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WO2000036557A1 - Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication - Google Patents

Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication Download PDF

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Publication number
WO2000036557A1
WO2000036557A1 PCT/CZ1998/000051 CZ9800051W WO0036557A1 WO 2000036557 A1 WO2000036557 A1 WO 2000036557A1 CZ 9800051 W CZ9800051 W CZ 9800051W WO 0036557 A1 WO0036557 A1 WO 0036557A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
mounting
card
plastic core
grips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CZ1998/000051
Other languages
English (en)
Inventor
Lubomír SLUNSKY
Judita SLUNSKÁ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/CZ1998/000051 priority Critical patent/WO2000036557A1/fr
Priority to AU14321/99A priority patent/AU1432199A/en
Publication of WO2000036557A1 publication Critical patent/WO2000036557A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a contact and combined chip card having a chip module which is provided with a set of leads in the shape of metal strips and is holded in the card body with the help of mounting grips created from this set of leads Simultaneously method of manufacture of this card is solved
  • chip cards are commonly produced for utilisation in a number of areas such as credit cards, permanent tickets, company ID cards and passes teiephpone cards etc According to the electronic circuits contained which are delimiting its functional capabilities, these are contact, contactless and combined chip cards All these types of cards contains one or two chip modules
  • the manufacturing process of chip cards is different according to the card type and it depends namely on the method of chip module mounting Manufacturing methods are described by Christine Lesher (Advanced Smart Card Manufacturing Techniques and Methods Conference Freedings - Card Tech ' 97 1997 vol 1 , 139-148)
  • Contact cards consist of the card body and the chip module In addition to that combined cards contain also internal antenna or the second, contactless chip module
  • the card body of all card types consists of plastic core provided as the case may be, with surface foils on the surface Plastic core is made usually of one or more layers of material
  • the way of mounting the chip module in the card body is usually the principal problem in the chip card production because the chip module must be fixed firmly and seated precisely in the card
  • the plastic core of the card is provided usually with seating opening or cavity whereas- the surface foil is provided with access hole, and these together create pocket in which the chip module is seated.
  • the chip module is designed either with the inner carrying substrate or without it.
  • Chip module of the first type consists of carrying substrate from laminate which is provided on its upper side with electrically conducting metalic foil creating contact areas, and with encapsulated chip with bonding contacts on the lower side. Manufacturing process of these cards depends namely by the method of fastening the chip module into the card.
  • complete card body is produced first, either by laminating together all layers and subsequent milling of the pocket for chip module, or by injecting hot plastic material into suitable form in the shape of card provided with pocket, subsequently, chip module is pasted into the card body, either using glue or adhesive foil.
  • Pasting with the help of glue is performed in the cold, pasting with adhesive tape is performed at high temperature and under pressure, when the adhesive foil of the required shape is inserted between substrate on the chip module bottom and corresponding surface of the pocket.
  • Both methods described above have significant disadvantages. Milling of pockets is relatively slow and manipulation demanding, casting into forms requires special manufacturing equipment and precisely shaped forms. In both cases, it is necessary to produce cards in a card by card process, which means that the manufacturing equipment executes given operation only on one, maximum two cards simultaneously.
  • Contactless chip cards have more complex construction, because they have no accessible contacting area on the chip module. They contain internal antenna, which is connected with the chip module. Encapsulated chip of the chip module is embeded in seating opening effected in the plastic core of the card, there is antenna seated on the plastic core of the card, and the surface is fitted with foil. In the course of contactless cards production, the chip module and the antenna are mounted together at first, whereupon the antenna is seated on the plastic core of the card, while the encapsulated chip of the chip module is embeded into the seating opening of the plastic core, whereupon this assembly is laminated inbetween surface foils, possibly, also additional layers of the plastic core are laminated in simultaneously. Recently, a method when the antenna is etched from metallic foil deposited on the top layer of the core is wide spread.
  • Combined chip cards are combination of both types of the card, they contain either two chip modules from which one is fitted with antenna, or one chip module. Similar solutions are presented e.g. by Francis Christian (The Contactless Smart Card Citcuit You never Thought Possible, Conference Proceedings - Card Tech ' 97, 1997, volJ , 575-583). Their manufacturing process is combination of both methods mentioned above, when for the contact part of the card, production method for the contact card is used and for the contactless part, the contactless card production method is used. Aforesaid methods and constructions of cards have some additional modifications which are based on different solution of mutual attachment of the chip module substrate and the plastic core of the card.
  • chip cards have in common that they contain a chip module with laminated substrate.
  • chip modules with laminated substrate has its drawbacks and it interferes with quality of the chip to contacts bonding, which is performed by combination of ultrasound and contacting little wires.
  • the laminated material used strictly limits maximum applicable temperature, which is on the acceptable limit value for the given bonding process. Considerable problems then arise in the case when production of chip modules with bulky chips is required. In the case of modules with laminated substrate, considerable limiting factor is also its relatively low ability to dissipate waste heat, originating from the chip functioning, into its surroundings.
