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WO2003098984A1 - Structure d'interconnexion entre couches et procede de fabrication associe - Google Patents

Structure d'interconnexion entre couches et procede de fabrication associe Download PDF

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Publication number
WO2003098984A1
WO2003098984A1 PCT/JP2002/013049 JP0213049W WO03098984A1 WO 2003098984 A1 WO2003098984 A1 WO 2003098984A1 JP 0213049 W JP0213049 W JP 0213049W WO 03098984 A1 WO03098984 A1 WO 03098984A1
Authority
WO
WIPO (PCT)
Prior art keywords
interlayer connection
layer
forming
metal
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/013049
Other languages
English (en)
Japanese (ja)
Inventor
Eiji Yoshimura
Mitsuhiko Kitamura
Ikuo Suyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiwa KK
Daiwa Co Ltd
Original Assignee
Daiwa KK
Daiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiwa KK, Daiwa Co Ltd filed Critical Daiwa KK
Priority to KR10-2004-7002072A priority Critical patent/KR100536933B1/ko
Priority to AU2002367949A priority patent/AU2002367949A1/en
Priority to JP2004506328A priority patent/JP3907062B2/ja
Publication of WO2003098984A1 publication Critical patent/WO2003098984A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Definitions

  • the present invention relates to a method for forming an interlayer connection structure for forming a conductive connection structure between wiring layers and a heat dissipation structure between layers on a multilayer wiring board and the like, and an interlayer connection structure and a multilayer wiring board formed by the method.
  • a step of forming a metal layer and a wiring pattern on an insulating layer is required.
  • These methods include a method of laminating a copper foil with a resin and a method of forming the same by the method.
  • a method of forming a pattern by etching a metal layer was common.
  • a method is also known in which a wiring layer is formed on a transfer base material and transferred to a thermoadhesive terminal layer provided on the outermost layer of the wiring board.
  • a multilayer wiring board requires a structure for conductively connecting between wiring layers, and wiring layers or metal layers formed on both surfaces of an insulating layer are connected between layers via interlayer connection protrusions.
  • interlayer connection structures have been proposed.
  • Japanese Patent Application Laid-Open No. Hei 6-314 878 discloses that a metal resist having an opening in a via hole portion is laminated on a lower wiring layer, and a columnar metal body is formed inside the opening by electrolytic copper plating. Subsequently, a method is disclosed in which an insulating resin is applied over the entire surface after removing the plating resist, flattened, and then an upper wiring layer is formed, thereby electrically connecting the wiring layers.
  • WO 00/528977 discloses that another metal exhibiting resistance during the etching of the metal constituting the columnar metal body is coated on the entire surface including the non-pattern portion of the lower wiring layer.
  • a protective metal layer on the entire surface of the protective metal layer, forming a metal plating layer constituting the columnar metal body by electrolytic plating, and then forming a mask layer on the surface portion of the plating layer.
  • the protective metal layer is eroded to remove the protective metal layer covering the non-patterned part, and then coated with a thread-like resin over the entire surface.
  • a method is disclosed in which an upper wiring layer is formed after flattening to conduct conductive connection between wiring layers.
  • the insulating layer is formed.
  • metal projections including columnar metal bodies
  • the insulating layer is formed.
  • the metal body protrusion and the copper foil are only in pressure contact with each other, and the resin is easily interposed between the two, and the surfaces are difficult to uniformly contact.
  • the reliability of the conductive connection between the wiring layers was not sufficient.
  • the insulating layer contained reinforcing fibers, the reinforcing fibers hindered the contact, and a conductive connection could not be made.
  • an object of the present invention is to provide an interlayer connection that can make the thickness of the insulating layer interposed between the layers uniform and enable the flattening of the surface and control of the thickness of the insulating layer even when the reinforcing fiber is included in the insulating layer.
  • An object of the present invention is to provide a method of forming a structure, and an interlayer connection structure and a multilayer wiring board formed by the method. Disclosure of the invention
  • the above object can be achieved by the present invention as described below.
  • the method for forming an interlayer connection structure of the present invention includes the first to third inventions.
  • the method for forming an interlayer connection structure according to the first invention is a method for forming an interlayer connection structure in which wiring layers or metal layers formed on both surfaces of a yarn edge layer are connected between layers via interlayer connection protrusions.
  • (1a) at least a sheet material allowing a concave deformation, a metal layer forming material, and a heat-adhesive insulating layer between the press surface and the laminated body on which the interlayer connection protrusions are formed.
  • a step of arranging the forming material by this method (lb) a laminate having a convex portion at a position corresponding to the interlayer connection protrusion and a metal layer formed on the surface by performing hot pressing with a press surface in this arrangement state (1c) removing the protrusions of the laminate to expose the layer connection protrusions, and (1d) removing the exposed interlayer connection protrusions and the metal layer adjacent to each other with the insulating layer interposed therebetween. Is electrically connected.
  • a sheet material allowing concave deformation is arranged between the pressed surface and the laminated body, and a heat-bonding insulating layer is formed with the metal layer forming material. Since the material and the object to be laminated are heated and pressed, concave deformation of the sheet material occurs at a position corresponding to the interlayer connection protrusion, so that a relief area for the layer forming material can be secured. For this reason, the thickness of the insulating layer around the interlayer connection protrusion is unlikely to change, and the protrusion serving as a relief is removed in a later step, so that the upper portion of the interlayer connection protrusion becomes flat.
