WO2001094669A1 - Polycrystalline silicon rod and method for processing the same - Google Patents
Polycrystalline silicon rod and method for processing the same Download PDFInfo
- Publication number
- WO2001094669A1 WO2001094669A1 PCT/JP2001/004636 JP0104636W WO0194669A1 WO 2001094669 A1 WO2001094669 A1 WO 2001094669A1 JP 0104636 W JP0104636 W JP 0104636W WO 0194669 A1 WO0194669 A1 WO 0194669A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rod
- polycrystalline silicon
- silicon rod
- outer peripheral
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/90—Apparatus characterized by composition or treatment thereof, e.g. surface finish, surface coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/911—Seed or rod holders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1072—Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2973—Particular cross section
Definitions
- the present invention relates to a polycrystalline silicon rod having a connection structure and a method for processing the same. More specifically, for a polycrystalline silicon rod having a connection structure in which a plurality of polycrystalline silicon rods can be hung from each other stably and easily to each other, a groove processing or the like is performed stably without annealing treatment. It relates to a processing method that can perform.
- a polycrystalline silicon rod may be simply referred to as a silicon rod.
- single-crystal silicon is mainly manufactured by the Czochralski method (CZ method).
- CZ method Czochralski method
- a seed crystal is immersed in a melt of molten polycrystalline silicon, and single-crystal silicon is grown around this seed crystal.
- the seed crystal is gradually pulled up in accordance with the growth to produce a rod-shaped single-crystal silicon.
- the raw material polycrystalline silicon is cut into a column with a length of about 7 O cm for easy handling, and this lump (called a silicon rod) is charged into a melting pot and melted.
- a silicon rod is charged into a melting pot and melted.
- a silicon rod is provided with a groove on the outer periphery near the upper end of the rod, and a wire is hung on this groove and suspended. For this reason, the rod is melted while leaving the upper part from a few centimeters below the groove of the rod, resulting in poor melting efficiency.
- a large amount of silicon rod is melted, it is necessary to repeat each process from attaching the wire to charging the silicon melt and pulling up the remaining mouth several times.
- a method has been proposed in which a plurality of silicon rods are suspended at the same time (Japanese Patent Laid-Open No. 09-255467). Not done.
- annealing does not avoid metal contamination from the heating source, and has the problem of lowering the purity of polycrystalline silicon.
- the annealing treatment requires heating to a high temperature of about 1200 ° C., which is troublesome and requires high-temperature heating equipment.
- the present invention has solved such a problem and provides a connection structure capable of hanging a plurality of silicon rods stably and easily with each other.
- Another object of the present invention is to provide a processing method capable of stably processing a silicon rod without performing annealing treatment when processing such a connection structure. That is, according to the present invention, a silicon rod having the following structure and a processing method thereof are provided.
- An engaging groove is provided on at least one of the end faces of the polycrystalline silicon rods facing each other, the engaging groove being formed by a narrow slit and an internal space wider than the slit width.
- An opening is formed in the end face and the side face of the rod so as to receive a connecting member larger than the width, and the connecting member is fitted to the engaging groove of the opposing rod so that the rods are connected to each other at the end.
- a polycrystalline silicon rod having a bonding structure.
- a polycrystalline silicon rod characterized in that the outer peripheral part or a part of the outer peripheral part at the end of the polycrystalline silicon rod is removed and the remaining central part is processed.
- a polycrystalline silicon rod characterized in that the outer peripheral portion or a part of the outer peripheral portion at the end of the polycrystalline silicon rod is removed and the remaining central portion is processed. Processing method.
- an engaging groove is provided on at least one end face of the polycrystalline silicon rods facing each other, and the engaging groove has a narrow slit and an internal space wider than the slit width.
- a groove processing or the like can be provided without subjecting the polycrystalline silicon rod to a high-temperature annealing treatment, so that metal contamination due to high-temperature heating can be avoided. Also, no heating equipment is required, and processing can be performed quickly. Therefore, the polycrystalline silicon rod processed according to the present invention is a high-purity rod with little metal contamination during processing.
- FIGS. 1, 2, and 3 are partial external views showing a connecting structure portion of a silicon rod
- FIG. 4 is a partial external view showing a state in which the silicon rods are connected vertically.
- FIG. 5 is an explanatory view showing a starting state of the working method of the present invention
- FIG. 6 is an explanatory view showing a procedure of the working method of the present invention
- FIGS. 7 and 8 show working methods of other shapes according to the present invention.
