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WO2002056388A3 - Boîtier semi-conducteur a capteur, muni d'un insert, et son procede de fabrication - Google Patents

Boîtier semi-conducteur a capteur, muni d'un insert, et son procede de fabrication Download PDF

Info

Publication number
WO2002056388A3
WO2002056388A3 PCT/FR2002/000069 FR0200069W WO02056388A3 WO 2002056388 A3 WO2002056388 A3 WO 2002056388A3 FR 0200069 W FR0200069 W FR 0200069W WO 02056388 A3 WO02056388 A3 WO 02056388A3
Authority
WO
WIPO (PCT)
Prior art keywords
insert
semiconductor package
sensor
making same
sensor semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2002/000069
Other languages
English (en)
Other versions
WO2002056388A2 (fr
Inventor
Christophe Prior
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to US10/466,191 priority Critical patent/US7095123B2/en
Publication of WO2002056388A2 publication Critical patent/WO2002056388A2/fr
Publication of WO2002056388A3 publication Critical patent/WO2002056388A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Measuring Fluid Pressure (AREA)
  • Light Receiving Elements (AREA)

Abstract

Boîtier semi-conducteur et son procédé de fabrication, dans lesquels un composant semi-conducteur (5) est fixée sur une face avant de moyens de montage et de connexion électrique (2) et comprend un capteur (8), un insert (11) est en appui sur la face avant dudit composant optique, autour dudit capteur et comprend un passage ouvert (14) s'étendant en avant dudit capteur, et des moyens d'encapsulation (26) comprennent une matière d'enrobage qui entoure ledit composant semi-conducteur et les moyens de montage et de connexion électrique, ledit passage comprenant un bouchon (17).
PCT/FR2002/000069 2001-01-15 2002-01-10 Boîtier semi-conducteur a capteur, muni d'un insert, et son procede de fabrication Ceased WO2002056388A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/466,191 US7095123B2 (en) 2001-01-15 2002-01-10 Sensor semiconductor package, provided with an insert, and method for making same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR01/00473 2001-01-15
FR0100473A FR2819634B1 (fr) 2001-01-15 2001-01-15 Boitier semi-conducteur a capteur, muni d'un insert et son procede de fabrication

Publications (2)

Publication Number Publication Date
WO2002056388A2 WO2002056388A2 (fr) 2002-07-18
WO2002056388A3 true WO2002056388A3 (fr) 2003-01-03

Family

ID=8858814

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2002/000069 Ceased WO2002056388A2 (fr) 2001-01-15 2002-01-10 Boîtier semi-conducteur a capteur, muni d'un insert, et son procede de fabrication

Country Status (3)

Country Link
US (1) US7095123B2 (fr)
FR (1) FR2819634B1 (fr)
WO (1) WO2002056388A2 (fr)

Families Citing this family (32)