  • the heat-adhesive insulating layer forming material is in a sheet form, it is possible to suitably cope with the thinning of the yarn edge layer as compared with the coating method. Then, after removing the protrusions of the laminated body to expose the interlayer connection protrusions, the metal layers on both sides of the edge layer are conductively connected to conductively connect the exposed interlayer connection protrusions and the surrounding metal layer. can do. Note that the method using a sheet material that allows concave deformation is suitable for mass production because the same material can be used even when the formation position of the interlayer connection protrusion is different.
  • the sheet material cushion paper, metal foil or rubber sheet having releasability.
  • a suitable convex portion can be formed on the laminate obtained by generating an appropriate concave deformation in the sheet material, and the release of the sheet material from the metal layer of the laminate becomes easy.
  • the method for forming an interlayer connection structure according to the second invention is a method for forming an interlayer connection structure in which wiring layers or metal layers formed on both surfaces of an insulating layer are connected between layers via interlayer connection protrusions.
  • the heat bonding property between the metal layer forming material and the metal layer forming material can be achieved by the pressing surface having the recess formed at the position facing the interlayer connection protrusion or the pressing surface having the plate for forming the recess formed thereon. Since the material for forming the yarn contact layer and the object to be laminated are hot-pressed, an escape area for the material for forming the insulating layer can be secured at the position where the interlayer connection protrusion is formed. For this reason, the thickness of the insulating layer around the interlayer connection protrusion is difficult to change, and the protrusion serving as a relief is removed in a later step, so that the upper portion of the interlayer connection protrusion becomes flat.
  • the heat-adhesive yarn edge layer forming material is in the form of a sheet, it is possible to suitably cope with the thinning of the yarn edge layer as compared with the coating method. Then, after removing the protrusions of the laminate to expose the interlayer connection protrusions, the metal layers on both surfaces of the terminal edge layer are conductively connected to conductively connect the exposed interlayer connection protrusions and the surrounding metal layer. Can be connected.
  • the method for forming an interlayer connection structure according to the third invention is a method for forming an interlayer connection structure in which wiring layers or metal layers formed on both surfaces of an insulating layer are connected between layers via interlayer connection protrusions. a) The laminated body on which the interlayer connection protrusions are formed, the thermally adhesive insulating layer forming material, and the metal layer forming material are arranged such that the upper surface of the interlayer connection protrusions is located near the surface of the self-metal layer forming material.
  • the heat-adhesive insulating layer forming material is in the form of a sheet, it is possible to suitably cope with the thinning of the yarn edge layer as compared with the coating method. Further, since an opening is formed by etching a portion overlapping with the upper surface of the interlayer connection protrusion, the upper surface of the interlayer connection protrusion can be exposed by removing the insulating layer through the opening. With this, the conductor layer can be formed from the upper surface of the interlayer connection protrusion to at least the inner peripheral surface of the opening. Unlike a simple press-contact structure as in the related art, reliable conductive connection can be performed. The reliability of the conductive connection with the projection is increased.
  • the upper surface of the layer connection protrusion is insulated. A portion exposed from the layer is connected to the wiring layer or the metal layer adjacent to the insulating layer with a conductive layer therebetween.
  • the portion where the upper surface of the interlayer connection protrusion is exposed from the insulating layer is connected to the wiring layer or the metal layer which is close to and separated by the insulating layer by the conductor layer.
  • the thickness of the insulating layer interposed between the layers can be made uniform, and even when the reinforcing fiber is included in the insulating layer, the surface can be flattened and the thickness of the insulating layer can be controlled. It becomes an interlayer connection structure.
  • the conductor layer is formed by plating.
  • the conductor layer is formed by plating, an inter-layer connection structure with higher reliability of conductive connection can be obtained.
  • a multilayer wiring board of the present invention is a multilayer wiring board comprising the above-mentioned interlayer connection structure between any layers.
  • the multilayer wiring board of the present invention since the layer interconnect structure exists between any of the layers, the thickness of the insulating layer interposed between the layers can be made uniform, and even when the reinforcing fiber is included in the yarn contact layer, A multilayer wiring board with an interlayer connection structure that can control the surface flattening and control the thickness of the insulating layer and has high reliability of conductive connection.
  • FIG. 1 and 2 are process diagrams showing an example of a method for forming an interlayer connection structure according to the first invention.
  • FIG. 3 is a process chart showing another example of the method for forming a connection between eyebrows according to the first invention.
  • FIGS. 4 to 5 are process diagrams showing an example of a method for forming a connection structure between eyebrows according to the second invention.
  • 6 to 9 are process diagrams showing an example of the method for forming the interlayer connection structure according to the second invention.
  • the wiring layer 22 formed on both surfaces of the core substrate and the metal layer 27 formed thereover via the edge layer 26 are connected between the layers via the interlayer connection protrusions B.
  • An example of forming an interlayer connection structure for connection will be described.
  • a laminated body L is prepared in which wiring layers 22 are pattern-formed on both surfaces of a base material 21, and further, interlayer connection protrusions B are formed on the wiring layers 22.
  • the pattern of the wiring layer 22 may be formed by any method, and for example, a method using a method using an etching resist, a method using a resist for patterning, or the like can be used.
  • the metal forming the wiring layer 22 copper, nickel, tin, or the like is usually used, but copper is preferable.