  • chip module are used without laminated substrate, instead, the chip is placed on a set of leads, similarly as in the case of chips for surface mounting.
  • the set of leads has a form of shaped metallic tapes arranged so that it creates contacting areas on the surface side, while the chip which is protected by casing is attached from underneath.
  • the contacting wires interconnecting lower surface of the set of leads and the bottom surface of the chip are also located in this case.
  • these chip modules are mounted into cards exclusively so that the chip module is seated in the mould, followed by injecting the plastic material until the whole body of the card is created. This method allows production of cards only in a "card by card” process.
  • Chip modules having any internal construction, are generally of a flat body shape, usually in the shape of rounded parallelogram or oval.
  • Body of the chip module is flat on its upper side, while upper smooth surface verges by single edge into vertical smooth sides, which verges into bottom wall of the chip module again by a single edge.
  • Lower part of the chip module has in its middle part lug created by encapsulated chip. This very solution of the chip module shape brings numerous problems during its attachment into card.
  • New type of the contact or combined chip card is designed, namely a card with a lead frame module equipped with a set of leads in the shape of metallic tapes, from which mounting grips are created, facilitating firm fastening of the chip module in the card body.
  • This card consists of at least single-layer plastic core equipped with a seating space for encapsulated chip of the chip module in the shape of seating opening or cavity, at least one upper surface foil with access opening, at least one lower surface foil, and at least one chip module.
  • This solution is suitable for the type of chip module without laminated substrate, ie. the chip module which consists of set of leads in the shape of metallic tapes, encapsulated chip and necessary contacts.
  • the essence of the invention consists in that that the chip module of this card is fitted with at least two mounting grips in a shape of projections which project on circumference of the chip module and are created from extension of its set of leads, fitted with at least two bendings for each mounting grip so that mounting grips are parallel with upper plane of the chip module and are situated simultaneously below its level and above the lower level of the chip module surface, or along with lower plane, while these mounting grips are fixed in the body of the card so, that their terminal parts are embedded into the plastic core and simultaneously are mounted below the upper surface foil of the card.
  • the card according to the invention is nowise different from the other cards, because the access part of the chip module is mounted, as well as in the case of existing cards, in the upper surface foit access opening and this access opening closely circumfuses circumferentially the upper access part of the chip module, but the mounting grips mounted inside ensure fixation of the chip module and prevent its evulsion from the card body.
  • the suggested adaptation of the chip module by means of mounting grips created on the chip module which is necessary already in the stage of the chip module manufacture allows simultaneously to change existing technology of cards production so, that it is no more necessary to manufacture it by the "card by card” process and it is possible to manufacture it by tens of pieces at once.
  • the embedded part, of at least one mounting grip is fitted with at least one mounting opening and/or shaped mounting cut, preventing undesirable evulsion of the chip module from the card body.
  • Mounting grips are at least two, they advantageously project on the chip module on opposing sides and are embedded in the plastic core of the card. So they reside at least partially in the cavity of the plastic core, in the optimal case so that the upper plane of its ending parts is simultaneously plane of the plastic core surface. It is necessary to struggle for such optimal seating
  • Recess of the plastic core for mounting grip can be created as late as during the process of fastening mounting grips, or in advance, as early as during manufacture of the carrier core. Cavity can be preferably made beforehand by matching several layers creating together the plastic core, with openings of the needed shape and size performed in advance. Then, the plastic core consists of at least two layers of plastics, where the lower layer, possibly layers, are provided with seating opening for encapsulated chip of the chip module, whereas the upper layer, possibly layers, are provided with seating opening not only for encapsulated chip of the chip module, but also for mounting grips. Upper layer opening for creation of cavity is preferably of such shape and dimension to allow fitting of mounting grips as exactly as possible.
  • Strength of the chip module fixation in the body of the card can be increased by fixing preparation deposited under the mounting grips, which is advantageous from the point of view of handling during manufacture, especially if the plastic core of the card is multilayer and mounting grips are inserted into seating openings prepared in advance.
  • Combined card can also be manufactured according to the invention. Then the plastic core is provided on its surface with at least one contacting layer with contacting areas created and placed accordingly dimensions and shape of the mounting grip, which layer is set under the mounting grip. If the said layer is provided with fixing preparation which is located between mounting grip and contacting layer, it is necessary to apply fixing preparation consisting of electrically conducting material such as solder or some kind of electrically conductible adhesive.
  • fixing preparation consisting of electrically conducting material such as solder or some kind of electrically conductible adhesive.
  • Contacting layer of the combined card has an antenna connected to it and seated on the plastic core, or in between its layers if it is multilayer.
  • this invention solves also technology of manufacturing.
