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WO2000018978A1 - Appareil et procede de production de paillettes paralleles planes - Google Patents

Appareil et procede de production de paillettes paralleles planes Download PDF

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Publication number
WO2000018978A1
WO2000018978A1 PCT/IB1999/001656 IB9901656W WO0018978A1 WO 2000018978 A1 WO2000018978 A1 WO 2000018978A1 IB 9901656 W IB9901656 W IB 9901656W WO 0018978 A1 WO0018978 A1 WO 0018978A1
Authority
WO
WIPO (PCT)
Prior art keywords
separating agent
vapor deposition
layer
substrate
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB1999/001656
Other languages
English (en)
Inventor
Hilmar H. Weinert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weinert Vakuum Verfahrenstechnik GmbH
Original Assignee
Weinert Vakuum Verfahrenstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1998144357 external-priority patent/DE19844357C2/de
Application filed by Weinert Vakuum Verfahrenstechnik GmbH filed Critical Weinert Vakuum Verfahrenstechnik GmbH
Priority to JP2000572423A priority Critical patent/JP4467186B2/ja
Priority to CA002332900A priority patent/CA2332900C/fr
Publication of WO2000018978A1 publication Critical patent/WO2000018978A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/0015—Pigments exhibiting interference colours, e.g. transparent platelets of appropriate thinness or flaky substrates, e.g. mica, bearing appropriate thin transparent coatings
    • C09C1/0018—Pigments exhibiting interference colours, e.g. transparent platelets of appropriate thinness or flaky substrates, e.g. mica, bearing appropriate thin transparent coatings uncoated and unlayered plate-like particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/62—Metallic pigments or fillers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0005—Separation of the coating from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C2200/00—Compositional and structural details of pigments exhibiting interference colours
    • C09C2200/30—Interference pigments characterised by the thickness of the core or layers thereon or by the total thickness of the final pigment particle
    • C09C2200/301—Thickness of the core
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C2220/00—Methods of preparing the interference pigments
    • C09C2220/20—PVD, CVD methods or coating in a gas-phase using a fluidized bed

Definitions

  • the present invention relates generally to plane- parallel flakes and, more particularly, to an apparatus and method for producing plane-parallel flakes.
  • plane-parallel flakes as pigments in paints and printing inks, as a catalyst material, as a starting product for magnetic and electric screens, and as a starting material for conductive lacquers.
  • plane-parallel flakes are characterized by an improved brilliance and by the fact that their quantity required in a paint as a pigment is substantially smaller.
  • PVD physical vapor deposition
  • aluminum flakes produced in accordance with a physical vapor deposition (PVD) process typically have a thickness of 30-500 n ; their superficial dimensions ranging between 5 and 50 microns. Even 3-4 layers of such aluminum flakes produce an optically opaque layer at quantities of no more than 0.3 to 0.4 g/m 2 .
  • Plane-parallel flakes have heretofore been produced, in accordance with the prior art, through a costly, intermittent three-stage process.
  • the high costs of this process and the low production quantities do not allow for use in mass-produced articles such as in metallic paintcoats or printer's inks.
  • One example for production according to an intermittent multi-stage process is the production of optically variable pigment flakes used to enhanced safety against forgery on banknotes such as disclosed in EP 227423. Similar products and processes are disclosed in U.S. Patent No. 5,278,590.
  • a process disclosed in U.S. Patent No. 4,434,010 does not involve use of separating agents. Vapor deposition is instead performed directly onto a plastic film which is subsequently comminuted and dissolved completely in a suitable solvent. As a result, the vapor deposition layer dissociated into particles remains as a suspension.
  • a vacuum coating machine for the production of oxide layers which are preferably made of silicon monoxide, on temperature-sensitive plastic films, such as polyethylene and polypropylene, is disclosed in DE 4221800 Al .
  • the purpose of this machine is to increase the barrier properties of the base film for oxygen, water vapor, and aroma substances.
  • the characteristics of web path, evaporation zone, and array of thermal treatment steps allow for the production of oxide layers which are substantially free of micro cracks.
  • This machine allows for the continuous removal of excess condensate, which allows the coating process to operate without the need to shield the rims of the film against coatings. However, the removal is accomplished by spalling when the belt passes over a deflection roller, or by scraping or brushing the excess condensate.
