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WO2003012166A3 - Verfahren zum erzeugen eines flächenhaften basismaterials aus metall insbesondere für eine supraleiterschicht - Google Patents

Verfahren zum erzeugen eines flächenhaften basismaterials aus metall insbesondere für eine supraleiterschicht Download PDF

Info

Publication number
WO2003012166A3
WO2003012166A3 PCT/DE2002/002687 DE0202687W WO03012166A3 WO 2003012166 A3 WO2003012166 A3 WO 2003012166A3 DE 0202687 W DE0202687 W DE 0202687W WO 03012166 A3 WO03012166 A3 WO 03012166A3
Authority
WO
WIPO (PCT)
Prior art keywords
base material
producing
flat base
superconducting layer
metal flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2002/002687
Other languages
English (en)
French (fr)
Other versions
WO2003012166A2 (de
Inventor
Ursus Krueger
Vogelaere Marc De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2003012166A2 publication Critical patent/WO2003012166A2/de
Publication of WO2003012166A3 publication Critical patent/WO2003012166A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

Die Erfindung bezieht sich auf ein Verfahren zum Erzeugen ei-nes flächenhaften Basismaterials aus Me-tall zum Aufbringen einer supraleitenden Schicht. Um ein solches Verfahren vergleichsweise kostengünstig durch-führen zu können, wird erfindungsgemäß auf einem einkristal-linen Substrat (1) eine Metallschicht (3) galvanisch erzeugt und die Metallschicht (3) unter Gewinnung des Basismaterials von dem Sub-strat (1) gelöst. Die Erfindung betrifft ferner ein nach dem Verfahren herge-stelltes Basismaterial sowie dessen Anwendung.
PCT/DE2002/002687 2001-07-25 2002-07-17 Verfahren zum erzeugen eines flächenhaften basismaterials aus metall insbesondere für eine supraleiterschicht Ceased WO2003012166A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10136891A DE10136891B4 (de) 2001-07-25 2001-07-25 Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall
DE10136891.7 2001-07-25

Publications (2)

Publication Number Publication Date
WO2003012166A2 WO2003012166A2 (de) 2003-02-13
WO2003012166A3 true WO2003012166A3 (de) 2003-10-16

Family

ID=7693460

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002687 Ceased WO2003012166A2 (de) 2001-07-25 2002-07-17 Verfahren zum erzeugen eines flächenhaften basismaterials aus metall insbesondere für eine supraleiterschicht

Country Status (2)

Country Link
DE (1) DE10136891B4 (de)
WO (1) WO2003012166A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136890B4 (de) 2001-07-25 2006-04-20 Siemens Ag Verfahren und Vorrichtung zum Erzeugen eines kristallstrukturell texturierten Bandes aus Metall sowie Band
DE10346368B4 (de) * 2003-09-29 2006-05-18 Siemens Ag Verfahren und Herstellungsanlage zum Herstellen eines schichtartigen Bauteils
KR101574483B1 (ko) 2008-08-11 2015-12-04 코닌클리케 필립스 엔.브이. 인체 영역 네트워크들에 대한 매체 액세스 제어(ｍａｃ) 프로토콜

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
KR20010063692A (ko) * 1999-12-24 2001-07-09 황해웅 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및이의 제조방법과 제조장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0612114B1 (de) * 1993-02-15 1997-05-14 Sumitomo Electric Industries, Ltd. Verfahren zum Erzeugen einer strukturierten oxydsupraleitenden Dünnschicht
GB2336849B (en) * 1998-04-27 2003-02-26 Telcon Ltd Substrate materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
US5968877A (en) * 1995-04-10 1999-10-19 Lockheed Martin Energy Research Corp High Tc YBCO superconductor deposited on biaxially textured Ni substrate
KR20010063692A (ko) * 1999-12-24 2001-07-09 황해웅 전기도금법에 의한 2축 집합조직을 갖는 니켈 도금층 및이의 제조방법과 제조장치
US6346181B1 (en) * 1999-12-24 2002-02-12 Korea Institute Of Machinery And Materials Electroplating process for preparing a Ni layer of biaxial texture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 200317, Derwent World Patents Index; Class M11, AN 2002-031979, XP002249052 *

Also Published As

Publication number Publication date
DE10136891B4 (de) 2004-07-22
DE10136891A1 (de) 2003-02-20
WO2003012166A2 (de) 2003-02-13

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