  • the substrate 21 a substrate composed of glass fiber and various reaction curable resins such as a polyimide resin and an epoxy resin can be used.
  • the thickness of the wiring layer 22 is, for example, 5 to 50 mH MS.
  • the method of forming the interlayer connection protrusion B on the wiring layer 22 may be any method as long as the wiring layer 22 and the interlayer connection protrusion B can be conductively connected. For example, a method of forming by etching a metal layer, A method of forming with a metal plating, a method of forming with a conductive paste, and the like can be given.
  • the interlayer connection protrusion B is formed on the wiring layer 22 by the formation method described in WO 00/52997.
  • the interlayer connection protrusion B is formed by the underlying conductive layer 10, the protective metal layer 11, and the plating layer 24. It consists of.
  • the method for forming the interlayer connection protrusion B is to cover substantially the entire surface of the lower wiring layer 22 including the non-patterned portion with another metal exhibiting resistance during etching of the metal constituting the columnar metal body.
  • the underlayer conductive layer 10 is formed by performing electroless plating on the entire surface including the non-patterned portion of the lower wiring layer 22 in which a pattern has been formed in advance, and then the electrolytic plating is performed on substantially the entire surface to form the protective metal layer. 1 forms 1.
  • the (la) step of the present invention comprises, as shown in FIG. 1 (2), at least a sheet material that allows concave deformation between the pressed surface 1 and the laminated body L on which the interlayer connection protrusion B is formed 1, a metal layer forming material 3, and a thermo-adhesive insulating layer forming material 4 are arranged in this order.
  • a resin-coated copper foil RC in which a metal layer forming material 3 and an insulating layer forming material 4 are previously laminated and integrated is used, and a sheet material 2 separate from the press surface 1 is arranged. Show.
  • the metal layer forming material 3 and the edge layer forming material 4 are separately arranged.
  • the metal layer forming material 3 to be the metal layer 27 any metal such as copper, nickel, and tin can be used. Although good, copper, which is widely used for wiring patterns, is most preferable from the viewpoints of conductivity, easiness of etching and cost.
  • the surface of the metal layer forming material 3 on the side of the insulating layer forming material 4 may be subjected to a blackening treatment or the like for the purpose of enhancing the adhesiveness with a resin or the like.
  • the thickness of the metal layer forming material 3 is, for example, about 5 to 50 ⁇ m.
  • any material may be used as long as it is deformed at the time of lamination and solidified by heating or the like, and has heat resistance required for the wiring board.
  • various reaction curable resins such as polyimide resin, phenol resin, epoxy resin, etc. And its composites (prepregs) with glass fiber, ceramic fiber, aramide fiber, etc.
  • a material which can be cured by a heating press and can be integrated with the laminated body L is preferable.
  • the thickness of the insulating layer forming material 4 is preferably such that the upper surface of the interlayer connection protrusion B is located near or above the upper surface of the metal layer 27 after bonding. Specifically, the thickness of the insulating layer forming material 4 is preferably from 40 m to 120 jum, which is the height of the interlayer connection protrusion B, and 2 Oi in to +1 height of the interlayer connection protrusion B. 0 zm is more preferred. Note that, in the present invention, since the interlayer connection protrusion B and the metal layer forming material 3 are not electrically conductively connected by pressing with a heating press, the thickness accuracy of the yarn / layer forming material 4 is not required to be so strict. There is.
  • the sheet material I may be any material that allows concave deformation during hot pressing, such as cushioning paper, rubber sheet, elastomer sheet, non-woven fabric, woven fabric, porous sheet, foam sheet, metal foil, etc. Complex, and the like.
  • elastically deformable materials such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof are preferable.
  • the metal layer forming material 3 with a metal foil permitting the concave deformation interposed therebetween.
  • a metal foil a metal that is easily deformed such as a copper foil or an aluminum foil is preferable.
  • a cushion paper having a releasing property or a rubber sheet having a releasing property is preferable.
  • the thickness of the sheet material 2 is preferably greater than half the height of the interlayer connection projection B, and is preferably greater than the height of the interlayer connection projection B.
  • the arrangement method is to laminate each layer between the press surface 1 of the lower die and the press surface 1 of the upper die as shown in Fig. 1 (2) ⁇ ) ⁇ . Good.
  • the heat press is performed on the press surface 1 in the above arrangement state, and the convex portion 5 is provided at a position corresponding to the interlayer connection protrusion B. Then, a laminate having a metal layer 27 formed on the surface is obtained.
  • the corresponding projections 5 are formed in the laminate.
  • the insulating layer forming material 4 includes a reinforcing fiber, the height and volume of the convex portion 5 are increased.
  • the heating press method may be performed using a heating and pressurizing device (hot laminator, heating press), etc. At that time, the atmosphere is set to a vacuum (vacuum laminator, etc.) in order to avoid air from being mixed. You may. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating layer forming material 4 and the metal layer forming material 3, but the pressure may be set as the interlayer connection protrusion B formed on the laminated body L. Is preferably adjusted in the range of 0.5 to 30 MPa in accordance with the total number of the components.
  • the insulating layer forming material 4 and the metal layer forming material 3 are deformed in accordance with the surface shape of the laminated body L, and the cured insulating layer 26 and the metal layer 27 are formed. After formation, the laminate is usually demolded, cooled, and the like.
  • the protrusions 5 of the laminate are removed to expose the interlayer connection projections B.
