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WO2000019788A1 - Dispositif de connexion d'un composant electronique non cable dote d'une electrode superieure et d'une electrode inferieure - Google Patents

Dispositif de connexion d'un composant electronique non cable dote d'une electrode superieure et d'une electrode inferieure Download PDF

Info

Publication number
WO2000019788A1
WO2000019788A1 PCT/DE1999/002629 DE9902629W WO0019788A1 WO 2000019788 A1 WO2000019788 A1 WO 2000019788A1 DE 9902629 W DE9902629 W DE 9902629W WO 0019788 A1 WO0019788 A1 WO 0019788A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
circuit board
electrode
connection device
fork
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1999/002629
Other languages
German (de)
English (en)
Inventor
Karl-Gerd Drekmeier
Frank Templin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Siemens Electromechanical Components GmbH and Co KG
Original Assignee
Tyco Electronics Logistics AG
Siemens Electromechanical Components GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG, Siemens Electromechanical Components GmbH and Co KG filed Critical Tyco Electronics Logistics AG
Publication of WO2000019788A1 publication Critical patent/WO2000019788A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Connection device for a non-wired electronic component with an upper and a lower electrode
  • the invention relates to a connection device for a non-wired electronic component, in particular a cylindrical thermistor, which is to be soldered to a circuit board with a top and a bottom electrode m surface mounting.
  • non-wired components such as hot or PTC thermistor plates
  • PTC thermistor plates that is to say non-linear ceramic components or in the case of cuboid-shaped, installed chip capacitors
  • the problem arises of contacting the top electrode downward on the circuit level. So far, the electrode on top has been contacted by hand with a wire or a ribbon, which means that there was no possibility of integrating m an automatic placement process or m an automatic reflow soldering process.
  • Such components are therefore currently often provided with relatively complex customer-specific connections.
  • the invention is based on the object of providing a connecting device of the type mentioned at the outset which is flexible in terms of dimensions or tolerances with regard to different components and which permits an automatic assembly and soldering process.
  • connection strip which can be fitted and soldered to the circuit board or the component using automatic methods, the first end of which is designed as a soldering fork to be soldered on the electrode located above, and the other end of which can at the same time be positioned m a solder deposit on the circuit board, the shape and contour of the terminal strip bending out so ⁇ leads are that varying level differences between the level of the overhead electrode and the level of the circuit board are compensated.
  • FIGS. 1 and 2 show a first exemplary embodiment of the invention, each schematically in a side view, FIG. 3 not yet isolated connecting strips of the exemplary embodiment according to FIGS. 1 and 2,
  • FIGS. 7 and 8 different details of the embodiment according to FIGS. 4 to 6.
  • the invention provides to automatically populate unwired components, i.e. the electrode at the bottom of the component either makes direct contact with the intended installation location on the circuit board, cf. Figures 1, 2 and 6, or indirectly, cf. Figure 4 and 5. Then, using a separating station of the automatic placement machine, SMD-capable connecting strips are separated from a useful tape, for example picked up and placed, and positioned correctly on the component and the circuit board so that the soldering fork of the connecting strip is on the top lying electrode of the component comes to rest and there in particular, cf. Figures 1 to 3, m immersed a prepared solder depot.
  • the level differences to be compensated for between the level of the above-lying electrode and the circuit board are caused by different component heights or due to component height tolerances.
  • the invention enables all soldering points occurring on the upper side of the component, between the connecting strip and the circuit board and between the electrode and the circuit board located below or an additional flat contact part arranged therebetween at the same time, for example using one of the known reflow soldering methods can be soldered.
  • an elongated connecting strip 1 is used.
  • FIG. 3 shows connection strips 1 in the delivery state which has not yet been separated.
  • the connecting strips are connected in a rung-like manner to the outer webs 2 and 3 and can be delivered wound up on a roll while maintaining an orderly position.
  • the separation from the benefit strips takes place, as indicated in FIG. 3, in zones "a" and "b". This creates U-shaped solder forks 4, 5 for good solder wetting when soldering the connecting strips 1.
  • the roof-shaped contour 8 also enables a level difference of ⁇ 30% of a nominal height "h" to be bridged.
  • the outside 6 of, for example, an embossed dome 7 has a spacing “d” which is matched to the spring behavior of the connecting strip 1 and which is selected such that a stop occurs temporarily when the connecting strip 1 is printed through.
  • the connecting strip 1 can also plastically deform in a defined manner by reducing the cross-section 8.
  • the calotte 7 maintains a defined, stable and closed region 9 for receiving a pick and place suction nozzle 10.
  • the connecting connector 1 is accordingly per Vacuum picked up from an orderly position and automatically transported to the installation location, positioned and m a solder paste layer 11 printed.
  • the dome 7 maintains the stop on the circuit board 12.
  • the resulting reaction force is advantageous for the assembly head to function properly.
  • the vacuum switches off, the nozzle 10 moves upwards, the stop of the spherical cap 7 on the substrate 12 is canceled by springback and the soldering areas of the connecting strip 1 take their defined position for reliable reflow soldering both on the component 13 and on the Circuit board 12 on.
  • the connecting strip is shaped as an angular connecting bracket 14, that a first section 16 is formed between the soldering fork 4 and the protrusion 15, which section rises slightly in relation to the level of the above-lying electrode 17, and that behind the Abwmkelung 15 a second section 18 is provided, which forms a single, slightly oblique to the vertical on the circuit board 12 standing plumb bob 19, so that there is a defined three-point contact between the connecting bracket 14 and component 13 and circuit board 12. This defined three-point contact can therefore compensate for component tolerances and, to a certain extent, component variations.
  • the connecting bracket 14 is recognizably designed so that it basically has a positive tolerance m in height with respect to the component 13.
  • the center of gravity of the connecting bend 14 is such that the connecting bend 14 tilts forward at any time and contacts the component 13.
  • the angle between the essential sections 16 and 18 of the connecting bend 14 is, for example, approximately 100 °.
  • the connection bracket 14 is soldered to the circuit board 12 and the component 13 by melting the solder.
  • the solder foot 19 can also be provided with its own solder depot instead of that on the circuit board 12, it is then simply positioned on the intended solder support point on the circuit board 12.
  • the prongs of the soldering fork 4 and the lower end of the soldering foot 19 are each curved, cf.
  • Figure 4 wherein the bulges 21 of the soldering fork 4 and 90 ° are offset from the curvature 22 of the solder base 19.
  • the stability of a three-point position is provided even when the bracket 14 is tilted or displaced.
  • connection bend 14 can be fed on the punching belt 23, cf. FIG. 7.
  • the individual connecting bow 14 is then separated from the assembly directly before the assembly.
  • the length according to FIG. 7 allows the length of the bow egg 14 to be determined directly when punching out.
  • an underside contact of the component 13 can also be carried out if necessary, cf. FIGS. 4, 5 and 8.
  • the electrode 24 of the component 13 lying at the bottom is thereby by means of a flaky contact part 25, the upper side of which can be soldered to the electrode 24 by means of a solder deposit and the underside of which is a soldering die integrally formed 26, indirectly and at a distance from the circuit board 12 can be connected to the latter.
  • the field of application of the invention is in particular hybrids or other assemblies with PTC fuses against touching the network.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une bande de connexion (1) dont la première extrémité est conçue comme fourche de brasage (4) à braser sur l'électrode supérieure (17), et dont l'autre extrémité peut être simultanément posée dans un point d'appui de brasage de la platine de circuit (12). La forme et les contours de la bande de connexion (1) sont réalisés de telle façon que soient compensées les différences de niveau entre l'électrode supérieure (17) et la platine de circuit (12).
PCT/DE1999/002629 1998-09-30 1999-08-23 Dispositif de connexion d'un composant electronique non cable dote d'une electrode superieure et d'une electrode inferieure Ceased WO2000019788A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19844946 1998-09-30
DE19844946.1 1998-09-30

