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WO2003012468A1 - Procede et dispositif pour l'analyse de sources de chaleur a l'interieur d'un echantillon presentant un materiau electroconducteur - Google Patents

Procede et dispositif pour l'analyse de sources de chaleur a l'interieur d'un echantillon presentant un materiau electroconducteur Download PDF

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Publication number
WO2003012468A1
WO2003012468A1 PCT/EP2002/006830 EP0206830W WO03012468A1 WO 2003012468 A1 WO2003012468 A1 WO 2003012468A1 EP 0206830 W EP0206830 W EP 0206830W WO 03012468 A1 WO03012468 A1 WO 03012468A1
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WO
WIPO (PCT)
Prior art keywords
sample
image recording
recording device
frequency
sample surface
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Ceased
Application number
PCT/EP2002/006830
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German (de)
English (en)
Inventor
Frank Altmann
Otwin Breitenstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of WO2003012468A1 publication Critical patent/WO2003012468A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections

Definitions

  • the invention relates to a method and an apparatus for examining heat sources within an electrically conductive material sample which is subjected to an electrical voltage for the purpose of heat development, in which the sample is exposed to at least one sample surface with a fluorescent agent, the Fluorescence property is temperature-dependent, the sample surface prepared in this way is exposed to an energy flow that energizes the fluorescent agent before, during and / or after the sample is supplied with the electrical voltage and by means of an image recording device images of fluorescent radiation emerging from the prepared sample surface are recorded and evaluated by an evaluation unit ,
  • the function of electronic components is based on internal current flows.
  • Local heat sources are always formed. These heat sources can be caused by various mechanisms, such as Joule heat when a current flows through an electrical resistor, recombination heat when recombining non-equilibrium charge carriers in a semiconductor, relaxation heat when thermalizing hot charge carriers, or Peltier heat when the current flows at the contact between different ones conductor materials. That's why it is It is obvious to use the thermographic mapping of local temperature differences in semiconductor components for the functional test of these components.
  • thermographic examination of electronic components Previously common methods for the thermographic examination of electronic components are the examination with an infrared (IR) thermal camera (see, for example, J. McDonald, L. Optics, G. Albright, “Microthermal imaging in the infrared”, Electronics Cooling 3 (1997) pp . ⁇ , the investigation with temperature-sensitive liquid crystals (see e.g. DJ Farina, "High resolution thermal mapping of integrated circuits using nematic and thermochromic liquid crystals", Temptronic Corp. publication), and Fluorescent Microthermal Imaging (abbreviated FMI, see e.g. P. Kolodner , JA Tyson, "Microscopic fluorescent imaging of surface temperature profiles with 0.01 ° C resolution", Appl. Phys. Lett. 40 (1982) pp. 782-784).
  • IR infrared
  • the latter FMI method has become established in the past few years in addition to the liquid crystal method as a standard method for thermal functional testing of electronic components and circuits, since its sensitivity is about an order of magnitude better than that of the other two methods.
  • the FMI method has a nominal spatial resolution down to the sub-micrometer range.
  • a thin layer of a special dye is applied to the surface of the sample, the luminescence of which is strongly temperature-dependent in the visible spectral range when UV-illuminated. In fluorescence microscopy, heated areas therefore appear darker than unheated areas.
  • the stimulating UV intensity cannot be chosen to be arbitrarily high because of the degradation of the dye used, an image integration time of usually a few seconds to minutes must be selected when measuring the luminescence intensity in order to obtain an image that is as noise-free as possible. This is neither possible with conventional CCD cameras nor is it useful because of the detector noise.
  • the FMI method usually uses a cooled, high-resolution slow scan CCD camera, which usually has an image integration time of many seconds.
  • methods of image storage and image processing are usually used to subtract the luminescent image from the component under no load and to display only the difference image.
  • the FMI process has become established in many places, it still has some disadvantages.
  • the strong thermal conductivity of silicon has a disturbing effect, as a result of which the heat generated in a specific area is generated relatively quickly, i.e. can spread laterally within a few milliseconds, whereby the lateral temperature contrasts "smear" after a short time.
  • This effect occurs especially in macroscopic applications when the heat sources are not small compared to the dimensions of the sample.
  • the macroscopic spatial resolution of the FMI method is significantly worse than the microscopic one.
