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WO2001099483A1 - Couvercle de blindage muni de nervures elastiques integrees - Google Patents

Couvercle de blindage muni de nervures elastiques integrees Download PDF

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Publication number
WO2001099483A1
WO2001099483A1 PCT/US2001/019301 US0119301W WO0199483A1 WO 2001099483 A1 WO2001099483 A1 WO 2001099483A1 US 0119301 W US0119301 W US 0119301W WO 0199483 A1 WO0199483 A1 WO 0199483A1
Authority
WO
WIPO (PCT)
Prior art keywords
shielding cover
ribs
board
shielding
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/019301
Other languages
English (en)
Inventor
William H. Stickney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Priority to AU2001268480A priority Critical patent/AU2001268480A1/en
Publication of WO2001099483A1 publication Critical patent/WO2001099483A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls

Definitions

  • the invention pertains to a shielding cover for providing electromagnetic shielding for all or part of a printed circuit (PC) board mounted in an enclosure.
  • PC printed circuit
  • EMI shall represent collectively electromagnetic interference and/or radio frequency interference (RFI).
  • housings or enclosures are typically found as generally rigid outer shells or covers which are joined together after the PC board is mounted therein.
  • the EMI shielding may be provided by metallic covers or by strip-like gaskets along the perimeters of the areas to be shielded.
  • Metallic covers solder-mounted over the top of surface-mount components can be seen in U.S. Patent No. 5,633,786 in a non-conductive enclosure with no gasketing. These have the disadvantage of lack of access for repair and the requirement for longer exposure to heat during the soldering process.
  • either one edge is permanently secured to an inner surface of the cover with the exposed opposite edge adapted to engage a surface of the PC board, or one edge is permanently secured to the surface of the PC board and the exposed opposite edge is adapted to engage an inner surface of the cover.
  • These gaskets are typically conductive elastomers, and in final assembly the gaskets must be compressed to insure an adequate EMI seal along the engaged surfaces. The force required often caused either deformation of the housing or buckling, twisting or other deformation of the gasket seal.
  • the PC card or PC board structure of the present invention is expected to have very widespread usage because of the rapidly expanding use of PC cards in the computer and computer-related industries.
  • the present invention constitutes a significant advance in the art because it permits use of non-conductive covers while maintaining adequate EMI shielding and providing various highly advantageous additional features, as disclosed herein.
  • An object of this invention is to provide a new EMI shielding arrangement in a PC card housing structure.
  • the new structure will allow easy access to the circuit board and components thereon by merely disassembling the housing.
  • Another object is to provide such structure wherein a shielding gasket is formed of elastomer ribs integrally joint to a substrate cover which thus does not require soldering or other permanent attachment of the ribs to the PC board.
  • a further object is to provide such structure of integral ribs on a metal substrate, which substrate can be used on either or both sides of the PC board.
  • the PC card housing does not have to be metal or metalized.
  • An additional object is to have elastromer ribs which do not require additional or integral stiffening elements to insure proper sealing.
  • a still further object is to achieve the EMI shielding by using a separate metal or metallic coated substrate which is situated between the PC board and the outer housing and to which the elastomer ribs are bonded.
  • the height of the ribs is greater than said nominal height of the intermediate space such that upon assembly of these component parts and closure of the housing, the ribs are compressed sufficiently to achieve proper pressure contact and EMI shielding seal with the PC card.
  • the inner surface of the cover against which the substrate lies or is secured may be designed to have shoulders to support the substrate in the areas on the substrate which are on the remote side opposite the ribs. This assures at the time of assembly and closure of the housing, that the ribs will be adequately compressed along their entire lengths to provide proper EMI sealing.
  • this type of structural arrangement can be provided on one or both sides of the PC card.
