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WO2002089553A1 - Procede permettant le montage d'un composant electronique sur une carte de cablage et feuille adhesive flexible permettant de fixer une carte de cablage imprimee - Google Patents

Procede permettant le montage d'un composant electronique sur une carte de cablage et feuille adhesive flexible permettant de fixer une carte de cablage imprimee Download PDF

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Publication number
WO2002089553A1
WO2002089553A1 PCT/JP2002/003610 JP0203610W WO02089553A1 WO 2002089553 A1 WO2002089553 A1 WO 2002089553A1 JP 0203610 W JP0203610 W JP 0203610W WO 02089553 A1 WO02089553 A1 WO 02089553A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
adhesive
fpc
wiring board
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/003610
Other languages
English (en)
Japanese (ja)
Inventor
Shigeki Muta
Kazumasa Tanaka
Kenji Sano
Hiroshi Yamamoto
Koichi Ikeda
Junji Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001119430A external-priority patent/JP2002309201A/ja
Priority claimed from JP2001119431A external-priority patent/JP2002314240A/ja
Priority claimed from JP2001151846A external-priority patent/JP2002338914A/ja
Priority claimed from JP2001151850A external-priority patent/JP2002338915A/ja
Priority claimed from JP2001151853A external-priority patent/JP4766776B2/ja
Priority claimed from JP2001176838A external-priority patent/JP2002368497A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to KR1020037013689A priority Critical patent/KR100867048B1/ko
Publication of WO2002089553A1 publication Critical patent/WO2002089553A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Definitions

