[go: up one dir, main page]

WO2002029848A3 - Wafer area pressure control for plasma confinement - Google Patents

Wafer area pressure control for plasma confinement Download PDF

Info

Publication number
WO2002029848A3
WO2002029848A3 PCT/US2001/042332 US0142332W WO0229848A3 WO 2002029848 A3 WO2002029848 A3 WO 2002029848A3 US 0142332 W US0142332 W US 0142332W WO 0229848 A3 WO0229848 A3 WO 0229848A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure control
wafer area
area pressure
wafer
confinement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/042332
Other languages
French (fr)
Other versions
WO2002029848A2 (en
Inventor
Han Taejoon
David W Benzing
Albert R Ellingboe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Priority to EP01977828.1A priority Critical patent/EP1323179B1/en
Priority to JP2002533335A priority patent/JP5100952B2/en
Priority to AU2001296916A priority patent/AU2001296916A1/en
Priority to KR1020037004805A priority patent/KR100603682B1/en
Publication of WO2002029848A2 publication Critical patent/WO2002029848A2/en
Publication of WO2002029848A3 publication Critical patent/WO2002029848A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • ing And Chemical Polishing (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A plasma processing chamber is provided which provides improved wafer area pressure control. The plasma processing chamber is a vacuum chamber with a device connected for generating and sustaining a plasma. Part of this device would be an etchant gas source and an exhaust port. A confinement ring defines an area above a wafer. The wafer area pressure is dependent on the pressure drop across the confinement ring. The confinement ring is part of a wafer area pressure control device that provides wafer area pressure control range greater than 100 %. Such a wafer area pressure control device may be three adjustable confinement rings and a confinement block on a holder that may be used to provide the desired wafer area pressure control.
PCT/US2001/042332 2000-10-04 2001-09-26 Wafer area pressure control for plasma confinement Ceased WO2002029848A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01977828.1A EP1323179B1 (en) 2000-10-04 2001-09-26 Wafer area pressure control for plasma confinement
JP2002533335A JP5100952B2 (en) 2000-10-04 2001-09-26 Wafer area pressure control for plasma confinement
AU2001296916A AU2001296916A1 (en) 2000-10-04 2001-09-26 Wafer area pressure control for plasma confinement
KR1020037004805A KR100603682B1 (en) 2000-10-04 2001-09-26 Wafer Area Pressure Control Apparatus and Method for Plasma Confinement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/684,695 2000-10-04
US09/684,695 US6492774B1 (en) 2000-10-04 2000-10-04 Wafer area pressure control for plasma confinement

Publications (2)

Publication Number Publication Date
WO2002029848A2 WO2002029848A2 (en) 2002-04-11
WO2002029848A3 true WO2002029848A3 (en) 2002-10-31

Family

ID=24749169

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/042332 Ceased WO2002029848A2 (en) 2000-10-04 2001-09-26 Wafer area pressure control for plasma confinement

Country Status (9)

Country Link
US (3) US6492774B1 (en)
EP (1) EP1323179B1 (en)
JP (2) JP5100952B2 (en)
KR (1) KR100603682B1 (en)
CN (1) CN1322539C (en)
AU (1) AU2001296916A1 (en)
RU (1) RU2270492C2 (en)
TW (1) TW587272B (en)
WO (1) WO2002029848A2 (en)