- FIG. 7 is a schematic external view of the upper end of the rod
- FIG. 8 is a plan view, a front view and a side view thereof
- FIG. 9 is a cross-sectional view of an engaging groove processed by the method of the present invention
- FIG. 10 is a method of the present invention
- FIG. 11 is a plan view of the engagement groove processed by the method of the present invention
- FIG. 12 is an explanatory view showing the distribution of residual stress inside the polycrystalline silicon rod.
- the silicon rod 10 of the present invention has an engaging groove 20 at at least one end.
- the engagement groove 20 is formed by the slit 21 and the internal space 22.
- the slit 21 is formed of a narrow groove, is opened on the end face 16 and the side face 17 of the rod, and extends inside the rod.
- An internal space 22 is formed in the body in communication with the slit 21 extending inside the rod.
- the inner space 22 is formed wider than the groove width of the slit 21, and therefore, the space communicating with the rod end face 16 is formed narrow by the slit 21.
- the inner space 22 has a side end opening to the side surface 17 of the rod.
- the shape of the internal space 22 shown in FIG. 1 is formed in a cylindrical shape
- the shape of the internal space 22 is not limited to this.
- the opening shape of the rod side surface 17 may be square or grooved, and may be any other shape as long as it is larger than the slit width.
- the depth (D) of the slit 21, that is, the length of the slit 21 reaching the internal space 22 is arbitrary, and the internal space 22 may be formed into a cylindrical shape or a free groove as shown in FIG. 1 or FIG.
- the depth (D) of the slit 21 may be substantially zero, and a part of the internal space 22 may be formed so as to open directly to the rod end face 16.
- the length (L) of the slit 21 and the internal space 22 is also arbitrary, and may be any length as long as the coupling member 26 can be securely fitted into the engagement groove 20.
- the length (L) of the slit 21 and the internal space 22 is formed up to the vicinity of the axis of the rod 10, but may be a length that penetrates the diameter of the rod horizontally.
- the connection structure of the present invention includes a structure in which a part of the internal space is directly opened to the rod end face 16 or a structure in which a slit or the internal space penetrates the rod.
- This engagement groove 20 is formed at at least one end of the silicon rod. .
- the silicon rod 18 attached to the suspending wire (not shown) of the melting device is provided with a groove 25 for winding the wire at the upper end thereof.
- the engagement groove 20 is provided.
- the silicon rod 19 connected to the silicon port 18 is provided with an engaging groove 20 of the present invention at the upper end thereof.
- the connecting member 26 is fitted in the engagement groove 20.
- the connecting member 26 has both ends 26a and 26b formed to be larger than the slit width.
- the ends 26a and 26b of the connecting member 26 are inserted into the engagement grooves 20 of the respective silicon rods from the side openings with respect to the pair of silicon rods 18 and 19 abutted against each other. To fit.
- the connecting member 26 is fitted in a state of being bridged over the silicon rods on both sides through the opening in the rod end face.
- the ends 26 a and 26 b of the connecting member 26 are larger than the slit width, the ends 26 a and 26 b are not affected by the force in the axial direction of the rod (direction toward the end face).
- the silicon rods can be stably connected to each other because they are engaged with the slit ends and the connecting member 26 is not pulled out of the engaging groove 20. Since the engagement groove 20 is open on the side of the mouth, the connecting member 26 can be easily inserted into the engagement groove 20 and can be easily removed. Further, since the connecting member 26 is engaged with the inside of the rod, there is no possibility that the engaging portion comes into contact with the outside and comes off when handling the connected rod.
- FIG. 4 shows an example in which two upper and lower silicon rods are connected, but the connecting structure of the present invention is not limited to this.
- the engagement grooves 20 may be provided at both upper and lower ends of the silicon rod, and a plurality of the silicon rods may be suspended vertically.
- the connection structure of the present invention can be suitably applied to a silicon silicon rod, and in this case, it is preferable to use a connection member made of silicon.
- connection structure a plurality of silicon silicon rods can be connected vertically at the end and hung, and the melting efficiency of polycrystalline silicon can be greatly increased. Further, since the connecting member of the present invention engages the connecting member inside the rod, The mating state is stable, and the connecting member can be inserted and engaged from the side surface of the rod, so that the work is easy.
- FIGS. 5 to 8 are explanatory views showing the processing method of the present invention
- FIGS. 9 to 11 are sectional views, partial perspective views, and plan views showing the shape of a groove
- FIGS. It is a schematic diagram which shows the distribution of stress.