  • the FPC when mounting electronic components on a flexible printed wiring board (hereinafter, may be abbreviated as “FPC”), the FPC can be easily fixed to a fixing plate, and the electronic components can be accurately and automatically mounted.
  • the present invention relates to a method for mounting electronic components on a flexible printed wiring board that can be mounted.
  • the present invention also relates to an adhesive sheet that facilitates the attachment and detachment of the FPC to and from a fixing plate, and that suppresses or prevents a decrease in adhesiveness even when heated when the electronic component is mounted on the FPC.
  • FPC flexible printed wiring boards
  • FIGS. 13 and 13B are schematic views showing a typical example of a conventional method of fixing an FPC.
  • the FPC 4 is placed on the surface of the mother port 6 (such as a fixing plate made of aluminum, etc.) and the FPC is aligned.
  • an object of the present invention is to provide a flexible printed circuit that can easily attach and detach an FPC to and from a fixed plate when mounting an electronic component on a flexible printed circuit board (FPC), and can firmly fix the FPC.
  • An object of the present invention is to provide a method for mounting electronic components on a board.
  • Another object of the present invention is to mount and remove an FPC from a fixed plate with excellent workability when mounting an electronic component on the FPC, and to mount the electronic component on the FPC with high accuracy. It is an object of the present invention to provide a method of mounting an electronic component on a flexible printed wiring board which can perform the method.
  • Still another object of the present invention is to make it easy to attach and detach a flexible printed wiring board to and from a fixed plate, and to reduce the adhesiveness even when heated when electronic components are mounted on the flexible printed wiring board. It is to provide an adhesive sheet which is suppressed or prevented.
  • invention disclosure> In the first invention, when mounting the electronic component on the surface of the flexible printed wiring board, the flexible printed wiring board is fixed on the adhesive layer surface of the fixing plate having an adhesive layer on the surface, This is a method for mounting electronic components on a flexible printed wiring board, in which electronic components are mounted on the surface of a wiring board.
  • the fixing plate having an adhesive layer on the surface is such that the adhesive layer of the adhesive sheet having the adhesive layer on at least one side is on the surface side opposite to the fixing plate side.
  • the one attached to one surface of the fixing plate can be suitably used.
  • the adhesive layer of the fixing plate to which the flexible printed wiring board is adhered is made of an adhesive having easy peelability.
  • an adhesive sheet is pasted on a surface of the flexible printed wiring board opposite to the surface on which the electronic component is mounted, and the adhesive sheet is And mounting the electronic component on the surface of the flexible printed wiring board after the flexible printed wiring board is fixed to the fixing plate via the flexible printed wiring board.
  • a double-sided adhesive sheet in which an adhesive layer is formed on both sides of a substrate can be suitably used as the adhesive sheet.
  • the substrate a porous substrate is preferable.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer an acrylic pressure-sensitive adhesive and a Z or silicone pressure-sensitive adhesive are preferable.
  • the present invention also includes a flexible printed wiring board to which a sheet is adhered.
  • a third invention is a flexible printed wiring board fixing adhesive sheet for fixing the flexible printed wiring board to a fixing plate when mounting an electronic component on the surface of the flexible printed wiring board, wherein the adhesive sheet comprises at least a porous base material.
  • This is an adhesive sheet for fixing a flexible printed wiring board having an adhesive layer formed on one side.
  • the porous substrate is preferably a porous substrate made of a fibrous material.
  • the adhesive constituting the adhesive layer acrylic adhesive And / or a silicone-based pressure-sensitive adhesive.
  • a fourth invention is a flexible printed wiring board fixing adhesive sheet for fixing the flexible printed wiring board to a fixing plate when mounting an electronic component on the surface of the flexible printed wiring board, wherein the adhesive sheet has at least one surface of a base material.
  • the storage modulus (frequency: 1 H z) is the temperature 0 to 3 0 0 ° C in 1 0 3 ⁇ 1 0 6
  • a flexible printed circuit board for fixing the adhesive layer is made form in the range of It is an adhesive sheet.
  • the tensile strength after mounting the electronic component is preferably 5 NZ15 mm or more.
  • the substrate is preferably a porous substrate.
  • a fifth invention is a flexible printed wiring board fixing adhesive sheet for fixing the flexible printed wiring board to a fixing plate when mounting an electronic component on the surface of the flexible printed wiring board, wherein the convex portion or the hole portion is provided.
  • This is an adhesive sheet for fixing a flexible printed wiring board having a plurality of adhesive layers formed on the surface.
  • the convex portion is preferably a linear convex portion.
  • Such linear projections may be formed by stripe coating.
  • the hole is preferably formed by punching.
  • the adhesive layer may be formed on at least one surface of a sheet-like or film-like base material having a melting point of not lower than 290 ° C. from the viewpoint of heat resistance during IR heating or the like.
  • the present invention also provides a method for mounting an electronic component on a flexible printed wiring board, wherein the electronic component is mounted on the surface of the flexible printed wiring board after the flexible printed wiring board is fixed to the fixing plate by the adhesive sheet for fixing the flexible printed wiring board.
  • FIG. 1A to 1C are schematic diagrams showing a state in which the FPC is attached to a fixing plate in the first embodiment
  • FIG. 1A is a diagram viewed from above
  • FIG. 1B is a diagram viewed from the side.
  • FIG. 1C is a modified example.
  • FIG. 2A and 2B show a state in which the FPC is attached to the fixing plate in the second embodiment.
  • 2A is a diagram viewed from the upper side
  • FIG. 2B is a diagram viewed from the lateral side.
  • FIG. 3 is a cross-sectional view illustrating an example of the adhesive sheet according to the present invention.
  • FIG. 4 is a cross-sectional view showing another example of the adhesive sheet according to the present invention.
  • FIG. 5 is a sectional view showing still another example of the adhesive sheet according to the present invention.
  • FIG. 6 is a sectional view showing still another example of the adhesive sheet according to the present invention.
  • FIG. 7 is a schematic view of the FPC fixing adhesive sheet according to FIGS. 5 and 6 as viewed from above.
  • FIG. 8 is a sectional view showing still another example of the adhesive sheet according to the present invention.
  • FIG. 9 is a sectional view showing still another example of the adhesive sheet according to the present invention.
  • FIG. 10 is a sectional view showing still another example of the adhesive sheet of the present invention.
  • FIG. 11 is a schematic view of the FPC fixing adhesive sheet according to FIGS. 9 and 10 as viewed from above.
  • FIG. 12 is a sectional view showing still another example of the adhesive sheet according to the present invention.
  • FIGS. 13 and 13B are schematic views showing a typical example of a conventional method of fixing an FPC.
  • FIGS. 1A and 1B are schematic views showing a first embodiment of a method for mounting an electronic component on an FPC according to the present invention.
  • FIG. 1A is a schematic view showing a state in which the FPC is attached to a fixing plate
  • FIG. 1A is a view from above
  • FIG. 1B is a view from the side.
  • FIGS. 1A and 1B are schematic views showing a first embodiment of a method for mounting an electronic component on an FPC according to the present invention.
  • FIG. 1A is a schematic view showing a state in which the FPC is attached to a fixing plate
  • FIG. 1A is a view from above
  • FIG. 1B is a view from the side.
  • 1A and 1B 4 is an FPC
  • 5 is a double-sided adhesive sheet with a base material
  • 5 1 is an upper adhesive layer of the double-sided adhesive sheet
  • 6 is a fixing plate
  • 7 1 is a guide bin for fixing a mother-to-port
  • 7 2 is a guide bin for FPC positioning
  • 7 1 a is a guide bin for fixing the motherboard 7 1
  • perforation for insertion 7 2 a is a guide pin for FPC alignment 7 2
  • a perforation for insertion 8 is It is a fixed table for sending.
  • the double-sided adhesive sheet 5 is attached to the entire surface or almost the entire surface of one side of the fixing plate 6, and the adhesive layer 5 on the double-sided adhesive sheet 5 FPC 4 is affixed to a predetermined part of. More specifically, a double-sided adhesive sheet 5 is adhered to one surface of the fixing plate 6, and the FPC alignment guide bin 7 is provided at a predetermined position on the other adhesive layer 5 1 of the double-sided adhesive sheet 5.
  • the fixing plate 6 to which the FPC 4 is attached is placed on the fixing stand 8 for transportation, and the guide bin 7 for fixing the mother board 7 1 And is fixed using the perforations 71a.
  • the perforations 7 1a for passing the mother board fixing guide pins 71 and the perforations 7 2a for passing the FPC alignment guide bins 72 attach the double-sided adhesive sheet 5 to the fixing plate 6. After that, it can be formed by punching or the like.
  • the FPC is placed on a predetermined portion of the surface of the adhesive layer of the fixing plate having the adhesive layer on the surface and fixed by sticking, so that the FPC is easily fixed to the fixing plate. be able to. Also, when removing the FPC on which the electronic components are mounted after mounting the electronic components, simply remove the FPC on which the electronic components are mounted from the fixing plate having an adhesive layer on the surface. There is no need to peel off. Therefore, the FPC can be fixed to the fixing plate and the FPC can be removed from the fixing plate with excellent workability.
  • the FPC since the entire lower surface of the FPC is fixed to the fixing plate via the adhesive layer, the FPC can be firmly fixed to the fixing plate. Therefore, there is little or no gap between the FPC and the fixing plate (the adhesive layer on the surface of the fixing plate). Therefore, when the electronic component is fixed to the FPC, there is no displacement of the FPC, and the electronic component can be mounted on the FPC with high positional accuracy.
  • FIGS. 2A and 2B are schematic views showing a second embodiment of the method for mounting an electronic component on an FPC according to the present invention.
  • a double-sided adhesive sheet 5 is attached to a surface opposite to the surface on which the electronic components of the FPC 4 are mounted (hereinafter, may be referred to as a “fixing plate attaching surface”).
  • the FPC 4 is stuck and fixed to a predetermined portion of the fixing plate 6 via the sheet 5. More specifically, the fixing plate 6 is fixed to the transfer fixing table 8 using the motherboard fixing guide bin 71 and the perforation 71a, and then fixed to the fixing plate attaching surface of the FPC 4.
  • the FPC when the FPC is attached to the fixing plate, an adhesive sheet is attached to the FPC in advance to form an adhesive layer on the fixing plate attaching surface of the FPC, and the fixing plate is formed. Since the FPC having the adhesive layer on the sticking surface is placed on a predetermined portion of the fixing plate and fixed by sticking, the FPC can be easily fixed to the fixing plate. Also, when removing the FPC on which the electronic components are mounted after mounting the electronic components, simply remove the FPC on which the electronic components are mounted from the fixing plate and attach it to the fixing plate attachment surface of the FPC. It is only necessary to peel off the adhesive sheet that has been removed, and there is no need to peel off multiple adhesive tapes. Therefore, in an excellent operation 4, the FPC can be fixed to the fixing plate and the FPC can be removed from the fixing plate.
