WO2003067950A1 - Douille elastique pour montage de carte de circuit imprime et ensemble montage avec douille elastique - Google Patents
Douille elastique pour montage de carte de circuit imprime et ensemble montage avec douille elastique Download PDFInfo
- Publication number
- WO2003067950A1 WO2003067950A1 PCT/KR2003/000248 KR0300248W WO03067950A1 WO 2003067950 A1 WO2003067950 A1 WO 2003067950A1 KR 0300248 W KR0300248 W KR 0300248W WO 03067950 A1 WO03067950 A1 WO 03067950A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pcb
- outer diameter
- diameter portion
- elastic collet
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Definitions
- the present invention relates to an elastic collet for PCB mounting jig and a PCB jig assembly having the collet, more particularly, to an elastic collet for PCB mounting jig and a PCB jig assembly having the collet, which prevents bending and the soldering defect of a printed circuit board (PCB) in the process of mounting and soldering chips and parts on the PCB.
- PCB printed circuit board
- the PCB can be detached from the elastic collet with suitable force.
- each through slots (30c) is longer than that of the large outer diameter portion (30a) of the collet to give the sufficient elasticity in case the collet is inserted in the pinhole (25) of the PCB. Since both distal ends of the large and small outer diameter portions of the elastic collet are chamfered with a predetermined angle, the elastic collet can be easily inserted into the pinhole (25) of the PCB (20) and through hole of the PCB jig (10).
- the skilled person in the art can calculate the suitable frictional force needed for holding the PCB during transfer, and also can determine the suitable size of the outer diameter (D4) of the large outer diameter portion (30a) and the width (W) of the through slot of the elastic collet and the diameter (D5) of the pinhole. It is preferable that the length of the large outer diameter portion (30a) is shorter by about 0.2 to 0.3mm than the thickness of the PCB, not to protrude over the top surface of the PCB (20) when the elastic collet is inserted into the pinhole (25) of the PCB (20).
- the small outer diameter portion of the elastic collet forms the interference fit with the small inner diameter portion of the through hole, since the outer diameters of the small outer diameter portion and the large outer diameter portion of the elastic collet are greater than the corresponding inner diameters of the through hole, respectively.
- the length (L) of the interference fit can be adjusted appropriately for the elastic collet not to escape when the PCB is mounted with the elastic collet (30).
- the length of the small outer diameter portion of the elastic collet should be shorter than the thickness of the PCB jig not to protrude below the PCB jig when being inserted.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003207103A AU2003207103A1 (en) | 2002-02-06 | 2003-02-05 | Elastic collet for pcb mounting jig and pcb jig assembly having the collet |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0006875 | 2002-02-06 | ||
| KR10-2002-0006875A KR100430879B1 (ko) | 2002-02-06 | 2002-02-06 | 인쇄회로기판의 지그용 탄성콜릿 및 이를 이용한인쇄회로기판용 지그 조립체 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003067950A1 true WO2003067950A1 (fr) | 2003-08-14 |
Family
ID=27725700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2003/000248 Ceased WO2003067950A1 (fr) | 2002-02-06 | 2003-02-05 | Douille elastique pour montage de carte de circuit imprime et ensemble montage avec douille elastique |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100430879B1 (fr) |
| AU (1) | AU2003207103A1 (fr) |
| WO (1) | WO2003067950A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1720388A4 (fr) * | 2004-02-24 | 2010-08-18 | Daisho Denshi Co Ltd | Dispositif de montage, cartouche partielle pour le dispositif, et methode pour tenir et porter le substrat |
| CN107918461A (zh) * | 2016-10-06 | 2018-04-17 | 技嘉科技股份有限公司 | 适配卡固定装置及主板模块 |
| CN115734492A (zh) * | 2022-11-29 | 2023-03-03 | 湖南航天机电设备与特种材料研究所 | 一种印制板压紧工装 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN217820584U (zh) * | 2021-11-15 | 2022-11-15 | 上海凌世电磁技术有限公司 | 一种三同轴法电缆屏蔽效能测试系统的低频圆筒测试工装 |
| KR102754814B1 (ko) * | 2023-05-08 | 2025-01-21 | 이상배 | 파이프 형상 대상물의 표면처리를 위한 지그 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715095A (en) * | 1986-01-22 | 1987-12-29 | Nifco Inc. | Plate fastener |
| JPS6338392U (fr) * | 1986-08-27 | 1988-03-11 | ||
| JPH0391298A (ja) * | 1989-09-01 | 1991-04-16 | Yamaha Corp | 基板固定構造 |
| JPH0529756A (ja) * | 1991-07-18 | 1993-02-05 | Fujitsu Ltd | プリント板支持治具 |
| US5239135A (en) * | 1992-02-14 | 1993-08-24 | Penn Engineering & Manufacturing Corp. | Circuit board fastener |
| JPH0690097A (ja) * | 1992-09-08 | 1994-03-29 | Ibiden Co Ltd | プリント配線基板用治具 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0411480U (fr) * | 1990-05-17 | 1992-01-30 | ||
| JPH0415300U (fr) * | 1990-05-25 | 1992-02-06 | ||
| JPH0432837U (fr) * | 1990-07-17 | 1992-03-17 | ||
| JPH0457327U (fr) * | 1990-09-21 | 1992-05-18 |
-
2002
- 2002-02-06 KR KR10-2002-0006875A patent/KR100430879B1/ko not_active Expired - Fee Related
-
2003
- 2003-02-05 AU AU2003207103A patent/AU2003207103A1/en not_active Abandoned
- 2003-02-05 WO PCT/KR2003/000248 patent/WO2003067950A1/fr not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4715095A (en) * | 1986-01-22 | 1987-12-29 | Nifco Inc. | Plate fastener |
| JPS6338392U (fr) * | 1986-08-27 | 1988-03-11 | ||
| JPH0391298A (ja) * | 1989-09-01 | 1991-04-16 | Yamaha Corp | 基板固定構造 |
| JPH0529756A (ja) * | 1991-07-18 | 1993-02-05 | Fujitsu Ltd | プリント板支持治具 |
| US5239135A (en) * | 1992-02-14 | 1993-08-24 | Penn Engineering & Manufacturing Corp. | Circuit board fastener |
| JPH0690097A (ja) * | 1992-09-08 | 1994-03-29 | Ibiden Co Ltd | プリント配線基板用治具 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1720388A4 (fr) * | 2004-02-24 | 2010-08-18 | Daisho Denshi Co Ltd | Dispositif de montage, cartouche partielle pour le dispositif, et methode pour tenir et porter le substrat |
| US8196292B2 (en) | 2004-02-24 | 2012-06-12 | Daisho Denshi Co., Ltd. | Method for holding and carrying substrate |
| CN107918461A (zh) * | 2016-10-06 | 2018-04-17 | 技嘉科技股份有限公司 | 适配卡固定装置及主板模块 |
| CN107918461B (zh) * | 2016-10-06 | 2020-12-22 | 技嘉科技股份有限公司 | 适配卡固定装置及主板模块 |
| CN115734492A (zh) * | 2022-11-29 | 2023-03-03 | 湖南航天机电设备与特种材料研究所 | 一种印制板压紧工装 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100430879B1 (ko) | 2004-05-17 |
| AU2003207103A1 (en) | 2003-09-02 |
| KR20030067068A (ko) | 2003-08-14 |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
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