  • thermography An analogous problem also arises with infrared (IR) thermography if it is operated as a stationary process, i.e. if the heat input is constant over time due to the application of an electrical voltage to the sample.
  • IR thermography has the disadvantage that the spatial resolution of the method is limited to a range of 3-5 ⁇ m due to the wavelength. As a result, IR thermography is in principle not suitable for examining sub-micrometer structures.
  • lock-in thermography A better use of the potential of IR thermography can be achieved by the so-called lock-in thermography.
  • lock-in thermography With lock-in thermography the heat input is periodically modulated and phase-coupled individual thermal images are recorded. The numerical correlation of the recorded thermal images ensures that the result reflects the local periodic temperature modulation.
  • Lock-in thermography using infrared cameras is known per se and is used, for example, for non-destructive material testing (eg G. Busse, D. Wu, W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography", J. Appl. Phys. 71 (1992) pp. 3962-3965).
  • US Pat. No. 5,653,539 describes a method and a device for temperature detection of a surface on which a chemiluminescent layer is applied, which is capable of emitting temperature-dependent luminescent radiation, which is received by means of a suitable detector and is used via an evaluation unit to determine the surface temperature.
  • EP 1006346 A1 shows a measuring method for determining the surface temperature which is based on the principle of phophoresis measurement.
  • a layer containing phosphorus or phosphorus is applied to a surface to be examined, the temperature-dependent luminescent radiation of which is received by a detector system and evaluated accordingly.
  • a detector system Even with the two methods mentioned above, only a rough spatially resolved temperature measurement can be achieved.
  • the method should serve for the thermal functional diagnosis of electronic components and should have a better temperature resolution and a better macroscopic spatial resolution than the FMI method.
  • the process should not be influenced by temperature drift.
  • claim 18 The solution to the problem on which the invention is based is specified in claim 1.
  • the subject matter of claim 18 is a device designed according to the invention, with which the method can be carried out.
  • Features which advantageously further develop the inventive concept can be found in the subclaims and in the description and the figure.
  • the approach according to the invention is based on the FMI method, which is known per se, in which an electrical voltage is applied to the sample for the purpose of examining heat sources within a sample comprising electrically conductive material, for the purpose of developing heat.
  • the sample is provided on at least one of its sample surfaces with a fluorescent agent, the fluorescence property of which is temperature-dependent, and is exposed to an energy flow that energizes the fluorescent agent before, during and / or after the sample is supplied with the electrical voltage.
  • images of the fluorescence radiation emerging from the prepared sample surface are recorded and correspondingly evaluated by means of an evaluation unit.
  • a modulation frequency f P is now applied to the electrical voltage and the image recording device is phase-coupled to the modulation frequency f P by means of a lock-in principle.
  • a pulsed heat input is generated within the sample by the electrical voltage applied to the sample with a predeterminable modulation frequency f P, which is recorded in phase lock-in principle by the image recording device, which records images with a likewise predeterminable refresh rate f w becomes.
  • the energy flow which excites the fluorescent agent on the sample or component surface is preferably UV radiation, which in the simplest case is stationary, i.e. with a constant intensity over time, is irradiated onto the surface.
  • the luminescent surface is recorded in a light microscope with a sensitive camera as an image recording device, digitized and fed to a computer system as an evaluation unit.
  • the camera is operated at a fixed refresh rate f w , which, depending on the camera type, is between under a heart and about 50 Hz or above.
  • the modulation of the electrical voltage applied to the component is correlated with the image repetition frequency f w by means of a phase coupling.
  • the lock-in correlation is preferably carried out the images of the camera fed to the evaluation unit according to a method customary in lock-in IR thermography.
  • An example is the simplest 4-point correlation method (G. Busse, D. Wu, W. Karpen, "Thermal wave imaging with phase sensitive modulated thermography", J. Appl. Phys. 71 (1992) pp.
  • the lock-in method is characterized in that the measurement can be averaged or integrated over many lock-in periods, which improves the signal-to-noise ratio.
  • the lock-in integration time is equivalent to the image integration time in the conventional, stationary FMI method.
  • this integration time is distributed over many individual modulation periods.
  • the advantage of the method is therefore that the use of expensive cooled slow-scan CCD cameras is not necessary, but that cheaper CCD cameras can be used which operate at a refresh rate of 50 Hz or even higher. The reason for this is that slow signal changes are not included in the result anyway when using the lock-in method.