  • the primary object of the present invention is to provide an apparatus and method for producing plane-parallel flakes wherein production costs are reduced, a longer service life and a higher product output of any apparatus used are ensured, and increased safety requirements are taken into account.
  • the present invention apparatus is realized as a belt-type vapor deposition apparatus comprising a vapor deposition chamber having first and second evaporation means for applying a separating agent layer and at least one additional layer on an endless substrate.
  • the belt-type vapor deposition apparatus also comprises a stripping chamber wherein the separating agent layer and the at least one additional layer are stripped from the substrate with the aid of stripping means in such a manner that the separating agent layer is present in a dissolved state, and the at least one additional layer is present in the form of plane-parallel flakes.
  • the pressure in the stripping chamber is higher than in the vapor deposition chamber and lower than atmospheric pressure.
  • the at least one additional layer may in one embodiment be metal and another vaporisable substance, whereby a paint having good covering properties is obtainable at small quantities of material used.
  • capacity may be further increased if two layers separated by a separating agent are produced by the second evaporation means.
  • a water-soluble substance that is vaporisable in high vacuum without decomposition and which is selected from the group consisting of chlorides, fluorides and borates is employed as the separating agent, so that non-flammable substances may be used as solvents, and only small material quantities are required owing to the layer thickness which may be adjusted to be very low.
  • Using water as a solvent improves the safety of the overall apparatus.
  • secondary and tertiary alcohol as a solvent the vacuum conditions in the vacuum chamber may be devised to be more favorable .
  • the substrate may be fabricated of a stainless steel alloy, nickel, or a metal comprising an electrodeposit or an organic protective coating. This results in good thermal resistance and high mechanical resistance of the substrate.
  • polyimide film is also suitable as a substrate owing to its good thermal and mechanical properties. With respect to properties and costs, substrate thicknesses of 20 to 2000 ⁇ m are preferred.
  • dynamically pumped locks can be arranged between the vapor deposition and stripping chambers, whereby optimum adjustment of the process conditions in the chambers separate from each other is possible.
  • the present invention method is realized by depositing a separating agent and at least one additional layer on a substrate and then treating the layers in a suspension in such a manner that the at least one additional layer is present in the form of plane-parallel flakes.
  • the pressure during formation of the suspension is lower than atmospheric pressure, but higher than the pressure in the deposition step.
  • the at least one additional layer may be present in the form of a first layer, a separating agent layer and a subsequent second layer, whereby high efficiency may be achieved in manufacturing plane-parallel flakes.
  • the overall process may take place dust-free in an encapsulated apparatus at a high degree of cleanness, without having to provide for a costly clean-room environment.
  • the thermal resistance of the substrate upon vapor deposition of multiple layers is increased, the use of flammable solvents in applying a separating agent and in stripping the product from the substrate is largely avoided, the separating agent fulfils its function even at a very small layer thickness and is easily applicable on the substrate and removable therefrom, and the substrate can provide a very long service life while having sufficient thermal and mechanical resistance .
  • Figure 1 shows a vapor deposition apparatus in accordance with the present invention.
  • Figure 2 is a table showing vacuum conditions and pump sizes and types for a specific embodiment of the apparatus shown in Figure 1.
  • Figure 3 illustrates how layer buildup and layer detachment occur in the course of one cycle of a substrate in the apparatus shown in Figure 1 in accordance with the present invention.
  • Figure 4 is a table showing examples of a wide variety of plane-parallel flakes and combinations thereof, as well as some typical applications therefor, which may be produced using the apparatus shown in Figure 1 in accordance with the present invention.
  • the vapor deposition apparatus 100 generally includes a vacuum chamber 1 subdivided by one or several dynamic locks 6a, 6b into a vapor deposition chamber 2, hereinafter referred to as the vapor deposition part, and a stripping chamber 7, hereinafter referred to as the chamber part.
  • a vacuum chamber 1 subdivided by one or several dynamic locks 6a, 6b into a vapor deposition chamber 2, hereinafter referred to as the vapor deposition part, and a stripping chamber 7, hereinafter referred to as the chamber part.
  • an endless belt 5 passes as a substrate.
  • the apparatus 100 may be operated with only slight modifications both as a vapor deposition apparatus in accordance with a PVD process and in accordance with a sputtering or plasma enhanced chemical vapor deposition (PECVD) process.