  • the adhesive sheet 5 is first adhered to the fixing plate 6, while in the second embodiment, the adhesive sheet 5 is first adhered to the FPC 4.
  • the two embodiments differ in this respect, but have the same effect.
  • the FPC 4 can be fixed to the fixing plate by using the adhesive sheet 5 having the adhesive layer on at least one surface of the substrate. Therefore, the present invention also includes an adhesive sheet for fixing a flexible printed wiring board applied to fix the flexible printed wiring board to a fixing plate when mounting an electronic component on the surface of the flexible printed wiring board. Fixed plate
  • the fixing plate 6 is not particularly limited as long as it is a plate on which an adhesive layer can be formed or a plate on which an adhesive sheet can be fixed.
  • Hard plate 6 A plate that can ensure surface properties, for example, an aluminum plate, a glass plate, a plate made of an epoxy resin, or the like can be used, but the material and shape of the plate are not limited at all. (Especially, an automatic mounting device) can be appropriately selected.
  • the fixing plate 6 having the adhesive layer 51 on its surface is fixed such that the surface of the adhesive layer on the adhesive sheet (such as an adhesive tape) is opposite to the fixing plate as in the first embodiment. Can be formed by attaching the adhesive sheet. Further, as shown in FIG. 1C, a fixing plate 6 having an adhesive layer 51 formed of an adhesive on the surface by applying a bonding agent may be used. Overview of adhesive sheet
  • FIG. 3 is a cross-sectional view illustrating an example of the adhesive sheet according to the present invention
  • FIG. 4 is a cross-sectional view illustrating another example of the adhesive sheet according to the present invention.
  • 1 is an adhesive sheet for fixing a flexible printed wiring board (hereinafter, sometimes referred to as “adhesive sheet for fixing an FPC” or simply “adhesive sheet”)
  • 2 is an adhesive layer
  • 3 is a base material.
  • the FPC fixing adhesive sheet 1 has a structure in which an adhesive layer 2 is laminated on one surface (on one surface) of a base material 3.
  • 11 is an adhesive sheet for fixing an FPC
  • 21 is an adhesive layer
  • 31 is a substrate.
  • the FPC fixing adhesive sheet 11 has a structure in which an adhesive layer 21 is laminated on both sides of a base material 31.
  • the FPC fixing adhesive sheets 1 and 11 a sheet formed by laminating an adhesive layer on one surface and Z or both surfaces of a substrate can be used.
  • a double-sided adhesive sheet as shown in FIG. 4 can be preferably used.
  • a substrate-less double-sided adhesive sheet comprising only an adhesive layer can be used.
  • Base material in the adhesive sheets 1 and 11, the substrates 3 and 31 are not particularly limited.
  • a plastic film made of a plastic such as polyester such as cellophane, polytetrafluoroethylene, polyethylene, or polyethylene terephthalate is used.
  • a substrate can be suitably used.
  • the FPC is usually exposed to very high temperatures for a short time to melt the solder.
  • IR calorie heat infrared rays
  • the peak temperature at which the maximum temperature is reached is about 260 ° C, and the retention time of the peak temperature is about 20 ° C.
  • the heating conditions are around seconds.
  • Adhesive sheets such as adhesive tapes that have undergone such a very high-temperature heating step can be used for adhesive tapes and other materials due to the rapid expansion (gasification) of water and the like contained in the adhesive during IR heating.
  • FPC and Z or the fixing plate was peeled off from the adhesive sheet.
  • a porous substrate is used as the substrate 3 or 31 of the adhesive sheet for fixing the FPC, even if the substrate is exposed to a high temperature in a heating step (particularly an IR heating step), a decrease in adhesiveness is suppressed or prevented. High adhesiveness can be maintained. In other words, even after the heating step of extremely high temperature, the state where the FPC and Z or the fixing plate is adhered to the adhesive sheet is maintained.
  • the base material is considered to be a porous base material.
  • the gas component vaporized in the adhesive layer can be released to the outside through the porous substrate, and the FPC can be suppressed or prevented from peeling off from the adhesive layer. Therefore, even after the heating process, the FPC does not have a positional shift, and the electronic component can be mounted on the FPC with high positional accuracy. In other words, when a porous substrate is used as the substrate, the positional accuracy of mounting electronic components on the FPC can be significantly improved.
  • the porous substrate is not particularly limited as long as it is a porous substrate, in addition to various properties such as the shape of the pore, its diameter (average cell diameter), and density, and the like.
  • the adhesive layer is used to release vaporized gas components to the outside. It preferably has the form of open cells. That is, when the porous substrate has the form of open cells, gas components (such as water vapor) vaporized in the adhesive layer can be released to the outside from the open end of the porous substrate.
  • the porous substrate in particular, the porous substrate made of a fibrous substance include, for example, porous paper materials (for example, kraft paper, crepe paper, Japanese paper, clay-coated paper, woodfree paper, dalasin paper, Paper such as Clupak paper), porous cloth (eg, aramide fiber, rayon fiber, acetate fiber, polyester fiber, polyvinyl alcohol fiber, polyamide fiber, polyolefin fiber, fluorine fiber, stainless fiber, asbestos, glass cloth) Nonwoven fabrics and woven fabrics made of synthetic or natural fibers such as glass fibers, manila hemp, and pulp).
  • the fibrous substance may be used alone or in combination of two or more. Further, the porous substrates can be used alone or in combination of two or more.
  • Japanese paper and nonwoven fabric are suitable as the porous substrate from the viewpoints of anchoring properties of the adhesive, gas permeability such as water vapor and heat resistance.
  • aramide fibers can be suitably used from the viewpoint of heat resistance.
  • Japanese paper and clay-coated paper are inexpensive and have heat resistance, and are therefore useful as porous substrates.
  • the porous substrate is made of only a fibrous substance (fiber component) without adding a substance such as a binder.
  • a porous substrate that is neutral or almost neutral and contains rayon fibers as a fiber component is preferable.
  • a porous base material containing rayon fibers those having a high content ratio of rayon fibers are preferable, and the content ratio of the rayon fibers is, for example, 30% by weight with respect to all the fiber components. As described above, it can be selected from a range of preferably 50% by weight or more.
  • the thickness of the substrate is not particularly limited and can be appropriately selected depending on the application. In general, for example, 25 to 200 ⁇ (preferably 50 to 15) 0 ⁇ ).
  • the basis weight is particularly limited. It is not limited, and may be, for example, about 1 to 300 g / m 2 .
  • a sheet-like foam may be used as the porous substrate.
  • Examples of the pressure-sensitive adhesive (pressure-sensitive adhesive) constituting the pressure-sensitive adhesive layers 2 and 21 include, for example, an acrylic pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and an additive such as a tackifying resin in an elastomer. Rubber-based adhesives and the like.
  • an acrylic pressure-sensitive adhesive or a silicone pressure-sensitive adhesive can be suitably used.
  • An acrylic pressure-sensitive adhesive is preferable from the viewpoint of heat resistance and ease of peeling of the FPC after mounting. When particularly high heat resistance is required, a silicone-based adhesive is preferred.
  • the adhesives can be used alone or in combination of two or more.
  • the acrylic pressure-sensitive adhesive contains, as a base polymer, a (meth) acrylic acid alkyl ester-based copolymer containing a (meth) acrylic acid alkyl ester as a main monomer component. More specifically, a polymer (including a copolymer) of an alkyl (meth) acrylate or the alkyl (meth) acrylate and another monoethylenically unsaturated monomer (copolymerizable monomer) are used. An acrylic polymer consisting of the above copolymer is used as a base polymer, and additives such as a cross-linking agent (eg, a cross-linking agent) and a tackifying resin are added to the base polymer as needed.
  • a cross-linking agent eg, a cross-linking agent
  • alkyl (meth) acrylate an alkyl (meth) acrylate having about 4 to 14 carbon atoms in the alkyl group can be preferably used.
  • alkyl (meth) acrylates include butyl (meth) acrylate, isoctyl (meth) acrylate, 21-ethylhexynole (meta) acrylate, isonoel (meth) acrylate, and lauryl (meth) acrylate.
  • Atarilate is preferably used.
  • the (meth) acrylic acid alkyl esters can be used alone or in combination of two or more.
  • alkyl (meth) acrylates are used as main monomer components.
  • an alkyl (meth) acrylate is used.
  • the proportion of glycol ester for example, can be selected from the range of 5 0 wt% or more relative to the total amount of monomer components (5 0-1 0 0 Weight 0/0).
  • the ratio of (meth) acrylic acid alkynoleate is preferably 80% by weight. / 0 or more, more preferably 90% by weight or more, and most preferably 97% by weight or more.
  • a copolymerizable monomer containing a functional group capable of copolymerizing with the (meth) acrylic acid alkyl ester When a copolymerizable monomer containing a functional group capable of copolymerizing with the (meth) acrylic acid alkyl ester is used together with the (meth) acrylic acid alkynoleate as a monomer component in the acryl-based polymer, it can be applied to an adherend such as FPC. Can improve the adhesiveness.
  • the functional group-containing copolymerizable monomer include a carboxy group-containing copolymerizable monomer, a nitrogen atom-containing copolymerizable monomer, a hydroxyl group-containing copolymerizable monomer, an epoxy group-containing copolymerizable monomer, and a mercapto group-containing copolymerizable monomer.
  • the functional group-containing copolymerizable monomer includes, for example, a canolepoxyl group-containing copolymerizable monomer such as acrylic acid, methacrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, and fumanoleic acid.
  • a canolepoxyl group-containing copolymerizable monomer such as acrylic acid, methacrylic acid, itaconic acid, maleic anhydride, crotonic acid, maleic acid, and fumanoleic acid.
  • the proportion of the functional group-containing copolymerizable monomer is about 10% by weight or less (for example, 0 to 10% by weight), preferably about 3% by weight or less (0 to 3% by weight) based on the total amount of the monomer components. Is also good.
  • the acrylic polymer may contain other copolymerizable monomer as a monomer component, if necessary, in addition to the main monomer and the functional group-containing copolymerizable monomer.
  • Such copolymerizable monomers include, for example, alkyl groups such as methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and isopropyl (meth) acrylate.
  • the monomer component other than the alkyl (meth) acrylate as the main monomer component may be selected from a range of less than 50% by weight based on the total amount of the monomer component, but is preferably 20%. It is desirable that it be less than 10% by weight, more preferably less than 10% by weight, especially less than 3% by weight.