  • the portion where the upper surface of the interlayer connection protrusion B is higher than the upper surface of the metal layer 27 of the stacked body may be removed at the same time and flattened.
  • a method using a grinding device having a hard rotary blade having a plurality of hard blades made of diamond or the like arranged in the radial direction of the rotary plate, a sander, a belt, or the like examples include a method using a sander, a grinder, a surface grinder, a hard abrasive molded product, and the like.
  • the hard upper blade can be moved along the upper surface of the fixedly supported wiring board while rotating, so that the upper surface can be flattened.
  • the polishing method include a method of light polishing using a belt sander, puff polishing, or the like.
  • the exposed interlayer connection protrusion B is electrically conductively connected to the metal layer 27 adjacent to the terminal layer 26 via the termination layer 26.
  • a conductor layer 28 is formed on substantially the entire surface of the metal layer 27 including the upper surface of the interlayer connection protrusion B by plating.
  • the interlayer connection protrusion B and the metal layer 17 are conductively connected via the conductor layer 28 in contact with the upper surface of the interlayer connection protrusion B.
  • the formation of the conductive layer 28 by plating can be performed by electroless plating, a combination of electroless plating and electrolytic plating, or a combination of sputtering / deposition and electrolytic plating. However, in order to enhance the reliability of the conductive connection, it is preferable to form them by a combination of electroless plating and electrolytic plating.
  • the thickness of the conductor layer 28 is preferably 1 to 30 m.
  • a plating solution such as copper, nickel, tin or the like is usually used.
  • the metal may be the same as or different from the constituent metal, and copper is preferred.
  • the electroless plating solution is well known for various metals, and various types are commercially available.
  • the liquid composition contains a metal ion source, an alkali source, a reducing agent, a chelating agent, a stabilizer and the like.
  • a plating catalyst such as palladium may be deposited prior to the electroless plating. Electrolytic plating can also be performed by a well-known method.
  • the conductor layer 28 and the metal layer 27 can be further etched to form a metal pattern.
  • the metal forming the conductor layer 28 and the metal forming the metal layer 27 are the same, they can be etched simultaneously. However, when they are different, the etching may be performed sequentially.
  • the interlayer connection structure of the present invention that can be obtained as described above has a wiring layer 22 or a metal layer 17 formed on both sides of an insulating layer 26.
  • the portion of the upper surface of the interlayer connecting protrusion B that is exposed from the insulating layer 26 is adjacent to the wiring layer 22 or the insulating layer 26 with the insulating layer 26 interposed therebetween. It is characterized by being connected by a metal layer 27 and a conductor layer 28 (preferably a plating layer).
  • a multilayer wiring board of the present invention is characterized in that the above-described interlayer connection structure is provided between any layers.
  • the four-layer substrate employs the interlayer connection structure of the present invention for connecting the first layer and the second layer and connecting the third layer and the fourth layer.
  • a multilayer wiring board having a further multilayer structure can be formed.
  • the interlayer connection structure of the present invention can be formed on a core substrate or a double-sided metal foil laminate.
  • a sheet material 2 is formed on a press surface 1.
  • the sheet material 2 may be formed directly on the press surface 1, or the sheet material 2 may be bonded using an adhesive or a pressure-sensitive adhesive.
  • a release layer may be provided on the surface of the sheet material 2.
  • the sheet material 2, the metal layer forming material 3, and the insulating layer forming material 4 are separately arranged between the press surface 1 and the laminated body L, and
  • the release sheet 6 is additionally arranged between the metal layer forming material 3 and the metal layer forming material 3.
  • the release sheet 6 include a fluororesin film, a silicone resin film, various release papers, a fiber-reinforced fluorocarbon resin film, and a fiber-reinforced silicone resin film.
  • the interlayer connection structure of the present invention can be formed in the same manner as in the above-described embodiment, even when the metal layer has an interlayer connection protrusion formed on the metal layer. Even in such a case, it can be carried out in the same process, except that the laminated body to be used is different.
  • the product thus obtained can be used as a double-sided metal foil laminate, and the metal layer and the metal foil can be simultaneously etched to form a pattern. It is also possible to use a metal layer as a ground layer or power supply layer without forming a pattern.
  • the conductive layer can be formed by applying a conductive paste, sputter deposition, vacuum deposition, or the like. Further, a conductor layer may be formed by combining these with electrolytic plating and the like. When applying a conductive paste, it may be applied by screen printing, a squeezing method, or the like, and any conductive paste used for a wiring board may be used. Wear.
  • the core substrate having the wiring layers formed on both surfaces is used as a laminate, and hot pressing is performed on both pressing surfaces to form an interlayer connection structure on both surfaces.
  • the interlayer connection structure may be formed only on one side of the substrate. In that case, a press surface for heating may be provided on only one side.
  • the method for forming an interlayer connection structure according to the second invention is a method for forming an interlayer connection structure in which wiring layers or metal layers formed on both surfaces of a yarn contact layer are connected between layers via interlayer connection protrusions, (2a) a step of forming a recess on the press surface at a position facing the interlayer connection protrusion or arranging a plate for forming the recess, (2b) forming the press surface and the interlayer connection protrusion A step of arranging at least a metal layer forming material and a thermo-adhesive insulating layer forming material between the stacked body and the laminated body, (2c) performing a hot press with a press surface in this arrangement state, A step of obtaining a laminate having a convex portion at a position corresponding to the interlayer connection protrusion and having a metal layer formed on the surface thereof; (2d) removing the convex portion of the laminate to expose the interlayer connection protrusion; And (2e) the exposed interlayer connection protrusions
  • a concave portion la is formed on the press surface 1 at a position facing the interlayer connection protrusion B.
