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WO2003068521A1 - Procede d'impression au tampon d'un circuit d'attaque electrique - Google Patents

Procede d'impression au tampon d'un circuit d'attaque electrique Download PDF

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Publication number
WO2003068521A1
WO2003068521A1 PCT/SE2003/000237 SE0300237W WO03068521A1 WO 2003068521 A1 WO2003068521 A1 WO 2003068521A1 SE 0300237 W SE0300237 W SE 0300237W WO 03068521 A1 WO03068521 A1 WO 03068521A1
Authority
WO
WIPO (PCT)
Prior art keywords
pad
circuit
work piece
printed
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE2003/000237
Other languages
English (en)
Inventor
Lars Eriksson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0200481A external-priority patent/SE0200481D0/xx
Priority claimed from SE0202902A external-priority patent/SE0202902D0/xx
Application filed by Individual filed Critical Individual
Priority to AU2003215976A priority Critical patent/AU2003215976A1/en
Publication of WO2003068521A1 publication Critical patent/WO2003068521A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • B41F17/001—Pad printing apparatus or machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Definitions

  • the present invention relates to a method for pad-printing an electrically-conducting circuit onto a work piece.
  • a method known as screen-printing is used to achieve electrical circuits on work pieces, preferable glass sheets, where the circuits conduct a current in, for example, a car windscreen that is to be heated.
  • circuits are screen-printed to achieve alarm loops on glass that set off an alarm when the circuit is broken.
  • Screen-printed circuits are also screen-printed on glass with a metallic coating where such circuits are screen-printed so that a part of the circuit ends up on the metallic coating, which can then be provided with current, especially to heat it up.
  • This heated windscreen is used in vehicles, aircraft and boats.
  • the screen-printing is done with the help of large machines. A net is tensioned over a surrounding frame.
  • the screen-printing method also generates substantial waste as a large amount of ink flows around in the frame. This ink deteriorates and must be replaced, which is costly, messy and stops production. Nor does the screen-printing method give an accurate location of the printed circuit, whereby the quality is not always good enough on the printed circuits. Screen-printing more than once onto one another to achieve a thicker circuit so that a connection surface in the form of, for example, a solder-friendly area is created so that one can connect connecting cables, components, contact devices, etc., to the electrically- conducting circuit, is difficult if not impossible as this method is far too imprecise.
  • One object of the present invention is to eliminate the disadvantages exsisting in the method mentioned above by instead pad-printing the electrically-conducting circuit with an equipment and a method intended for the purpose, whereby small circuits and more complicated circuits that resemble circuit-boards can be pad-printed directly onto the work piece so that a circuit-board is not needed.
  • an inexpensive and well-functioning means of pad-printing an electrically-conducting circuit has now been achieved, which is pad-printed on a work piece even if this has curves.
  • the circuit is connected to a source of current.
  • This method is based on picking up an image from a cliche with a pad that is sufficiently soft and pliable.
  • the cliche is a metal plate that is embossed with an image.
  • the embossing is achieved by a simple photographic method that achieves recesses in the plate by etching.
  • the electrically-conducting ink lies completely enclosed in a so-called ink cup, which is open at the bottom via a tight seal against the cliche.
  • the ink cup is transferred backwards and forwards over the cliche by a pad-printing machine, whereby the cliche is coated with the electrically-conducting ink in the etched recesses, whereby an image is formed that constitutes a whole or partial image of the finally-printed, electrically-conducting circuit, which can include a number of circuits, whereby the image, according to one application of the invention, resembles partial images or a whole image of the circuit on a circuit-board.
  • the pad then presses against the cliche, whereby the image is left on the soft pad. This then prints the image on the work piece in exactly the position desired.
  • Pad-printing gives a very high image resolution, whereby very small work pieces can be printed. This is very useful when pad-printing circuits in electronic items such as mobile phones, whereby many circuits can be printed directly on the casing of the mobile phone, whereby circuit-boards can be partly or wholly eliminated.
  • the precision of the method is so great that one can pad- print several layers of circuit on one another and by one another so that one can build up the desired appropriate thickness and extension on the built-up circuits since one can print circuits next to and on one another with the highest quality.
  • the machines for pad-printing are also cheaper and faster, and take up less space than screen-printing machines and they are besides easy to re-set to print other images of electrically-conducting circuits, whereby set-up times become shorter and adjustment less complicated. Furthermore, this method is very quick.
  • one can pad-print on work pieces with curved surfaces such as, for example, casings of different types that are suitable for electrical items such as, for example, mobile phones where curved surfaces are found and that have corners or edges that project up, which can also be found on sheet or slab-like items. According to the invention, this is possible to execute by building up partial images one after the other next to each other anywhere at all in the three-dimensional space against the work piece.
  • the precision of the pad-printing means that one can easily print several layers on one another and anywhere at all on and by the electrically-conducting circuit, whereby an electrical connection area in the form of, for example, an easy-to-solder area or a good contact surface is formed and that is used to create a good connection to other components, cables and contact devices.
  • the pad-printing machine is built up with pads that can move in a stepless manner in three directions controlled by a computer programmed for this purpose, whereby one pad-prints the electrically-conducting circuits directly on the work piece in a casing even if the surface of the work piece is curved.
  • the primary advantages of the invention are that one has achieved an environmentally-friendly method that applies the circuit onto a work piece, even if the work piece is curved and small, that is quick and inexpensive, and that can eliminate circuit-boards in an electronic item since one can pad-print the circuit directly onto the work piece.
  • Fig. 1 shows a perspective view of an electrically-conducting circuit built up of several partial images and printed on a sheet-like item
  • Fig. 2 shows a perspective view of electrically-conducting circuits that are printed directly on the casing of a mobile phone.
  • a complete whole image of an electrically-conducting circuit 1 is pad-printed from five different partial images a-e, each of which has a different appearance, which is why they are picked up from five different places at a number of different cliches and then pad-printed on five different locations on the work piece 5, which in this case is the sheet-like item 2.
  • the partial image a shows a connecting surface 3 in the form of an easy-to-solder area or an electrical contact surface, whereby a good connection to other components, cables and contacts can take place. Joints 4 occur between the partial images. These are well made since the pad-printing takes place with great precision, whereby no electrical breaks occur at these places. What's more, the joints 4 can be printed to overlap to further improve their ability to conduct electricity.
  • the work piece 5 is executed as a casing 6 for a mobile phone that has curved surfaces 8 in the form of corners, recesses, elevations, bridges, grooves, etc.
  • Circuits 1 that resemble the circuits on a circuit- board and that have an extension that even extends over the curved surfaces 8 are pad-printed on the casing 6.
  • the electrical connecting surfaces 3 are also shown here with different extensions in the form of rounded surfaces, rectangular surfaces, triangular surfaces or other shapes.
  • the casing completely or to a partial extent comprises an electrically-conducting material and is thus electrically-conducting, it can be insulated with an insulating surface, e.g. be surface treated with a non-electrically-conducting material, e.g. painted before circuit 2 is pad-printed, whereby the circuit is pad-printed on the surface-treated material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé permettant d'appliquer au moins un circuit conducteur d'électricité (1) sur une pièce à usiner (5), ledit circuit (1), lors de son utilisation, étant directement ou indirectement couplé à une source de courant. Ce circuit (1) est imprimé au tampon sur ladite pièce à usiner (5), ainsi au moins une image entière ou au moins une image partielle du circuit (1) prélevée d'au moins un cliché par au moins un tampon est alors imprimée au tampon sur la pièce à usiner (5), ledit circuit (1) étant formé sur la pièce à usiner (5).
PCT/SE2003/000237 2002-02-14 2003-02-12 Procede d'impression au tampon d'un circuit d'attaque electrique Ceased WO2003068521A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003215976A AU2003215976A1 (en) 2002-02-14 2003-02-12 Method of tampoprinting an electrical leading circuit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
SE0200481-0 2002-02-14
SE0200481A SE0200481D0 (sv) 2002-02-14 2002-02-14 Sätt att tampongtrycka en elektriskt ledande krets på en detalj
SE0202902A SE0202902D0 (sv) 2002-09-30 2002-09-30 Sätt att tampongtrycka en elektriskt ledande krets på en detalj
SE0202902-3 2002-09-30

