[go: up one dir, main page]

WO2003001264A3 - Improvements in mounting of an optical fibre - Google Patents

Improvements in mounting of an optical fibre Download PDF

Info

Publication number
WO2003001264A3
WO2003001264A3 PCT/GB2002/002811 GB0202811W WO03001264A3 WO 2003001264 A3 WO2003001264 A3 WO 2003001264A3 GB 0202811 W GB0202811 W GB 0202811W WO 03001264 A3 WO03001264 A3 WO 03001264A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical fibre
optical
channel
face
free end
Prior art date
Application number
PCT/GB2002/002811
Other languages
French (fr)
Other versions
WO2003001264A2 (en
Inventor
Ebrahim Iravani
Original Assignee
Bookham Technology Plc
Ebrahim Iravani
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bookham Technology Plc, Ebrahim Iravani filed Critical Bookham Technology Plc
Priority to AU2002311458A priority Critical patent/AU2002311458A1/en
Publication of WO2003001264A2 publication Critical patent/WO2003001264A2/en
Publication of WO2003001264A3 publication Critical patent/WO2003001264A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A substrate (1;101;201) for an optical chip (10;110;210) has a surface (3;103;203) in which a channel (7;107;207) is provided for an optical fibre (13;113) to be received in. To aid in drawing off any excess adhesive used in securing the optical fibre in the channel, the channel is provided with a bottom (23,25;123,125;223,225) having a stepped profile. To accommodate flaring of the free end (14;114;214) of the optical fibre, e.g. caused by laser cleaving, the channel may step into an enlarged section at an end face (12;112;212) thereof. These features promote a flatter lie of the optical fibre in the channel and improved optical coupling between the optical fibre and an optical component (5;105;205) on the surface at the end face. For optimal optical coupling between the optical fibre and the optical component, the end face may extend widthwise at an inclined angle to the axis of the channel, which angle substantially corresponds to the cleave angle of the free end of the optical fibre. To prevent the free end of the optical fibre impacting the optical component on feeding of the optical fibre along the channel, a recess (27;127;227) may be provided in the end face to space the free end from the optical component.
PCT/GB2002/002811 2001-06-22 2002-06-21 Improvements in mounting of an optical fibre WO2003001264A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002311458A AU2002311458A1 (en) 2001-06-22 2002-06-21 Improvements in mounting of an optical fibre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0115364.2 2001-06-22
GB0115364A GB2376754A (en) 2001-06-22 2001-06-22 Optical chip substrate with a channel having a stepped profile

Publications (2)

Publication Number Publication Date
WO2003001264A2 WO2003001264A2 (en) 2003-01-03
WO2003001264A3 true WO2003001264A3 (en) 2003-03-13

Family

ID=9917207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002811 WO2003001264A2 (en) 2001-06-22 2002-06-21 Improvements in mounting of an optical fibre

Country Status (3)

Country Link
AU (1) AU2002311458A1 (en)
GB (1) GB2376754A (en)
WO (1) WO2003001264A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2334306B1 (en) * 2008-04-02 2010-12-03 Das Photonics, S.L. OPTOELECTRONIC CONNECTION AND CONVERSION DEVICE FOR A SPACE ENVIRONMENT.
JP6345153B2 (en) * 2015-05-21 2018-06-20 Ｎｔｔエレクトロニクス株式会社 Si photonics lightwave circuit and manufacturing method thereof
US9638859B1 (en) * 2016-01-12 2017-05-02 Elenion Technologies, Llc Optical fiber alignment device
WO2018076308A1 (en) * 2016-10-29 2018-05-03 Huawei Technologies Co., Ltd. Optical device and method for fabricating the same
EP4182745A4 (en) * 2020-07-17 2024-07-17 CommScope Technologies LLC Ferrule-less fiber optic connectors, systems, and methods
US20230384542A1 (en) * 2020-11-12 2023-11-30 Nippon Telegraph And Telephone Corporation Optical connecting structure, optical module and manufacturing method for optical connecting structure
WO2025079140A1 (en) * 2023-10-10 2025-04-17 日本電信電話株式会社 Silicon photonics optical circuit chip with glass plate and method for manufacturing same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538633A1 (en) * 1991-10-23 1993-04-28 Robert Bosch Gmbh Connection between optical fibre and integrated optical waveguide and manufacturing process
JPH1020159A (en) * 1996-07-01 1998-01-23 Mitsubishi Electric Corp Semiconductor laser module
JPH10282370A (en) * 1997-04-01 1998-10-23 Sumitomo Electric Ind Ltd Optical module and manufacturing method thereof
DE19827553A1 (en) * 1998-06-20 1999-12-30 Inst Mikrotechnik Mainz Gmbh Optic coupling element for optical sensors and communication systems
US6212320B1 (en) * 1998-05-01 2001-04-03 Bookham Technology Plc Coupling optical fibre to waveguide