  • the size of the opening dog and the size of the recess 1a of the press surface 1 can be determined according to the shape and size of the interlayer connection protrusion B, and the opening area of the recess 1a is the upper surface area of the interlayer connection protrusion B. It is preferably larger.
  • the depth of the concave portion 1a is preferably set so that the volume of the concave portion 1a is substantially the same as or larger than the volume of the inter-layer connection protrusion B, and is substantially the same as the volume of the inter-layer connection protrusion B. It is more preferable to set so that Specifically, for example, the concave portion 1a has a depth of 5 ⁇ m or more, preferably 10 m or more.
  • the overall shape of the concave portion 1a of the press surface may be a truncated cone, a cylinder, a truncated pyramid, However, it is preferable that the side wall is tapered like a truncated cone or a truncated pyramid.
  • Examples of a method for forming the concave portion 1a on the press surface 1 include half-etching using an etching resist, mirror fabrication, NC processing, and the like. In particular, it is advantageous in terms of accuracy and cost to perform half-etching by using a pattern in forming the interlayer connection protrusion B.
  • step (2b) at least the metal layer forming material 3 and the thermoadhesive insulating layer forming material 4 are arranged in this order between the press surface 1 and the laminated body on which the interlayer connection protrusions B are formed. . Note that an appropriate cushioning material, release sheet, or the like may be interposed between the press surface 1 and the metal layer forming material 3.
  • a plate 7 for forming a recess is arranged on the press surface 1 at a position facing the interlayer connection protrusion B.
  • the plate 7 has a through hole 7a at the position where the concave portion is formed.
  • the material of the plate 7 may be any of metal, resin and the like.
  • Examples of a method of forming the through hole 7a include etching using an etching resist, self-fetching, structure, NC processing, punching, and drilling.
  • the plate 7 is properly positioned with respect to the stacked body L.
  • the metal layer forming step is performed in the step (2b).
  • a layer of the metal layer forming material 3 is formed on the plate 8 in order to dispose the material 3.
  • a concave portion 1a may be formed on the press surface 1 at a position facing the interlayer connection protrusion B, and a layer of the metal layer forming material 3 may be formed on the press surface 1 in the same manner. .
  • a release layer may be interposed.
  • the release layer is preferably made of metal in order to form the layer of the metal layer forming material 3 by electrolytic plating.
  • the metal release layer when the metal layer is copper, nickel, stainless steel, particularly nickel formed by electroless plating is preferable.
  • the release layer is made of insulating material such as ceramic or resin, a combination of electroless plating and electrolytic plating is used to form the metal layer.
  • the conductive connection structure of the present invention is formed on interlayer connection protrusions formed on wiring layers on both surfaces of a core substrate.
  • a substrate in which wiring layers 22 are pattern-formed on both surfaces of a substrate 21 in the same manner as in the first invention is prepared.
  • an interlayer connection protrusion B for making a conductive connection between the layers is formed on the wiring layer 22.
  • the method of forming the interlayer connection protrusion B may be any method as long as the wiring layer 22 and the interlayer connection protrusion B can be conductively connected, for example, a method of forming the metal layer by etching, or a method of forming a metal. Method.
  • the former is described in WO 00/52978 and WO 00/30420, and the latter is described in Japanese Patent Application Laid-Open No. Hei 6-314 878.
  • the underlying conductive layer 10 and the protective metal layer 11 are interposed between the columnar metal body 24 and the wiring layer 22.
  • these layers are not necessarily required, and can be omitted when the columnar metal body 24 and the wiring layer 22 are formed of different metals.
  • the insulating layer forming material and the metal layer forming material are laminated and integrally formed on the laminated body using the heat adhesive insulating layer forming material and the metal layer forming material. However, they may be laminated and integrated in advance.
  • a metal foil 27 on which an adhesive insulating layer 26a is formed is used.
  • Various types of such laminates are commercially available, and any of them can be used.
  • any metal may be used as the metal foil 27, but copper, which is widely used for wiring patterns, is most preferable from the viewpoints of conductivity, ease of etching, and cost.
  • the surface of the metal foil 27 on the side of the insulating layer 26a may be subjected to a blackening treatment or the like for the purpose of enhancing the adhesiveness with a resin or the like.
  • the adhesive insulating layer 26a is deformed at the time of lamination and becomes a force [I
  • any material may be used as long as it has the heat resistance required for the wiring board.
  • Specific examples include various reaction curable resins such as polyimide resins and epoxy resins, and composites (prepredders) of the same with glass fibers, aramide fibers, and the like.
  • a material which is cured by heating and pressurization (thermal lamination) and can be laminated and integrated with the core substrate is preferable from the viewpoint of simplifying the manufacturing process.
  • the thickness of the insulating layer 26a is such that the upper surface of the interlayer connection protrusion 24 is located near the surface of the metal foil 27 after bonding. Specifically, the thickness may be about the thickness corresponding to the height from the surface of the base material 21 to the upper surface of the interlayer connection protrusion 24. Note that, in the present invention, since the interlayer connection protrusion 24 and the metal foil 27 are not pressed and conductively connected to each other in the laminating step, the advantage that the thickness accuracy of the yarn layer 26 a is not so strictly required. There is.