  • a known crosslinking agent such as an isocyanate-based compound or an epoxy-based compound is added as a cross-linking agent in order to improve the holding characteristics of the pressure-sensitive adhesive. It is useful to add (meth) atarylate.
  • the crosslinkers can be used alone or in combination of two or more.
  • the isocyanate-based compound for example, a polyfunctional isocyanate compound having two or more isocyanate groups, for example, diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2, Aromatic didisocyanates such as 6-tolylene diisocyanate, phenylene diisocyanate, 1,5-naphthylene diisocyanate, xylylene diisocyanate, toluylene diisocyanate; hexamethylene diisocyanate
  • aliphatic or cycloaliphatic diisocyanates such as 4,1'-cyclohexyl methane diisocyanate, disophorone diisocyanate, diphenyl methane diisocyanate, trimethylolpropane and tolylene diisocyanate Reaction product with isocyanate, trimethylolpropane Reaction products of hexamethylene Jie Deutschen ⁇
  • Examples of the polyfunctional (meth) phthalate as a cross-linking agent used in the case of performing photopolymerization include, for example, trimethylolpropane tri (meth) atalylate, pentaerythritol tetra (meth) atalylate, and ethylene daricol. Di (meth) acrylate and 1,6-hexanediol di (meth) acrylate.
  • the acrylic polymer can be synthesized from a mixture of the above monomer components by a general polymerization method, for example, an emulsion polymerization method or a solution polymerization, by general batch polymerization, continuous drop polymerization, split drop polymerization, or the like.
  • a commonly used or known polymerization initiator may be used.
  • a commonly used or known emulsifier may be used.
  • the polymerization temperature is, for example, in the range of 30 to 80 ° C.
  • the above-mentioned pressure-sensitive adhesive may contain, as optional components, various known additives such as a tackifier, a plasticizer, a softener, a filler, a colorant (eg, a pigment and a dye), an antioxidant, and an antioxidant. Can be added.
  • various known additives such as a tackifier, a plasticizer, a softener, a filler, a colorant (eg, a pigment and a dye), an antioxidant, and an antioxidant. Can be added.
  • tackifying resin examples include petroleum resins such as aliphatic petroleum resin, aromatic petroleum resin, alicyclic petroleum resin (alicyclic saturated hydrocarbon resin) obtained by hydrogenating aromatic petroleum resin, and rosin-based resin ( Rosin, hydrogenated rosin ester, etc.), terpene resins (terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, terpene phenol resins, etc.), styrene resins, bear-mouth indene resins, and the like.
  • petroleum resins such as aliphatic petroleum resin, aromatic petroleum resin, alicyclic petroleum resin (alicyclic saturated hydrocarbon resin) obtained by hydrogenating aromatic petroleum resin, and rosin-based resin ( Rosin, hydrogenated rosin ester, etc.)
  • terpene resins terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, terpene phenol resins, etc.
  • styrene resins bear-mouth in
  • the adhesive layers 2 and 21 can be formed by applying the adhesive to at least one surface of a porous substrate.
  • the thickness of the adhesive layers 2 and 21 is not particularly limited, and can be selected, for example, from a range of about 10 to 200 m, and preferably about 20 to 100 / zm. Also, the physical properties viewpoint, 1 0 3 to 1 0 6? & (Peripheral sticky layer at a temperature 0-3 0 0 (Wave number: 1 Hz). In this case, in the operating temperature range of the adhesive sheet for fixing the FPC (for example, a temperature of 0 ° C. or higher and 300 ° C. or lower, etc.), the change in storage elastic modulus of the adhesive layer is relatively small. Since the storage elastic modulus of the enclosure is maintained, the temperature-dependent change and deterioration of the adhesive layer can be suppressed or prevented.
  • the adhesive layer does not soften or harden, and can maintain excellent adhesiveness and peelability at room temperature. Therefore, even after the heating step, the FPC does not detach from the carrier board, and even when the FPC is peeled, the FPC has no adhesive component remaining in the adhesive layer (that is, adhesive residue is generated). Not).
  • the storage elastic-resistance ratio of the adhesive layer provided on at least one surface of the substrate (Frequency: 1 H z) as is, as described above, at a temperature 0 ⁇ 300 ° C, 1 0 3 sufficient if the range of ⁇ 1 0 6 P a (l X 1 0 3 ⁇ l X 1 0 6 P a), is preferably in the range of inter alia 10 4 ⁇ 1 0 6 P a, even 10 5 it is optimal in the range of to 10 6 P a.
  • FIGS. 5 and 6 are schematic views of the FPC fixing adhesive sheet according to FIGS. 5 and 6 as viewed from above.
  • FIG. 11 is a schematic view of the FPC fixing adhesive sheet according to FIGS. 9 and 10 as viewed from above.
  • the surface of the adhesive layer 2 and 21 has a plurality of convex portions 2 a and 21 a or a plurality of holes 2 c and 21 c.
  • the surface area of the adhesive layers 2 and 21 is large, and moreover, from the bottom of the protrusions 2 a and 21 a and the inside of the center, or the non-porous portions 2 d and 21 d Distance from the bottom or inside of the center to the surface of the adhesive layer (shortest distance) ⁇ ⁇ It is shorter than the case where the convex portions 2a and 2la or the holes 2c and 21c are not formed.
  • the heating step for melting the solder and the like especially in the IR heating step
  • the surface of the pressure-sensitive adhesive layer has irregularities or irregularities. Since the holes are formed, the surface area of the adhesive layer is large, and the gas component vaporized in the adhesive layer is released to the outside using the holes or the holes of the adhesive layer. This can suppress or prevent the FPC from peeling off from the adhesive layer. Further, as shown in FIG.
  • the linear concave portions 2b between the linear convex portions 2a and 21a, 21b is formed from an end of one end to an end of the other end, and the concave portion is an open end at the end. Therefore, even if the upper surface of the concave portion of the adhesive layer is covered with the FPC, the gaseous component vaporized in the adhesive layer is removed from the open portion using the linear shape of the concave portion (the entire surface is covered). Even when the FPC is released, it can be released to the outside (from the open end), so that it is possible to further suppress or prevent the FPC from peeling off from the adhesive layer.
  • the adhesive sheet for fixing an FPC of this example is used, even if it is exposed to a high temperature in a heating step (particularly, an IR heating step), it is possible to further suppress or prevent a decrease in adhesiveness and to maintain high adhesiveness. Can be. In other words, even after the heating step at which the temperature becomes extremely high, the state in which the FPC and / or the fixing plate is adhered to the FPC fixing adhesive sheet is maintained.
  • the FPC fixing adhesive sheet when the FPC fixing adhesive sheet is bonded to the fixing plate or the FPC, it is possible to prevent air bubbles from being mixed into the interface between the adhesive layer and the fixing plate or the FPC. Therefore, one of the important points in the FPC fixing adhesive sheet of this example is to increase the surface area of the adhesive layer. Also, even if the upper surface of the concave portion of the adhesive layer is covered with the FPC, the gas component vaporized in the adhesive layer is removed from the portion where the concave portion is opened by using the shape of the concave portion of the adhesive layer. It is also important to have a shape that can be released into the air.
  • a gas component vaporized in the adhesive layer is utilized from the surface of the adhesive layer by using the increased surface area, and further by utilizing the shape of the surface.
  • the shape is not particularly limited as long as it can be released to the outside.
  • the cross-sectional shape of the projections or holes on the surface of the adhesive layer is not particularly limited as long as it is at least protruding or depressed, and may be, for example, a mountain shape or an inverted mountain shape. , May be in a linear form.
  • the mountain-shaped projection include a cone-like shape, a cylinder-like shape, a polygonal pyramid-like shape (for example, a triangular pyramid-like shape, a quadrangular pyramid-like shape, etc.), a polygonal column-like shape (for example, a triangular prism-like shape, a square prism, etc.). Etc.).
  • examples of the linear convex portion include a convex portion having a shape in which the mountain-shaped convex portion linearly extends.
  • examples of the inverted mountain-shaped hole include an inverted cone-like shape, an inverted cylinder-like shape, an inverted polygonal pyramid-like shape (for example, an inverted triangular pyramid-like shape, an inverted quadrangular pyramid-like shape, etc.), an inverted polygonal prism-like shape ( For example, an inverted triangular prism-like shape, an inverted square prism-like shape, and the like).
  • examples of the linear hole include a hole in which the inverted mountain-shaped hole extends linearly.
  • the shape of the convex portion may be a substantially polygonal shape (for example, a substantially square shape, a substantially triangular shape, etc.) or a substantially circular shape (for example, a semi-elliptical shape, a semi-circular shape, etc.).
  • the diameter (radius, side length, etc.) of the convex portion may be smaller or larger from the bottom surface to the top portion, or may be the same.
  • the apex may be flat, pointed or rounded.
  • the shape of the hole may be a substantially polygonal cross section (for example, a substantially square shape, a substantially triangular shape, etc.) or a substantially circular shape (for example, a semi-elliptical shape, a semicircular shape, etc.).
  • the hole may have a smaller or larger diameter (radius, side length, etc.) from the top to the bottom or the bottom, or may have the same diameter.
  • it has a bottom surface In that case, the bottom surface may be flat, pointed, or
  • the diameter of the projection or the hole is not particularly limited, and can be appropriately selected depending on, for example, the size of the FPC.
  • the average diameter or the average length of the side is 0.01 to 1 Omm. However, it can be preferably selected from a range of about 0.05 to 5 mm.
  • the height of the projection is not particularly limited, and can be appropriately selected depending on the size of the FPC, the thickness of the adhesive layer, and the like. For example, 0.01 to 0.5 mm, preferably Can be selected from the range of about 0.03 to 0.1 mm.
  • the depth of the hole is not particularly limited, and can be appropriately selected according to the size of the FPC, the thickness of the adhesive layer, the thickness of the adhesive sheet, and the like.
  • the bottom of the hole may be the adhesive layer / substrate, that is, a depression.
  • the adhesive sheet may be penetrated to the adhesive layer on the other side of the substrate, that is, a through hole penetrated from one surface to the other surface of the adhesive sheet. It should be noted that such a through-hole can be easily formed by punching.
  • the distance between the convex portions is not particularly limited and can be appropriately selected depending on the size of the FPC, for example, 0.01 to 1 Omm, preferably 0.05 to 1 Omm. It can be selected from a range of about 5mm.
  • the distance between the holes is also not particularly limited, and can be appropriately selected depending on the size of the FPC, for example, 0.1 to 1 Omm, preferably 0.5 to You can choose from a range of about 5 mm.
  • Such protrusions or holes may be formed over the entire surface of the adhesive layer, or may be partially formed at one or more places on the surface.
  • the site includes at least a predetermined site to which FPC is attached.
  • the convex portions or the hole portions may be formed regularly, and the convex portions or the hole portions may be formed in a linear shape as a whole in plan view.
