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WO2003023790A1 - Conductor composition and method for production thereof - Google Patents

Conductor composition and method for production thereof Download PDF

Info

Publication number
WO2003023790A1
WO2003023790A1 PCT/JP2002/007530 JP0207530W WO03023790A1 WO 2003023790 A1 WO2003023790 A1 WO 2003023790A1 JP 0207530 W JP0207530 W JP 0207530W WO 03023790 A1 WO03023790 A1 WO 03023790A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
composition
production
conductor composition
metal powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/007530
Other languages
English (en)
French (fr)
Inventor
Atsushi Nagai
Kazutaka Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001269788A external-priority patent/JP3564089B2/ja
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to US10/488,615 priority Critical patent/US20040245507A1/en
Priority to KR1020047003404A priority patent/KR100855169B1/ko
Publication of WO2003023790A1 publication Critical patent/WO2003023790A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
PCT/JP2002/007530 2001-09-06 2002-07-25 Conductor composition and method for production thereof Ceased WO2003023790A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/488,615 US20040245507A1 (en) 2001-09-06 2002-07-25 Conductor composition and method for production thereof
KR1020047003404A KR100855169B1 (ko) 2001-09-06 2002-07-25 도체 조성물 및 그 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001269788A JP3564089B2 (ja) 2001-01-24 2001-09-06 導体ペースト及びその製造方法
JP2001-269788 2001-09-06

Publications (1)

Publication Number Publication Date
WO2003023790A1 true WO2003023790A1 (en) 2003-03-20

Family

ID=19095542

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007530 Ceased WO2003023790A1 (en) 2001-09-06 2002-07-25 Conductor composition and method for production thereof

Country Status (4)

Country Link
US (1) US20040245507A1 (ja)
KR (2) KR100855169B1 (ja)
CN (2) CN1316509C (ja)
WO (1) WO2003023790A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7938988B2 (en) * 2004-07-01 2011-05-10 Toyo Aluminium Kabushiki Kaisha Paste composition and solar cell element using the same

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JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
JP3736802B2 (ja) * 2002-11-25 2006-01-18 Ｔｄｋ株式会社 導電性組成物とセラミック電子部品
KR20050098908A (ko) * 2003-02-10 2005-10-12 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 은 금속 입자 및 금속 염을 포함하는 조성물
KR100728366B1 (ko) * 2005-02-04 2007-06-14 엘지전자 주식회사 플라즈마 디스플레이 전극 형성용 잉크조성물 및 전극의제조방법
JP2007019069A (ja) * 2005-07-05 2007-01-25 Toyo Aluminium Kk ペースト組成物およびそれを用いた太陽電池素子
JP4843291B2 (ja) * 2005-10-18 2011-12-21 東洋アルミニウム株式会社 アルミニウムペースト組成物およびそれを用いた太陽電池素子
US7872022B2 (en) * 2006-04-03 2011-01-18 Hoffmann-La Roche Inc. Serotonin transporter (SERT) inhibitors for the treatment of depression and anxiety
CN100499940C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺
CN100499942C (zh) * 2006-07-28 2009-06-10 王克政 基于金属基板的稀土厚膜电路稀土电阻浆料及其制备工艺
KR100711505B1 (ko) * 2007-01-30 2007-04-27 (주)이그잭스 도전막 형성을 위한 은 페이스트
US8143431B2 (en) * 2007-06-05 2012-03-27 Air Products And Chemicals, Inc. Low temperature thermal conductive inks
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
KR20100080612A (ko) * 2007-10-18 2010-07-09 이 아이 듀폰 디 네모아 앤드 캄파니 반도체 소자의 제조에 사용하기 위한 무연 전도성 조성물 및 공정: Ｍｇ-함유 첨가제
US7485245B1 (en) * 2007-10-18 2009-02-03 E.I. Du Pont De Nemours And Company Electrode paste for solar cell and solar cell electrode using the paste
JP2011503772A (ja) * 2007-10-18 2011-01-27 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 伝導性組成物、および半導体デバイスの製造における使用方法：Ｍｇ含有添加剤
JP2011097038A (ja) * 2009-10-02 2011-05-12 Ibiden Co Ltd セラミック配線基板およびその製造方法
TW201114876A (en) * 2009-10-29 2011-05-01 Giga Solar Materials Corp Conductive paste with surfactants
US9984787B2 (en) 2009-11-11 2018-05-29 Samsung Electronics Co., Ltd. Conductive paste and solar cell
KR101332429B1 (ko) * 2009-12-17 2013-11-22 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 태양전지
US8802230B2 (en) * 2009-12-18 2014-08-12 GM Global Technology Operations LLC Electrically-insulative coating, coating system and method
JP5075222B2 (ja) 2010-05-11 2012-11-21 Ｔｄｋ株式会社 電子部品及びその製造方法
KR101741683B1 (ko) 2010-08-05 2017-05-31 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
US8668847B2 (en) 2010-08-13 2014-03-11 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8987586B2 (en) 2010-08-13 2015-03-24 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
US8974703B2 (en) 2010-10-27 2015-03-10 Samsung Electronics Co., Ltd. Conductive paste and electronic device and solar cell including an electrode formed using the same
US9105370B2 (en) 2011-01-12 2015-08-11 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
US8940195B2 (en) 2011-01-13 2015-01-27 Samsung Electronics Co., Ltd. Conductive paste, and electronic device and solar cell including an electrode formed using the same
EP2787511B1 (en) * 2013-04-02 2018-05-30 Heraeus Deutschland GmbH & Co. KG Particles comprising Al and Ag in electro-conductive pastes and solar cell preparation
CN104112487A (zh) * 2013-04-18 2014-10-22 上海市灿晶电子材料有限公司 一种导电铜浆料及其制备方法和应用
EP3076401A1 (en) 2015-03-27 2016-10-05 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising a metal compound
US10636540B2 (en) 2015-03-27 2020-04-28 Heraeus Deutschland GmbH & Co. KG Electro-conductive pastes comprising an oxide additive
KR101930285B1 (ko) * 2016-10-31 2018-12-19 엘에스니꼬동제련 주식회사 태양전지 전극용 도전성 페이스트 및 이를 사용하여 제조된 태양전지
CN109524150B (zh) * 2018-07-06 2021-04-23 南通天盛新能源股份有限公司 一种全铝背场背银浆料及其制备方法与应用
CN110335700B (zh) * 2019-06-28 2021-11-26 乾宇电子材料(苏州)有限公司 高温烧结型黄光导电浆料、导电线路及制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179802A (ja) * 1985-02-05 1986-08-12 Fukuda Kinzoku Hakufun Kogyo Kk 金属粉の処理方法
JPH0320341A (ja) * 1989-06-16 1991-01-29 Mitsui Mining & Smelting Co Ltd 厚膜組成物用銅粉
JPH03297007A (ja) * 1990-04-13 1991-12-27 Dai Ichi Kogyo Seiyaku Co Ltd 厚膜導電性ペースト組成物
JPH06240183A (ja) * 1993-02-18 1994-08-30 Daiken Kagaku Kogyo Kk 電極用導電性塗料
JPH0762275A (ja) * 1993-08-26 1995-03-07 Asahi Chem Ind Co Ltd セラミック焼成基板用導体ペースト
JPH07242845A (ja) * 1994-03-08 1995-09-19 Daiken Kagaku Kogyo Kk 電極用導電性塗料およびその製造法
JPH09129028A (ja) * 1995-11-01 1997-05-16 Daiken Kagaku Kogyo Kk 無機皮膜を有する金属粉の製造法及び金属粉
JPH10340625A (ja) * 1997-04-08 1998-12-22 Matsushita Electric Ind Co Ltd 導電性ペーストおよびその製造方法およびそれを用いたプリント配線基板

