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WO2003015976A1 - Brittle material substrate chamfering method and chamfering device - Google Patents

Brittle material substrate chamfering method and chamfering device Download PDF

Info

Publication number
WO2003015976A1
WO2003015976A1 PCT/JP2002/008203 JP0208203W WO03015976A1 WO 2003015976 A1 WO2003015976 A1 WO 2003015976A1 JP 0208203 W JP0208203 W JP 0208203W WO 03015976 A1 WO03015976 A1 WO 03015976A1
Authority
WO
WIPO (PCT)
Prior art keywords
edge
laser spot
chamfered
glass substrate
chamfering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008203
Other languages
French (fr)
Japanese (ja)
Inventor
Haruo Wakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to KR1020037008580A priority Critical patent/KR100820689B1/en
Priority to JP2003520519A priority patent/JP3823108B2/en
Publication of WO2003015976A1 publication Critical patent/WO2003015976A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/04—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way
    • C03B29/06—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a continuous way with horizontal displacement of the products
    • C03B29/08—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C03B25/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A first laser spot (LS1) in elliptic shape having one end positioned on an edge (51) to be chamfered included in the side edges of a glass substrate (50). The major axis of the first laser spot (LS1) is inclined by an angle θ with respect to the edge, and the other end is positioned on the portion in vicinity of the edge (51). The heat energy intensity of the first laser spot (LS1) is low at the end positioned on the portion in the vicinity of the edge (51) and highest at the end positioned on the edge (51) to be chamfered. When the glass substrate (50) is moved in the X-direction, the first laser spot (LS1), after preheating the portion of the glass substrate (50) in the vicinity of the edge (51), melts and chamfers the edge (51). Further, after the edge (51) has been melted and chamfered, the substrate is heated by a second laser spot and then annealed, thereby making it possible to mitigate the residual stress and prevent the occurrence of fine cracks. Thereby, the edge (51) of the glass substrate can be reliably chamfered without producing cracks.
PCT/JP2002/008203 2001-08-10 2002-08-09 Brittle material substrate chamfering method and chamfering device Ceased WO2003015976A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020037008580A KR100820689B1 (en) 2001-08-10 2002-08-09 Chamfering Method and Chamfering Device for Brittle Material Substrate
JP2003520519A JP3823108B2 (en) 2001-08-10 2002-08-09 Chamfering method for brittle material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-244748 2001-08-10
JP2001244748 2001-08-10

Publications (1)

Publication Number Publication Date
WO2003015976A1 true WO2003015976A1 (en) 2003-02-27

Family

ID=19074633

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008203 Ceased WO2003015976A1 (en) 2001-08-10 2002-08-09 Brittle material substrate chamfering method and chamfering device

Country Status (5)

Country Link
JP (1) JP3823108B2 (en)
KR (1) KR100820689B1 (en)
CN (1) CN1283409C (en)
TW (1) TWI252788B (en)
WO (1) WO2003015976A1 (en)

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WO2006125306A1 (en) * 2005-05-23 2006-11-30 Quality Craft Ltd. Flooring connection
US7217640B2 (en) 2003-05-16 2007-05-15 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing method thereof
WO2007094160A1 (en) * 2006-02-15 2007-08-23 Asahi Glass Company, Limited Method and apparatus for chamfering glass substrate
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WO2013007504A1 (en) * 2011-07-14 2013-01-17 Saint-Gobain Glass France Method for smoothing the edges of a glass pane
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EP2239085A4 (en) * 2007-12-19 2016-12-14 Mitsuboshi Diamond Ind Co Ltd Method for chamfering/machining brittle material substrate and chamfering/machining apparatus
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US9010151B2 (en) 2011-09-15 2015-04-21 Nippon Electric Glass Co., Ltd. Glass sheet cutting method
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02241684A (en) * 1989-03-13 1990-09-26 Tokai Rika Co Ltd Method for chamfering glass member
JPH1167700A (en) * 1997-08-22 1999-03-09 Hamamatsu Photonics Kk Manufacture of semiconductor wafer
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass
JP2000344551A (en) * 1999-03-03 2000-12-12 Shin Meiwa Ind Co Ltd Glass plate manufacturing method and glass plate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167700A (en) * 1987-12-23 1989-07-03 Fuji Electric Co Ltd Radioactive liquid waste treatment equipment for nuclear reactor facility

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02241684A (en) * 1989-03-13 1990-09-26 Tokai Rika Co Ltd Method for chamfering glass member
JPH1167700A (en) * 1997-08-22 1999-03-09 Hamamatsu Photonics Kk Manufacture of semiconductor wafer
JP2000344551A (en) * 1999-03-03 2000-12-12 Shin Meiwa Ind Co Ltd Glass plate manufacturing method and glass plate
JP2000247671A (en) * 1999-03-04 2000-09-12 Takatori Corp Method for cutting glass

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Also Published As

Publication number Publication date
KR20040024537A (en) 2004-03-20
CN1283409C (en) 2006-11-08
JPWO2003015976A1 (en) 2004-12-02
JP3823108B2 (en) 2006-09-20
CN1491144A (en) 2004-04-21
KR100820689B1 (en) 2008-04-10
TWI252788B (en) 2006-04-11

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