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WO2003080235A1 - Corps dessiccant de type feuille flexible pour dispositif electronique ferme et son procede de production - Google Patents

Corps dessiccant de type feuille flexible pour dispositif electronique ferme et son procede de production Download PDF

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Publication number
WO2003080235A1
WO2003080235A1 PCT/KR2003/000589 KR0300589W WO03080235A1 WO 2003080235 A1 WO2003080235 A1 WO 2003080235A1 KR 0300589 W KR0300589 W KR 0300589W WO 03080235 A1 WO03080235 A1 WO 03080235A1
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Prior art keywords
substance
desiccant
moisture
porous
polymer binder
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PCT/KR2003/000589
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English (en)
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Byeng-Chul Lee
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Individual
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Priority claimed from KR10-2002-0078635A external-priority patent/KR100500194B1/ko
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Publication of WO2003080235A1 publication Critical patent/WO2003080235A1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
    • B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
    • B01J20/28026—Particles within, immobilised, dispersed, entrapped in or on a matrix, e.g. a resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/0203—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of metals not provided for in B01J20/04
    • B01J20/0248—Compounds of B, Al, Ga, In, Tl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/0203—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of metals not provided for in B01J20/04
    • B01J20/0274—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of metals not provided for in B01J20/04 characterised by the type of anion
    • B01J20/0281—Sulfates of compounds other than those provided for in B01J20/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B01J20/0203—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising compounds of metals not provided for in B01J20/04
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B01J20/08—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising oxides or hydroxides of metals not provided for in group B01J20/04 comprising aluminium oxide or hydroxide; comprising bauxite
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    • B01J20/103—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate comprising silica
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    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
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    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/10—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
    • B01J20/16—Alumino-silicates
    • B01J20/18—Synthetic zeolitic molecular sieves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01J20/02—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material
    • B01J20/20—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising inorganic material comprising free carbon; comprising carbon obtained by carbonising processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
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    • B01J20/22—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
    • B01J20/26—Synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
    • B01J20/28—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties
    • B01J20/28002—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their physical properties
    • B01J20/28004—Sorbent size or size distribution, e.g. particle size
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01J20/28014—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof characterised by their form or physical properties characterised by their form
    • B01J20/28023—Fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
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    • B01J20/2803—Sorbents comprising a binder, e.g. for forming aggregated, agglomerated or granulated products
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B01J20/28033—Membrane, sheet, cloth, pad, lamellar or mat
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    • B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
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    • B01J20/28078—Pore diameter
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    • B01J20/3042—Use of binding agents; addition of materials ameliorating the mechanical properties of the produced sorbent
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Definitions