  • the concave portion or the non-hole portion has a shape corresponding to the convex portion or the hole portion, Further, it is formed at a portion corresponding to the convex portion or the hole. That is, the concave portion has a bottom portion formed by the lower adhesive layer, and a wall portion formed by the convex adhesive layer.
  • the upper portion is the upper surface of the adhesive layer
  • the wall portion is the wall surface of the hole portion.
  • its thickness is not particularly limited. It can be selected from the range of about 100 ⁇ , preferably about 20 to 100 / m.
  • the adhesive layers 2 and 21 are formed by linear uneven portions, the force S at the bottom of the concave portion is an adhesive layer, and the adhesive layer is formed at the bottom of the concave portion.
  • the adhesive layer has a shape in which the cross section is mountain-shaped, that is, as shown in FIG. 8, an adhesive layer having a mountain-shaped cross section is formed on the base material. The same effect can be exerted even when the cross section is formed as a protrusion by the mountain-shaped adhesive layer.
  • FIG. 8 is a sectional view showing still another example of the adhesive sheet of the present invention. In FIG.
  • reference numeral 12 denotes an adhesive sheet
  • reference numeral 22 denotes an adhesive layer
  • reference numeral 32 denotes a base material
  • the adhesive layer 22 is partially formed on both sides of the base material 32 so that the cross section has a mountain shape. Is formed.
  • FIG. 9 and FIG. 10 since the adhesive layers 2 and 21 are formed by penetrating holes, the holes do not have a bottom, but the adhesive layer is formed on the bottom of the holes.
  • the adhesive layer has a shape in which the cross section is mountain-shaped, that is, as shown in FIG. 12, an adhesive layer having a mountain-shaped cross section is formed on the base material. The same effect can be exerted even if the cross section is made non-porous by the mountain-shaped adhesive layer.
  • FIG. 12 is a sectional view showing still another example of the adhesive sheet of the present invention. In FIG.
  • reference numeral 13 denotes an adhesive sheet
  • reference numeral 23 denotes an adhesive layer
  • reference numeral 33 denotes a base material
  • the adhesive layer 23 is partially formed on both sides of the base material 33, so that the cross section has a mountain shape. It is formed as follows. Composition of adhesive sheet
  • the adhesive sheet 1, 1 1, 1 2, 1 3 in the present invention may be, for example, an adhesive (such as an acrylic adhesive) on at least one surface (one or both surfaces) of a substrate, especially a porous substrate.
  • an adhesive such as an acrylic adhesive
  • Pressure-sensitive adhesive and if necessary, cross-linking treatment by heating or the like, or polymerization by ultraviolet irradiation to form an adhesive layer on at least one of the base material (particularly a porous base material). It can be manufactured by forming on the surface. Further, if necessary, a release liner may be coated on the adhesive layer.
  • the adhesive sheet (adhesive sheet) of the present invention may be a double-sided adhesive sheet having an adhesive layer on both sides of a substrate such as a porous substrate, and may be an adhesive sheet on one side of a substrate such as a porous substrate. It may be a single-sided adhesive sheet having a functional layer.
  • a method of applying the adhesive composition by strip coating is preferable.
  • the adhesive layer having a convex portion on the surface can also be formed.
  • the hole (particularly, a hole formed by a through hole) can be formed by performing punching on the adhesive layer.
  • Punching eg, punching
  • the adhesive layer having holes on the surface can also be formed.
  • the adhesive sheet of the present invention is preferably a double-sided adhesive sheet.
  • the adhesive in each of the adhesive layers laminated on both sides of the porous substrate may be different from each other, or may be the same adhesive. .
  • a fixing plate having an adhesive layer on the surface as in the first embodiment can be manufactured.
  • a double-sided adhesive sheet 5 with a porous base material is provided between the fixing plate 6 and the FPC 4, and the fixing plate 6 and the FPC 4 Is glued. That is, fixed plate 6 and F The PC 4 is bonded via a double-sided adhesive sheet 5.
  • the double-sided adhesive sheet 5 with a substrate made of a porous substrate or the adhesive layer 51 is adhered to the entire surface of one side of the fixing plate 6. May be affixed only to a predetermined portion (for example, a portion where the FPC is installed and a peripheral portion thereof) on one side of the FPC.
  • an adhesive sheet for fixing to the fixing plate is attached to the fixing plate attaching surface of the FPC in advance. Wearing FPC can be made.
  • the double-sided adhesive sheet 5 with a base material made of a porous base material is completely adhered to one surface of the FPC 4, but is partially adhered to one surface of the FPC 4. It may be done.
  • the adhesive sheet may be a single-sided adhesive sheet with a substrate (adhesive tape), particularly a single-sided adhesive sheet with a substrate made of a porous substrate.
  • a substrate adhesive tape
  • the surface of the adhesive tape on the substrate side may be used.
  • the adhesive tape is attached to the entire surface or a predetermined portion of the fixing plate to form a fixing plate having an adhesive layer of the adhesive tape on the surface, and FPC is attached and fixed to the surface of the adhesive layer. be able to.
  • the adhesive sheet in order to easily peel the adhesive sheet from the fixing plate to which the adhesive sheet is attached without damaging the adhesive sheet itself, the adhesive sheet has a tensile strength of 5N / 15 mm or more (for example, 5 to 15 mm). ON / 15 mm), more preferably 8 N / 15 mm or more (for example, 8 to 50 N / I 5 mm).
  • the adhesive sheet preferably has a tensile strength of 5 N / 15 mm or more (preferably 8 NZl 5 mm or more) even after mounting the electronic component.
  • the electronic component is mounted on the FPC through a heating step, the FPC on which the electronic component is mounted is separated from the fixing plate, and then the adhesive sheet attached to the fixing plate is separated. Therefore, tensile strength after mounting electronic components is important. Therefore, after the electronic component is mounted, if the adhesive sheet has a peel strength in the above range, the adhesive sheet can be easily peeled from the fixing plate without damaging the adhesive sheet, and the adhesive sheet peelability is improved. Can be Therefore, the fixed plate can be reused. Further, according to the present invention, after the electronic component is mounted on the FPC, the FPC on which the electronic component is mounted is peeled from the adhesive layer (that is, in order to enhance the pick-up property of the FPC).
  • the adhesive strength between the adhesive layer and the FPC is preferably 7 N / 20 mm or less (for example, 0.5 to 7 N / 20 mm), and more preferably 1 to 6 N / 20 mm.
  • the adhesive strength between the adhesive sheet and the fixing plate can be selected from the same range as the adhesive strength between the adhesive sheet and the FPC.
  • the adhesive strength of the adhesive sheet can be adjusted by appropriately selecting the kind of the pressure-sensitive adhesive and its additive, the mixing ratio thereof, and the like.
  • the guide bins 71 and 72 and the fixed table 8 for conveyance are not particularly limited, and can be appropriately selected according to a device for mounting electronic components on the FPC (particularly, an automatic mounting device).
  • the FPC can be fixed only by placing the FPC on the adhesive layer provided on the fixing plate and attaching the FPC.
  • an adhesive sheet is attached to the fixing plate attaching surface of the FPC in advance. Therefore, there is no need to attach an adhesive tape as in the related art.
  • the FPC can be removed from the fixing plate simply by removing the FPC on which the electronic components are mounted, and there is no need to remove the adhesive tape as in the conventional case. Therefore, the workability in attaching and detaching the FPC to and from the fixing plate can be greatly improved, the operation can be performed quickly, and the manufacturing cost can be reduced.
  • the entire surface of the FPC can be fixed to the fixing plate by sticking, it is possible to fix the FPC firmly.
  • the fixing plate (particularly, an adhesive layer formed on the surface of the fixing plate) Little or no gap between the and the FPC. Therefore, when the electronic component is mounted on the FPC, there is no displacement or the like, and the electronic component can be mounted with high positional accuracy.
  • the adhesiveness of the adhesive layer by the adhesive hardly or completely decreases, so that the FPC has not been displaced after heating. Therefore, electronic components must be mounted on the FPC with high positional accuracy. Is possible. In other words, the positional accuracy of mounting electronic components on the FPC can be significantly improved.
  • an adhesive sheet with a substrate made of a porous substrate especially a double-sided adhesive sheet
  • gas components such as water vapor generated even after the heating step. Can be released to the outside of the system through the porous substrate, so that the FPC can be kept fixed at a predetermined position with little or no decrease in adhesive strength.
  • the FPC after mounting the electronic component on the FPC, the FPC can be easily peeled off from the adhesive layer on the surface of the fixing plate.
  • the adhesive layer has a specific storage modulus in a specific temperature range, as described above, even after a heating step (such as an IR heating step), no further deformation or deterioration occurs. . Therefore, the adhesiveness (adhesiveness) and releasability of the adhesive layer are kept good even after heating, and no detachment or adhesive residue is generated in the FPC. Further, after heating, the FPC has no displacement, and the electronic component can be mounted on the FPC with high positional accuracy.
  • a heating step such as an IR heating step
  • the adhesive sheet after mounting electronic components to 5 N / 15 mm or more, the adhesive sheet itself can be easily peeled from the fixing plate without being damaged after mounting the electronic components on the FPC. Will be able to do it.
  • the generated gas component such as water vapor can be removed by using the concaves or holes on the surface of the adhesive layer. (For example, through), and when the substrate is a porous substrate, it can be released through the porous substrate and out of the system. Fixation to a predetermined site can be further maintained. Moreover, after mounting the electronic component on the FPC, the FPC can be easily peeled off from the adhesive sheet. Therefore, the method of the present invention is extremely useful as a method for mounting an electronic component on a flexible printed wiring board.
  • the adhesive sheet of the present invention is an adhesive sheet for fixing a flexible printed wiring board. It is extremely useful as a tool.
  • the electronic components mounted on the FPC are not particularly limited, and include, for example, an IC, a capacitor, a connector, a resistor, and an LED (light emitting diode; light emitting diode; light emitting diode). Examples>
  • Acrylic rubber (trade name “Leocoat R500” manufactured by Toray Cotex) was dissolved in toluene to prepare a solution having a base polymer content of 15% by weight.
  • an isocyanate-based crosslinking agent (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was added and mixed to prepare an adhesive composition.
  • This adhesive layer is transferred to both sides of a porous substrate (trade name “NONOX” manufactured by DuPont) made of aramid fiber as the porous substrate to prepare a double-sided adhesive sheet with the porous substrate. did. Then, one side of the double-sided adhesive sheet was bonded to an aluminum plate to produce a fixed plate having an adhesive layer on the surface.
