceased
- 2002-10-10 JP JP2003537107A patent/JPWO2003034475A1/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0627644A (en) * | 1992-07-08 | 1994-02-04 | Seiko Epson Corp | Pellicle and production of pellicle |
| JP2001267200A (en) * | 2000-03-14 | 2001-09-28 | Nikon Corp | Gas replacement method and apparatus, and exposure method and apparatus |
| JP2002033258A (en) * | 2000-07-17 | 2002-01-31 | Nikon Corp | Exposure apparatus, mask apparatus, pattern protection apparatus, and device manufacturing method |
| JP2002372777A (en) * | 2001-06-18 | 2002-12-26 | Canon Inc | Gas replacement method and exposure apparatus |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005010700A (en) * | 2003-06-23 | 2005-01-13 | Toppan Printing Co Ltd | Exposure plate inspection apparatus and inspection method |
| US7619718B2 (en) | 2003-10-07 | 2009-11-17 | Asml Holding N.V. | Method and system for active purging of pellicle volumes |
| JP2009182339A (en) * | 2004-12-07 | 2009-08-13 | Asml Netherlands Bv | Lithographic apparatus, reticle exchange unit, and device manufacturing method |
| US9779972B2 (en) | 2009-12-18 | 2017-10-03 | Adixen Vacuum Products | Method and device for controlling the manufacture of semiconductor by measuring contamination |
| US9403196B2 (en) | 2010-06-29 | 2016-08-02 | Adixen Vacuum Products | Treatment device for transport and storage boxes |
| JP2013539559A (en) * | 2010-09-08 | 2013-10-24 | アデイクセン・バキユーム・プロダクト | Method and apparatus for removing contamination of reticle with pellicle |
| US11868041B2 (en) * | 2017-05-10 | 2024-01-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2003034475A1 (en) | 2005-02-03 |
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Legal Events
| Date | Code | Title | Description |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 2003537107 Country of ref document: JP |
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| 122 | Ep: pct application non-entry in european phase |