  • the modulation frequency f P and thus also the effective lock-in frequency can also be significantly above the refresh rate f w .
  • the amplitude and thus the intensity of the exciting UV light is not kept constant, but is modulated with a frequency f m0C ⁇ , which preferably differs somewhat from f P.
  • the UV modulation frequency can be 100 Hz and can be synchronized with the mains frequency.
  • This corresponds to the use of a conventional AC-operated mercury vapor lamp for generating the UV lighting, as is also used in conventional FMI systems, and which "flickers" in time with the current load. If voltage pulses with a frequency of f p 100 Hz - f w / 4 are then applied to the sample, then the luminescent light is also amplitude-modulated here with fw / 4, which means that again with 4 pictures the 4-point correlation can be carried out, although the pulse repetition frequency used for heat input is much higher at 100 Hz.
  • Another particularly advantageous method variant provides that the electrical voltage of the component under investigation is not pulsed to modulate the heat input into the sample, but that a nominal operating voltage is applied permanently and only certain control inputs of the component are appropriately controlled with control voltages. Depending on these control signals, certain heat sources arise and disappear in the component, which can provide information about the function of the component. Through a complex timing of different control signals and clock signals, it can be achieved that only the elements to be examined are specifically activated in such a way that they generate a periodically modulated heat which is then detected by the lock-in FMI method. This enables a detailed investigation of the function of complex structures that goes far beyond the summary mapping of internal heat sources in the component in question.
  • FIG. 1 Schematic circuit diagram of an apparatus for performing the method according to the invention.
  • FIG. 1 shows the functional diagram for a typical exemplary embodiment for carrying out the lock-in FMI method according to the invention.
  • the device shown in FIG. 1 shows an electronic component 3, on the component surface of which is coated with a fluorescent agent, UV radiation from a UV lighting device is directed.
  • the UV radiation causes fluorescence radiation, which is imaged onto a CCD camera 6 via a microscope 5.
  • the images recorded by the CCD camera are then evaluated in a computer.
  • the component itself is supplied with electrical voltage by means of a frequency generator 1 and a multiplexer 2 in the context of digital frequency processing, as described below.
  • the frequency generator 1 used for the modulation has four outputs, at which the set modulation frequency appears with a phase position of 0 ° (reference), 90 °, 180 ° and 270 °.
  • the multiplexer 2 selects one of these four signals and uses it to pulse the heat generation in the sample 3 under investigation. This is irradiated by a UV lighting device 4, the intensity of which is modulated by the 0 ° (reference) signal of the signal generator 1.
  • the luminescence image generated is recorded via the microscope 5 by the CCD camera 6, which is operated at a fixed refresh rate f w .
  • the image trigger signal taken from the camera control is used to switch the multiplexer 2 cyclically, whereby the phase of the sample control is increased by 90 ° after each captured image.
  • the images of the camera transmitted to the computer system 7 are correlated with one another there according to the known 4-point method, if necessary averaged over several periods, and according to the Take at least 4 pictures as shown in lock-in thermography.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour l'analyse de sources de chaleur à l'intérieur d'un échantillon qui présente un matériau électroconducteur et qui est soumis à une tension électrique afin de développer de la chaleur. Selon l'invention, l'échantillon est sollicité sur au moins une surface d'échantillon par un moyen fluorescent dont la propriété de fluorescence dépend de la température. La surface d'échantillon ainsi préparée est exposée à un courant d'énergie excitant énergétiquement le moyen fluorescent, avant, pendant ou après l'alimentation de l'échantillon avec la tension électrique. Des vues du rayonnement de fluorescence sortant de la surface d'échantillon préparée sont prises au moyen d'un dispositif de prise de vues et sont évaluées au moyen d'une unité d'évaluation. L'invention est caractérisée en ce que la tension électrique est sollicitée par une fréquence de modulation fP et en ce que le dispositif de prise de vues est couplé en phase avec la fréquence de modulation fP dans le cadre d'un principe de synchronisation.
PCT/EP2002/006830 2001-07-27 2002-06-20 Procede et dispositif pour l'analyse de sources de chaleur a l'interieur d'un echantillon presentant un materiau electroconducteur Ceased WO2003012468A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10136774.0 2001-07-27
DE2001136774 DE10136774C1 (de) 2001-07-27 2001-07-27 Verfahren und Vorrichtung zur Untersuchung von Wärmequellen innerhalb einer elektrisch leitendes Material aufweisenden Probe

