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WO2002063314A1 - Sonde - Google Patents

Sonde Download PDF

Info

Publication number
WO2002063314A1
WO2002063314A1 PCT/JP2002/000845 JP0200845W WO02063314A1 WO 2002063314 A1 WO2002063314 A1 WO 2002063314A1 JP 0200845 W JP0200845 W JP 0200845W WO 02063314 A1 WO02063314 A1 WO 02063314A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
terminal
electrode
contact terminal
inspected body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/000845
Other languages
English (en)
Japanese (ja)
Inventor
Rikihito Yamasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of WO2002063314A1 publication Critical patent/WO2002063314A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention se rapporte à une sonde utilisée pour l'examen de caractéristiques électriques au contact avec l'électrode d'un corps examiné. Cette sonde comporte une première borne de contact de structure en colonne, un élément isolant disposé autour de la première borne de contact et une seconde borne de contact disposée autour du premier élément isolant. Une partie terminale située au niveau de l'extrémité inférieure de la seconde borne de contact entre en contact électriquement avec l'électrode du corps examiné, et une partie terminale au niveau de l'extrémité inférieure de la première borne de contact entre en contact électriquement avec l'électrode du corps examiné.
PCT/JP2002/000845 2001-02-02 2002-02-01 Sonde Ceased WO2002063314A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001027238A JP2002228682A (ja) 2001-02-02 2001-02-02 プローブ
JP2001-27238 2001-02-02

Publications (1)

Publication Number Publication Date
WO2002063314A1 true WO2002063314A1 (fr) 2002-08-15

Family

ID=18891933

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/000845 Ceased WO2002063314A1 (fr) 2001-02-02 2002-02-01 Sonde

Country Status (2)

Country Link
JP (1) JP2002228682A (fr)
WO (1) WO2002063314A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166121A (ja) * 2006-12-28 2008-07-17 Toyo Denshi Giken Kk 同軸プローブと、プローブ収納ボードと、ケーブル保持ボードと、コンタクト機と、ケーブル保持ボードの製造方法
JP2009109438A (ja) * 2007-10-31 2009-05-21 Toyo Denshi Giken Kk 測定用プローブ
CN104319247A (zh) * 2014-10-30 2015-01-28 南通富士通微电子股份有限公司 测试针头和半导体测试夹具
WO2021075455A1 (fr) * 2019-10-18 2021-04-22 株式会社村田製作所 Connecteur d'essai et unité d'essai

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136246A (ja) 2003-10-31 2005-05-26 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4521611B2 (ja) 2004-04-09 2010-08-11 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR100688507B1 (ko) 2004-12-08 2007-03-02 삼성전자주식회사 반도체 칩 검사 장치 및 이를 이용한 반도체 칩 검사 방법
WO2007116963A1 (fr) * 2006-04-07 2007-10-18 Nidec-Read Corporation Contact pour l'inspection d'un substrat et son procede de fabrication
WO2008117343A1 (fr) * 2007-02-23 2008-10-02 Nidec-Read Corporation Contact d'examen de substrat
JP5386769B2 (ja) 2008-09-29 2014-01-15 日本電産リード株式会社 検査治具
JP5490425B2 (ja) * 2009-02-26 2014-05-14 ラピスセミコンダクタ株式会社 半導体チップの電気特性測定方法
JP5937208B2 (ja) * 2011-08-30 2016-06-22 Ｌｅｅｎｏ工業株式会社Ｌｅｅｎｏ Ｉｎｄｕｓｔｒｉａｌ Ｉｎｃ． 同軸プローブ
WO2013032218A2 (fr) * 2011-08-30 2013-03-07 리노공업 주식회사 Sonde coaxiale
JP6283929B2 (ja) * 2013-10-08 2018-02-28 日本電産リード株式会社 検査用治具及び検査用治具の製造方法
CN104330593B (zh) * 2014-10-30 2017-09-29 通富微电子股份有限公司 测试针头和半导体测试治具
CN104316864B (zh) * 2014-10-30 2018-06-22 通富微电子股份有限公司 半导体测试治具
KR102708399B1 (ko) * 2021-12-10 2024-09-23 (주)포인트엔지니어링 켈빈 검사용 접촉핀 어셈블리 및 이를 구비하는 켈빈 검사장치

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107166U (fr) * 1984-12-20 1986-07-07
JPS6358757U (fr) * 1986-10-03 1988-04-19
JPS63141462U (fr) * 1987-03-09 1988-09-19
JPH02168164A (ja) * 1988-12-22 1990-06-28 Nec Corp プローブ
JPH0299361U (fr) * 1989-01-27 1990-08-08
JPH0333375U (fr) * 1989-08-07 1991-04-02
JPH06317624A (ja) * 1993-05-10 1994-11-15 Hitachi Ltd 電極の接続装置
JPH09152447A (ja) * 1995-12-01 1997-06-10 Yokowo Co Ltd 両端可動形同軸コンタクトプローブ
JP2001153909A (ja) * 1999-11-24 2001-06-08 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123666U (ja) * 1984-01-30 1985-08-20 株式会社ヨコオ 回路基板等の検査装置
JPH05232137A (ja) * 1992-02-21 1993-09-07 Sumitomo Electric Ind Ltd コンタクトプローブ
JP2002207049A (ja) * 2001-01-10 2002-07-26 Toyo Denshi Giken Kk 四探針測定用コンタクトピンと、コンタクト機器と、被測定物側装置と、測定回路側装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107166U (fr) * 1984-12-20 1986-07-07
JPS6358757U (fr) * 1986-10-03 1988-04-19
JPS63141462U (fr) * 1987-03-09 1988-09-19
JPH02168164A (ja) * 1988-12-22 1990-06-28 Nec Corp プローブ
JPH0299361U (fr) * 1989-01-27 1990-08-08
JPH0333375U (fr) * 1989-08-07 1991-04-02
JPH06317624A (ja) * 1993-05-10 1994-11-15 Hitachi Ltd 電極の接続装置
JPH09152447A (ja) * 1995-12-01 1997-06-10 Yokowo Co Ltd 両端可動形同軸コンタクトプローブ
JP2001153909A (ja) * 1999-11-24 2001-06-08 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166121A (ja) * 2006-12-28 2008-07-17 Toyo Denshi Giken Kk 同軸プローブと、プローブ収納ボードと、ケーブル保持ボードと、コンタクト機と、ケーブル保持ボードの製造方法
JP2009109438A (ja) * 2007-10-31 2009-05-21 Toyo Denshi Giken Kk 測定用プローブ
CN104319247A (zh) * 2014-10-30 2015-01-28 南通富士通微电子股份有限公司 测试针头和半导体测试夹具
WO2021075455A1 (fr) * 2019-10-18 2021-04-22 株式会社村田製作所 Connecteur d'essai et unité d'essai

Also Published As

Publication number Publication date
JP2002228682A (ja) 2002-08-14

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