  • the shielding cover or substrate is stiff in the length, width and diagonal direction within the plane of this substrate so that its shape is maintained and so that the shielding ribs on its surface will align precisely with mating ground traces on the PC card, hi one embodiment this shielding cover may be flexible or bendable in the direction normal to the planes of the cover and of the PC card, so that the cover may flex or bow if necessary to accommodate a warped card or housing.
  • the substrate or shielding cover must be electrically conductive and is preferably metallic.
  • cooling holes may be cut through the thickness of the substrate.
  • the substrate may have three-dimensional shape, but typically it is flat. Flat shapes are advantageous because they can be cut out using blanking, CNC punching, laser cutting or photo chemical machining (photo etching). Since laser cutting and photo etching do not require special tooling they can be used where time is limited or production quantities are too small to justify blanking dies.
  • the shielding cover is made by placing a substrate piece into a mold, filling the mold cavity with conductive elastomer, then curing the elastomer, separating the mold halves, and removing the finished shield. Since the elastomer is introduced into the mold cavity under pressure, normal edge seals are utilized.
  • Fig. 1 is an exploded, schematic front, top perspective view showing the components of the new shielding cover within an electronics housing.
  • Fig. 2 is a sectional view taken through a closed and assembled electronics housing of Fig. 1.
  • Fig. 3 is a bottom rear perspective view of the shielding cover in the assemblies of Figs. 1 and 2.
  • Fig. 4 is similar to Fig. 1 and shows further detail.
  • Fig. 5 is similar to Figs. 1 and 4 but shows an exploded schematic rear, top perspective view thereof.
  • Fig. 6 is a bottom plan view of the shielding cover of Fig. 3.
  • Fig. 7 is an enlarged elevation view in section of the elastomer rib, taken along line A- A in Fig. 6.
  • Fig. 8 is a schematic sectional view showing the PCMCIA structure with the housing shells positioned to be closed, and with the elastomer ribs still uncompressed.
  • Fig. 9 is similar to Fig. 8 but showing the housing shells fully closed and the elastomer ribs compressed.
  • Fig. 10 shows a fragmentary sectional view of a PC board and shielding covers positioned above and below the PC board.
  • Fig. 11 is a bottom plan view that shows schematically the direction of stiffness of the shielding cover.
  • Fig. 12 is a side elevation view showing the directions of flexibility of the shielding cover.
  • Fig. 13 is a fragmentary sectional view showing an injection mold for forming and bonding the elastomer rib on the surfaces of the shielding cover or substrate.
  • Fig. 14 is a fragmentary schematic view showing the elastomer rib in assembled and compressed state.
  • the invention disclosed herein comprises both the new shielding cover with integral resilient ribs and the combination of this cover in a housing assembly for or with a PC card.
  • Fig. 1 shows a complete assembly 10 in exploded view comprising the upper housing 12, the lower housing 14, the printed circuit (PC) board 16 and the shielding cover 19.
  • PC printed circuit
  • the shielding cover 19 On the PC board are components 17 and ground trace 18.
  • the elastomer rib 20 extending downward from the bottom surface of the shielding cover.
  • a wall structure 22 on the inside or upper surface of the lower housing 14 with caps 24 located on top edges of these walls to engage and support the PC board.
  • Fig. 2 shows the components of Fig. 1 assembled into a closed housing 26.
  • upper and lower housing parts 12 and 14 have their mutual edges 12E, 14E adjacent and joined.
  • the PC board 16 is situated atop caps 24 positioned atop walls 22.
  • the elastomer ribs 20 have their lower compressed edges 21 against the top surface 28 of PC board 16. As noted above, each rib is bonded to and extends downward from the lower surface 29 of the shielding cover 19.
  • walls 30 whose lower edges 32 support and back up the elastomer ribs when they are compressed.
  • the lower edges 32 contact the upper surface of shielding cover 19.
  • the lower edges may be fitted with caps to engage and support the shielding cover.
  • Figs. 3 and 6 show more clearly the bottom surface 29 of the shielding cover of substrate 19.
  • the bottom edges 21 of the elastomer ribs 20 define the footprint that engages the top surface 28 of the PC board.
  • any selected group of wall segments of the elastomer ribs, such as 32A, 32B, 32C and 32D define an enclosure 33 which becomes shielded from adjacent enclosures and of course from external EMI.
  • Fig. 4 is quite similar to Fig. 1, but shows certain structure in greater detail.