  • a porous substrate trade name “NONOX” manufactured by DuPont
  • Silicone polymer product name "SH4280” manufactured by Toray Dow Corning Silicone Co., Ltd. 100 parts of benzoyl peroxide and 2.0 parts of toluene are mixed. Was prepared. After applying the adhesive composition to the separator, the adhesive composition is dried in a hot air dryer at 170 ° C. for 5 minutes to form an adhesive layer (pressure-sensitive adhesive layer) having a thickness of 25 ⁇ . did. Transfer this adhesive layer to both sides of Japanese paper as a porous substrate, A double-sided adhesive sheet with a base material using a porous base material was produced. Then, one side of the double-sided adhesive sheet was bonded to an aluminum plate to produce a fixed plate having an adhesive layer on the surface.
  • the fixing plate according to Comparative Example 1 is made of only an aluminum plate, and has no adhesiveness on the surface as in Examples 1 to 3. Rating I
  • the time required for fixing the FPC, the gap between the FPC and the fixing plate when the FPC is bonded to the fixing plate, and the time required for removing the FPC The time is measured by the following method, and the workability and FP The fixed state of C was evaluated.
  • the fixing plate according to Comparative Example 1 was adjusted. Put the FPC on the fixing plate by attaching adhesive tape (adhesive tape on one side of polyimide substrate coated with silicone adhesive) to the four corners of one FPC. Fixed to.
  • the electronic component was mounted on the FPC, and after the mounting was completed, the FPC on which the electronic component was mounted was removed with tweezers.
  • the adhesive tape attached to the four corners of the FPC was peeled off, and the FPC on which the electronic components were mounted was removed with tweezers.
  • the adhesive composition After applying the adhesive composition to the separator, the adhesive composition is dried in a hot air drier at 40 ° C. for 5 minutes, and further dried at 130 ° C. for 5 minutes to form an adhesive layer having a thickness of 50 ⁇ m.
  • Pressure-sensitive adhesive layer This pressure-sensitive adhesive layer was transferred onto both sides of a nonwoven fabric (basis weight: 23 g / m 2 ) made of rayon fiber as a porous base material to prepare a double-sided adhesive sheet with a base material made of a porous base material. Then, affix one side of the double-sided adhesive sheet to the side opposite to the side on which electronic components of the FPC are mounted. In addition, an FPC to which an adhesive sheet for fixing to a fixing plate was attached was manufactured.
  • Silicone polymer product name "SH4280” manufactured by Toray 'Dow' Koung 'Silicone Co., Ltd.
  • 100 parts of benzoyl peroxide and 2.0 parts of toluene are mixed and stirred to form an adhesive composition
  • the adhesive composition is dried in a hot air dryer at 170 ° C. for 5 minutes to form an adhesive layer (pressure-sensitive adhesive layer) having a thickness of 25 ⁇ m. did.
  • the adhesive layer is transferred to both sides of a porous substrate (trade name “NoMetass 4111” manufactured by DuPont Teijin “Advans Dopa”) using an aramide fiber as a porous substrate to form a porous substrate.
  • a double-sided adhesive sheet with a base material was prepared. Then, in the same manner as in Example 4, an FPC to which an adhesive sheet for fixing to one side of the double-sided adhesive sheet was fixed was produced. Comparative Example 2
  • the time required for attaching the adhesive sheet to the FPC the time required for fixing the FPC to the fixing plate, and the time required for removing the FPC from the fixing plate
  • the time required for peeling the adhesive sheet from the FPC, the gap between the FPC and the fixing plate when the FPC is bonded to the fixing plate, the appearance of the adhesive sheet after IR heating, and the peelability of the adhesive sheet are as follows. The workability and the fixed state of the FPC were evaluated by the method described above. .
  • FIGS.2A and 2B As for the FPCs to which the adhesive sheets according to Examples 4 and 5 were attached, as shown in FIGS.2A and 2B, six FPCs were aligned with respect to one fixing plate. Thereafter, the FPC was fixed on the fixing plate by placing it on the fixing plate and pressing it by hand to adhere.
  • Example 4 Example 5 Comparative Example 2 Time required for sticking the adhesive sheet (sec) 3 0 3 0
  • Table 2 shows that using the FPC to which the adhesive sheets according to Examples 4 and 5 were attached The time required for mounting the Pc on the fixing plate and the time required for removing it can be greatly reduced, and workability is excellent. In addition, there is almost no gap between the FPC and the fixing plate, and the FPC is firmly bonded to the fixing plate, so that the FPC does not shift. Therefore, electronic components can be mounted on the FPC with excellent accuracy.
  • Example 6
  • Acrylic rubber (trade name “Leocoat R5000” manufactured by Toray Cotex) was dissolved in toluene to prepare a solution having a base polymer content of 15% by weight.
  • an isocyanate-based crosslinking agent (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was added and mixed to prepare an adhesive composition.
  • the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 50 ⁇ was formed by performing a drying treatment in a hot air dryer at 130 at 5 minutes for 5 minutes.
  • This pressure-sensitive adhesive layer was transferred to both sides of a porous substrate (trade name “NONOX” manufactured by Dupont) made of aramid fiber as the porous substrate to prepare a double-sided adhesive sheet with the substrate made of the porous substrate. did.
  • a porous substrate trade name “NONOX” manufactured by Dupont
  • aramid fiber as the porous substrate
  • This pressure-sensitive adhesive layer was transferred to both sides of a nonwoven fabric (basis weight: 23 g / m 2 ) made of rayon fiber as a porous base material, to produce a double-sided adhesive sheet with a base material made of a porous base material.
  • a premix consisting of 70 parts of isanol acrylate, 28 parts of butyl acrylate, 2 parts of acrylic acid, and 0.1 part of 2,2-dimethoxy-2-phenylacetophenone (photopolymerization initiator) is mixed with nitrogen. Exposure to ultraviolet light in an atmosphere caused partial polymerization to prepare a coatable syrup having a viscosity of about 300 voids. To 100 parts of this syrup, 0.4 part of trimethylolpropane triatalylate (crosslinking agent) was added and mixed to prepare an adhesive composition.
  • crosslinking agent trimethylolpropane triatalylate
  • the pressure-sensitive adhesive composition was coated on a separator, after photopolymerization process by irradiating 9 0 0 m ultraviolet J / cm 2 using a high-pressure mercury lamp of light intensity 5 mWZ cm 2 under a nitrogen gas atmosphere A drying treatment was performed at 130 ° C. for 5 minutes in a hot air drier to form a pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 50 ⁇ m.
  • This pressure-sensitive adhesive layer was transferred onto one surface of a nonwoven fabric (basis weight: 14 g / m 2 ) made of rayon fiber as a porous substrate.
  • a premix consisting of 100 parts of isononyl acrylate and 0.3 part of 2,2-dimethoxy-2-phenylacetophenone (photopolymerization initiator) was exposed to ultraviolet light in a nitrogen atmosphere to obtain a part. Polymerize and coat with a viscosity of about 200 V A processable syrup was prepared. To 100 parts of this syrup, 0.2 part of trimethylolpropane triatalylate (crosslinking agent) was added and mixed to prepare a pressure-sensitive adhesive composition.
  • crosslinking agent crosslinking agent
  • the surface of the non-woven fabric (porous substrate) made of rayon fiber with the transferred agent layer was directly photographed on the non-woven fabric side, and the pressure of 90 Om jZcm 2 was measured with a high-pressure mercury lamp with a light intensity of 5 mW / cm 2 under a nitrogen gas atmosphere. After irradiating photopolymerization by irradiating ultraviolet rays, dry in a hot air dryer at 130 ° C for 5 minutes, and then use a porous substrate to attach a double-sided adhesive sheet with a base material (sheet thickness 12 O / m ).
  • sheet thickness 12 O / m base material
  • silicone polymer (trade name "SH4280” manufactured by Toray Dow Corning Silicone Co., Ltd.), 2.0 parts of benzoyl peroxide, and toluene are mixed and stirred to prepare an adhesive composition. did.
  • the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 25 ⁇ was formed by drying in a hot air drier at 170 ° C for 5 minutes. This pressure-sensitive adhesive layer was transferred to one side of clay-coated paper as a porous substrate.
  • polyimide film having a thickness of 2 5 ⁇ the (Du Pont-Toray Co., Ltd. "Kapton 100 H", is widely used as a substrate for FPC) Adhere and peel off the separator to form an adhesive tape with a width of 20 mm and a length of 10 Omm.
  • the adhesive tape is used as an adherend on the same polyimide film and aluminum plate as above with a 2 kg roller. Paste it back and forth, aged at 23 ° (relative humidity 50./.
  • Table 3 shows that the adhesive tapes of Examples 6 to 10 are very easy to peel, which is very important as an adhesive tape for fixing the FPC when mounting electronic components on the FPC. In addition to the ability to prevent swelling and peeling during heating, it also prevents warping and breaking of the FPC when the FPC is peeled off, and maintains proper adhesion to the FPC even after IR heating are doing.
  • Example 1 1
  • the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 50 / m was dried by drying at 120 ° C. for 3 minutes in a hot air drier. Formed.
  • This pressure-sensitive adhesive layer was transferred to one side of a nonwoven fabric (basal weight: 23 g / m 2 ) made of neutral rayon fiber as a porous substrate to form a pressure-sensitive adhesive layer on the FPC side.
  • An adhesive sheet having a layer was produced.
  • Example 1 2 0.5 part of an epoxy-based crosslinking agent (trade name “Tetrad C” manufactured by Mitsubishi Gas Chemical Co., Ltd.) was added to 100 parts of the pressure-sensitive adhesive solution, and mixed to prepare a pressure-sensitive adhesive composition.
  • the material was applied to a release paper, and dried in a hot air dryer at 120 ° C. for 3 minutes to form a 50 ⁇ thick adhesive layer (pressure-sensitive adhesive layer).
  • the pressure-sensitive adhesive layer is transferred to the non-woven fabric side surface of the adhesive sheet having the FPC-side pressure-sensitive adhesive layer, and both sides with a base material comprising a porous substrate having a carrier-side pressure-sensitive adhesive layer and an FPC-side pressure-sensitive adhesive layer An adhesive sheet was prepared.
  • Example 1 2 an epoxy-based crosslinking agent manufactured by Mitsubishi Gas Chemical Co., Ltd.
  • Example 11 100 parts of the pressure-sensitive adhesive solution of 1 was added with 2 parts of an anti-aging agent (trade name “IRGANOX 100 100” manufactured by Ciba Geigy Co., Ltd.) to prepare a pressure-sensitive adhesive solution containing an anti-aging agent. did. Except for using the anti-aging agent-containing pressure-sensitive adhesive solution as a pressure-sensitive adhesive solution, the same procedure as in Example 11 was carried out to prepare a base material having a porous-side pressure-sensitive adhesive layer and an FPC-side pressure-sensitive adhesive layer. A double-sided adhesive sheet with a material was produced.
  • an anti-aging agent trade name “IRGANOX 100 100” manufactured by Ciba Geigy Co., Ltd.
  • Example 14 a double-sided adhesive sheet with a base material was produced using a porous base material having a carrier board side pressure-sensitive adhesive layer and an FPC side pressure-sensitive adhesive layer.
  • Eluacetophenone photopolymerization initiator
  • a premix consisting of 0.1 part was exposed to ultraviolet light in a nitrogen atmosphere to partially polymerize, thereby preparing a syrup having a viscosity of about 300 voise and capable of being coated.