  • PECVD plasma enhanced chemical vapor deposition
  • dissolution of the separating agent in accordance with the invention takes place in water, implying the condition that a pressure which is sufficiently high above the water vapor pressure at the operating temperature must prevail in the chamber part 7. It should be noted that the higher the temperature of a solvent, the more rapid the dissolution of the vapor deposited separating agent takes place. Trials have shown that most favorable conditions - under which the dissolution of the separating agent takes place at a sufficient rate and under which operation is still possible with only 2 locks 6a, 6b between the high vacuum range of the vapor deposition part 2 and the chamber part 7 - are provided if the following requirements are met:
  • the surface of a condenser 8 cooled to 4-25°C causes generated water vapor to condense and flow back into the stripping station 9 in the chamber part 7.
  • the values shown in the table of Figure 2 were determined for the passage of an endless belt of 600 * 0.4 mm and an open gap width above the substrate 5 of 0.2 x 600.2 mm for the reciprocating movement of the substrate 5 between the vapor deposition part 2 and the chamber part 7.
  • the belt-type vapor deposition apparatus 100 of the present invention requires no more than two dynamic locks 6a, 6b in the range between 10 ⁇ 4 and 50 mbar.
  • the vacuum conditions turn out to be even more favorable if, instead of water, secondary or tertiary alcohols are used as a solvent. This is under the condition of using separating agents that are well soluble in the named substances.
  • Secondary and tertiary alcohols have a substantially lower vapor pressure than water and still lend themselves well to pumping at -5°C, corresponding to a vapor pressure of less than 0.01 mbar. It is preferred to use secondary or tertiary alcohols at more than 0.05 mbar.
  • the locks 6a and 6b may therefore be omitted, and the chamber part 7 directly follows the vapor deposition part 2 while separated from it by a slot.
  • the economic advantages of such a 2-chamber unit are, however, slight because there is a limited number of separating agents soluble and well vaporisable in secondary or tertiary alcohols, and these alcohols are harmful to the environment.
  • Also suited as solvents are, however, branched or linear primary alcohols, or mixtures of water, branched or linear primary alcohols, secondary alcohols and tertiary alcohols.
  • the stripping station 9 consists of a number of deflection rollers 10 each immersing the substrate 5 into a respective container 11a and lib capable of being raised and lowered.
  • the first container 11a is raised in the running direction and serves as a stripping station for the product to be rejected until a time when stable conditions are present.
  • the container lib serving as a collector for good material is raised, and the container 11a is lowered. Stripping the product and collecting it in the form of a suspension subsequently take place in the container lib.
  • FIG 3 there is shown a more detailed view of the selected portions 100' of the apparatus 100 revealing how layer buildup and layer stripping occur in the course of one cycle of the substrate 5 in accordance with the present invention.
  • the use of several different evaporators 4a, 4b, 4c along the running direction of the substrate 5 allows for the production of a wide variety of plane-parallel flakes and combinations thereof. Examples of such flakes, as well as some typical corresponding applications, are shown in the table of Figure 4.
  • separating agent soluble in water or alcohol as the first layer on the substrate 5, wherein the gsm typically is 0.05 to 0.1 g/m 2 .
  • Suitable separating agents which may be evaporated without decomposition, have little or no toxicity and are water-soluble are, for example: anhydrous sodium chloride, potassium chloride, lithium chloride, sodium fluoride, potassium fluoride, lithium fluoride, calcium fluoride, sodium aluminum fluoride (cryolite) and di-sodium tetraborate.
  • antimony trioxide boron oxide, calcium iodide, cerium (III) iodide, lithium iodide, sodium iodide, yttrium iodide, lithium sulfate, potassium sulfate, sodium sulfate and other sulfates, sodium hydroxide, potassium hydroxide, yttrium bromide and other bromides.
  • the choice of the substrate belt 5 is of particular importance.
  • the substrate belt 5 is to present a surface having a very small surface roughness, lend itself well to welding following introduction into the belt-type vapor deposition apparatus 100, and present very good chemical and mechanical strength.
  • the following materials are suitable for the substrate belt 5: mirror-finish rolled or electropolished stainless steel, superalloys such as INCONELTM, INCOLOYTM etc., high-polished nickel, but also electroplated metals, wherein the coating determines the resistance to chemical attack as well as the surface quality, and the backing material determines the desired strength.