  • the step (3a) of the present invention comprises the steps of: forming a wiring layer 22 on which interlayer connection protrusions 24 are formed and a metal foil 27 on which an adhesive insulating layer 26a is formed; Are laminated so that the upper surface 24 a of the layer connection protrusion 24 is located near the surface of the metal foil 7.
  • the vicinity of the surface of the metal foil 27 may be in contact with the metal foil 27, and a distance of 1 Owm or less is preferable. It is also possible to use a metal layer before forming a wiring pattern in place of the wiring layer 22 (this will be described later).
  • a metal foil 27 with an insulating layer 26a may be stacked and arranged on the upper and lower sides of the core substrate or the like, and heated and pressed (heat lamination, heating press) or the like. At this time, the atmosphere may be vacuum (vacuum lamination) in order to avoid mixing of air. Note that conditions such as the heating temperature are appropriately set according to the material of the insulating layer 26a. As a result, the surface of the core substrate is deformed and hardened in accordance with the dog to form a fiber 26.
  • step (3b) of the present invention as shown in FIGS. 7 (4) to (5), at least a portion of the metal foil 27 overlapping with the upper surface 24a of the interlayer connection projection B is etched.
  • the opening 27a is formed.
  • the upper surface 24a of the columnar metal body 24 corresponding to the interlayer connection protrusion B does not need to be completely flat, and when formed by plating, it is likely to have a curved surface. In that case, the part other than the peripheral wall of the columnar metal 4 a.
  • the portion overlapping the upper surface 24 a of the interlayer connection protrusion B is a region where the upper surface 24 a of the interlayer connection protrusion B is projected on the metal foil 27, and a region of the opening 27 a.
  • from the viewpoint of increasing the area of the conductive connection from the viewpoint of increasing the area between the eyebrows, that is, at least 80% of the area where the upper surface 24 a of the columnar metal body 24 is projected on the metal foil 27, Preferably, 0% is included in the region of the opening 27a.
  • the area of the opening 27a of the metal foil 27 is preferably 0.8 to 5 times the area of the upper surface 24a of the interlayer connection protrusion B.
  • the photosensitive resin refers to a resin composition containing a low molecular weight and / or high molecular weight component that causes photodecomposition, photocrosslinking, or photopolymerization by light.
  • a method of laminating a dry film or a method of applying and curing a photosensitive resin composition can be used. Dry film (photoresist) is available in an organic solvent development type or an aqueous solution development type, and thermocompression bonding (lamination) is performed using a dry film laminator having a heat compression roll.
  • the application of the photosensitive resin composition can be carried out by using various kinds of coatings.
  • a portion forming the opening 27a or a reverse portion thereof is exposed and developed to remove the former portion.
  • Such exposure is usually performed with ultraviolet light or the like using an exposure machine, with a photomask film interposed or by direct exposure using a photo processor or the like.
  • a developer or the like is used according to the type of dry film.For example, trichloroethane or the like is used for the organic solvent development type, and sodium carbonate is used for the night development type. Is done.
  • an etching resist 38 having an opening 38a as shown in FIG. 7 (4) is formed.
  • an opening 27a is formed using an etching solution corresponding to the material of the metal foil 17.
  • etching solution Commercially available etching solution, chloride etching solution, ammonium persulfate, over etching solution Hydrogen oxide / sulfuric acid and the like.
  • the etching resist 38 is removed as necessary, but it may be appropriately selected depending on the type of the etching resist 38, such as removal of a chemical agent and removal of the peeling.
  • a chemical agent for example, in the case of a dry film resist, for example, it can be stripped with methylene chloride or the like for an organic solvent development type or with sodium hydroxide for an alkaline water night development type.
  • the removal of the etching resist 38 can be performed simultaneously with the next step (3c).
  • step (3c) of the present invention as shown in FIG. 8 (6), at least a part of the insulating layer 26 exposed from the opening 27a is removed, and the upper surface 24a of the interlayer connection projection 24 is removed. Is to expose Here, it is not necessary to expose the entire upper surface 24a of the interlayer connection protrusion 24, but it is preferable to expose the entire upper surface 24a from the viewpoint of increasing the area of the conductive connection.
  • puff polishing, belt sander, mechanical grinding, laser irradiation, plasma etching, transfer peeling, or the like can be used, but the opening 2 is formed by blasting or chemical etching. It is preferable to use a means for selectively removing the insulating layer 26 exposed from 7a. By blasting with sand blast or the like, the grinding effect can be obtained even on the concave parts on the surface, and the insulating layer such as resin can be removed more quickly than metal, so that the upper surface of the columnar metal body can be more exposed to 51. Become. Similarly, the insulating layer can be selectively removed by chemical etching.
  • blasting examples include dry or wet sand blasting and metal particle blasting.
  • chemical etching a chemical solution or the like which selectively decomposes the resin can be used.
  • the etching resist 38 provided earlier can be used as a mask material. In this case, the etching resist 38 is removed after the step (3c). Removed.
  • a conductor layer 29 is formed from the upper surface 24a of the exposed interlayer connection protrusion 24 to at least the inner peripheral surface of the opening 27a. Is what you do.
