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WO2001003878A1 - Alliage pour soudures - Google Patents

Alliage pour soudures Download PDF

Info

Publication number
WO2001003878A1
WO2001003878A1 PCT/GB2000/002502 GB0002502W WO0103878A1 WO 2001003878 A1 WO2001003878 A1 WO 2001003878A1 GB 0002502 W GB0002502 W GB 0002502W WO 0103878 A1 WO0103878 A1 WO 0103878A1
Authority
WO
WIPO (PCT)
Prior art keywords
amount
soldering
flux
alloy
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB2000/002502
Other languages
English (en)
Inventor
Hector Andrew Hamilton Steen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multicore Solders Ltd
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Priority to AU55568/00A priority Critical patent/AU5556800A/en
Priority to GB0201171A priority patent/GB2367834B/en
Publication of WO2001003878A1 publication Critical patent/WO2001003878A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Definitions

  • This invention relates to solder alloys and in particular solder alloys for use in soldering methods that use a reservoir of molten solder.
  • solder materials have hitherto been tin-lead solders.
  • the molten solder oxidises and thereby prevents the surface from looking bright and clear.
  • Phosphorus has, indeed, become a widely used additive to tin-lead solders in amounts of 0.001 - 0.004 per cent. Such addition slows down the rate at which the molten solder oxidises and prevents the formation of coloured interference films of oxide and keeps the surface looking bright and clear.
  • a further advantageous effect is to break up the "wet" dross containing a high proportion of unoxidised solder formed on wave soldering machine solder pots into a more powdery, drier dross with less unoxidised metal.
  • phosphorus addition confers no particular advantage in terms of reduced incidence of soldering defects.
  • Wave soldering with the now preferred lead-free alloys such as SnAg3.8Cu0.7 and SnCu0.7, especially when working with low solids (solvent base) fluxes, has led to the identification of a tendency for a tenacious oxide layer to form on the wave which can cause soldering defects such as webbing and bridging.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention porte sur un alliage pour soudures sans plomb s'utilisant pour la soudure à vague et en particulier à l'aide de flux aqueux exempt de VOC, de flux aqueux à faible teneur en VOC, et flux de solides à bas point de fusion (étain + un ou plusieurs des éléments suivants: jusqu'à 10 % d'Ag, jusqu'à 5 % de Cu, jusqu'à 10 % de Sb, jusqu'à 10 % de Bi, et jusqu'à 10 % de phosphore, le tout en % du poids d'étain.
PCT/GB2000/002502 1999-07-07 2000-06-29 Alliage pour soudures Ceased WO2001003878A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU55568/00A AU5556800A (en) 1999-07-07 2000-06-29 Solder alloy
GB0201171A GB2367834B (en) 1999-07-07 2000-06-29 Solder alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9915954.3A GB9915954D0 (en) 1999-07-07 1999-07-07 Solder alloy
GB9915954.3 1999-07-07

Publications (1)

Publication Number Publication Date
WO2001003878A1 true WO2001003878A1 (fr) 2001-01-18

Family

ID=10856849

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2000/002502 Ceased WO2001003878A1 (fr) 1999-07-07 2000-06-29 Alliage pour soudures

Country Status (3)

Country Link
AU (1) AU5556800A (fr)
GB (2) GB9915954D0 (fr)
WO (1) WO2001003878A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1273384A1 (fr) 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
WO2004096484A3 (fr) * 2003-04-25 2005-03-24 Siemens Ag Metal d'apport de brasage a base snagcu
WO2005035180A1 (fr) 2003-10-07 2005-04-21 Senju Metal Industry Co., Ltd. Boule de soudure exempte de plomb
WO2007045191A3 (fr) * 2005-10-19 2007-11-29 Jan Jenik Alliage de brasage sans plomb
EP1464431A4 (fr) * 2002-01-10 2008-06-18 Senju Metal Industry Co Technique de brasage et alliage de brasure pour apport supplementaire
US10213879B2 (en) * 2015-11-30 2019-02-26 Senju Metal Industry Co., Ltd. Solder alloy

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (ja) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Ｓｎ−Ｓｂ系合金はんだ
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
EP0336575A1 (fr) * 1988-03-31 1989-10-11 COOKSON GROUP plc Compositions d'alliages à basse toxicité pour joindre et rendre étanche
JPH1034376A (ja) * 1996-07-26 1998-02-10 Nippon Genma:Kk 無鉛はんだ
JPH10225790A (ja) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd 半田付け用無鉛合金
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186091A (ja) * 1984-10-03 1986-05-01 Furukawa Electric Co Ltd:The Ｓｎ−Ｓｂ系合金はんだ
DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
EP0336575A1 (fr) * 1988-03-31 1989-10-11 COOKSON GROUP plc Compositions d'alliages à basse toxicité pour joindre et rendre étanche
JPH1034376A (ja) * 1996-07-26 1998-02-10 Nippon Genma:Kk 無鉛はんだ
JPH10225790A (ja) * 1997-02-15 1998-08-25 Samsung Electron Co Ltd 半田付け用無鉛合金
US5980822A (en) * 1997-02-15 1999-11-09 Samsung Electronics Co., Ltd. Leadless alloy for soldering
DE19816671A1 (de) * 1997-04-16 1998-10-22 Fuji Electric Co Ltd Lötmittel-Legierungen

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 261 (M - 514) 5 September 1986 (1986-09-05) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 13 30 November 1998 (1998-11-30) *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7682468B2 (en) 2001-06-28 2010-03-23 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP1273384A1 (fr) 2001-06-28 2003-01-08 Senju Metal Industry Co., Ltd. Alliage de soudure sans plomb
EP1897649A1 (fr) 2001-06-28 2008-03-12 Senju Metal Industry Co., Ltd. Alliage pour soudure sans plomb
US7338567B2 (en) 2001-06-28 2008-03-04 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP1464431A4 (fr) * 2002-01-10 2008-06-18 Senju Metal Industry Co Technique de brasage et alliage de brasure pour apport supplementaire
US7628308B2 (en) 2002-01-10 2009-12-08 Senju Metal Industry Co., Ltd. Method of replenishing an oxidation suppressing element in a solder bath
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu
US10376994B2 (en) 2003-04-25 2019-08-13 Hans-Jürgen Albrecht Soldering material based on Sn Ag and Cu
WO2004096484A3 (fr) * 2003-04-25 2005-03-24 Siemens Ag Metal d'apport de brasage a base snagcu
US7750475B2 (en) 2003-10-07 2010-07-06 Senju Metal Industry Co., Ltd. Lead-free solder ball
EP1679149A4 (fr) * 2003-10-07 2007-03-28 Senju Metal Industry Co Boule de soudure exempte de plomb
WO2005035180A1 (fr) 2003-10-07 2005-04-21 Senju Metal Industry Co., Ltd. Boule de soudure exempte de plomb
WO2007045191A3 (fr) * 2005-10-19 2007-11-29 Jan Jenik Alliage de brasage sans plomb
US10213879B2 (en) * 2015-11-30 2019-02-26 Senju Metal Industry Co., Ltd. Solder alloy

Also Published As

Publication number Publication date
GB0201171D0 (en) 2002-03-06
GB2367834B (en) 2003-07-23
GB2367834A (en) 2002-04-17
AU5556800A (en) 2001-01-30
GB9915954D0 (en) 1999-09-08

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