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WO2001065595A3 - A method of forming an opening or cavity in a substrate for receiving an electronic component - Google Patents

A method of forming an opening or cavity in a substrate for receiving an electronic component Download PDF

Info

Publication number
WO2001065595A3
WO2001065595A3 PCT/IB2001/000555 IB0100555W WO0165595A3 WO 2001065595 A3 WO2001065595 A3 WO 2001065595A3 IB 0100555 W IB0100555 W IB 0100555W WO 0165595 A3 WO0165595 A3 WO 0165595A3
Authority
WO
WIPO (PCT)
Prior art keywords
opening
cavity
substrate
receiving
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2001/000555
Other languages
French (fr)
Other versions
WO2001065595A2 (en
Inventor
John Gregory
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STS ATL Corp
Original Assignee
STS ATL Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0012754.8A external-priority patent/GB0012754D0/en
Priority to US10/204,154 priority Critical patent/US6956182B2/en
Application filed by STS ATL Corp filed Critical STS ATL Corp
Priority to JP2001564387A priority patent/JP2003526205A/en
Priority to AU2001242703A priority patent/AU2001242703A1/en
Priority to EP01915623A priority patent/EP1340414A2/en
Publication of WO2001065595A2 publication Critical patent/WO2001065595A2/en
Publication of WO2001065595A3 publication Critical patent/WO2001065595A3/en
Anticipated expiration legal-status Critical
Priority to US11/070,560 priority patent/US20050146025A1/en
Priority to US11/070,559 priority patent/US20050145609A1/en
Priority to US11/070,558 priority patent/US7288739B2/en
Priority to US11/070,561 priority patent/US20050155957A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method of forming an opening or cavity in a substrate (12), for receiving an electronic component, consists of or includes providing a patterned opaque masking layer (21a) on or adjacent a first major surface of the substrate (12), the masking layer (21a) having an opening overlying the position where the cavity is to be made, removing material from the substrate (12) by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.
PCT/IB2001/000555 2000-02-28 2001-02-26 A method of forming an opening or cavity in a substrate for receiving an electronic component Ceased WO2001065595A2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US10/204,154 US6956182B2 (en) 2000-05-26 2001-02-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
JP2001564387A JP2003526205A (en) 2000-02-28 2001-02-26 Method of making an opening or cavity in a substrate for receiving an electronic component
AU2001242703A AU2001242703A1 (en) 2000-02-28 2001-02-26 A method of forming an opening or cavity in a substrate for receiving an electronic component
EP01915623A EP1340414A2 (en) 2000-02-28 2001-02-26 A method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,561 US20050155957A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,558 US7288739B2 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,560 US20050146025A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,559 US20050145609A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US51425700A 2000-02-28 2000-02-28
US09/514,257 2000-02-28
GB0012754.8 2000-05-26
GBGB0012754.8A GB0012754D0 (en) 2000-02-28 2000-05-26 Apparatus for forming interconnects on a substrate and related method

Related Child Applications (5)

Application Number Title Priority Date Filing Date
US10204154 A-371-Of-International 2001-02-02
US11/070,559 Continuation US20050145609A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,558 Continuation US7288739B2 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,561 Continuation US20050155957A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component
US11/070,560 Continuation US20050146025A1 (en) 2001-02-26 2005-03-02 Method of forming an opening or cavity in a substrate for receiving an electronic component

Publications (2)

Publication Number Publication Date
WO2001065595A2 WO2001065595A2 (en) 2001-09-07
WO2001065595A3 true WO2001065595A3 (en) 2002-01-03

Family

ID=26244351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2001/000555 Ceased WO2001065595A2 (en) 2000-02-28 2001-02-26 A method of forming an opening or cavity in a substrate for receiving an electronic component

Country Status (5)

Country Link
EP (1) EP1340414A2 (en)
JP (1) JP2003526205A (en)
CN (2) CN1668167A (en)
AU (1) AU2001242703A1 (en)
WO (1) WO2001065595A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10213879C1 (en) * 2002-03-27 2003-07-10 Infineon Technologies Ag Electronic component has semiconductor chips fitted into respective recesses in surface of electronic circuit board
DE10213881C1 (en) * 2002-03-27 2003-10-02 Infineon Technologies Ag Memory module has two semiconductor chips stacked on top of one another with underlying chip received in recess in surface of electronic circuit board
WO2010006067A2 (en) 2008-07-09 2010-01-14 Fei Company Method and apparatus for laser machining
CN102110866B (en) * 2009-12-24 2013-08-28 深南电路有限公司 Manufacturing process of waveguide slot

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3608410A1 (en) * 1986-03-13 1987-09-17 Siemens Ag PRODUCTION OF FINE STRUCTURES FOR SEMICONDUCTOR CONTACT
DE4326424A1 (en) * 1993-08-06 1995-02-09 Ant Nachrichtentech Process for the production of TAB film supports
GB2286787A (en) * 1994-02-26 1995-08-30 Oxford Lasers Ltd Selective machining by dual wavelength laser
EP0706309A1 (en) * 1994-10-06 1996-04-10 International Computers Limited Printed circuit manufacture
JPH1098081A (en) * 1996-09-24 1998-04-14 Hitachi Cable Ltd Tape carrier for mounting semiconductor chip and method of manufacturing the same
US5837154A (en) * 1996-04-23 1998-11-17 Hitachi Cable, Ltd. Method of manufacturing double-sided circuit tape carrier
DE19824225A1 (en) * 1997-07-28 1999-02-04 Matsushita Electric Works Ltd Method of manufacturing a printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793485B2 (en) * 1988-05-16 1995-10-09 カシオ計算機株式会社 How to connect IC unit
JP3506002B2 (en) * 1997-07-28 2004-03-15 松下電工株式会社 Manufacturing method of printed wiring board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3608410A1 (en) * 1986-03-13 1987-09-17 Siemens Ag PRODUCTION OF FINE STRUCTURES FOR SEMICONDUCTOR CONTACT
DE4326424A1 (en) * 1993-08-06 1995-02-09 Ant Nachrichtentech Process for the production of TAB film supports
GB2286787A (en) * 1994-02-26 1995-08-30 Oxford Lasers Ltd Selective machining by dual wavelength laser
EP0706309A1 (en) * 1994-10-06 1996-04-10 International Computers Limited Printed circuit manufacture
US5837154A (en) * 1996-04-23 1998-11-17 Hitachi Cable, Ltd. Method of manufacturing double-sided circuit tape carrier
JPH1098081A (en) * 1996-09-24 1998-04-14 Hitachi Cable Ltd Tape carrier for mounting semiconductor chip and method of manufacturing the same
DE19824225A1 (en) * 1997-07-28 1999-02-04 Matsushita Electric Works Ltd Method of manufacturing a printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *

Also Published As

Publication number Publication date
AU2001242703A1 (en) 2001-09-12
CN1668167A (en) 2005-09-14
CN100366132C (en) 2008-01-30
JP2003526205A (en) 2003-09-02
EP1340414A2 (en) 2003-09-03
CN1406452A (en) 2003-03-26
WO2001065595A2 (en) 2001-09-07

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