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WO2001044875A3 - Micromolds fabricated using mems technology and methods of use therefor - Google Patents

Micromolds fabricated using mems technology and methods of use therefor Download PDF

Info

Publication number
WO2001044875A3
WO2001044875A3 PCT/US2000/041781 US0041781W WO0144875A3 WO 2001044875 A3 WO2001044875 A3 WO 2001044875A3 US 0041781 W US0041781 W US 0041781W WO 0144875 A3 WO0144875 A3 WO 0144875A3
Authority
WO
WIPO (PCT)
Prior art keywords
molds
mems technology
micromolds
fabricated
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2000/041781
Other languages
French (fr)
Other versions
WO2001044875A2 (en
Inventor
John Evans
John R Havens
Noel Harvey
Dan Smolko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanogen Inc
Original Assignee
Nanogen Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanogen Inc filed Critical Nanogen Inc
Priority to AU30781/01A priority Critical patent/AU3078101A/en
Publication of WO2001044875A2 publication Critical patent/WO2001044875A2/en
Anticipated expiration legal-status Critical
Publication of WO2001044875A3 publication Critical patent/WO2001044875A3/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A method of making microreaction molds for grafting and molding very thin films onto surfaces of materials such as microchips is provided. The methods utilize MEMS technology to achieve the manufacture of molds that have a high degree of consistency and uniformity in the thicknesses of the films applied to the surfaces. Use of MEMS technology allows such molds to be made with an accuracy of less than 1 νm in mold depth. The method provides for the manufacture of molds from a single transparent material that is able to be etched in a consistent manner. The method of this invention is particularly applicable to mass generation of microchip surfaces having uniform thin polymeric films bound thereto.
PCT/US2000/041781 1999-12-15 2000-10-31 Micromolds fabricated using mems technology and methods of use therefor Ceased WO2001044875A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU30781/01A AU3078101A (en) 1999-12-15 2000-10-31 Micromolds fabricated using mems technology and methods of use therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46438099A 1999-12-15 1999-12-15
US09/464,380 1999-12-15

Publications (2)

Publication Number Publication Date
WO2001044875A2 WO2001044875A2 (en) 2001-06-21
WO2001044875A3 true WO2001044875A3 (en) 2002-06-27

Family

ID=23843714

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/041781 Ceased WO2001044875A2 (en) 1999-12-15 2000-10-31 Micromolds fabricated using mems technology and methods of use therefor

Country Status (2)

Country Link
AU (1) AU3078101A (en)
WO (1) WO2001044875A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7524672B2 (en) 2004-09-22 2009-04-28 Sandia Corporation Microfluidic microarray systems and methods thereof
US7592139B2 (en) 2004-09-24 2009-09-22 Sandia National Laboratories High temperature flow-through device for rapid solubilization and analysis

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091034B2 (en) 2000-12-15 2006-08-15 Burstein Technologies, Inc. Detection system for disk-based laboratory and improved optical bio-disc including same
US20060189160A1 (en) * 2002-08-30 2006-08-24 Tadashi Hattori Method for producing a pattern formation mold
CN102197338A (en) * 2008-10-28 2011-09-21 惠普开发有限公司 Composite stamp for embossing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4543225A (en) * 1984-07-05 1985-09-24 Docdata N.V. Method and system for reproducing relief structures onto a substrate
EP0156372A2 (en) * 1984-03-28 1985-10-02 Hitachi, Ltd. Process for producing plastic information-recording medium and resin composition used therefor
JPH0354569A (en) * 1989-07-24 1991-03-08 Dainippon Printing Co Ltd Formation of resist pattern
US5171392A (en) * 1988-11-08 1992-12-15 Pioneer Electronic Corporation Method of producing an optical information record carrier
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
EP0623440A1 (en) * 1993-03-16 1994-11-09 Koninklijke Philips Electronics N.V. Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0156372A2 (en) * 1984-03-28 1985-10-02 Hitachi, Ltd. Process for producing plastic information-recording medium and resin composition used therefor
US4543225A (en) * 1984-07-05 1985-09-24 Docdata N.V. Method and system for reproducing relief structures onto a substrate
US5171392A (en) * 1988-11-08 1992-12-15 Pioneer Electronic Corporation Method of producing an optical information record carrier
JPH0354569A (en) * 1989-07-24 1991-03-08 Dainippon Printing Co Ltd Formation of resist pattern
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
EP0623440A1 (en) * 1993-03-16 1994-11-09 Koninklijke Philips Electronics N.V. Method of providing a patterned relief of cured photoresist on a flat substrate surface and device for carrying out such a method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HAISMA J ET AL: "MOLD-ASSISTED NANOLITHOGRAPHY: A PROCESS FOR RELIABLE PATTERN REPLICATION", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART B, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 14, no. 6, 1 November 1996 (1996-11-01), pages 4124 - 4128, XP000721137, ISSN: 0734-211X *
PATENT ABSTRACTS OF JAPAN vol. 015, no. 207 (P - 1207) 28 May 1991 (1991-05-28) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7524672B2 (en) 2004-09-22 2009-04-28 Sandia Corporation Microfluidic microarray systems and methods thereof
US7592139B2 (en) 2004-09-24 2009-09-22 Sandia National Laboratories High temperature flow-through device for rapid solubilization and analysis

Also Published As

Publication number Publication date
WO2001044875A2 (en) 2001-06-21
AU3078101A (en) 2001-06-25

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