  • the present invention relates to a flexible film-type desiccant body used for electronic devices that are sealed within enclosures to avoid failure by moisture, such as organic electro-luminescence (EL) devices, polymer EL and charge couple devices (CCD) for displaying information, and a method for producing the body.
  • EL organic electro-luminescence
  • CCD charge couple devices
  • MVTR moisture vapor transmission rate
  • the performance of a desiccant body used in the enclosed electronic devices is determined by the speed and amount of desiccation and the equilibrium moisture density at an equilibrium state.
  • a good desiccant body features a faster desiccation speed and a lower equilibrium moisture density.
  • Desiccants are broken down into desiccants using physical absorption such as silica gel and those using chemical absorption.
  • the physical desiccants have a high equilibrium moisture density and highly depend on temperature such that if temperature goes up even within the range of typical operation temperature, the physical desiccants release moisture again.
  • the desiccants removing moisture by chemical reactions such as alkaline metal oxides, alkaline earth metal oxides, sulfate, metal halides, perchlorates, phosphorus pentoxide, metal hydrides, and other metals with a higher ionization tendency than hydrogen, have a low equilibrium moisture density because inverse reaction hardly occurs in the typical operation temperature range for electronic devices.
  • U.S. Pat. No. 4,405,487 discloses a desiccant body which removes moisture by making aluminum and zinc powder react with moisture and removes the resultant hydrogen by coupling the hydrogen with unsaturated organic substance in the presence of a catalyst, and a method for producing this desiccant body in the form of pellet by hot pressing.
  • the body and method have drawbacks that the speed of removing hydrogen is slow and it is difficult to make the desiccant body in the form of a flexible film.
  • Japanese laid-open patent No. 3(1991 )-261091 discloses a desiccant body for an organic EL device in which phosphorous pentoxide powder is stored in an air-permeable container and is placed inside an organic EL device.
  • the body since the body is in the form of power, it is inconvenient to use.
  • phosphoric acid which is generated when the phosphorous pentoxide powder reacts with moisture, has a low melting point ranging from 41 to 44°C, the phosphoric acid may leak out of the container even at an ordinary operation temperature and contaminate the electronic circuit device.
  • U.S. Pat. No. 5,304,419 discloses a method of blending a pressure sensitive adhesive with a desiccant
  • U.S. Pat. No. 5,401 ,536 discloses a method of blending a polymer with alumina silicate powder
  • U.S. Pat. No. 5,591 ,379 discloses a method of blending a moisture-permeable binder with a desiccant such as a molecular sieve.
  • the methods are based on physical moisture absorption and moisture should permeate the molecular layer of the binder, the speed of moisture absorption is slow and moisture is released again at room temperature.
  • desiccant substance which absorbs moisture by chemical reactions is mostly in the form of solid state powder when the substance does not absorb moisture, and in this state the desiccation speed of the substance is the fastest.
  • the desiccant substance in order to be placed inside a high-tech electronic device ever-getting smaller and thinner, after securing a predetermined space the desiccant substance should be separated by a moisture-permeable diaphragm, or should be inserted into a moisture-permeable envelop and then attached to the inside, which increases the thickness of the devices and the expenses.
  • U.S. Pat. No. 5,882,761 discloses a method using metal oxide, metal sulfate, metal halide and metal perchlorate in the form of powder or using after coating them inside an organic EL device by vapor deposition, sputtering, or spin coating.
  • U.S. Pat. No. 6,226,890 discloses a method by which a desiccant body is obtained by blending a polymer having a high MVTR with metal oxide, metal sulfate, metal halide and metal perchlorate, and the body is attached to an enclosed electronic device and then is used.
  • This method has an advantage of easiness-to-use.
  • water molecules should permeate through the molecular combination layer of the polymer binder. Accordingly, even though a polymer having a high MVTR is used, the desiccation speed is greatly lowered compared to when the desiccant body is used in the form of powder. Disclosure of the Invention
  • the present invention provides a desiccant body (12) which has a flexible thin-film shape so as to be conveniently attached to the inside of a thin enclosed electronic device (10) and be used, and has countless fine pores formed inside the desiccant body (22) such that movement of moisture is quickly performed and the speed of desiccation is high, and a method of therefor.
  • number 11 is, for example, electronic circuit.
  • a desiccant body (12) for enclosed electronic devices comprising: a desiccant substance (23) which removes moisture by reacting with moisture; a porous substance (20) which with fine pores provides transfer passages for moisture, and contains gas or a volatile substance so that when the desiccant body is formed, fine pores can be formed in a polymer binder (21); and a polymer binder which gives a shape to a mixture of the desiccant substance and porous substance and in which, when the desiccant body is formed, fine pores are formed by releasing of the gas or volatile substance contained in the porous substance such that transfer passages for moisture are provided.