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
US5184662A (en) * 1990-01-22 1993-02-09 Quick Nathaniel R Method for clad-coating ceramic particles
JPH07197103A (ja) * 1994-01-10 1995-08-01 Murata Mfg Co Ltd 金属粉末表面への金属化合物被覆方法
JP3414502B2 (ja) * 1994-06-15 2003-06-09 株式会社ノリタケカンパニーリミテド 高温焼成対応貴金属粉末および導体ペースト
US6488869B2 (en) * 1997-04-08 2002-12-03 Matsushita Electric Industrial Co., Ltd. Conductive paste, its manufacturing method, and printed wiring board using the same
JP3737617B2 (ja) * 1997-10-30 2006-01-18 日鉄鉱業株式会社 膜被覆粉体の製造方法
JP3511895B2 (ja) * 1998-06-05 2004-03-29 株式会社村田製作所 セラミック多層基板の製造方法
US20010016252A1 (en) * 2000-02-09 2001-08-23 Murata Manufacturing Co., Ltd. Conductive paste and ceramic electronic device using the same
JP3734731B2 (ja) * 2001-09-06 2006-01-11 株式会社ノリタケカンパニーリミテド セラミック電子部品及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179802A (ja) * 1985-02-05 1986-08-12 Fukuda Kinzoku Hakufun Kogyo Kk 金属粉の処理方法
JPH0320341A (ja) * 1989-06-16 1991-01-29 Mitsui Mining & Smelting Co Ltd 厚膜組成物用銅粉
JPH03297007A (ja) * 1990-04-13 1991-12-27 Dai Ichi Kogyo Seiyaku Co Ltd 厚膜導電性ペースト組成物
JPH06240183A (ja) * 1993-02-18 1994-08-30 Daiken Kagaku Kogyo Kk 電極用導電性塗料
JPH0762275A (ja) * 1993-08-26 1995-03-07 Asahi Chem Ind Co Ltd セラミック焼成基板用導体ペースト
JPH07242845A (ja) * 1994-03-08 1995-09-19 Daiken Kagaku Kogyo Kk 電極用導電性塗料およびその製造法
JPH09129028A (ja) * 1995-11-01 1997-05-16 Daiken Kagaku Kogyo Kk 無機皮膜を有する金属粉の製造法及び金属粉
JPH10340625A (ja) * 1997-04-08 1998-12-22 Matsushita Electric Ind Co Ltd 導電性ペーストおよびその製造方法およびそれを用いたプリント配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7938988B2 (en) * 2004-07-01 2011-05-10 Toyo Aluminium Kabushiki Kaisha Paste composition and solar cell element using the same

Also Published As

Publication number Publication date
CN1316509C (zh) 2007-05-16
KR100866220B1 (ko) 2008-10-30
CN101030457A (zh) 2007-09-05
CN1639806A (zh) 2005-07-13
KR20040044863A (ko) 2004-05-31
CN101030457B (zh) 2010-05-26
KR100855169B1 (ko) 2008-08-29
KR20080068938A (ko) 2008-07-24
US20040245507A1 (en) 2004-12-09

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