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WO2003056609A3 - Appareil et procede de galvanoplastie d'une surface de plaquette - Google Patents

Appareil et procede de galvanoplastie d'une surface de plaquette Download PDF

Info

Publication number
WO2003056609A3
WO2003056609A3 PCT/IB2002/005396 IB0205396W WO03056609A3 WO 2003056609 A3 WO2003056609 A3 WO 2003056609A3 IB 0205396 W IB0205396 W IB 0205396W WO 03056609 A3 WO03056609 A3 WO 03056609A3
Authority
WO
WIPO (PCT)
Prior art keywords
electroplating
wafer surface
wafer
axis
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2002/005396
Other languages
English (en)
Other versions
WO2003056609A2 (fr
Inventor
Kubber Daan L De
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Priority to US10/499,270 priority Critical patent/US20050072680A1/en
Priority to AU2002367224A priority patent/AU2002367224A1/en
Priority to JP2003557031A priority patent/JP2005520930A/ja
Priority to EP02805861A priority patent/EP1527215A2/fr
Publication of WO2003056609A2 publication Critical patent/WO2003056609A2/fr
Anticipated expiration legal-status Critical
Publication of WO2003056609A3 publication Critical patent/WO2003056609A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

L'invention concerne un procédé de galvanoplastie d'une surface de plaquette comprenant l'introduction d'un liquide de plaquage à la surface de la plaquette dans une chambre ainsi que la rotation de ladite plaquette autour d'un axe de rotation qui passe au travers de ladite surface à plaquer. Ledit procédé comprend une étape supplémentaire consistant à déplacer ladite plaquette, de sorte que son axe de rotation soit lui-même entraîné, ceci permettant d'effectuer une rotation autour d'un second axe de rotation.
PCT/IB2002/005396 2001-12-24 2002-12-12 Appareil et procede de galvanoplastie d'une surface de plaquette Ceased WO2003056609A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/499,270 US20050072680A1 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface
AU2002367224A AU2002367224A1 (en) 2001-12-24 2002-12-12 Apparatus and method for electroplating a wafer surface
JP2003557031A JP2005520930A (ja) 2001-12-24 2002-12-12 ウェハ表面を電気メッキするための装置および方法
EP02805861A EP1527215A2 (fr) 2001-12-24 2002-12-12 Appareil et procede de galvanoplastie d'une surface de plaquette

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP01205083 2001-12-24
EP01205083.7 2001-12-24

Publications (2)

Publication Number Publication Date
WO2003056609A2 WO2003056609A2 (fr) 2003-07-10
WO2003056609A3 true WO2003056609A3 (fr) 2005-03-10

Family

ID=8181506

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2002/005396 Ceased WO2003056609A2 (fr) 2001-12-24 2002-12-12 Appareil et procede de galvanoplastie d'une surface de plaquette

Country Status (7)

Country Link
US (1) US20050072680A1 (fr)
EP (1) EP1527215A2 (fr)
JP (1) JP2005520930A (fr)
CN (1) CN1630739A (fr)
AU (1) AU2002367224A1 (fr)
TW (1) TW200411089A (fr)
WO (1) WO2003056609A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007026633B4 (de) * 2007-06-06 2009-04-02 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
CN102268719B (zh) * 2010-06-03 2013-10-30 台湾积体电路制造股份有限公司 直立式电镀设备及其电镀方法
CN104233410A (zh) * 2013-06-24 2014-12-24 马悦 在衬底上电化学沉积金属的装置
EP3176288A1 (fr) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Procédé de dépôt de métal galvanique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003230A1 (fr) * 1995-07-11 1997-01-30 American Plating Systems Procede et appareil de revetement electrolytique
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003230A1 (fr) * 1995-07-11 1997-01-30 American Plating Systems Procede et appareil de revetement electrolytique
US5670034A (en) * 1995-07-11 1997-09-23 American Plating Systems Reciprocating anode electrolytic plating apparatus and method
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 03 3 April 2002 (2002-04-03) *

Also Published As

Publication number Publication date
US20050072680A1 (en) 2005-04-07
AU2002367224A8 (en) 2003-07-15
WO2003056609A2 (fr) 2003-07-10
AU2002367224A1 (en) 2003-07-15
JP2005520930A (ja) 2005-07-14
TW200411089A (en) 2004-07-01
CN1630739A (zh) 2005-06-22
EP1527215A2 (fr) 2005-05-04

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