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WO2002013261A3 - Heat spreading die cover - Google Patents

Heat spreading die cover Download PDF

Info

Publication number
WO2002013261A3
WO2002013261A3 PCT/US2001/024186 US0124186W WO0213261A3 WO 2002013261 A3 WO2002013261 A3 WO 2002013261A3 US 0124186 W US0124186 W US 0124186W WO 0213261 A3 WO0213261 A3 WO 0213261A3
Authority
WO
WIPO (PCT)
Prior art keywords
frame
heat spreading
cover
die cover
generating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/024186
Other languages
French (fr)
Other versions
WO2002013261A2 (en
Inventor
Douglas S Ondricek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Priority to AU2001279137A priority Critical patent/AU2001279137A1/en
Publication of WO2002013261A2 publication Critical patent/WO2002013261A2/en
Anticipated expiration legal-status Critical
Publication of WO2002013261A3 publication Critical patent/WO2002013261A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat spreader for a heat generating component. The heat spreader includes a frame having a first top surface and a cover disposed on the first top surface. The cover is made from, at least in part, a thermally conductive material. The frame can be fixed relative to a substrate such that the frame and the cover enclose a heat generating component coupled to the substrate. The frame has non-curved inner walls which bound a space that is capable of accommodating a heat generating component.
PCT/US2001/024186 2000-08-07 2001-08-01 Heat spreading die cover Ceased WO2002013261A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001279137A AU2001279137A1 (en) 2000-08-07 2001-08-01 Heat spreading die cover

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63355100A 2000-08-07 2000-08-07
US09/633,551 2000-08-07

Publications (2)

Publication Number Publication Date
WO2002013261A2 WO2002013261A2 (en) 2002-02-14
WO2002013261A3 true WO2002013261A3 (en) 2003-07-10

Family

ID=24540091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/024186 Ceased WO2002013261A2 (en) 2000-08-07 2001-08-01 Heat spreading die cover

Country Status (3)

Country Link
AU (1) AU2001279137A1 (en)
TW (1) TW526599B (en)
WO (1) WO2002013261A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11385281B2 (en) * 2019-08-21 2022-07-12 Micron Technology, Inc. Heat spreaders for use in semiconductor device testing, such as burn-in testing
US11372043B2 (en) 2019-08-21 2022-06-28 Micron Technology, Inc. Heat spreaders for use in semiconductor device testing, such as burn-in testing
CN117156790A (en) * 2022-05-24 2023-12-01 华为技术有限公司 A heating module, heat dissipation device and communication equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322165A1 (en) * 1987-12-21 1989-06-28 The Standard Oil Company Thermally conductive ceramic/polymer composites
US5798565A (en) * 1993-08-16 1998-08-25 Micron Technology, Inc. Repairable wafer scale integration system
WO2000033360A1 (en) * 1998-12-04 2000-06-08 Formfactor, Inc. A method and apparatus for the transport and tracking of an electronic component
WO2000035262A2 (en) * 1998-12-04 2000-06-15 Formfactor, Inc. Method for mounting an electronic component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322165A1 (en) * 1987-12-21 1989-06-28 The Standard Oil Company Thermally conductive ceramic/polymer composites
US5798565A (en) * 1993-08-16 1998-08-25 Micron Technology, Inc. Repairable wafer scale integration system
WO2000033360A1 (en) * 1998-12-04 2000-06-08 Formfactor, Inc. A method and apparatus for the transport and tracking of an electronic component
WO2000035262A2 (en) * 1998-12-04 2000-06-15 Formfactor, Inc. Method for mounting an electronic component

Also Published As

Publication number Publication date
WO2002013261A2 (en) 2002-02-14
TW526599B (en) 2003-04-01
AU2001279137A1 (en) 2002-02-18

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