  • the conductor layer 29 is formed on substantially the entire surface of the metal foil 27 including the upper surface 24a by plating. Thereby, it joined to the upper surface 24a
  • the conductive layer 29 a, the conductive layer 29 b bonded to the inner peripheral surface of the opening 27 a, and the conductive layer 29 c around the conductive layer 29 b and the interlayer connection protrusion 24 and the metal foil 27 Are conductively connected.
  • the formation of the conductor layer 29 by plating can be performed by electroless plating, or a combination of electroless plating and electrolytic plating.However, in order to enhance the reliability of conductive connection, a combination of electroless plating and electrolytic plating is used. Preferably, it is formed. At that time, the thickness of the conductor layer 29 is preferably 1 to 50 m.
  • a plating solution such as copper, nickel, or tin is usually used. These metals may be the same as or different from the metal constituting the metal foil 27, and copper is preferred. . Electroless plating solutions are well known for various metals, and various types are sold on the market. Generally, the liquid composition contains a metal ion source, an alkali source, a reducing agent, a chelating agent, a stabilizer and the like. Prior to the electroless plating, a plating catalyst such as palladium may be deposited. Electrolytic plating can also be performed by a well-known method.
  • the conductor layer 29 and the metal foil 27 are further etched to form a metal pattern (step 3e). Can be implemented.
  • the metal constituting the conductor layer 29 and the metal constituting the metal foil 27 are the same, they can be etched simultaneously. However, when they are different, the etching may be performed sequentially.
  • a dry film resist or the like is laminated, and as shown in FIG. 9 (9), exposure is performed in accordance with the shape of the metal pattern, developed, and developed to form an etching resist 30. a is formed.
  • etching is performed using an etching solution according to the material of the conductor layer 29 and the metal foil 27, thereby forming a metal pattern 27b.
  • the etching resist 30a is removed.
  • the conductive connection structure of the present invention that can be obtained as described above includes an interlayer connection protrusion 24 for making conductive connection between layers, and an interlayer connection protrusion 24 thereof.
  • An insulating layer 26 disposed around the interlayer connection protrusion 24 while exposing at least a part of the upper surface 24 a of the insulating layer 26.
  • a metal pattern 27 b which is opened overlapping with the surface 24 a; and a conductor formed from the upper surface 24 a of the interlayer connection projection 24 to at least the inner peripheral surface of the opening 27 a of the metal pattern 27 b.
  • a layer 29 is disposed around the interlayer connection protrusion 24 for making conductive connection between layers, and an interlayer connection protrusion 24 thereof.
  • An insulating layer 26 disposed around the interlayer connection protrusion 24 while exposing at least a part of the upper surface 24 a of the insulating layer 26.
  • a metal pattern 27 b which is opened overlapping with the surface 24 a; and a conductor formed from the
  • the interlayer connection protrusion is formed by the method described in WO 00/52997.
  • the interlayer connection protrusion is formed by another method. It is also possible to do so.
  • the example of the method of forming the conductive connection structure of the present invention on the wiring layer on which the interlayer connection protrusion is formed has been described, but the wiring pattern is not formed or formed.
  • the conductive connection structure of the present invention can be formed in the same manner as in the above-described embodiment even in the case where the interlayer connection projection is formed on the previous metal layer.
  • the metal layer having no wiring pattern and the metal foil on which the adhesive insulating layer is formed are integrally laminated so that the upper surface of the interlayer connection protrusion is located near the surface of the metal foil.
  • the subsequent steps are exactly the same.
  • what is obtained in this way can be used as a double-sided metal foil laminate, and the metal layer and the metal foil can be simultaneously etched to form a pattern. It is also possible to use the metal layer as a ground layer ⁇ power supply layer without forming a pattern.
  • the conductor layer was formed by substantially flushing the metal foil including the upper surface of the interlayer connection protrusion, but from the upper surface of the exposed interlayer connection protrusion to the inner peripheral surface of the opening.
  • the conductor layer may be formed by plating.
  • a conductive layer is formed after providing a photoresist having an opening corresponding to or slightly smaller than the opening. At this time, it is preferable that plating be selectively performed inside the opening.
  • an electroless plating layer serving as a conductive base may be formed before providing a plating resist. Good morning.
  • the catalyst may be selectively adsorbed inside the opening.
  • the example in which the formation of the conductor layer is performed by plating is shown. Filling with a conductive paste, sputtering evaporation, vacuum evaporation, or the like can also be performed. Further, a conductor layer may be formed by combining these with electrolytic plating and the like.
  • the inside of the metal foil may be filled by screen printing, squeeze method, etc., through the opening of the metal foil, and any conductive paste used for the wiring board may be used. Can also be used.
  • the filling of the conductive paste is preferably carried out so as to be substantially at the same height as the surface of the metal foil. It becomes easy to form an upper interlayer connection projection just above the projection.
  • any conductive thin film may be formed, and any conventionally known thin film forming method can be used. It is to be noted that the sputter deposition or the vacuum deposition is performed before the plating resist of the above (3) is provided, and the underlying conductive layer when forming the conductive layer by electrolytic plating, industrial applicability.
  • the thickness of the insulating layer interposed between layers can be made uniform, and even when reinforcing fibers are included in the insulating layer, the surface of the insulating layer can be controlled to have a flat surface.
