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WO2002019392A1 - Procede et dispositif pour adapter un support de substrat sur un outil de traitement - Google Patents

Procede et dispositif pour adapter un support de substrat sur un outil de traitement Download PDF

Info

Publication number
WO2002019392A1
WO2002019392A1 PCT/EP2000/008560 EP0008560W WO0219392A1 WO 2002019392 A1 WO2002019392 A1 WO 2002019392A1 EP 0008560 W EP0008560 W EP 0008560W WO 0219392 A1 WO0219392 A1 WO 0219392A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate carrier
process tool
front door
clamping
docking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2000/008560
Other languages
English (en)
Inventor
Clint Haris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to PCT/EP2000/008560 priority Critical patent/WO2002019392A1/fr
Publication of WO2002019392A1 publication Critical patent/WO2002019392A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • the present invention generally relates to a method and device for docking a substrate carrier to a process tool.
  • process tools require a hermetic or nearly hermetic seal between the process tool and a substrate carrier (for the 300 mm generation of process tools this carrier is also called Front Opening Unified Pod or shortly FOUP) .
  • substrate carrier for the 300 mm generation of process tools this carrier is also called Front Opening Unified Pod or shortly FOUP
  • process tools include furnaces that require minimal exposure of the loadlock to the atmosphere as well as tools that utilize a nitrogen purge for said substrate carrier.
  • the substrate carriers can either be purged from nitrogen purge sockets located on the base of the substrate carrier or through the use of a nitrogen purge through the substrate carrier front door opening.
  • FIG. 1 illustrates a known device for docking a substrate carrier to a process tool.
  • reference sign 1 denotes a wafer substrate carrier containing a plurality of wafer substrates 12.
  • 2 denotes a top flange for attaching a lifting means 5 for lifting said substrate carrier 1 to another location.
  • 11 denotes the bottom of said substrate carrier 1, and 50 a conveyor means for conveying said substrate carrier 1 in the horizontal plane.
  • 8 denotes the front door of the substrate carrier.
  • 10 denotes a process tool, here an oven, to which the substrate carrier 1 is to be docked in a hermetically sealed manner by using a clamping means 200.
  • the carrier 1 is also clamped to loadport 100 using another clamping means 501. All loadports have such clamping means 501 for holding the carrier 1.
  • This clamping means 501 is intended to prevent an operator from removing the carrier while the wafers are being processed.
  • an hermetic seal in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1. Moreover, on the side edges of the front side, there is a lip around the door 8.
  • the clamping means 200 which is connected to the front side of the process tool 10 engages with the lip in order to clamp said substrate carrier 1 and urge it against said process tool 10 for forming a sealed connection between both of them.
  • the front door 8 of the substrate carrier 1 is opened by latch keys on the front door of the process tool 10, and a wafer substrate handling mechanism (not shown) transports the wafer substrates 12 stored in said wafers substrate carrier 1 into said process tool 10 for thermal processing.
  • FIG. 1 illustrates a known device for docking a substrate carrier to a process tool
  • FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool
  • FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool
  • FIG. 4 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 2;
  • FIG. 5 illustrates magnified view of the front door section of the substrate carrier and the process tool of FIGS. 3; and FIG. 6 illustrates a simplified flow-chart diagram of a method for docking a substrate carrier to a front door of a process tool in an hermetically sealed manner .
  • a method for docking a substrate carrier to a process tool comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner by using a clamping means for clamping said substrate carrier and urging it against said process tool, and having interposed a seal between said substrate carrier and said process tool; and said clamping means clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
  • a device for docking a substrate carrier to a process tool comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner, said device comprising a clamping means for clamping said substrate carrier and urging it against said process tool, and a seal between said substrate carrier and said process tool; said clamping means being designed for clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
  • the general idea underlying the present invention is to utilize a clamping means to a standardized substrate carrier feature, particularly the top robotic flange or the bottom kinematic coupling plate, with which the substrate carrier is pressed against the seal located at the load port.