  • the desiccant substance a chemical desiccant substance which does not release again moisture even though the surrounding temperature goes up after moisture is absorbed is used.
  • this desiccant substance alkaline metal oxides, alkaline earth metal oxides, sulfate, metal halides, perchlorates, phosphorus pentoxide, metal hydrides, and other metals with a higher ionization tendency than hydrogen and mixtures thereof are used.
  • any one of lithium (Li), potassium (K), sodium (Na), calcium (Ca), barium (Ba), aluminum (Al), and mixtures thereof is selected and used.
  • Most porous substances have a characteristic of absorbing moisture by absorption. However, their equilibrium moisture density is very high and the substances release again moisture if temperature goes up. Accordingly, the substances are not appropriate as absorption body for electronic devices sensitive to moisture. In the present invention, since a chemical desiccant substance spread neighboring a porous substance immediately absorbs moisture, the function of the porous substance as a desiccant body can be neglected.
  • the porous substance provides a function as a vector of a desiccant substance and a function for providing a passage for moisture transfer.
  • a porous substance any one of active carbon, silica gel, active alumina, zeolite, diatomaceous earth, porous resin, and porous fiber, or mixtures thereof, is selected and used as a solid substance in the form of particles with a diameter equal to or less than 1mm, or a filamentous solid substance with a diameter equal to or less than 1mm in which pores with a diameter of 03nm ⁇ 100microns are formed.
  • the gas or volatile substance contained in the porous substance has a function for forming fine pores in the polymer binder in the desiccant body manufacturing process.
  • the gas or evaporated volatile substance in the pores of the porous substance goes through the polymer binder to the outside such that fine pores are formed in the polymer binder.
  • the pores of the polymer binder become moisture transfer passages to improve the desiccation speed.
  • the MVTR of the substance used as the polymer binder does not matter greatly. Accordingly, considering the mechanical intensity and chemical stability of the polymer, a shape for the mixture of the desiccant substance and the porous substance is given. If fine pores that will become transfer passages for moisture can be formed by gas or volatile substance contained in a polymer substance in the manufacturing process, the polymer can be used.
  • the desiccant body for enclosed electronic devices of the present invention is manufactured by a process comprising producing a mixture of a desiccant substance and a porous substance; blending the mixture of the desiccant substance and the porous substance with a polymer binder; forming a film; and forming fine pores in the polymer binder.
  • a step for curing the polymer binder may be added. First, as shown in FIG. 2, the mixture of the desiccant substance and the porous substance is made such that the desiccant substance 23 is dispersed neighboring the surface or pores of the porous substance 20.
  • the porous substance Since only physically mixing the desiccant substance and the porous substance has a limit, a more precise method is needed. At this time, after filling fine pores of the porous substance with nitrogen or an inert gas, or a volatile liquid having a low boiling point, the porous substance is used so that after the forming, fine pores can be formed in the polymer binder.
  • One method for producing a desiccant substance and a porous substance is vapor deposition or sputtering of a desiccant substance on the porous substance.
  • Another method is using a small amount of a liquid substance such as a volatile liquid, a high boiling point liquid having a low vapor pressure enough to no contaminate the inside by natural evaporation, or a coupling body so that the desiccant substance can be evenly dispersed on the surface or pores of the porous substance.
  • the two substances are physically blended or are blended by using a solvent.
  • the mixture of the polymer binder and the desiccant mixture body (the mixture body of the desiccant substance and the porous substance) may be formed with a desired thickness on a polymer film or release liner by using an ordinary machine tool or equipment, or without forming a separate film, the mixture may be directly applied on the inside of the sealed case of an enclosed electronic device and used.
  • the step for forming fine pores in the polymer binder is the most characteristic step. This step may be performed by applying heat to the formed film, or reducing the pressure. If heat is applied to the formed film or the film is placed inside a vacuum container and then pressure is reduced, the gas or volatile substance in the fine pores of the porous substance leaks out from the film, making passages in the polymer binder.
  • the desiccant body according to the present invention can select and use a polymer binder virtually irrespective of its MVTR, and has a desiccation speed 5 -20 times higher that of a desiccant film having no fine pores formed.
  • the desiccant body according to the present invention can be used by being mixed with an oxygen getter or a hydrogen getter, when necessary.
  • FIG. 1 is a conceptual diagram of an enclosed electronic device to which the present invention is applied.
  • FIG. 2 is a schematic diagram of a fine structure of a desiccant body of the present invention.