Publications (1)

Publication Number Publication Date
WO2000019788A1 true WO2000019788A1 (fr) 2000-04-06

Family

ID=7882865

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/002629 Ceased WO2000019788A1 (fr) 1998-09-30 1999-08-23 Dispositif de connexion d'un composant electronique non cable dote d'une electrode superieure et d'une electrode inferieure

Country Status (1)

Country Link
WO (1) WO2000019788A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006116967A3 (fr) * 2005-05-02 2007-05-18 Epcos Ag Condensateur de puissance
US8339767B2 (en) 2005-05-02 2012-12-25 Epcos Ag Power capacitor
WO2017167696A1 (fr) * 2016-03-29 2017-10-05 Epcos Ag Condensateur électrolytique
DE102014203755B4 (de) 2013-02-28 2024-02-22 Denso Corporation Elektronisches teil und elektronische steuereinheit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632629A (en) * 1993-09-14 1997-05-27 Zierick Manufacturing Corporation Mount electrical connectors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5632629A (en) * 1993-09-14 1997-05-27 Zierick Manufacturing Corporation Mount electrical connectors

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006116967A3 (fr) * 2005-05-02 2007-05-18 Epcos Ag Condensateur de puissance
EP2264726A1 (fr) * 2005-05-02 2010-12-22 Epcos Ag Condensateur de puissance
US8339767B2 (en) 2005-05-02 2012-12-25 Epcos Ag Power capacitor
US8416556B2 (en) 2005-05-02 2013-04-09 Conti Temic Microelectronic Gmbh Power capacitor
DE102014203755B4 (de) 2013-02-28 2024-02-22 Denso Corporation Elektronisches teil und elektronische steuereinheit
WO2017167696A1 (fr) * 2016-03-29 2017-10-05 Epcos Ag Condensateur électrolytique
US10957492B2 (en) 2016-03-29 2021-03-23 Tdk Electronics Ag Electrolytic capacitor

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