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175781A (en) * 1991-10-11 1992-12-29 United Technologies Corporation Attaching optical fibers to integrated optic chips
JPH0829638A (en) * 1994-05-12 1996-02-02 Fujitsu Ltd Optical waveguide / optical fiber connection structure, optical waveguide / optical fiber connection method, optical waveguide substrate used for optical waveguide / optical fiber connection, method of manufacturing the same, and optical fiber with optical fiber substrate used for optical waveguide / optical fiber connection fiber
JPH08122561A (en) * 1994-10-21 1996-05-17 Fujitsu Ltd Method for connecting optical waveguide and optical fiber and optical waveguide type device
AU7701998A (en) * 1997-06-10 1998-12-30 Minnesota Mining And Manufacturing Company Rib-type integrated optical interconnect

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0538633A1 (en) * 1991-10-23 1993-04-28 Robert Bosch Gmbh Connection between optical fibre and integrated optical waveguide and manufacturing process
JPH1020159A (en) * 1996-07-01 1998-01-23 Mitsubishi Electric Corp Semiconductor laser module
JPH10282370A (en) * 1997-04-01 1998-10-23 Sumitomo Electric Ind Ltd Optical module and manufacturing method thereof
US6212320B1 (en) * 1998-05-01 2001-04-03 Bookham Technology Plc Coupling optical fibre to waveguide
DE19827553A1 (en) * 1998-06-20 1999-12-30 Inst Mikrotechnik Mainz Gmbh Optic coupling element for optical sensors and communication systems

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 01 29 January 1999 (1999-01-29) *

Also Published As

Publication number Publication date
AU2002311458A1 (en) 2003-01-08
GB0115364D0 (en) 2001-08-15
WO2003001264A2 (en) 2003-01-03
GB2376754A (en) 2002-12-24

Similar Documents

Publication Publication Date Title
CN101939681B (en) Remote grip optical fiber connector
WO2004045111A3 (en) Optical communications module and substrate for the same
EP1189084A3 (en) Planar lightwave circuit and optical circuit
EP1376178A3 (en) Integrated aspheric optical coupler for automatic photonics packaging
AU2002320167A1 (en) Laser diode chip with waveguide
WO2001075492A3 (en) Optical system including coupler for transmitting light between a single fiber light guide and multiple single fiber light guides
AU2002329185A1 (en) Vertical waveguide tapers for optical coupling between optical fibers and thin silicon waveguides
WO2004044622A3 (en) Optical component for free-space optical propagation between waveguides
CA2486684A1 (en) Stub having an optical fiber
AU2002351513A1 (en) Module mounted aligning optical connector
JPH11344646A (en) Optical module, plug for optical fiber connection, and optical coupler equipped with them
WO2003001264A3 (en) Improvements in mounting of an optical fibre
EP0938005A3 (en) Optical module and optical reflecting member applicable thereto
EP1513006A3 (en) Light wavelength converting system
EP0948104A3 (en) Semiconductor laser module and method of manufacturing the same
WO2005054916A3 (en) High sbs threshold nzds optical fiber
EP1241504A3 (en) Ferrule assembly, method of making the same, and optical module
WO2003058288A3 (en) Lens coupling fiber attachment for polymer optical waveguide on polymer substrate
KR100524167B1 (en) Optical connector
US20020168168A1 (en) Mounting an optical fibre to an optical chip
US20030059622A1 (en) Micromachined structures made by combined wet and dry etching
AU2002323006A1 (en) Assembly for aligning an optical array with optical fibers
GB0105838D0 (en) Optical coupling for mounting an optical fibre on a substrate
EP0919842A3 (en) Optical coupling module
SE9804383D0 (en) An optical transmitter-receiver module

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP