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WO2002025698A3 - Kühlkörper zur kühlung insbesondere elektronischer bauelemente - Google Patents

Kühlkörper zur kühlung insbesondere elektronischer bauelemente Download PDF

Info

Publication number
WO2002025698A3
WO2002025698A3 PCT/DE2001/003565 DE0103565W WO0225698A3 WO 2002025698 A3 WO2002025698 A3 WO 2002025698A3 DE 0103565 W DE0103565 W DE 0103565W WO 0225698 A3 WO0225698 A3 WO 0225698A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
electronic components
cooling body
tin
cooling electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/003565
Other languages
English (en)
French (fr)
Other versions
WO2002025698A2 (de
Inventor
Frank Baxmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOSTON COOLTEC Corp
Original Assignee
BOSTON COOLTEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOSTON COOLTEC Corp filed Critical BOSTON COOLTEC Corp
Priority to AU2002213800A priority Critical patent/AU2002213800A1/en
Publication of WO2002025698A2 publication Critical patent/WO2002025698A2/de
Anticipated expiration legal-status Critical
Publication of WO2002025698A3 publication Critical patent/WO2002025698A3/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Resistors (AREA)

Abstract

Die Erfindung betrifft einen Kühlkörper zur Kühlung insbesondere elektronischer Bauelemente. Der Kühlkörper besteht aus mehreren Elementen, welche durch Zinn, ähnliche Legierungen oder Zinn/Pulvermischungen miteinander verlötet sind.
PCT/DE2001/003565 2000-09-19 2001-09-18 Kühlkörper zur kühlung insbesondere elektronischer bauelemente Ceased WO2002025698A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002213800A AU2002213800A1 (en) 2000-09-19 2001-09-18 Cooling body, especially for cooling electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20016316U DE20016316U1 (de) 2000-09-19 2000-09-19 Kühlkörper zur Kühlung insbesondere elektronischer Bauelemente
DE20016316.7 2000-09-19

Publications (2)

Publication Number Publication Date
WO2002025698A2 WO2002025698A2 (de) 2002-03-28
WO2002025698A3 true WO2002025698A3 (de) 2004-03-25

Family

ID=7946743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/003565 Ceased WO2002025698A2 (de) 2000-09-19 2001-09-18 Kühlkörper zur kühlung insbesondere elektronischer bauelemente

Country Status (3)

Country Link
AU (1) AU2002213800A1 (de)
DE (1) DE20016316U1 (de)
WO (1) WO2002025698A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7299639B2 (en) * 2004-06-22 2007-11-27 Intel Corporation Thermoelectric module
DE102007053090B4 (de) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Kühlkörper und Kühlanordnung für elektrische Komponenten und Verfahren zur Herstellung eines Kühlkörpers und einer Kühlanordnung für elektrische Komponenten
FR2965699B1 (fr) * 2010-10-05 2013-03-29 Commissariat Energie Atomique Dispositif pour la dissipation thermique destine a au moins un composant electronique et procede correspondant
DE102018216649A1 (de) * 2018-09-27 2020-04-02 Robert Bosch Gmbh Elektronische Baugruppe

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212564A (en) * 1962-10-05 1965-10-19 Harry M Passman Heat conductive resiliently compressible structure for space electronics package modules
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
US5292054A (en) * 1990-12-20 1994-03-08 Telefonaktiebolaget L M Ericsson Method of manufacturing heat transfer devices, and a tool for carrying out the method
DE9404717U1 (de) * 1994-03-22 1995-05-04 TBS GmbH, 33613 Bielefeld Kühlelement
EP0859408A2 (de) * 1997-02-06 1998-08-19 Sumitomo Electric Industries, Ltd. Kühlkörpermaterial für Halbleiterbauelemente und Verfahren zu dessen Herstellung
DE29822241U1 (de) * 1998-12-14 1999-03-04 Baxmann, Frank, 41462 Neuss Gerippter Kühlkörper

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212564A (en) * 1962-10-05 1965-10-19 Harry M Passman Heat conductive resiliently compressible structure for space electronics package modules
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
US5292054A (en) * 1990-12-20 1994-03-08 Telefonaktiebolaget L M Ericsson Method of manufacturing heat transfer devices, and a tool for carrying out the method
DE9404717U1 (de) * 1994-03-22 1995-05-04 TBS GmbH, 33613 Bielefeld Kühlelement
EP0859408A2 (de) * 1997-02-06 1998-08-19 Sumitomo Electric Industries, Ltd. Kühlkörpermaterial für Halbleiterbauelemente und Verfahren zu dessen Herstellung
DE29822241U1 (de) * 1998-12-14 1999-03-04 Baxmann, Frank, 41462 Neuss Gerippter Kühlkörper

Also Published As

Publication number Publication date
DE20016316U1 (de) 2001-04-05
WO2002025698A2 (de) 2002-03-28
AU2002213800A1 (en) 2002-04-02

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