  • the present invention solves the problem of having to change tool and loadport design as one changes from one substrate carrier manufacturer to another.
  • said bottom retaining feature comprises at least one of a bottom recess and a bottom conveyor rail hole.
  • said substrate carrier is for carrying* semiconductor wafer substrates .
  • said top flange is also used for attaching a lifting means for lifting said substrate carrier.
  • said seal surrounds said front door of a process tool loadport.
  • FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool.
  • reference sign 100 denotes a loadport to a process tool 10 in form of a furnace.
  • the wafer substrate carrier 1 containing the wafer substrates 12 has been brought forward to the loadport by the conveyor means 50. Before, the wafer substrate carrier 1 has been set onto the conveyor means 50 by the lifting means 5 which engages with the top flange 2.
  • the clamping means 20 provided at the loadport and connected to the process tool 10 is moved to the top flange 2 of the substrate carrier 1 and clamped thereon (cf. 310 in FIG. 6).
  • the clamping means 20 will be retracted to the process tool 10 and therefore means 20 pulls the wafer substrate carrier 1 with its front door 8 to the front door 15 of the process tool 10.
  • the hermetic seal 7 surrounding the front door 15 of the process tool 10 (also cf . FIG. 4) is urged against the front wall of the substrate carrier 8 in order to establish hermetically sealed state.
  • the door 8 of the substrate carrier 1 and door 15 of the process tool 10 are opened, and the wafers 12 are transported to the process tool 10, as already explained above in connection with FIG. 1.
  • the clamping means 20 engages with the standardized top flange 2 of the wafer carrier which allows that substrate carriers of different manufacturers are used at the same time in the line.
  • FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool.
  • the clamping means 20' is attached to the loadport 100 basis and engages with standardized retaining features at the bottom plate 11 of the substrate carrier 1. As may be obtained from FIG. 1, there are different standardized retaining features in the bottom plain of the substrate carrier 1.
  • FIG. 4 illustrates magnified view of the front door section of the substrate carrier 1 and the process tool
  • a hermetic seal 7 in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1.
  • the seal 7 is located at the side of the tool 10. Moreover, on the side edges of the front side of the carrier 1, there is a lip 9 around the door 8.
  • clamping means 200 used in the prior art; as well as the mentioned latch keys in front door 15 of tool 10.
  • FIG. 5 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 3.
  • the clamping means includes two clamping mechanisms, namely one engaging with the top flange 2 and the other one engaging with the bottom plate retaining features 18 and/or 19 and/or 17a and /of 17b.
  • FIG. 6 illustrates a simplified flow-chart diagram of method 300 for docking a substrate carrier 1 having a case with a front door 8 to a front door 15 of a process tool 10 in a hermetically sealed manner (cf. FIGS. 2-5).
  • Method 300 comprises the steps of: clamping 310 substrate carrier 1 by using a clamping means 20, 20' at ' either or both of a top flange 2 and a bottom retaining feature (cf. FIG. 5, 17a, 17b; 18; 19) and moving 320 substrate carrier 1 against process tool 10 (cf. the horizontal arrows in FIGS. 2-3), thereby having interposed seal 7 between substrate carrier 1 and said process tool (10) substrate carrier (1).
  • the bottom retaining feature (17a, 17b; 18; 19) has at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) .
  • seal 7 surrounds front door 8 of said substrate carrier 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour adapter un support de substrat (1) sur un outil de traitement (10), ce support de substrat (1) comprenant un boîtier doté d'une porte frontale (8) à adapter sur la porte frontale (15) dudit outil de traitement de façon hermétique, grâce à un moyen de serrage (20, 20') pour fixer ledit support de substrat (1) contre l'outil de traitement (10). Un joint (7) est disposé entre le support de substrat (1) et l'outil de traitement (10). Le moyen de serrage (20, 20') permet de fixer le support de substrat (1) sur une semelle supérieure (2) ou sur un dispositif de fixation inférieur (17a, 17b; 18; 19), ou sur les deux.
PCT/EP2000/008560 2000-09-01 2000-09-01 Procede et dispositif pour adapter un support de substrat sur un outil de traitement Ceased WO2002019392A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2000/008560 WO2002019392A1 (fr) 2000-09-01 2000-09-01 Procede et dispositif pour adapter un support de substrat sur un outil de traitement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2000/008560 WO2002019392A1 (fr) 2000-09-01 2000-09-01 Procede et dispositif pour adapter un support de substrat sur un outil de traitement