  • Essence of the method of manufacturing of the chip card according to the invention consists in that that chip module is mounted in the card body by means of mounting grips projecting from it, namely by their fixation between surface foil and plastic core, when at first, mounting grips are imbedded into plastic core from above, than upper and lower surface foils are applied, lamination process is accomplished and finally the card is finished by common method.
  • This method allows manufacture of chip cards at whole tens of pieces at once, when necessity of complex milling of pockets for seating of the chip module is eliminated and when creation of accurate and high-quality card with firmly fixed chip module is accomplished under simultaneous compliance to specified dimensional parameters.
  • Embedding of mounting grips into plastic core can be accomplished by their pressing in to the material of plastic core, preferably by the local one, under increased pressure and temperature like during lamination.
  • At least one recess is executed in the plastic core of the card in advance, and mounting grips are embedded in it.
  • Recess of the plastic core is favourably prepared by manufacturing of plastic core from more layers, when at least two layers of material are matched together, while at least one, the upper one, is provided with seating opening adequate not only to dimensions of encapsulated chip of the chip module, but also to dimensions and location of mounting grips.
  • lower layer or, as the case may be, layers are, preferably all, provided with seating opening for encapsulated chip.
  • common opening is created afterwards, or, in the case of lower layer without opening, common recess, having in its top part shape allowing fitting of the encapsulated chip of the chip module as well as of mounting grips, whereas only opening or, as the case may be, recess, for encapsulated chip is in the lower part.
  • opening for mounting grips can be located, solved as single shaped larger opening intended jointly for mounting grips as well as for the chip casing, or as a set of openings, from which the middle one is intended for encapsulated chip and the others, in number, shape and dislocation of mounting grips, are intended for mounting grips.
  • the fixing preparation is deposited either on lower side of mounting grips, or on corresponding part of the plastic core surface under mounting grips. If the chip module is mounted in the beforehand prepared recess executed by matching more layers of the plastic core, fixing preparation is deposited with advantage as early as before matching of these layers.
  • the upper surface of the lower layer of plastic core is provided with contacting layer before seating mounting grips onto adequate position, whereupon fixing preparation, which must be in this case electrically conductive, is deposited between this contacting layer and lower area of mounting grip.
  • the conductive fixing preparation may be preferably layer of electrically conductive adhesive or solder.
  • the antenna is enclosed, printed or etched and connected to contacting layers before seating the chip module, and also before depositing fixing preparation by method prevailing in the case of this type of cards.
  • the invention can be favourably applied in manufacturing of contact and combined chip cards using chip module fitted with set of leads in the shape of metallic tapes containing no laminated substrate.
  • Main contribution of the invention is, that it allows manufacturing of cards at whole tens of pieces at once, while extra firm as well as accurate seating of the chip module in the card body is accomplished and mounting of the card body and of the chip module is performed in single lamination operation.
  • Fig. 1 illustrates the exemplary embodiment of contact chip card according to the invention with single-layer plastic core, on detailed cross-section across matched parts of the card
  • Fig. 2 illustrates the exemplary embodiment of combined chip card according to the invention, on detailed cross-section across matched parts
  • Fig. 3 illustrates exemplary embodiment of the contact chip card according to the invention with multilayer plastic core on detailed cross-section across matched parts
  • Fig. 4 illustrates exemplary variants A through D of mounting grips in the top view .
  • Example embodiment of the invention is a plastic contact chip card according Fig. 1 illustrating its detail in the cross-section.
  • Chip module 1_ Basic constructional elements of this card are chip module 1_ and plastic core 2.
  • Plastic core 2 is provided with upper surface foil 3 on its upper side, and lower surface foil 4 on its lower side.
  • Upper surface foil 3 is printed on its surface and access opening 5 is excised in the place for access to the chip module 1_.
  • Chip module 1 is mounted in the card so that its electrically and thermally conductive set of leads 6 consisting of shaped metallic tapes is located at the top. Part of the chip module 1, accessible from outer side, which is access part 7 of the set of leads 6, is located in the access opening 5 of the upper surface foil 3.
  • Metallic tapes of the set of leads 6 are, in contrast to conventional existing solution, prolonged on two opposite sides and provided with two bendings on each of both prolongations so that their prolongation creates two mounting grips 8, by means of which chip module 1 is strongly fixed in the card body.
  • Mounting grips 8 projects on circumference of the chip module 1 in the direction from its centre, horizontally, judged relatively to horizontally placed card, and are favourably located on opposite sides of the chip module __.
  • Plastic core 2 as well as surface foils 3,4, and also case 9 of the chip TO consist of common plastics such as ABS (polyacrylonitrile-co-butadiene -co-styrene) and epoxide resin, however, also other common materials can be used, such as, for example PVC (polyvinylchloride), PET (polyethylene), PC (polycarbonate) or PI (polyimide).
  • Set of leads 6 is made of surface modified copper. Card has been manufactured in a process according to the invention. For mounting of the chip module 1_, plastic core 2 has been prepared and provided with seating opening 12.
  • chip module 1 has been placed to the seating opening 12, and mounting grips 8 were impressed into the plastic core 2 surface by simultaneous action of local heating on mounting grips 8 and thereby also on the surface of plastic core 2, and of pressure on salient parts of mounting grips 8.