- the processing method and the rod that has been processed according to the present invention are characterized in that a part of the outer peripheral portion or the outer peripheral portion of the polycrystalline silicon rod is removed and the remaining central portion is processed.
- the outer peripheral part of the rod end is rounded off along the peripheral surface, leaving a columnar central part, or the shoulders on both sides of the rod end are removed, leaving the central part of the ridge and engaging with this Processing such as grooves is performed.
- a polycrystalline silicon rod is manufactured by the method, the temperature of the central portion of the rod is higher than that of the surface portion, and a temperature difference of 100 ° C. or more is generated. For this reason, a difference in stress occurs between the central portion and the surface portion, and the residual stress remains on the rod even after the reaction is completed.
- compressive stress always acts in the circumferential direction (0 direction), but compressive stress acts on the central part of the rod in the radial direction (r direction).
- Tensile stress is acting on the outer peripheral part.
- bow-I tension stress acts on the central part of the rod, and compressive stress acts on the outer peripheral part. If a groove is formed on the upper end of the silicon rod in the presence of such residual stress, a tensile stress acts on the outer peripheral portion in the radial direction (r direction), so that cracks are likely to occur in the radial direction, so that it is easy. Cracks.
- a compressive stress always acts in the circumferential direction of the rod).
- the tensile strength in the radial direction is reduced by removing the outer peripheral portion 10b of the end of the rod 10 in the circumferential direction.
- the tensile stress in the radial direction is reduced by removing a part of the outer peripheral portion of the rod end, that is, the shoulder portions 31 on both sides of the rod end.
- the portion to be removed is suitably a portion corresponding to 10 to 60% of the diameter. Most of the remaining central portions 10a and 30 excluding the outer peripheral portion are regions of compressive stress, so that they are not easily cracked even when processed.
- the removed portion is less than 10% of the rod diameter, a considerable portion of the tensile stress remains, which is not preferable because the effect of the tensile stress cannot be sufficiently eliminated.
- the removed part exceeds 60% of the diameter, the central part to be processed becomes smaller, which is not appropriate.
- FIGS. An example of the processing method is shown in FIGS.
- a diamond wheel (a cutter having a diamond coating on the outer periphery) 11 having a predetermined thickness is applied to an outer periphery of an end portion of the polycrystalline silicon opening (silicon opening) 10.
- the outer periphery 10b of the rod 10 is ground and removed.
- the axial length of the ground portion 10b may be determined as appropriate according to the shape and depth of the groove to be processed.
- the method of removing the outer peripheral portion is not limited to grinding.
- the periphery of the outer peripheral portion is cut using a diamond saw or the like, and then, if necessary, the peripheral surface is smoothly ground using a diamond wheel. May be.
- a groove is formed in the center portion 10a in the centered state.
- a small-diameter drill is used to drill a central portion 10a in the radial direction to form a small-diameter hole 14, and this is formed along the axial direction at the upper end surface of the central portion 10a.
- the groove (slit) 12 which is communicated up and down is repeatedly formed from to the lower part of the grinding part.
- a hole 13 in the same direction is drilled at the bottom of the groove 12 using a drill 15 having a large diameter, and a larger internal space is formed while communicating with the groove 12.
- An engagement groove 20 having 13 is formed. Further, as shown in FIGS. 7 and 8, the outer peripheral portion of the rod end may be removed.
- An engagement groove 32 is provided in the cut surface of the central portion 30, and a slit 33 having a narrow groove width is formed in the body through the engagement groove 32 vertically.
- the engaging groove 32 may be provided through the central portion 30 or may be formed halfway without penetrating the central portion 30 as shown.
- the engagement grooves 20 and 32 are formed by the slits 12 and 33 and the internal space (hole), and the passage leading to the upper end surface of the rod is formed narrow by the slits 12 and 33.
- the inner space at the bottom or center of the slit is formed widely.
- This internal space (? Shi) opens to the side of the rod.
- the internal space of the engagement grooves 20 and 30 is formed in a cylindrical shape, but the cross-sectional shape may be a square-shaped groove, and the groove width of the slits 12 and 33 Other shapes are acceptable as long as they are larger.
- the depth of the slits 12 and 33 (the length reaching the inside of the engagement groove) ⁇ the length in the radial direction is arbitrary, and the connecting member can be securely fitted into the engagement grooves 20 and 30. Any length is fine.
- the boundary between the groove (slit) 12 and the internal space is preferably provided with a taper 0 at the corner to prevent the corner from being damaged.