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WO2003012468A1 true WO2003012468A1 (fr) 2003-02-13

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WO (1) WO2003012468A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011051351U1 (de) 2011-09-19 2011-11-08 Aesculap Ag Temperatursensor, Temperaturmessvorrichtung sowie medizintechnische Systeme mit einem Temperatursensor oder einer Temperaturmessvorrichtung
DE102011053755A1 (de) 2011-09-19 2013-03-21 Aesculap Ag Temperatursensor, Temperaturmessvorrichtung sowie medizintechnische Systeme mit einem Temperatursensor oder einer Temperaturmessvorrichtung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007037377B4 (de) * 2007-08-08 2018-08-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Detektion von durch Unterbrechungen charakterisierbare Fehlstellen in Leitbahnnetzwerken

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071009A (en) * 1997-10-03 2000-06-06 Micron Technology, Inc. Semiconductor wirebond machine leadframe thermal map system
US6168311B1 (en) * 1998-10-13 2001-01-02 Checkpoint Technologies Llc System and method for optically determining the temperature of a test object

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5653539A (en) * 1994-05-02 1997-08-05 Rosengaus; Eliezer Method and apparatus for remotely measuring the temperature of a surface
GB9826281D0 (en) * 1998-12-01 1999-01-20 Rolls Royce Plc A method of temperature measurement

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071009A (en) * 1997-10-03 2000-06-06 Micron Technology, Inc. Semiconductor wirebond machine leadframe thermal map system
US6168311B1 (en) * 1998-10-13 2001-01-02 Checkpoint Technologies Llc System and method for optically determining the temperature of a test object

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011051351U1 (de) 2011-09-19 2011-11-08 Aesculap Ag Temperatursensor, Temperaturmessvorrichtung sowie medizintechnische Systeme mit einem Temperatursensor oder einer Temperaturmessvorrichtung
DE102011053755A1 (de) 2011-09-19 2013-03-21 Aesculap Ag Temperatursensor, Temperaturmessvorrichtung sowie medizintechnische Systeme mit einem Temperatursensor oder einer Temperaturmessvorrichtung
WO2013041550A2 (fr) 2011-09-19 2013-03-28 Aesculap Ag Capteur de température, dispositif de mesure de température et système technique médical comprenant un capteur de température ou un dispositif de mesure de température
US10244946B2 (en) 2011-09-19 2019-04-02 Aesculap Ag Temperature sensor, temperature measuring device and medical engineering systems comprising a temperature sensor or a temperature measuring device

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