  • printed upper surface foil 3 has been placed from above and matched to plastic core 2 so that its access opening 5, which has been in the shape of contour of access part 7 of set of leads 6, fitted on it. Assembly of plastic core 2 with chip module 1_ and upper surface foil 3 has been fitted with lower surface foil 4 and everything has been laminated together, under high temperature and pressure which are common for performance of this operation.
  • the most preferable embodiment of the invention is plastic combined chip card according Fig 2, illustrating its detail in the cross-section
  • the plastic core 2 consists of two layers, namely upper layer 2' and lower layer 2" On upper surface of lower layer 2", contacting layer 14 is located along with contacting areas created and located according to size and shape of mounting grips 8
  • Contacting layer 14 has connected etched antenna, seated on lower layer 2' of the plastic core 2, which is not visible on drawing because leads off the cut area
  • Contacting layer 14 is on its upper surface provided with coating of fixing preparation 15, which fills also mounting opening 3 in the mounting grips 8, and which is in this particular case solder
  • printed upper surface foil 3 has been laid from above and has been matched to upper layer 2' so that its access opening 5, having shape of upper contour of the chip module 1, fitted around access part 7 of set of leads 6 of the chip module 1.
  • Assembly with chip module 1 and upper surface foil 3 has been provided with lower surface foil 4 and all layers were laminated together under high temperature and pressure common for performance of this operation. Individual layers of the card had been knitted together during lamination . Mounting grips 8 anchor chip module safely in the card body.
  • the card has been finished by common method, which means in this particular case, that it has been cut off from plate containing other cards made simultaneously and located in the plane of the plate.
  • FIG. 3 Another exemplary embodiment of the invention is contact plastic chip card according Fig. 3, illustrating its detail in the cross-section .
  • This card differs from the card described in the example 1 in that the plastic core 2 consists of two layers, namely upper layer 2' and lower layer 2".
  • layer of fixing preparation 1_5 is found, in this case adhesive, fixing from below four mounting grips 8, salient around circumference between each circumferential side of the chip module 1 and provided with mounting recesses 1_6.
  • Mounting recesses 1_6 have in this particular case shape shown in the top view on Fig. 4B, but other shaping is also possible, for instance in shapes shown on Fig. 4C and 4D in the top view , or enhanced rigidity of fastening of mounting grips 8 can be accomplished by mere undulation of mounting grips 8 by means of one or more bending in vertical direction.
  • Card has been made in a process according to the invention.
  • upper layer 2' and lower layer 2" of plastic core 2 were prepared.
  • Seating openings 1_2 were punched into upper layer 2' in advance, namely one for case 9 of the chip 1_0 of the chip module 1 and four for mounting grips 8.
  • Seating openings 12 were punched into lower layer 2" only for case 9 of the chip 10 of the chip module __.
  • Lower layer 2" has been than provided on its upper surface with a layer of fixing preparation 5 adequately to the future placing of mounting grips 8.
  • Upper layer 2' and lower layer 2" were then matched on themselves so that their seating openings 12 for case 9 of the chip 10 were placed one above the other.
  • Chip module 1 has been placed so that case 9 of the chip 1_0 fitted into seating opening 12 of lower layer 2" intended for it, and mounting grips fitted into corresponding seating openings 12 of the upper layer 2', onto the layer of fixing preparation 1_5. Pressing of the chip module resulted in adhesion of the fixing preparation 1_5 and also pressing of the chip module into mounting dents 16.
  • printed upper surface foil 3 has been laid from above and has been matched to upper layer 2' so that its access opening 5 fitted around access part 7 of set of leads 6 of the chip module 1.
  • Assembly with chip module 1 and upper surface foil 3 has been provided with lower surface foil 4 and all layers were laminated together under high temperature and pressure common for performance of this operation. Individual layers of the card had been knitted together during lamination . Mounting grips 8 anchor chip module safely in the card body.
  • the card has been finished by common method when it has been cut off from plate containing other cards made simultaneously and located in the plane of the plate, and packed for distribution.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Cette invention concerne une carte à puce de contact ou combinée comprenant un module à puce (1) qui est fixé dans le corps de la carte à l'aide d'au moins deux attaches de montage (8) formées à partir d'un ensemble de conducteurs allongés (6), qui dépassent sur la circonférence du module à puce (1) et, le cas échéant, qui comprennent des ouvertures de montage (13) ou des dents de montage (16). Ces attaches de montage (8) sont noyées dans le noyau de plastique (2) et sont également fixées par une feuille de surface (3) depuis le haut. Cette carte est fabriquée en commençant par placer le module à puce (1) sur le noyau (2) avec, le cas échéant, une couche de contact (14) et une antenne. Les attaches de montage (8) sont ensuite intégrées tandis que le boîtier (9) de la puce (10) vient s'insérer dans une ouverture de réception (12) du noyau (2). La fixation des attaches de montage (8) peut encore se faire, le cas échéant, à l'aide d'une préparation de fixation (15), la feuille surface supérieure (3) et la feuille de surface inférieure (4) étant ensuite intégrées. Les éléments de la carte sont ensuite laminés tout d'un bloc, puis la carte est soumise à une finition selon un procédé traditionnel.
PCT/CZ1998/000051 1998-12-11 1998-12-11 Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication Ceased WO2000036557A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CZ1998/000051 WO2000036557A1 (fr) 1998-12-11 1998-12-11 Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication
AU14321/99A AU1432199A (en) 1998-12-11 1998-12-11 Chip card with a shaped lead frame module and mehtod of its manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CZ1998/000051 WO2000036557A1 (fr) 1998-12-11 1998-12-11 Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication

Publications (1)

Publication Number Publication Date
WO2000036557A1 true WO2000036557A1 (fr) 2000-06-22

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PCT/CZ1998/000051 Ceased WO2000036557A1 (fr) 1998-12-11 1998-12-11 Carte a puce comprenant un module a cadre de conducteurs mis en forme et procede de fabrication

Country Status (2)

Country Link
AU (1) AU1432199A (fr)
WO (1) WO2000036557A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002013135A3 (fr) * 2000-08-04 2002-04-25 Hei Inc Structures et procedes d'assemblage pour modules d'identification a radiofrequences
EP1739596A1 (fr) * 2005-06-21 2007-01-03 VisionCard PersonalisierungsgmbH Carte à puce et méthode de sa fabrication
US7777317B2 (en) 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
EP2290590A3 (fr) * 2009-08-14 2011-07-27 Giesecke & Devrient GmbH Support de données portatif

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0246973A1 (fr) * 1986-05-21 1987-11-25 Gérard Jacques Guy Michot Objet associé à un élément électronique et procédé d'obtention
EP0339763A2 (fr) * 1988-04-28 1989-11-02 Citizen Watch Co. Ltd. Carte à circuit intégré

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0246973A1 (fr) * 1986-05-21 1987-11-25 Gérard Jacques Guy Michot Objet associé à un élément électronique et procédé d'obtention
EP0339763A2 (fr) * 1988-04-28 1989-11-02 Citizen Watch Co. Ltd. Carte à circuit intégré

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002013135A3 (fr) * 2000-08-04 2002-04-25 Hei Inc Structures et procedes d'assemblage pour modules d'identification a radiofrequences
US6696952B2 (en) 2000-08-04 2004-02-24 Hei, Inc. Structures and assembly methods for radio-frequency-identification modules
EP1739596A1 (fr) * 2005-06-21 2007-01-03 VisionCard PersonalisierungsgmbH Carte à puce et méthode de sa fabrication
US7777317B2 (en) 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
EP2290590A3 (fr) * 2009-08-14 2011-07-27 Giesecke & Devrient GmbH Support de données portatif
EP2595095A1 (fr) * 2009-08-14 2013-05-22 Giesecke & Devrient GmbH Support de données portable

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