  • Fig. 5 is essentially an upside down view of Fig. 4 with the lower housing 14 on top and PC board 16 adjacent thereto.
  • Fig. 6 clarifies the structure seen in Fig. 3, and Fig. 7 shows an enlarged sectional view of the elastomer rib 20.
  • the rib has the height of 0.120 inches, a base width of 0.062 inches, a top edge radius of 0.012 inches and a draft angle of 10.0° for the tapered walls.
  • Figs. 8 and 9 show schematically the final assembly where components co ⁇ esponding to those in Figs. 1 and 2 are given the same reference numbers as a matter of convenience.
  • the upper and lower housing shells 12 and 14 are positioned and aligned for closure.
  • the conductive ground trace 18 On the top surface of PC board 16 and immediately below the lower edges 21 of elastomer ribs 20 is the conductive ground trace 18 which is to be in pressure contact with said edges 21 of the ribs.
  • Fig. 9 shows full closure of the upper and lower housing and compression of the ribs 20 whose lower edges 21 become somewhat flattened and wider than they were in Fig. 8.
  • closure force F is applied which must overcome the elastic resilience of the ribs. The force adequately compresses and widens the elastomer ribs into pressure contact with the ground trace to affect the EMI shielding seal; this also helps to firmly and securely maintain the PC board in its proper position unless the PC board is otherwise adequately secured in the housing.
  • the actual housing can now be made of material other than metal which significantly reduces cost and manufacturing difficulty.
  • Fig. 10 demonstrates how the assembly 40 can utilize two separate metal substrate shielding covers 41 and 42 respectively below and above the PC board 43.
  • the PC board has ground traces 44 on both top and bottom surfaces to engage and seal with respective elastomer ribs.
  • perimeter gasket (rib) 45 isolates circuitry from outside environmental interference
  • compartment gasket or inside ribs 46 isolate one section of the PC board from another to reduce crosstalk, as previously noted in the description of enclosure 33 seen in Figs. 3 and 6.
  • Figs. 11 and 12 are merely schematic renditions showing that shielding cover 19 is stiff in the directions of a ⁇ ows a-f in the plane of the cover, and is flexible to bend if force g is applied in a direction normal to said plane.
  • this substrate 19 will maintain its rectangular (or other original) shape of its perimeter, and accordingly the elastomer ribs along this perimeter will always be properly aligned with the ground traces of the PC board for effective EMI shielding.
  • Fig. 13 shows schematically injection molding apparatus, namely top and bottom mold halves 50 and 51 with the substrate 52 temporarily captured therebetween when the elastomer 53 is injected through sprue 54 into the cavity 55 which defines the space and shape of the elastomer rib molded therein.
  • This molding is done by equipment and methods and using materials well known in the industry, with the resulting ribs securely bonded to the surface of the substrate.
  • Fig. 14 is merely another schematic drawing showing how the closure forces compress the elastomer rib into its widened shape and how the compressed rib exerts a counter spring force back against the substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention se rapporte à un dispositif de blindage conçu pour assurer le blindage électromagnétique d'une carte (16) à circuit imprimé ('PC') comportant une ou plusieurs zones de composants et un tracé de mise à la terre (18) entourant les zones de composants (17). Ledit dispositif est composé d'un couvercle de blindage métallique ou métallisé (19) possédant des nervures élastomères conductrices (20) et des éléments de boîtier (12, 14) non conducteurs, supérieur et inférieur. Les nervures élastomères (20) du couvercle de blindage sont en correspondance et en contact avec le tracé de mise à la terre (18) de la carte PC (16). Le couvercle de blindage (19) et la carte PC (16) sont entièrement ou partiellement logés à l'intérieur des éléments de boîtier (12, 14) supérieur et inférieur. Lors de l'assemblage et de la fermeture, les éléments de boîtier (12, 14) compriment les nervures élastomères (20) de manière à assurer un blindage efficace contre le rayonnement électromagnétique et haute fréquence (collectivement 'EMI') autour des zones de composants.
PCT/US2001/019301 2000-06-20 2001-06-14 Couvercle de blindage muni de nervures elastiques integrees Ceased WO2001099483A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001268480A AU2001268480A1 (en) 2000-06-20 2001-06-14 Shielding cover with integral resilient ribs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21289700P 2000-06-20 2000-06-20
US60/212,897 2000-06-20