  • a formation method, and an interlayer connection structure and a multilayer wiring board formed by the method can be provided. Therefore, the present invention has high industrial applicability.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention porte sur un procédé de fabrication d'une structure de connexion entre couches dans lequel des couches de connexion (22) ou des couches métalliques (27) formées sur les deux côtés d'une couche isolante (26) sont connectées entre les couches au moyen d'une projection de connexion entre couches (B). Ce procédé consiste à empiler, dans l'ordre suivant, au moins un élément de feuille (2) pouvant être déformé dans un sens concave, un élément de formation de couche métallique, et un élément de formation de couche isolante thermo-adhésive, entre une surface de pression (1) et un corps à laminer et doté d'une projection de connexion entre couches, à effectuer une compression à chaud de la pile au moyen de la surface de pression afin de produire un laminé doté d'une projection dans une position correspondant à la projection de connexion entre couches et possédant une couche métallique à sa surface, à ôter la projection du laminé afin d'exposer la projection de connexion entre couches, et à électriquement relier la projection de connexion entre couches exposée à la couche métallique placée près de la projection de connexion entre couches, la couche isolante étant interposée entre les deux. Grâce à ce procédé, l'épaisseur de la couche isolante entre les couches peut être égalisée, et la planarisation de la surface et le contrôle de l'épaisseur de la couche isolante peuvent être obtenus même si la couche isolante contient des fibres de renforcement. L'invention concerne également une structure de connexion entre couches fabriquée selon le procédé et un tableau de connexion multicouches.
PCT/JP2002/013049 2002-05-21 2002-12-13 Structure d'interconnexion entre couches et procede de fabrication associe Ceased WO2003098984A1 (fr)

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KR10-2004-7002072A KR100536933B1 (ko) 2002-05-21 2002-12-13 층간 접속 구조 및 그 형성 방법
AU2002367949A AU2002367949A1 (en) 2002-05-21 2002-12-13 Interlayer connection structure and its building method
JP2004506328A JP3907062B2 (ja) 2002-05-21 2002-12-13 層間接続構造及びその形成方法

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JP2006060047A (ja) * 2004-08-20 2006-03-02 North:Kk 配線基板とその製造方法
JP2006278688A (ja) * 2005-03-29 2006-10-12 Sumitomo Bakelite Co Ltd クッション材および配線板の製造方法
JP2006303056A (ja) * 2005-04-19 2006-11-02 Murata Mfg Co Ltd 多層セラミック基板およびその製造方法
JP2008235761A (ja) * 2007-03-23 2008-10-02 Matsushita Electric Ind Co Ltd キャビティ付きプリント配線基板とその製造方法
JP2011054955A (ja) * 2009-08-07 2011-03-17 Semiconductor Energy Lab Co Ltd 端子構造の作製方法、および電子装置の作製方法
JP2012186451A (ja) * 2011-02-14 2012-09-27 Murata Mfg Co Ltd 多層配線板の製造方法および多層配線板
JP2021007185A (ja) * 2016-02-22 2021-01-21 株式会社ダイワ工業 配線基板又は配線基板材料の製造方法

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JP5001903B2 (ja) * 2008-05-28 2012-08-15 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
TWI406621B (zh) * 2010-12-30 2013-08-21 Subtron Technology Co Ltd 線路板及其製作方法
US9095085B2 (en) * 2013-03-29 2015-07-28 Kinsus Interconnect Technology Corp. Method of manufacturing a stacked multilayer structure
CN106034378A (zh) * 2015-03-11 2016-10-19 深圳市英内尔科技有限公司 一种新型材质的卷对卷柔性线路板及其制作方法
CN105101674A (zh) * 2015-07-20 2015-11-25 惠州绿草电子科技有限公司 一种叠加式电路板制造方法及叠加式电路板
JP6652443B2 (ja) * 2016-05-06 2020-02-26 株式会社日本マイクロニクス 多層配線基板及びこれを用いたプローブカード
CN110369854B (zh) * 2019-08-08 2022-08-30 广东省纵鑫电子科技有限公司 热压式复合散热板的制作工艺
US20240173935A1 (en) * 2021-02-03 2024-05-30 Resonac Corporation Layered structure and object detection structure

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JP2006060047A (ja) * 2004-08-20 2006-03-02 North:Kk 配線基板とその製造方法
JP2006278688A (ja) * 2005-03-29 2006-10-12 Sumitomo Bakelite Co Ltd クッション材および配線板の製造方法
JP2006303056A (ja) * 2005-04-19 2006-11-02 Murata Mfg Co Ltd 多層セラミック基板およびその製造方法
JP2008235761A (ja) * 2007-03-23 2008-10-02 Matsushita Electric Ind Co Ltd キャビティ付きプリント配線基板とその製造方法
JP2011054955A (ja) * 2009-08-07 2011-03-17 Semiconductor Energy Lab Co Ltd 端子構造の作製方法、および電子装置の作製方法
JP2012186451A (ja) * 2011-02-14 2012-09-27 Murata Mfg Co Ltd 多層配線板の製造方法および多層配線板
JP2021007185A (ja) * 2016-02-22 2021-01-21 株式会社ダイワ工業 配線基板又は配線基板材料の製造方法

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CN1565150A (zh) 2005-01-12
AU2002367949A1 (en) 2003-12-02
JP3907062B2 (ja) 2007-04-18
JPWO2003098984A1 (ja) 2005-09-22
CN100334929C (zh) 2007-08-29
KR100536933B1 (ko) 2005-12-14

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