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WO2001082339A3 - Method and device for the wet-chemical removal of layers and for cleaning plate-shaped individual substrates - Google Patents

Method and device for the wet-chemical removal of layers and for cleaning plate-shaped individual substrates Download PDF

Info

Publication number
WO2001082339A3
WO2001082339A3 PCT/EP2001/004557 EP0104557W WO0182339A3 WO 2001082339 A3 WO2001082339 A3 WO 2001082339A3 EP 0104557 W EP0104557 W EP 0104557W WO 0182339 A3 WO0182339 A3 WO 0182339A3
Authority
WO
WIPO (PCT)
Prior art keywords
wet
substrate
layers
chemical removal
cleaning plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/004557
Other languages
German (de)
French (fr)
Other versions
WO2001082339A2 (en
Inventor
Horst Kunze-Concewitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Contrade Microstructure Technology GmbH
Original Assignee
Contrade Microstructure Technology GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Contrade Microstructure Technology GmbH filed Critical Contrade Microstructure Technology GmbH
Publication of WO2001082339A2 publication Critical patent/WO2001082339A2/en
Publication of WO2001082339A3 publication Critical patent/WO2001082339A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning In General (AREA)

Abstract

The invention relates to a method and a device for the wet-chemical removal of organic layers and particles from substrate surfaces (stripping and cleaning). According to said method, an individual substrate is introduced vertically into one or more processing baths which is/are filled with chemicals for carrying out chemical stripping and cleaning processes (filled with water for rinsing processes). The substrate is subsequently subjected to a physical cleaning process, in which the substrate surface is physically cleaned and the cleaned substrate is then dried in a drying device.
PCT/EP2001/004557 2000-04-22 2001-04-23 Method and device for the wet-chemical removal of layers and for cleaning plate-shaped individual substrates Ceased WO2001082339A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10020103.2 2000-04-22
DE2000120103 DE10020103A1 (en) 2000-04-22 2000-04-22 Method and device for wet chemical removal of layers and for cleaning disc-shaped individual substrates

Publications (2)

Publication Number Publication Date
WO2001082339A2 WO2001082339A2 (en) 2001-11-01
WO2001082339A3 true WO2001082339A3 (en) 2002-03-14

Family

ID=7639795

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/004557 Ceased WO2001082339A2 (en) 2000-04-22 2001-04-23 Method and device for the wet-chemical removal of layers and for cleaning plate-shaped individual substrates

Country Status (2)

Country Link
DE (1) DE10020103A1 (en)
WO (1) WO2001082339A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018268B2 (en) 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100441323C (en) * 2002-05-10 2008-12-10 株式会社理光 Cleaning method and cleaning device for substrate for electrophotographic photoreceptor
RU2327247C1 (en) * 2006-12-06 2008-06-20 Институт кристаллографии имени А.В. Шубникова Российской академии наук (RU), 119333, Москва, ул. Ленинский проспект, 59 Assembly for double sided vertical cleaning of the surface of round plates made out of semi conductive and optic materials

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183513A (en) * 1986-02-07 1987-08-11 Mitsubishi Electric Corp semiconductor manufacturing equipment
JPH06310486A (en) * 1993-04-23 1994-11-04 Dainippon Screen Mfg Co Ltd Method and apparatus for drying substrate
US5547515A (en) * 1991-07-31 1996-08-20 Shin-Etsu Handotai Co., Ltd. Method for handling or processing semiconductor wafers
US5974680A (en) * 1996-03-11 1999-11-02 Memc Electronic Materials, Inc. Apparatus for use in cleaning wafers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
JPH09262557A (en) * 1996-03-29 1997-10-07 P-Su Eito:Kk Thin disc cleaning device, thin disc rinsing device, and thin disc cleaning rinsing device
JPH10144650A (en) * 1996-11-11 1998-05-29 Mitsubishi Electric Corp Semiconductor material cleaning equipment
JP3818333B2 (en) * 1997-05-20 2006-09-06 ローツェ株式会社 Substrate cleaning device
JP4007677B2 (en) * 1998-04-22 2007-11-14 信越半導体株式会社 Brush cleaning device and workpiece cleaning system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62183513A (en) * 1986-02-07 1987-08-11 Mitsubishi Electric Corp semiconductor manufacturing equipment
US5547515A (en) * 1991-07-31 1996-08-20 Shin-Etsu Handotai Co., Ltd. Method for handling or processing semiconductor wafers
JPH06310486A (en) * 1993-04-23 1994-11-04 Dainippon Screen Mfg Co Ltd Method and apparatus for drying substrate
US5974680A (en) * 1996-03-11 1999-11-02 Memc Electronic Materials, Inc. Apparatus for use in cleaning wafers

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 026 (E - 577) 26 January 1988 (1988-01-26) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018268B2 (en) 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing

Also Published As

Publication number Publication date
DE10020103A1 (en) 2001-10-31
WO2001082339A2 (en) 2001-11-01

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