Publications (1)

Publication Number Publication Date
WO2001099483A1 true WO2001099483A1 (fr) 2001-12-27

Family

ID=22792831

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/019301 Ceased WO2001099483A1 (fr) 2000-06-20 2001-06-14 Couvercle de blindage muni de nervures elastiques integrees

Country Status (2)

Country Link
AU (1) AU2001268480A1 (fr)
WO (1) WO2001099483A1 (fr)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1348554A3 (fr) * 2002-03-28 2004-04-14 Seiko Epson Corporation Protection contre les ondes électromagnétiques et appareil d'enregistrement comportant un tel dispositif
EP1553814A1 (fr) * 2004-01-08 2005-07-13 Ngk Insulators, Ltd. Boítier de blindage électromagnétique et son procédé de fabrication
FR2869499A1 (fr) * 2004-04-23 2005-10-28 Motorola Inc Soc De Droit De L Cadre de blindage pour un ensemble de protection vis-a-vis des frequences radio
EP1345485A3 (fr) * 2002-03-11 2006-04-19 Helmut Kahl Boîtier d'appareil dont un espace est blindé électromagnétiquement
WO2008015561A1 (fr) * 2006-08-03 2008-02-07 Johnson Controls Technology Company Boitier de composants electroniques et procede de montage du boitier
US7534968B2 (en) 2006-11-03 2009-05-19 Laird Technologies, Inc. Snap install EMI shields with protrusions and electrically-conductive members for attachment to substrates
JP2014065274A (ja) * 2012-09-27 2014-04-17 Lenovo Singapore Pte Ltd 筐体用材料及び筐体、並びに、筐体用材料の製造方法及び筐体の製造方法
US9125294B2 (en) 2008-12-12 2015-09-01 Bae Systems Plc Shield
WO2016090999A1 (fr) * 2014-12-11 2016-06-16 中兴通讯股份有限公司 Boîte de blindage contre les radiofréquences
US20160192544A1 (en) * 2014-12-26 2016-06-30 Intel Corporation Integrated thermal emi structure for electronic devices
CN106255371A (zh) * 2016-09-19 2016-12-21 北京龙坤盛达科技有限公司 一种atr机箱的电源盒
WO2017019738A1 (fr) * 2015-07-30 2017-02-02 Laird Technologies, Inc. Blindages contre les interférences électromagnétiques et procédés associés
WO2017187004A1 (fr) * 2016-04-28 2017-11-02 Teleste Oyj Agencement structural destiné à un dispositif de champ de télévision par câble
WO2017218614A1 (fr) 2016-06-15 2017-12-21 Hunter Fan Company Système de ventilateur de plafond et boîtier de composants électroniques
WO2022065747A1 (fr) * 2020-09-24 2022-03-31 삼성전자 주식회사 Dispositif électronique comprenant un élément de blindage
DE102022104810A1 (de) 2022-03-01 2023-09-07 HELLA GmbH & Co. KGaA Gehäuse, insbesondere für ein Steuergerät, mit einer Abschirmung gegen elektromagnetische Strahlung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
US5764492A (en) * 1996-07-08 1998-06-09 Motorola, Inc. Radio device with radio shielding and method of manufacture
US5847317A (en) * 1997-04-30 1998-12-08 Ericsson Inc. Plated rubber gasket for RF shielding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5764492A (en) * 1996-07-08 1998-06-09 Motorola, Inc. Radio device with radio shielding and method of manufacture
US5717577A (en) * 1996-10-30 1998-02-10 Ericsson, Inc. Gasketed shield can for shielding emissions of electromagnetic energy
US5847317A (en) * 1997-04-30 1998-12-08 Ericsson Inc. Plated rubber gasket for RF shielding

