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WO2002052615A3 - Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement - Google Patents

Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement Download PDF

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Publication number
WO2002052615A3
WO2002052615A3 PCT/DE2001/004880 DE0104880W WO02052615A3 WO 2002052615 A3 WO2002052615 A3 WO 2002052615A3 DE 0104880 W DE0104880 W DE 0104880W WO 02052615 A3 WO02052615 A3 WO 02052615A3
Authority
WO
WIPO (PCT)
Prior art keywords
conversion element
luminescence conversion
radiation
semiconductor component
emitting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/004880
Other languages
English (en)
French (fr)
Other versions
WO2002052615A2 (de
Inventor
Bert Braune
Stefan Gruber
Guenter Waitl
Ulrich Zehnder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of WO2002052615A2 publication Critical patent/WO2002052615A2/de
Publication of WO2002052615A3 publication Critical patent/WO2002052615A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

Die Erfindung bezieht sich auf ein strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement (8). Dabei ist einem Halbleiterkörper (3) ein Reflektor (7) nachgeordnet, der mit einem Lumineszenzkonversionselement (8) beschichtet ist oder ein Lumineszenzkonversionselement (8) enthält. Das Lumineszenzkonversionselement (8) wandelt einen Teil der von dem Halbleiterkörper (3) in Betrieb generierten Strahlung (6) in einem ersten Wellenlängenbereich in Strahlung (9) in einem zweiten Wellenlängenbereich um. Vorzugsweise sind Halbleiterkörper (3) und Lumineszenzkonversionselement (8) so aufeinander abgestimmt, daß mischfarbig weißes Licht emittiert wird.
PCT/DE2001/004880 2000-12-27 2001-12-21 Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement Ceased WO2002052615A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10065381A DE10065381B4 (de) 2000-12-27 2000-12-27 Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE10065381.2 2000-12-27

Publications (2)

Publication Number Publication Date
WO2002052615A2 WO2002052615A2 (de) 2002-07-04
WO2002052615A3 true WO2002052615A3 (de) 2002-12-19

Family

ID=7669239

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004880 Ceased WO2002052615A2 (de) 2000-12-27 2001-12-21 Strahlungsemittierendes halbleiterbauelement mit lumineszenzkonversionselement

Country Status (2)

Country Link
DE (1) DE10065381B4 (de)
WO (1) WO2002052615A2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047748A (ja) 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
JP2004128273A (ja) * 2002-10-03 2004-04-22 Sharp Corp 発光素子
US7806541B2 (en) 2004-08-06 2010-10-05 Koninklijke Philips Electronics N.V. High performance LED lamp system
US7256057B2 (en) 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
DE102004045950A1 (de) * 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102004047640A1 (de) 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
JP4264109B2 (ja) * 2007-01-16 2009-05-13 株式会社東芝 発光装置
DE102007059548A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Auskoppellinse für ein optoelektronisches Bauelement
KR101488448B1 (ko) * 2007-12-06 2015-02-02 서울반도체 주식회사 Ｌｅｄ 패키지 및 그 제조방법
DE102010054591B4 (de) * 2010-12-15 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse und Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Bauelement
US8480254B2 (en) 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US9062198B2 (en) 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
CN104204055B (zh) 2011-12-30 2016-05-25 提克纳有限责任公司 用于发光装置的反射器
DE102012109650A1 (de) 2012-10-10 2014-04-10 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Halbleiterelement und Verfahren zur Herstellung eines keramischen Konversionselements
CN104903399B (zh) 2012-12-18 2017-05-31 提克纳有限责任公司 用于发光二极管组件的模制反射器
DE102017111426A1 (de) 2017-05-24 2018-11-29 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements
DE102018204163A1 (de) 2018-03-19 2019-09-19 Osram Opto Semiconductors Gmbh Konversionselement für LED-Anwendungen mit hoher Leistung und hoher Farbwiedergabe
CN109786517B (zh) 2019-01-25 2020-05-15 京东方科技集团股份有限公司 发光结构、发光二极管及其制备方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (de) * 1972-09-05 1974-04-04 Matsushita Electronics Corp Festkoerper-anzeigevorrichtung
JPH07176794A (ja) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd 面状光源
DE29804149U1 (de) * 1998-03-09 1998-06-18 Chen, Hsing, Hsinchu Leuchtdiode (LED) mit verbesserter Struktur
WO1998054930A2 (en) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Uv/blue led-phosphor device with enhanced light output
JPH1168166A (ja) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd 発光ダイオード装置
JP2000022220A (ja) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd 反射型ｌｅｄランプ
JP2000082849A (ja) * 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
WO2000019546A1 (en) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Lighting system
JP2000347601A (ja) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp 発光装置
WO2001059851A1 (fr) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Source lumineuse

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29724582U1 (de) * 1996-06-26 2002-07-04 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344774A1 (de) * 1972-09-05 1974-04-04 Matsushita Electronics Corp Festkoerper-anzeigevorrichtung
JPH07176794A (ja) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd 面状光源
WO1998054930A2 (en) * 1997-05-27 1998-12-03 Koninklijke Philips Electronics N.V. Uv/blue led-phosphor device with enhanced light output
JPH1168166A (ja) * 1997-08-19 1999-03-09 Sanken Electric Co Ltd 発光ダイオード装置
DE29804149U1 (de) * 1998-03-09 1998-06-18 Chen, Hsing, Hsinchu Leuchtdiode (LED) mit verbesserter Struktur
JP2000022220A (ja) * 1998-07-03 2000-01-21 Stanley Electric Co Ltd 反射型ｌｅｄランプ
WO2000019546A1 (en) * 1998-09-28 2000-04-06 Koninklijke Philips Electronics N.V. Lighting system
JP2000347601A (ja) * 1999-06-02 2000-12-15 Toshiba Electronic Engineering Corp 発光装置
JP2000082849A (ja) * 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
WO2001059851A1 (fr) * 2000-02-09 2001-08-16 Nippon Leiz Corporation Source lumineuse
EP1187228A1 (de) * 2000-02-09 2002-03-13 Nippon Leiz Corporation Lichtquelle

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 10 30 November 1995 (1995-11-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 15 6 April 2001 (2001-04-06) *

Also Published As

Publication number Publication date
DE10065381A1 (de) 2002-07-11
DE10065381B4 (de) 2010-08-26
WO2002052615A2 (de) 2002-07-04

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