Publications (1)

Publication Number Publication Date
WO2002019392A1 true WO2002019392A1 (fr) 2002-03-07

Family

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PCT/EP2000/008560 Ceased WO2002019392A1 (fr) 2000-09-01 2000-09-01 Procede et dispositif pour adapter un support de substrat sur un outil de traitement

Country Status (1)

Country Link
WO (1) WO2002019392A1 (fr)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1450399A1 (fr) * 2003-01-27 2004-08-25 Applied Materials, Inc. Une bride de transfert et un support pour suspendre un porteur de substrat
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7077264B2 (en) 2003-01-27 2006-07-18 Applied Material, Inc. Methods and apparatus for transporting substrate carriers
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7234584B2 (en) 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7243003B2 (en) 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
US7578647B2 (en) 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7930061B2 (en) 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US8297319B2 (en) 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US8672121B2 (en) 2007-10-22 2014-03-18 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
WO1999065803A1 (fr) * 1998-06-17 1999-12-23 Genmark Automation, Inc. Systeme automatique d'ouverture et de fermeture de recipients de stockage ultra propres
US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
EP0987750A1 (fr) * 1998-04-06 2000-03-22 Dainichi Shoji K.K. Recipient

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US6013920A (en) * 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
EP0987750A1 (fr) * 1998-04-06 2000-03-22 Dainichi Shoji K.K. Recipient
WO1999065803A1 (fr) * 1998-06-17 1999-12-23 Genmark Automation, Inc. Systeme automatique d'ouverture et de fermeture de recipients de stockage ultra propres

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7506746B2 (en) 2002-08-31 2009-03-24 Applied Materials, Inc. System for transporting substrate carriers
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7930061B2 (en) 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US7792608B2 (en) 2002-08-31 2010-09-07 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7234584B2 (en) 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7243003B2 (en) 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7299831B2 (en) 2002-08-31 2007-11-27 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7346431B2 (en) 2002-08-31 2008-03-18 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyer
US7359767B2 (en) 2002-08-31 2008-04-15 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7673735B2 (en) 2002-08-31 2010-03-09 Applied Materials, Inc. System for transporting substrate carriers
US7527141B2 (en) 2002-08-31 2009-05-05 Applied Materials, Inc. System for transporting substrate carriers
US7293642B2 (en) 2003-01-27 2007-11-13 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
US7367446B2 (en) 2003-01-27 2008-05-06 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
CN100397607C (zh) * 2003-01-27 2008-06-25 应用材料有限公司 用于悬挂衬底载体的高架传送凸缘和支撑件
US7537108B2 (en) 2003-01-27 2009-05-26 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
US7578647B2 (en) 2003-01-27 2009-08-25 Applied Materials, Inc. Load port configurations for small lot size substrate carriers
US7594789B2 (en) 2003-01-27 2009-09-29 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7611318B2 (en) 2003-01-27 2009-11-03 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7506752B2 (en) 2003-01-27 2009-03-24 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
EP1450399A1 (fr) * 2003-01-27 2004-08-25 Applied Materials, Inc. Une bride de transfert et un support pour suspendre un porteur de substrat
US7711445B2 (en) 2003-01-27 2010-05-04 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7077264B2 (en) 2003-01-27 2006-07-18 Applied Material, Inc. Methods and apparatus for transporting substrate carriers
US8297319B2 (en) 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
US8672121B2 (en) 2007-10-22 2014-03-18 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers

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