  • 0.4 part of trimethylolpropane triatalylate (crosslinking agent) was added and mixed to prepare an adhesive composition. After applying the pressure-sensitive adhesive composition to release paper, the light intensity is increased in a nitrogen gas atmosphere.
  • the pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) was formed. This adhesive layer was transferred to one surface of a nonwoven fabric (basis weight: 14 gZm 2 ) made of rayon fiber as a porous substrate.
  • a premix consisting of 100 parts of isononyl acrylate and 0.3 part of 2,2-dimethoxy-2-phenylacetophenone (photopolymerization initiator) is exposed to ultraviolet rays in a nitrogen atmosphere to partially polymerize.
  • a coatable syrup having a viscosity of about 200 boise was prepared.
  • 0.2 part of trimethylolpropane triatalylate (crosslinking agent) was added and mixed to prepare a pressure-sensitive adhesive composition.
  • Example 11 Regarding the adhesive sheets of Examples 1 to 14, the storage elastic modulus, tensile strength, 90 ° peel-off adhesive strength, FPC pick-up property after IR heating, adhesive sheet peelability after IR heating, IR The presence or absence of swelling / peeling upon heating (swelling / peeling prevention during IR heating) was measured and evaluated by the following method. Table 4 shows the results.
  • Example 11 A pressure-sensitive adhesive composition (pressure-sensitive adhesive composition relating to the FPC-side pressure-sensitive adhesive layer) prepared by the production method according to 1 to 14 was applied to a separator, and dried at a predetermined temperature and time in a hot-air dryer. By performing the treatment, pressure-sensitive adhesive layers (pressure-sensitive adhesive layers) each having a thickness of 100 m were prepared, and the pressure-sensitive adhesive layers were laminated to prepare a sheet having a thickness of about 1 mm.
  • the sheet was punched into a predetermined size to obtain a measurement sample, and the storage elastic modulus (p a ) of the sample was measured using RAREOMEX's “ARE S”, the geometry was a parallel plate, the frequency was 1 Hz, The temperature was measured at 0 and 250 ° C.
  • Storage modulus The evaluation results are shown in the column of “Storage modulus” in Table 4.
  • Each of the adhesive sheets obtained in Examples 11 to 14 was processed into a width of 2 Omm, and at a temperature of 23 ° C. and a relative humidity of 50 under a condition of 100 mm between chucks. /.
  • Strength after aging for 30 minutes (initial) under the conditions of (1) and after heating by IR (IR heating) (after IR heating) after breaking at a speed of 30 OmmZ with a tensile tester (NZl 5 mm) was measured. The evaluation results are shown in the corresponding columns of “Initial” and “After IR heating” in “Tensile strength” in Table 4.
  • Each adhesive sheet obtained in Examples 11 to 14 was coated on one side with a polyimide film having a thickness of 25 ⁇ m (“Kapton 100H” manufactured by Toray DuPont, commonly used as a base material for FPC). ) And peel off the separator to form an adhesive tape with a width of 20 mm and a length of 10 Omm.
  • the adhesive tape is used as an adherend on the same polyimide film and aluminum plate as above using a 2 kg roller.
  • a carrier board as the carrier board, as shown in Figs.1A and 1B, six FPCs are aligned with one carrier board and then formed on the surface of the carrier board.
  • the FPC was fixed on the carrier board by placing it on the pressure-sensitive adhesive layer and pressing it by hand. After that, IR heating is performed, and immediately after IR heating and after cooling to room temperature, the FPC is peeled off from the adhesive sheet, and the ease with which the FPC is peeled off and the stress on the FPC are sensuously (depending on the touch). After confirming, the FPC pickup performance was evaluated. The evaluation results are shown in the corresponding columns of “immediately after IR heating” and “after room temperature cooling” in “Pick-up property of FPC after IR heating” in Table 4, respectively.
  • each adhesive sheet of Examples 1 1 to 14 the storage elastic modulus of the adhesive layer (frequency: 1 Hz) temperature 0 to 300 ° C at 10 3 ⁇ ; L since the range of 0 6 P a, also be effected IR pressurized heat, is not caused to deterioration of the adhesive layer, Pikkuatsu flop of F PC becomes good.
  • the adhesive sheet has a tensile strength of 5 N / 15 mm or more, the peelability of the adhesive sheet is also good.
  • a porous substrate is used as the substrate, it has a property of preventing blistering and peeling during IR heating. Therefore, each of the adhesive sheets in Examples 11 to 14 is very important as an adhesive tape for fixing the FPC when mounting electronic components on the FPC. It has all the swelling and peeling prevention properties.
  • Example 15 the storage elastic modulus of the adhesive layer (frequency: 1 Hz) temperature 0 to 300 ° C at 10 3 ⁇ ; L since the range of 0 6 P a, also be effected IR pressurized
  • Acrylic rubber (trade name “Leocoat R5000” manufactured by Toray Cotex) was dissolved in toluene to prepare a solution having a base polymer content of 15% by weight.
  • an isocyanate-based crosslinking agent (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was added and mixed to prepare an adhesive composition.
  • the adhesive composition was applied to both sides of a porous substrate (trade name “NONOX” manufactured by Dupont) using an aramid fiber as a porous substrate using an applicator to which a spacer of 2 mm pitch was attached.
  • a double-sided adhesive sheet with a substrate (tape thickness: 150 // m) was prepared.
  • an adhesive is stripe-coated, and an adhesive layer having a linear convex portion on the surface is formed.
  • Silicone polymer (trade name "S-420" manufactured by Toray Dow Corning Silicone Co., Ltd.) 100 parts of benzoyl peroxide and toluene are mixed and stirred. A composition was prepared.
  • the pressure-sensitive adhesive composition was applied to both sides of a polyimide film substrate (non-porous substrate) using an applicator to which a spacer of 2 mm pitch was attached, and then applied in a hot air dryer at 170 °. After drying for 5 minutes at C, a 50 m thick adhesive layer (pressure-sensitive adhesive layer) was formed, and a double-sided adhesive sheet with a base material (tape thickness: 150 ⁇ ) was prepared. .
  • the pressure-sensitive adhesive is subjected to stripe coating, and a pressure-sensitive adhesive layer having a linear convex portion on the surface is formed. Then, one side of the double-sided adhesive sheet was bonded to an aluminum plate to prepare a fixing plate having an adhesive layer having a linear convex portion on the surface.
  • the pressure-sensitive adhesive composition was applied to both sides of a polyimide film substrate (non-porous substrate) using an applicator to which a spacer of 2 mm pitch was attached. After drying for 5 minutes at C, an adhesive layer (pressure-sensitive adhesive layer) with a thickness of 50 ⁇ is formed, and a double-sided adhesive sheet with a base material (tape thickness: 150 ⁇ ) Produced.
  • an adhesive is stripe-coated, and an adhesive layer having a linear convex portion on the surface is formed.
  • the fixing plate according to Comparative Example 3 is made of only an aluminum plate, and has no pressure-sensitive adhesive layer on the surface as in Examples 15 to 17. Rating V
  • the time required for fixing the FPC, the gap between the FPC and the fixing plate when the FPC was bonded to the fixing plate, and the time required for removing the FPC, was measured by the following method to evaluate workability and the FPC fixing state.
  • the electronic component was mounted on the FPC. After the mounting was completed, the FPC on which the electronic component was mounted was removed with tweezers. In the fixing plate according to Comparative Example 3, the adhesive tape attached to the four corners of the FPC was peeled off, and the FPC on which the electronic components were mounted was removed with tweezers.
  • Acrylic rubber (trade name “Leocoat R5000” manufactured by Toray Cotex) was dissolved in toluene to prepare a solution having a base polymer content of 15% by weight.
  • an isocyanate-based crosslinking agent (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was added and mixed to prepare an adhesive composition.
  • the pressure-sensitive adhesive composition was applied to both sides of a porous substrate (trade name “NOMMETUS” manufactured by DuPont) made of aramid fiber as the porous substrate, and then heated at 130 ° C. for 5 minutes in a hot air dryer.
  • silicone polymer (trade name “SH4280” manufactured by Toray Dow Corning Co., Ltd., Silicone), 2.0 parts of benzoyl peroxide and toluene were mixed and stirred to prepare an adhesive composition. .
  • the adhesive composition is applied on both sides of a polyimide film substrate (non-porous substrate) and then dried in a hot air drier at 170 ° C. for 5 minutes to obtain a 50 ⁇ thick adhesive.
  • a double-sided adhesive sheet with a base material (tape thickness: 150 / im) is formed by forming a layer (pressure-sensitive adhesive layer), and the double-sided adhesive sheet with a base material is subjected to a punching process.
  • a double-sided adhesive sheet with a base material (tape thickness: 150 m) made of a porous base material having a surface formed with a pressure-sensitive adhesive layer having a shape of a hole penetrating to another surface (through hole) was prepared.
  • Example 20 One surface of the double-sided adhesive sheet was bonded to an aluminum plate to prepare a fixing plate having a pressure-sensitive adhesive layer having a hole on the surface.
  • Example 20
  • the adhesive composition was dried in a hot air drier at 130 ° C. for 5 minutes to obtain a thickness of 50 / m 2.
  • a double-sided adhesive sheet with a base material tape thickness: 150 / im
  • punching on the double-sided adhesive sheet with the base material A double-sided adhesive sheet with a base material made of a porous base material having an adhesive layer in the form of holes (through holes) penetrating to the other surface (tape thickness: 150 / im) was prepared.
  • the flexible printed wiring board can be easily attached to and detached from the fixed plate, and the time required for this can be reduced. Moreover, the flexible printed wiring board can be firmly fixed to the fixing plate. Therefore, the flexible printed wiring board can be attached to and detached from the fixed plate with excellent workability. Moreover, electronic components can be mounted on the flexible printed wiring board with high accuracy. In addition, when the electronic component is mounted on a flexible printed wiring board, a decrease in adhesion can be suppressed or prevented even when heated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Le procédé décrit permet la fixation d'une carte (4) de câblage imprimée sur la couche adhésive sensible à la pression d'une feuille (6) de montage, et le montage d'un composant électronique sur cette carte (4) de câblage imprimée flexible. Un mode de mise en oeuvre différent consiste à fixer une feuille (5) adhésive sur le côté de la carte (4) imprimée opposé au côté sur lequel le composant électronique doit être monté, et à fixer la carte imprimée flexible sur la feuille (6) de montage au moyen de la feuille adhésive, puis à monter un composant électronique sur la carte (4) imprimée flexible. La feuille (5) adhésive permettant de fixer la carte (4) de câblage imprimée flexible sur la feuille (6) de fixation comprend une couche sensible à la pression sur au moins une face de sa base poreuse. Le module de conservation d'élasticité (fréquence : 1 Hz) de la couche adhésive sensible à la pression se situe dans un intervalle de 103 à 106 Pa pour une température de 0 à 300 °C. Des protubérances ou des dépressions peuvent être formées sur ou dans la couche adhésive sensible à la pression.
PCT/JP2002/003610 2001-04-18 2002-04-11 Procede permettant le montage d'un composant electronique sur une carte de cablage et feuille adhesive flexible permettant de fixer une carte de cablage imprimee Ceased WO2002089553A1 (fr)