- FIG. 10 shows an example in which, in the shape of the rod end portion in FIG. 6, the engaging groove 20 is formed so as to penetrate the central portion 10a of the mouth in the radial direction.
- the radial length of the engaging groove 20 may be a part of the center part 10a that is formed by drilling.
- Such engagement grooves 20 and 30 are formed on at least one end of the silicon rod 10 or formed on opposite end surfaces of a pair of silicon rods abutting each other. They are suspended by being engaged with each other via a connecting member (not shown) fitted to 20 and 30. Both ends of the connecting member are slit;
- the connecting member is formed larger than 2 and 33, and its end is inserted into the engaging groove 20 and 30 of each silicon rod and fitted.
- the end of the connecting member is larger than the slit width As a result, the silicon rods 10 can be connected to each other without this end falling out of the slit groove. Since the engagement grooves 20 and 30 are open toward the side surfaces of the rod, the connecting member can be easily inserted into the engagement grooves 20 and 30 and can be easily removed. is there. Further, since the connecting member is engaged with the inside of the engaging grooves 20 and 30, there is no possibility that the engaging portion comes into contact with the outside and comes off.
- connection structure of the present invention has a stable engagement state and facilitates the connection operation.
- grooves and the like for connecting the silicon rod of polycrystalline silicon can be performed without performing annealing treatment, so Metal contamination due to heating can be avoided.
- the processing steps can be greatly simplified, and the groove processing can be performed quickly.
- a heating facility for annealing treatment is not required, and the processing cost can be reduced.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
Claims
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01934482A EP1291456B1 (en) | 2000-06-05 | 2001-06-01 | Polycrystalline silicon rod and method for processing the same |
| KR1020027016494A KR100786049B1 (ko) | 2000-06-05 | 2001-06-01 | 다결정 실리콘 로드와 그의 가공방법 |
| DE60135460T DE60135460D1 (de) | 2000-06-05 | 2001-06-01 | Polykrystalliner siliziumstab und herstellungsverfahren dafür |
| US10/296,230 US7060355B2 (en) | 2000-06-05 | 2001-06-01 | Polycrystalline silicon rod and method of processing the same |
| US11/414,342 US7455731B2 (en) | 2000-06-05 | 2006-05-01 | Polycrystalline silicon rod and method for processing the same |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-167402 | 2000-06-05 | ||
| JP2000167402 | 2000-06-05 | ||
| JP2000-214430 | 2000-07-14 | ||
| JP2000214430A JP4661999B2 (ja) | 2000-06-05 | 2000-07-14 | 多結晶シリコンロッドとその加工方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10296230 A-371-Of-International | 2001-06-01 | ||
| US11/414,342 Division US7455731B2 (en) | 2000-06-05 | 2006-05-01 | Polycrystalline silicon rod and method for processing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2001094669A1 true WO2001094669A1 (en) | 2001-12-13 |
Family
ID=26593306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2001/004636 Ceased WO2001094669A1 (en) | 2000-06-05 | 2001-06-01 | Polycrystalline silicon rod and method for processing the same |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7060355B2 (ja) |
| EP (1) | EP1291456B1 (ja) |
| JP (1) | JP4661999B2 (ja) |
| KR (1) | KR100786049B1 (ja) |
| CN (1) | CN1433488A (ja) |
| DE (1) | DE60135460D1 (ja) |
| MY (1) | MY134229A (ja) |
| TW (1) | TWM250934U (ja) |
| WO (1) | WO2001094669A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6875269B2 (en) | 2001-11-13 | 2005-04-05 | Advanced Silicon Materials Llc | System for increasing charge size for single crystal silicon production |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8043470B2 (en) * | 2007-11-21 | 2011-10-25 | Lam Research Corporation | Electrode/probe assemblies and plasma processing chambers incorporating the same |