Publications (1)

Publication Number Publication Date
WO2003068521A1 true WO2003068521A1 (fr) 2003-08-21

Family

ID=27736687

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2003/000237 Ceased WO2003068521A1 (fr) 2002-02-14 2003-02-12 Procede d'impression au tampon d'un circuit d'attaque electrique

Country Status (2)

Country Link
AU (1) AU2003215976A1 (fr)
WO (1) WO2003068521A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
US6158341A (en) * 1997-09-22 2000-12-12 Telefonaktiebolaget L M Ericsson (Publ) Method for transferring a picture to a surface
US6294730B1 (en) * 1998-04-27 2001-09-25 Telefonaktiebolaget Lm Ericsson (Publ) Adapted electrically conductive layer
WO2001070504A1 (fr) * 2000-03-21 2001-09-27 Lars Eriksson Procede de tampographie sur un detail

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
US6158341A (en) * 1997-09-22 2000-12-12 Telefonaktiebolaget L M Ericsson (Publ) Method for transferring a picture to a surface
US6294730B1 (en) * 1998-04-27 2001-09-25 Telefonaktiebolaget Lm Ericsson (Publ) Adapted electrically conductive layer
WO2001070504A1 (fr) * 2000-03-21 2001-09-27 Lars Eriksson Procede de tampographie sur un detail

Also Published As

Publication number Publication date
AU2003215976A1 (en) 2003-09-04

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