Priority Applications (1)

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KR1020037013689A KR100867048B1 (ko) 2001-04-18 2002-04-11 가요성 프린트 배선회로에의 전자 부품의 장착 방법 및 가요성 프린트 배선회로 고정용 감압성 접착 시트

Applications Claiming Priority (12)

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JP2001-119430 2001-04-18
JP2001119430A JP2002309201A (ja) 2001-04-18 2001-04-18 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP2001-119431 2001-04-18
JP2001119431A JP2002314240A (ja) 2001-04-18 2001-04-18 フレキシブルプリント配線板への電子部品の実装方法
JP2001151846A JP2002338914A (ja) 2001-05-22 2001-05-22 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP2001151850A JP2002338915A (ja) 2001-05-22 2001-05-22 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP2001-151853 2001-05-22
JP2001151853A JP4766776B2 (ja) 2001-05-22 2001-05-22 フレキシブルプリント配線板固定用接着シート及びフレキシブルプリント配線板への電子部品の実装方法
JP2001-151846 2001-05-22
JP2001-151850 2001-05-22
JP2001-176838 2001-06-12
JP2001176838A JP2002368497A (ja) 2001-06-12 2001-06-12 フレキシブルプリント配線板への電子部品の実装方法

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Cited By (9)

* Cited by examiner, † Cited by third party
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WO2005048669A1 (fr) * 2003-11-14 2005-05-26 Koninklijke Philips Electronics N.V. Composants souples
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
US20110229703A1 (en) * 2010-03-03 2011-09-22 Nitto Denko Corporation Protective sheet and use thereof
US8236614B2 (en) 2005-02-21 2012-08-07 Nitto Denko Corporation Semiconductor device manufacturing method
US8345193B2 (en) * 2008-09-12 2013-01-01 Kabushiki Kaisha Toshiba Flexible electronic device and flexible display device
CN103396743A (zh) * 2006-10-19 2013-11-20 日东电工株式会社 带胶粘层的树脂多孔膜及其制造方法以及过滤器部件
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
JP2015177180A (ja) * 2014-03-18 2015-10-05 デクセリアルズ株式会社 可撓性実装モジュール体の製造方法
CN111642067A (zh) * 2019-03-01 2020-09-08 北京梦之墨科技有限公司 一种电路基材、柔性薄膜电路及其制作方法

Families Citing this family (4)

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KR101146525B1 (ko) 2005-06-30 2012-05-25 엘지디스플레이 주식회사 기판 고정 지그 및 그 제조방법
JP4800363B2 (ja) * 2008-09-26 2011-10-26 日東電工株式会社 光学部材貼り合わせ用粘着シート
CN106102327B (zh) * 2016-08-12 2019-01-01 中国航空工业集团公司西安飞行自动控制研究所 一种胶膜的粘接方法
WO2019049200A1 (fr) * 2017-09-05 2019-03-14 株式会社寺岡製作所 Composition adhésive à base de silicone et ruban adhésif

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JPH02128500A (ja) * 1988-11-08 1990-05-16 Hitachi Chem Co Ltd フレキシブルプリント配線板の製造法
JPH0722795A (ja) * 1993-06-30 1995-01-24 Shin Etsu Chem Co Ltd 薄型基板用固定治具
JP2000261193A (ja) * 1999-03-11 2000-09-22 Misuzu Kogyo:Kk 搬送板へのｆｐｃ基板固着方法
JP2001040301A (ja) * 1999-07-29 2001-02-13 Nitto Denko Corp 接着シート類

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JPH02128500A (ja) * 1988-11-08 1990-05-16 Hitachi Chem Co Ltd フレキシブルプリント配線板の製造法
JPH0722795A (ja) * 1993-06-30 1995-01-24 Shin Etsu Chem Co Ltd 薄型基板用固定治具
JP2000261193A (ja) * 1999-03-11 2000-09-22 Misuzu Kogyo:Kk 搬送板へのｆｐｃ基板固着方法
JP2001040301A (ja) * 1999-07-29 2001-02-13 Nitto Denko Corp 接着シート類

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005048669A1 (fr) * 2003-11-14 2005-05-26 Koninklijke Philips Electronics N.V. Composants souples
US8236614B2 (en) 2005-02-21 2012-08-07 Nitto Denko Corporation Semiconductor device manufacturing method
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
US8278153B2 (en) 2006-09-12 2012-10-02 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
US8975759B2 (en) 2006-09-12 2015-03-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
CN103396743A (zh) * 2006-10-19 2013-11-20 日东电工株式会社 带胶粘层的树脂多孔膜及其制造方法以及过滤器部件
US8345193B2 (en) * 2008-09-12 2013-01-01 Kabushiki Kaisha Toshiba Flexible electronic device and flexible display device
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
US20110229703A1 (en) * 2010-03-03 2011-09-22 Nitto Denko Corporation Protective sheet and use thereof
JP2015177180A (ja) * 2014-03-18 2015-10-05 デクセリアルズ株式会社 可撓性実装モジュール体の製造方法
CN111642067A (zh) * 2019-03-01 2020-09-08 北京梦之墨科技有限公司 一种电路基材、柔性薄膜电路及其制作方法

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KR20040016855A (ko) 2004-02-25
CN1504070A (zh) 2004-06-09
CN100341391C (zh) 2007-10-03

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