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Publication number Priority date Publication date Assignee Title
US7127793B2 (en) * 2002-04-24 2006-10-31 Fuji Photo Film Co., Ltd. Method of producing solid state pickup device
WO2004047421A2 (fr) 2002-11-14 2004-06-03 Donnelly Corporation Systeme d'imagerie pour vehicule
SG111092A1 (en) 2002-11-15 2005-05-30 St Microelectronics Pte Ltd Semiconductor device package and method of manufacture
US20060003483A1 (en) * 2003-07-07 2006-01-05 Wolff Larry L Optoelectronic packaging with embedded window
US8476591B2 (en) 2005-09-21 2013-07-02 Analog Devices, Inc. Radiation sensor device and method
US7897920B2 (en) * 2005-09-21 2011-03-01 Analog Devices, Inc. Radiation sensor device and method
WO2007053404A2 (fr) * 2005-10-28 2007-05-10 Donnelly Corporation Module d'appareil de prise de vues pour système de vision de véhicule
JP4382030B2 (ja) * 2005-11-15 2009-12-09 富士通マイクロエレクトロニクス株式会社 半導体装置及びその製造方法
US8766186B2 (en) 2006-12-27 2014-07-01 Analog Devices, Inc. Control aperture for an IR sensor
US8482664B2 (en) 2008-10-16 2013-07-09 Magna Electronics Inc. Compact camera and cable system for vehicular applications
EP2394426A4 (fr) 2009-02-06 2013-02-20 Magna Electronics Inc Améliorations apportées à une caméra pour véhicule
US12328491B1 (en) 2009-03-25 2025-06-10 Magna Electronics Inc. Vehicular camera and lens assembly
EP3438721B1 (fr) 2009-03-25 2020-07-08 Magna Electronics Inc. Ensemble caméra et objectif véhiculaire
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
DE102011013468A1 (de) * 2011-03-09 2012-09-13 Micronas Gmbh Halbleitergehäuse und Verfahren zur Herstellung eines Halbleitergehäuses
WO2012145501A1 (fr) 2011-04-20 2012-10-26 Magna Electronics Inc. Filtre angulaire pour une caméra installée sur un véhicule
US9871971B2 (en) 2011-08-02 2018-01-16 Magma Electronics Inc. Vehicle vision system with light baffling system
US9596387B2 (en) 2011-08-02 2017-03-14 Magna Electronics Inc. Vehicular camera system
US8802508B2 (en) 2012-11-29 2014-08-12 Freescale Semiconductor, Inc. Semiconductor device package
US9451138B2 (en) 2013-11-07 2016-09-20 Magna Electronics Inc. Camera for vehicle vision system
US9749509B2 (en) 2014-03-13 2017-08-29 Magna Electronics Inc. Camera with lens for vehicle vision system
EP2765410B1 (fr) * 2014-06-06 2023-02-22 Sensirion AG Structure d'emballage de capteur de gaz
US10351072B2 (en) 2015-11-05 2019-07-16 Magna Electronics Inc. Vehicle camera with modular construction
US10250004B2 (en) 2015-11-05 2019-04-02 Magna Electronics Inc. Method of forming a connector for an electrical cable for electrically connecting to a camera of a vehicle
US10560613B2 (en) 2015-11-05 2020-02-11 Magna Electronics Inc. Vehicle camera with modular construction
US10230875B2 (en) 2016-04-14 2019-03-12 Magna Electronics Inc. Camera for vehicle vision system
US10142532B2 (en) 2016-04-08 2018-11-27 Magna Electronics Inc. Camera for vehicle vision system
CN107611147B (zh) * 2016-07-11 2020-02-18 胜丽国际股份有限公司 多芯片塑胶球状数组封装结构
US10237456B2 (en) 2016-08-22 2019-03-19 Magna Electronics Inc. Vehicle camera assembly process
FR3073980A1 (fr) * 2017-11-23 2019-05-24 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique et procede de fabrication
US11683911B2 (en) 2018-10-26 2023-06-20 Magna Electronics Inc. Vehicular sensing device with cooling feature
US11438487B2 (en) 2019-03-07 2022-09-06 Magna Electronics Inc. Vehicular camera with thermal interface material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134187A (ja) * 1984-12-04 1986-06-21 Toshiba Corp 固体撮像デバイス
JPS63186469A (ja) * 1987-01-28 1988-08-02 Mitsubishi Electric Corp 光透過窓を有する半導体装置
US4812420A (en) * 1986-09-30 1989-03-14 Mitsubishi Denki Kabushiki Kaisha Method of producing a semiconductor device having a light transparent window
JPH0575935A (ja) * 1991-09-17 1993-03-26 Toshiba Corp Ｃｃｄモジユール
US5534725A (en) * 1992-06-16 1996-07-09 Goldstar Electron Co., Ltd. Resin molded charge coupled device package and method for preparation thereof
DE19958229A1 (de) * 1998-12-09 2000-06-15 Fuji Electric Co Ltd Optisches Halbleiter-Sensorbauelement

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134187A (ja) * 1984-12-04 1986-06-21 Toshiba Corp 固体撮像デバイス
US4812420A (en) * 1986-09-30 1989-03-14 Mitsubishi Denki Kabushiki Kaisha Method of producing a semiconductor device having a light transparent window
JPS63186469A (ja) * 1987-01-28 1988-08-02 Mitsubishi Electric Corp 光透過窓を有する半導体装置
JPH0575935A (ja) * 1991-09-17 1993-03-26 Toshiba Corp Ｃｃｄモジユール
US5534725A (en) * 1992-06-16 1996-07-09 Goldstar Electron Co., Ltd. Resin molded charge coupled device package and method for preparation thereof
DE19958229A1 (de) * 1998-12-09 2000-06-15 Fuji Electric Co Ltd Optisches Halbleiter-Sensorbauelement

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 329 (E - 452) 8 November 1986 (1986-11-08) *
PATENT ABSTRACTS OF JAPAN vol. 012, no. 465 (E - 690) 7 December 1988 (1988-12-07) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 404 (E - 1405) 28 July 1993 (1993-07-28) *

Also Published As

Publication number Publication date
FR2819634B1 (fr) 2004-01-16
WO2002056388A2 (fr) 2002-07-18
US7095123B2 (en) 2006-08-22
FR2819634A1 (fr) 2002-07-19
US20040077118A1 (en) 2004-04-22

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