| US9102035B2 (en) * | 2012-03-12 | 2015-08-11 | MEMC Electronics Materials S.p.A. | Method for machining seed rods for use in a chemical vapor deposition polysilicon reactor |
| US9863453B2 (en) * | 2013-03-15 | 2018-01-09 | Mitsubishi Polycrystalline Silicon America Corporation (MIPSA) | Mechanical seed coupling |
| CN104309016B (zh) * | 2014-09-30 | 2016-02-17 | 天津市环欧半导体材料技术有限公司 | 一种大直径多晶棒料的加工方法 |
| WO2017087817A1 (en) * | 2015-11-18 | 2017-05-26 | Sunedison, Inc. | Methods for recycling monocrystalline segments cut from a monocrystalline ingot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09255467A (ja) * | 1996-03-22 | 1997-09-30 | Sumitomo Sitix Corp | 単結晶用原料の供給方法及び単結晶用原料の保持具 |
| US5888293A (en) * | 1995-05-16 | 1999-03-30 | Komatsu Electronic Metals Co., Ltd. | Material supplied for fabricating single-crystal semiconductor |
| JP2000313690A (ja) * | 1999-04-27 | 2000-11-14 | Toshiba Ceramics Co Ltd | 半導体単結晶の製造方法およびこれに用いられる固体の半導体原料塊 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69802864T2 (de) * | 1997-05-21 | 2002-08-29 | Shin-Etsu Handotai Co., Ltd. | Silizium-Impfkristall, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Silizium-Einkristalls unter Verwendung des Silizium-Impfkristalls |
| JP3376877B2 (ja) * | 1997-09-02 | 2003-02-10 | 信越半導体株式会社 | 種結晶保持具 |
| JP2000098931A (ja) * | 1998-07-24 | 2000-04-07 | Seiko Epson Corp | 表示装置 |
| US6183556B1 (en) * | 1998-10-06 | 2001-02-06 | Seh-America, Inc. | Insulating and warming shield for a seed crystal and seed chuck |
| US6203614B1 (en) * | 1999-05-28 | 2001-03-20 | Memc Electronic Materials, Inc. | Cable assembly for crystal puller |
| JP2001278693A (ja) * | 2000-03-31 | 2001-10-10 | Mitsubishi Materials Polycrystalline Silicon Corp | カットロッドの連結方法と連結構造を有するカットロッド |
| DE10025863A1 (de) * | 2000-05-25 | 2001-12-06 | Wacker Chemie Gmbh | Chargiergut und Halterungssystem für das Chargiergut |
-
2000
- 2000-07-14 JP JP2000214430A patent/JP4661999B2/ja not_active Expired - Lifetime
-
2001
- 2001-05-31 MY MYPI20012589 patent/MY134229A/en unknown
- 2001-05-31 TW TW093206624U patent/TWM250934U/zh unknown
- 2001-06-01 EP EP01934482A patent/EP1291456B1/en not_active Expired - Lifetime
- 2001-06-01 DE DE60135460T patent/DE60135460D1/de not_active Expired - Lifetime
- 2001-06-01 US US10/296,230 patent/US7060355B2/en not_active Expired - Lifetime
- 2001-06-01 WO PCT/JP2001/004636 patent/WO2001094669A1/ja not_active Ceased
- 2001-06-01 CN CN01810701A patent/CN1433488A/zh active Pending
- 2001-06-01 KR KR1020027016494A patent/KR100786049B1/ko not_active Expired - Lifetime
-
2006
- 2006-05-01 US US11/414,342 patent/US7455731B2/en not_active Expired - Lifetime
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|---|---|---|---|---|
| US5888293A (en) * | 1995-05-16 | 1999-03-30 | Komatsu Electronic Metals Co., Ltd. | Material supplied for fabricating single-crystal semiconductor |
| JPH09255467A (ja) * | 1996-03-22 | 1997-09-30 | Sumitomo Sitix Corp | 単結晶用原料の供給方法及び単結晶用原料の保持具 |
| JP2000313690A (ja) * | 1999-04-27 | 2000-11-14 | Toshiba Ceramics Co Ltd | 半導体単結晶の製造方法およびこれに用いられる固体の半導体原料塊 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6875269B2 (en) | 2001-11-13 | 2005-04-05 | Advanced Silicon Materials Llc | System for increasing charge size for single crystal silicon production |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002059417A (ja) | 2002-02-26 |
| US20060228565A1 (en) | 2006-10-12 |
| KR20030015265A (ko) | 2003-02-20 |
| TWM250934U (en) | 2004-11-21 |
| KR100786049B1 (ko) | 2007-12-17 |
| EP1291456A4 (en) | 2004-10-06 |
| US20030183162A1 (en) | 2003-10-02 |
| US7455731B2 (en) | 2008-11-25 |
| EP1291456A1 (en) | 2003-03-12 |
| EP1291456B1 (en) | 2008-08-20 |
| MY134229A (en) | 2007-11-30 |
| CN1433488A (zh) | 2003-07-30 |
| DE60135460D1 (de) | 2008-10-02 |
| US7060355B2 (en) | 2006-06-13 |
| JP4661999B2 (ja) | 2011-03-30 |
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