Families Citing this family (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492774B1 (en) * 2000-10-04 2002-12-10 Lam Research Corporation Wafer area pressure control for plasma confinement
US6800173B2 (en) * 2000-12-15 2004-10-05 Novellus Systems, Inc. Variable gas conductance control for a process chamber
US6602381B1 (en) 2001-04-30 2003-08-05 Lam Research Corporation Plasma confinement by use of preferred RF return path
US6936135B2 (en) * 2002-04-17 2005-08-30 Lam Research Corporation Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber
US6926803B2 (en) * 2002-04-17 2005-08-09 Lam Research Corporation Confinement ring support assembly
TWI229367B (en) * 2002-12-26 2005-03-11 Canon Kk Chemical treatment apparatus and chemical treatment method
US7296534B2 (en) * 2003-04-30 2007-11-20 Tokyo Electron Limited Hybrid ball-lock attachment apparatus
US7053994B2 (en) * 2003-10-28 2006-05-30 Lam Research Corporation Method and apparatus for etch endpoint detection
KR100539266B1 (en) * 2004-06-02 2005-12-27 삼성전자주식회사 Plasma processing apparatus having segment confinements
US7863702B2 (en) * 2004-06-10 2011-01-04 Samsung Electronics Co., Ltd. Image sensor package and method of manufacturing the same
KR100790392B1 (en) * 2004-11-12 2008-01-02 삼성전자주식회사 Semiconductor manufacturing device
US7632375B2 (en) * 2004-12-30 2009-12-15 Lam Research Corporation Electrically enhancing the confinement of plasma
US7364623B2 (en) * 2005-01-27 2008-04-29 Lam Research Corporation Confinement ring drive
US7837825B2 (en) * 2005-06-13 2010-11-23 Lam Research Corporation Confined plasma with adjustable electrode area ratio
US20060278339A1 (en) * 2005-06-13 2006-12-14 Lam Research Corporation, A Delaware Corporation Etch rate uniformity using the independent movement of electrode pieces
KR100621778B1 (en) * 2005-06-17 2006-09-11 삼성전자주식회사 Plasma processing equipment
CN100362622C (en) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 Lower-extraction type etching device
US7632377B2 (en) 2006-01-24 2009-12-15 United Microelectronics Corp. Dry etching apparatus capable of monitoring motion of WAP ring thereof
US7578258B2 (en) * 2006-03-03 2009-08-25 Lam Research Corporation Methods and apparatus for selective pre-coating of a plasma processing chamber
US7740736B2 (en) * 2006-06-08 2010-06-22 Lam Research Corporation Methods and apparatus for preventing plasma un-confinement events in a plasma processing chamber
US8043430B2 (en) 2006-12-20 2011-10-25 Lam Research Corporation Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber
US8034409B2 (en) * 2006-12-20 2011-10-11 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
US7732728B2 (en) 2007-01-17 2010-06-08 Lam Research Corporation Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor
US8313610B2 (en) * 2007-09-25 2012-11-20 Lam Research Corporation Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
US8522715B2 (en) * 2008-01-08 2013-09-03 Lam Research Corporation Methods and apparatus for a wide conductance kit
TWI516175B (en) * 2008-02-08 2016-01-01 蘭姆研究公司 A method to stabilize pressure in a plasma processing chamber, and a program storage medium of same
US20090286397A1 (en) * 2008-05-15 2009-11-19 Lam Research Corporation Selective inductive double patterning
US8627783B2 (en) * 2008-12-19 2014-01-14 Lam Research Corporation Combined wafer area pressure control and plasma confinement assembly
US8540844B2 (en) * 2008-12-19 2013-09-24 Lam Research Corporation Plasma confinement structures in plasma processing systems
US8869741B2 (en) * 2008-12-19 2014-10-28 Lam Research Corporation Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber
US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
KR101559913B1 (en) * 2009-06-25 2015-10-27 삼성전자주식회사 Plasma dry etching apparatus
US8617347B2 (en) * 2009-08-06 2013-12-31 Applied Materials, Inc. Vacuum processing chambers incorporating a moveable flow equalizer
SG178287A1 (en) * 2009-08-31 2012-03-29 Lam Res Corp A local plasma confinement and pressure control arrangement and methods thereof
US8992722B2 (en) * 2009-09-01 2015-03-31 Lam Research Corporation Direct drive arrangement to control confinement rings positioning and methods thereof
US8501631B2 (en) 2009-11-19 2013-08-06 Lam Research Corporation Plasma processing system control based on RF voltage
JP5597463B2 (en) 2010-07-05 2014-10-01 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
US9076826B2 (en) * 2010-09-24 2015-07-07 Lam Research Corporation Plasma confinement ring assembly for plasma processing chambers
US9462672B2 (en) 2012-02-22 2016-10-04 Lam Research Corporation Adjustment of power and frequency based on three or more states
US9114666B2 (en) 2012-02-22 2015-08-25 Lam Research Corporation Methods and apparatus for controlling plasma in a plasma processing system
US10157729B2 (en) 2012-02-22 2018-12-18 Lam Research Corporation Soft pulsing
US10325759B2 (en) 2012-02-22 2019-06-18 Lam Research Corporation Multiple control modes
US9368329B2 (en) 2012-02-22 2016-06-14 Lam Research Corporation Methods and apparatus for synchronizing RF pulses in a plasma processing system
US9390893B2 (en) 2012-02-22 2016-07-12 Lam Research Corporation Sub-pulsing during a state
US9295148B2 (en) 2012-12-14 2016-03-22 Lam Research Corporation Computation of statistics for statistical data decimation
US9530620B2 (en) 2013-03-15 2016-12-27 Lam Research Corporation Dual control modes
US9842725B2 (en) 2013-01-31 2017-12-12 Lam Research Corporation Using modeling to determine ion energy associated with a plasma system
US9502216B2 (en) 2013-01-31 2016-11-22 Lam Research Corporation Using modeling to determine wafer bias associated with a plasma system
US9320126B2 (en) 2012-12-17 2016-04-19 Lam Research Corporation Determining a value of a variable on an RF transmission model
US9171699B2 (en) 2012-02-22 2015-10-27 Lam Research Corporation Impedance-based adjustment of power and frequency
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
US9197196B2 (en) 2012-02-22 2015-11-24 Lam Research Corporation State-based adjustment of power and frequency
US9408288B2 (en) 2012-09-14 2016-08-02 Lam Research Corporation Edge ramping
US9043525B2 (en) 2012-12-14 2015-05-26 Lam Research Corporation Optimizing a rate of transfer of data between an RF generator and a host system within a plasma tool
US9155182B2 (en) 2013-01-11 2015-10-06 Lam Research Corporation Tuning a parameter associated with plasma impedance
US9779196B2 (en) 2013-01-31 2017-10-03 Lam Research Corporation Segmenting a model within a plasma system
US9620337B2 (en) 2013-01-31 2017-04-11 Lam Research Corporation Determining a malfunctioning device in a plasma system
US9107284B2 (en) 2013-03-13 2015-08-11 Lam Research Corporation Chamber matching using voltage control mode
US9119283B2 (en) 2013-03-14 2015-08-25 Lam Research Corporation Chamber matching for power control mode
US9564285B2 (en) * 2013-07-15 2017-02-07 Lam Research Corporation Hybrid feature etching and bevel etching systems
US9502221B2 (en) 2013-07-26 2016-11-22 Lam Research Corporation Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching
US9594105B2 (en) 2014-01-10 2017-03-14 Lam Research Corporation Cable power loss determination for virtual metrology
US10950421B2 (en) 2014-04-21 2021-03-16 Lam Research Corporation Using modeling for identifying a location of a fault in an RF transmission system for a plasma system
US9536749B2 (en) 2014-12-15 2017-01-03 Lam Research Corporation Ion energy control by RF pulse shape
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
US10957561B2 (en) 2015-07-30 2021-03-23 Lam Research Corporation Gas delivery system
CN105390362B (en) * 2015-10-29 2017-06-23 上海华力微电子有限公司 System and method for changing the O-ring on pressure-control valve
US10825659B2 (en) 2016-01-07 2020-11-03 Lam Research Corporation Substrate processing chamber including multiple gas injection points and dual injector
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US20170278679A1 (en) * 2016-03-24 2017-09-28 Lam Research Corporation Method and apparatus for controlling process within wafer uniformity
KR101680850B1 (en) * 2016-06-28 2016-11-29 주식회사 기가레인 Plasma processing apparatus having control of exhaust flow path size
US10410832B2 (en) 2016-08-19 2019-09-10 Lam Research Corporation Control of on-wafer CD uniformity with movable edge ring and gas injection adjustment
KR102254224B1 (en) 2017-11-21 2021-05-20 램 리써치 코포레이션 Bottom and middle edge rings
CN110767568B (en) * 2018-07-26 2022-05-27 北京北方华创微电子装备有限公司 Pressure regulating assembly, lower electrode device, process chamber and semiconductor processing equipment
JP7466686B2 (en) 2020-03-23 2024-04-12 ラム リサーチ コーポレーション Intermediate ring erosion compensation in substrate processing systems
CN115513023B (en) * 2021-06-23 2025-07-08 中微半导体设备(上海)股份有限公司 Confinement ring, plasma processing apparatus, and exhaust control method thereof
TWI857462B (en) * 2023-01-18 2024-10-01 奈盾科技股份有限公司 Dual-chamber pressure control method and dual-chamber pressure control device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019060A (en) * 1998-06-24 2000-02-01 Lam Research Corporation Cam-based arrangement for positioning confinement rings in a plasma processing chamber
WO2001050498A1 (en) * 1999-12-30 2001-07-12 Lam Research Corporation Linear drive system for use in a plasma processing system