  • a white paste was produced and the produced paste was coated on a polyester film. The film was heated at 60°C for 10 minutes with the pressure of 1 Torr so that fine pores could be formed. Then the film was cooled for curing. As a result, a white flexible desiccant film having the thickness of 2mm was produced.
  • EXAMPLE 2 Calcium oxide (CaO) was used as a desiccant substance, active carbon as a porous substance and hot melt of ethylenevinylacetate series as a polymer binder to produce the desiccant body.
  • Barium oxide (BaO) was used as a desiccant substance, active carbon as a porous substance and UV cured resin of polyurethane series as a polymer binder to produce the desiccant body.
  • Phosphorous pentoxide was used as a desiccant substance, active carbon as a porous substance and polybutadiene having a mean molecular weight of 2,500,000 as a pplymer binder to produce the desiccant body.
  • Lithium aluminum hydride (LiAIH 4 ) was used as a desiccant substance, active carbon as a porous substance and polybutadiene having a mean molecular weight of 2,500,000 as a polymer binder to produce the desiccant body.
  • Lithium (Li) and aluminum (Al) were used as desiccant substances, active alumina as a porous substance and polybutadiene having a mean molecular weight of 2,500,000 as a polymer binder to produce the desiccant body.
  • LiAIH LiAIH
  • 500mg diethyl ether solution 500mg diethyl ether solution, and 50mg active alumina in which moisture is removed by vacuum heating, in a glove box in a nitrogen atmosphere, the mixture was heated at 200°C for long hours.
  • lithium aluminum hydride was decomposed and hydrogen was removed, and lithium and aluminum metals were coated on the fine pores and surface of active alumina.
  • a solution of 100 mg of fluorocarbon elastomer dissolved at 15wt% in tetrahydrofuran was additionally blended.
  • a gray paste was produced and the produced paste was coated on polyester film.
  • the film was heated at 80°C for 30 minutes with the pressure of 1 Torr so that the film could be cured with fine pores being formed.
  • a black flexible desiccant film having the thickness of 0.2mm was produced.
  • 100mg polybutadiene in ' the state of gum was blended.
  • a white paste was produced and the produced paste was coated on a polyethylene film. The film was heated at 60°C for 10 minutes with the pressure of 1 Torr so that fine pores could be formed. Then, the film was cooled for curing. As a result, a white flexible desiccant film was produced.
  • COMPARISON EXAMPLE 2 Calcium oxide (CaO) was used as a desiccant substance, active carbon as a porous substance and hot melt of ethylenevinylacetate series as a polymer binder to produce the desiccant body.
  • Barium oxide (BaO) was used as a desiccant substance, active carbon as a porous substance and UV cured resin of polyurethane series as a polymer binder to produce the desiccant body.
  • Phosphorous pentoxide was used as a desiccant substance, and polybutadiene having a mean molecular weight of 2,500,000 as a polymer binder to produce the desiccant body, but a porous substance was not used.
  • Lithium aluminum hydride (LiAIH ) was used as a desiccant substance and polybutadiene having a mean molecular weight of 2,500,000 as a polymer binder to produce the desiccant body, but a porous substance was not used.
  • LiAIH Lithium aluminum hydride
  • 50mg lithium aluminum hydride powder and a solution of 100mg polybutadiene dissolved at 15wt% in hexane were blended.
  • a white paste was produced and the produced paste was coated on a polyethylene film. The film was heated at 80°C for 30 minutes with the pressure of 1 Torr and then cured. As a result, a white flexible desiccant film having the thickness of 0.2mm was produced.
  • the desiccant bodies produced by the examples 1 through 6 and compa ⁇ son examples 1 through 5 had been placed in the air at a temperate of 25°C and a relative humidity of 50% for 30 minutes. Then, by measuring the increased weight of each desiccant body, the mean desiccation speed was measured. The results are shown in the following table 1. Table 1
  • the comparison example 5 shows a case in which because of not using a porous substance, even when heating or reduced pressure was applied after forming a film, there was no substance released through the polymer binders from the inside such that fine pores were not formed.
  • the comparison samples 1 through 3 show the cases in which though a porous substance was used, the process of forming fine pores by applying heat or reduced pressure was not performed such that no fine pores were formed in polymer binders.
  • the table 1 shows that when the desiccant bodies produced by the examples 1 through 5 were compared with those produced by the comparison examples 1 through 5, in which the same desiccant substances and polymer binders as in the examples 1 through 5 were used but the process of forming fine pores was not performed, the absorption speed of the desiccant bodies produced by the examples were ten times or more faster than that of the desiccant bodies produced by the comparison examples.
  • the table also shows that, as in the example 2 and the comparison example 2, the desiccation speed difference was widened when polymer binders having a low MVTR was applied.
  • a flexible thin film-type desiccant body which has a high desiccation speed and can be conveniently attached and used, without releasing moisture and without generated fluid products damaging electronic circuit devices even when the temperature goes up, and a method of therefor are provided. Accordingly, enclosed electronic devices which are constructed as an enclosure type to avoid moisture, such as organic EL devices and CCD, can be used under appropriate conditions for a longer time.