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1345485A3 (fr) * 2002-03-11 2006-04-19 Helmut Kahl Boîtier d'appareil dont un espace est blindé électromagnétiquement
CN100407886C (zh) * 2002-03-11 2008-07-30 赫尔穆特·卡尔 带有一个电磁屏蔽区的设备罩
EP1348554A3 (fr) * 2002-03-28 2004-04-14 Seiko Epson Corporation Protection contre les ondes électromagnétiques et appareil d'enregistrement comportant un tel dispositif
US7006361B2 (en) 2002-03-28 2006-02-28 Seiko Epson Corporation Electromagnetic wave shielding member and recording apparatus incorporating the same
CN1298538C (zh) * 2002-03-28 2007-02-07 精工爱普生株式会社 安装有电磁波屏蔽部件的记录装置
EP1553814A1 (fr) * 2004-01-08 2005-07-13 Ngk Insulators, Ltd. Boítier de blindage électromagnétique et son procédé de fabrication
US7626832B2 (en) 2004-01-08 2009-12-01 Ngk Insulators, Ltd. Electromagnetic wave shield case and a method for manufacturing electromagnetic wave shield case
FR2869499A1 (fr) * 2004-04-23 2005-10-28 Motorola Inc Soc De Droit De L Cadre de blindage pour un ensemble de protection vis-a-vis des frequences radio
WO2008015561A1 (fr) * 2006-08-03 2008-02-07 Johnson Controls Technology Company Boitier de composants electroniques et procede de montage du boitier
FR2904752A1 (fr) * 2006-08-03 2008-02-08 Johnson Controls Tech Co Boitier de composants electroniques et procede de montage du boitier
US7534968B2 (en) 2006-11-03 2009-05-19 Laird Technologies, Inc. Snap install EMI shields with protrusions and electrically-conductive members for attachment to substrates
US9125294B2 (en) 2008-12-12 2015-09-01 Bae Systems Plc Shield
JP2014065274A (ja) * 2012-09-27 2014-04-17 Lenovo Singapore Pte Ltd 筐体用材料及び筐体、並びに、筐体用材料の製造方法及び筐体の製造方法
WO2016090999A1 (fr) * 2014-12-11 2016-06-16 中兴通讯股份有限公司 Boîte de blindage contre les radiofréquences
US20160192544A1 (en) * 2014-12-26 2016-06-30 Intel Corporation Integrated thermal emi structure for electronic devices
US10278314B2 (en) 2015-07-30 2019-04-30 Laird Technologies, Inc. Soft and/or flexible EMI shields and related methods
CN106455462B (zh) * 2015-07-30 2023-10-20 莱尔德电子材料(深圳)有限公司 柔软和/或柔性emi屏蔽件以及相关方法
WO2017019738A1 (fr) * 2015-07-30 2017-02-02 Laird Technologies, Inc. Blindages contre les interférences électromagnétiques et procédés associés
CN106455462A (zh) * 2015-07-30 2017-02-22 莱尔德电子材料(深圳)有限公司 柔软和/或柔性emi屏蔽件以及相关方法
WO2017187004A1 (fr) * 2016-04-28 2017-11-02 Teleste Oyj Agencement structural destiné à un dispositif de champ de télévision par câble
EP3472524A4 (fr) * 2016-06-15 2020-02-12 Hunter Fan Company Système de ventilateur de plafond et boîtier de composants électroniques
WO2017218614A1 (fr) 2016-06-15 2017-12-21 Hunter Fan Company Système de ventilateur de plafond et boîtier de composants électroniques
US10590940B2 (en) 2016-06-15 2020-03-17 Hunter Fan Company Ceiling fan system and electronics housing
US11073156B2 (en) 2016-06-15 2021-07-27 Hunter Fan Company Ceiling fan system and electronics housing
CN106255371A (zh) * 2016-09-19 2016-12-21 北京龙坤盛达科技有限公司 一种atr机箱的电源盒
WO2022065747A1 (fr) * 2020-09-24 2022-03-31 삼성전자 주식회사 Dispositif électronique comprenant un élément de blindage
DE102022104810A1 (de) 2022-03-01 2023-09-07 HELLA GmbH & Co. KGaA Gehäuse, insbesondere für ein Steuergerät, mit einer Abschirmung gegen elektromagnetische Strahlung

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