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068784A (en) * 1989-10-03 2000-05-30 Applied Materials, Inc. Process used in an RF coupled plasma reactor
SU1702825A1 (en) * 1989-11-09 1994-02-28 Воронежский завод полупроводниковых приборов Process of manufacture of semiconductor devices
US5246532A (en) 1990-10-26 1993-09-21 Mitsubishi Denki Kabushiki Kaisha Plasma processing apparatus
JP2638443B2 (en) 1993-08-31 1997-08-06 日本電気株式会社 Dry etching method and dry etching apparatus
US5569356A (en) * 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US5534751A (en) 1995-07-10 1996-07-09 Lam Research Corporation Plasma etching apparatus utilizing plasma confinement
JPH1012578A (en) * 1996-06-26 1998-01-16 Mitsubishi Electric Corp Wafer / support substrate bonding method and wafer / support substrate bonding apparatus
RU2131631C1 (en) * 1997-04-18 1999-06-10 Самсоненко Борис Николаевич Method for manufacturing of semiconductor instruments
US6026762A (en) * 1997-04-23 2000-02-22 Applied Materials, Inc. Apparatus for improved remote microwave plasma source for use with substrate processing systems
JP3468446B2 (en) * 1997-05-20 2003-11-17 東京エレクトロン株式会社 Plasma processing equipment
US6008130A (en) * 1997-08-14 1999-12-28 Vlsi Technology, Inc. Polymer adhesive plasma confinement ring
US5998932A (en) * 1998-06-26 1999-12-07 Lam Research Corporation Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber
JP2000058512A (en) 1998-08-03 2000-02-25 Matsushita Electric Ind Co Ltd Plasma processing apparatus and processing method
US6178919B1 (en) * 1998-12-28 2001-01-30 Lam Research Corporation Perforated plasma confinement ring in plasma reactors
US6354241B1 (en) * 1999-07-15 2002-03-12 Applied Materials, Inc. Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing
US6261408B1 (en) * 2000-02-16 2001-07-17 Applied Materials, Inc. Method and apparatus for semiconductor processing chamber pressure control
US6433484B1 (en) * 2000-08-11 2002-08-13 Lam Research Corporation Wafer area pressure control
US6492774B1 (en) * 2000-10-04 2002-12-10 Lam Research Corporation Wafer area pressure control for plasma confinement
US6936135B2 (en) * 2002-04-17 2005-08-30 Lam Research Corporation Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019060A (en) * 1998-06-24 2000-02-01 Lam Research Corporation Cam-based arrangement for positioning confinement rings in a plasma processing chamber
WO2001050498A1 (en) * 1999-12-30 2001-07-12 Lam Research Corporation Linear drive system for use in a plasma processing system