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Electroluminescent Light Sources (AREA)
  • Drying Of Gases (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)

Abstract

L'invention concerne un corps dessiccant de type feuille flexible destinés à être utilisés dans les dispositifs électroniques scellés dans des boîtiers afin d'éviter les pannes dues à l'humidité, et un procédé permettant de produire ce corps. Ce corps dessiccant se présente sous la forme d'une feuille fine et flexible, ce qui permet de le fixer facilement à l'intérieur d'un dispositif électronique fermé mince, et assure une dessiccation rapide grâce à un grand nombre de pores fins formés dans la feuille. Cet corps dessiccant pour dispositifs électroniques fermés comprend une substance dessiccante qui élimine l'humidité en réagissant avec cette dernière, une substance poreuse dont les pores fins constituent des passages permettant le transfert de l'humidité, et qui contient du gaz ou une substance volatile de manière à permettre la formation de pores fins dans un liant polymère lorsque le corps dessiccant est formé, et un liant polymère qui donne une forme au mélange de produit dessiccant et de substance poreuse, et dans lequel des pores fins sont formés lors de la formation du corps dessiccant, sous l'effet de la libération du gaz ou de la substance volatile contenus dans la substance poreuse, ces pores constituant des passages permettant le transfert de l'humidité.
PCT/KR2003/000589 2002-03-26 2003-03-25 Corps dessiccant de type feuille flexible pour dispositif electronique ferme et son procede de production Ceased WO2003080235A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20020016299 2002-03-26
KR10-2002-0016299 2002-03-26
KR10-2002-0078635 2002-12-11
KR10-2002-0078635A KR100500194B1 (ko) 2002-03-26 2002-12-11 유연한 필름형태의 밀폐형 전자 디바이스용 제습제 및그의 제조방법

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1652581A1 (fr) * 2004-10-21 2006-05-03 E.I. Dupont De Nemours And Company Compositions de pâte à film épais durcissable pour l'utilisation dans le contrôle de l'humidité
WO2006069781A3 (fr) * 2004-12-30 2006-09-21 Grace Gmbh & Co Kg Corps adsorbants souples
US8829634B2 (en) 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
EP2438629A4 (fr) * 2009-06-01 2015-08-19 Sumitomo Chemical Co Formulations pour des électrodes améliorées pour des dispositifs électroniques

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4081397A (en) * 1969-12-22 1978-03-28 P. R. Mallory & Co. Inc. Desiccant for electrical and electronic devices
DE3738285A1 (de) * 1987-11-11 1989-05-24 Bayer Ag Phosphorpentoxid und ester von saeuren des phosphors enthaltende gemische und deren verwendung als trockenmittel
US5591379A (en) * 1990-07-06 1997-01-07 Alpha Fry Limited Moisture getting composition for hermetic microelectronic devices
US6214255B1 (en) * 1995-04-19 2001-04-10 Capitol Specialty Plastics, Inc. Desiccant entrained polymer
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4081397A (en) * 1969-12-22 1978-03-28 P. R. Mallory & Co. Inc. Desiccant for electrical and electronic devices
DE3738285A1 (de) * 1987-11-11 1989-05-24 Bayer Ag Phosphorpentoxid und ester von saeuren des phosphors enthaltende gemische und deren verwendung als trockenmittel
US5591379A (en) * 1990-07-06 1997-01-07 Alpha Fry Limited Moisture getting composition for hermetic microelectronic devices
US6214255B1 (en) * 1995-04-19 2001-04-10 Capitol Specialty Plastics, Inc. Desiccant entrained polymer
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1652581A1 (fr) * 2004-10-21 2006-05-03 E.I. Dupont De Nemours And Company Compositions de pâte à film épais durcissable pour l'utilisation dans le contrôle de l'humidité
US7371335B2 (en) 2004-10-21 2008-05-13 E.I. Dupont De Nemours And Company Curable thick film compositions for use in moisture control
US7494604B2 (en) 2004-10-21 2009-02-24 E.I. Du Pont De Nemours And Company Curable thick film paste compositions for use in moisture control
WO2006069781A3 (fr) * 2004-12-30 2006-09-21 Grace Gmbh & Co Kg Corps adsorbants souples
RU2380153C2 (ru) * 2004-12-30 2010-01-27 Грейс Гмбх Унд Ко. Кг Гибкие адсорбирующие изделия
KR101318541B1 (ko) * 2004-12-30 2013-10-16 그라세 게엠베하 운트 캄파니 카게 가요성 흡착체
US8829634B2 (en) 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
EP2438629A4 (fr) * 2009-06-01 2015-08-19 Sumitomo Chemical Co Formulations pour des électrodes améliorées pour des dispositifs électroniques

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