Also Published As

Publication number Publication date
CN1479936A (en) 2004-03-03
US20020190657A1 (en) 2002-12-19
EP1323179A2 (en) 2003-07-02
KR20030051698A (en) 2003-06-25
KR100603682B1 (en) 2006-07-20
JP2012178614A (en) 2012-09-13
WO2002029848A2 (en) 2002-04-11
US7470627B2 (en) 2008-12-30
CN1322539C (en) 2007-06-20
TW587272B (en) 2004-05-11
JP2004511096A (en) 2004-04-08
US6823815B2 (en) 2004-11-30
US6492774B1 (en) 2002-12-10
US20050051268A1 (en) 2005-03-10
EP1323179B1 (en) 2013-11-06
JP5100952B2 (en) 2012-12-19
RU2270492C2 (en) 2006-02-20
AU2001296916A1 (en) 2002-04-15

Similar Documents

Publication Publication Date Title
WO2002029848A3 (en) Wafer area pressure control for plasma confinement
WO2002015236A3 (en) Wafer area pressure control
TW200504861A (en) Uniform etch system
WO2001093315A3 (en) Methods and apparatus for plasma processing
CA2278751A1 (en) Atmospheric-pressure plasma jet
EP1390558A4 (en) Penning discharge plasma source
CA2377253A1 (en) Sterilization system employing a switching module adapted to pulsate the low frequency power applied to a plasma
WO2003060958A3 (en) Air bearing-sealed micro-processing chamber
EP1332241A4 (en) Electrostatically clamped edge ring for plasma processing
AU1767401A (en) Plasma processing system with dynamic gas distribution control
EP1192953A3 (en) Power system for sterilization systems employing low frequency plasma
WO2004017368A3 (en) Sidewall smoothing in high aspect ratio/deep etching using a discreet gas switching method
AU4568099A (en) Semiconductor process chamber electrode and method for making the same
WO2006091588A3 (en) Etching chamber with subchamber
WO2004030020A3 (en) Upper electrode plate with deposition shield in a plasma processing system
WO2003075323A3 (en) Device and method for anisotropically plasma etching a substrate
SE0302045D0 (en) Work piece processing by pulsed electric discharges in solid-gas plasmas
WO2001078101A3 (en) Method and apparatus for plasma processing
MY126731A (en) Lower electrode design for higher uniformity
WO2000065631A3 (en) Apparatus and method for exposing a substrate to plasma radicals
AU2002211886A1 (en) Stepped upper electrode for plasma processing uniformity
TW200729339A (en) Selective etch of films with high dielectric constant with H2 addition
EP1278259A3 (en) Fuel cell unit
EP1292176B8 (en) Device for the production of an active gas beam
WO2004036627A3 (en) Plasma system and method for anistropically etching structures into a substrate

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
AK Designated states

Kind code of ref document: A3

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

ENP Entry into the national phase

Country of ref document: RU

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2002533335

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020037004805

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2001977828

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 018200532

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020037004805

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2001977828

Country of ref document: EP

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

WWG Wipo information: grant in national office

Ref document number: 1020037004805

Country of ref document: KR