  • Metallic substrates comprising organic coatings of pigmented or unpigmented paints of hard and chemically resistant thermoset and thermoplastic materials are also suitable for the substrate belt 5.
  • polyimide film substrates such as, e.g., KAPTONTM, which permanently resistant up to 200°C under vacuum are also suitable for the substrate belt 5.
  • the thickness of the substrate belt 5 has a bearing on the diameters of the deflection rolls utilized in the belt-type vapor deposition apparatus 100. At an expected service life of 10 6 cycles, about 10 million bending deformations are to be assumed. The fatigue strength of the material, the thickness of the substrate belt 5 and the diameters of the rolls must herein be adapted to each other. As commercially offered qualities of steel or nickel belts having the required low surface roughness are available only above 0.2 mm thickness, there result typical roll diameters of about 250 mm or 500 mm for film thicknesses of 0.2 mm and 0.4 mm, respectively.
  • the choice of substrate thickness results in another compromise: particularly in cases of multi-layer vapor depositions, the substrate 5 is strained by condensation heat and heat radiation originating in the evaporator sources, with no intermediate cooling of the substrate 5 by cooled rolls being provided. Calculations and measurements have shown that owing to the good infrared reflection of a mirror-finish substrate and also of most vapor deposited metal layers, about 70 to 85% of incident energy is reflected. Moreover metal belts, other than plastic films, may heat up to 180°C under vacuum during passage, whereas plastic materials already outgas at 60°C to such a degree that vacuum breakdown may take place in the evaporation range.
  • This ratio is about 1/66 for 400 ⁇ m of metal and 12 ⁇ m of plastic. This means, under otherwise identical conditions, that the metal belt only heats up by 1.5% in comparison with the plastic. At the same time, a metal belt allows for admissible heating which is higher by the following factor:
  • the above-described belt-type vapor deposition apparatus 100 permits technical displacement velocities of up to 350 m/min, wherein, however, synchronous behavior of all the stages is required.
  • the vapor deposition rates must be adapted correspondingly to the desired layer thicknesses by means of suitable control mechanisms known per se.
  • Layer thickness measurement systems whereby the layer thickness produced by each evaporator may be measured and controlled over very long periods in the order of days, are disclosed in DE 4338907.
  • the stripping station 9 must be designed such that the product is completely stripped from the substrate 5 even at maximum displacement velocities. As this station 9 is operated at a vacuum of no more than about 50 mbar, adaptation through increasing the chamber length and the pumping capacity is possible at moderate costs. Continuous operation of the apparatus 100 is possible over periods of several days up until the time when maintenance and cleaning of the evaporators requires an interruption. This necessitates the use of continuously chargeable evaporators having a construction known per se.
  • the calculated amount of plane-parallel flakes of aluminum produced per hour is sufficient for spray-painting 108 automobiles each having 25 m 2 of surface to be painted with a metallic paint, wherein a 4-layer cover of flakes is provided.
  • the use of different surface structures of the substrate 5 makes it possible to influence the degree of gloss of the product.
  • the present invention thus relates to a multi-chamber apparatus for producing layers vapor deposited in vacuum on an endlessly circulating substrate, including the following sequential steps: vapor deposition of a separating agent in high vacuum; vapor deposition of one or several layers of metal, oxides, fluorides, nitrides in high vacuum; stripping the vapor deposited layers from the endless substrate under low vacuum.
  • the vapor deposited layers are subsequently present in a separate vacuum stage separated from the vapor deposition chamber by dynamic locks as a suspension of fine flakes in a mixture of solvent and separating agent.
  • the suspension may continuously or intermittently be transferred out of the separate vacuum stage for further processing.
  • the solvent may be water in a vacuum environment of more than 20 mbar or secondary or tertiary alcohols at more than 0.05 mbar.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)

Abstract

L'invention concerne un appareil et un processus technique de production de paillettes parallèles planes. Dans un mode de réalisation préféré, on utilise un appareil multi-chambres permettant de produire de telles paillettes à partir de couches déposées par évaporation sous vide sur un substrat circulant en continu. Le procédé, selon l'invention, comporte notamment les étapes séquentielles suivantes : dépôt par évaporation d'une couche d'agent séparateur sous vide poussé sur un substrat circulant en continu ; dépôt par évaporation d'au moins une couche de métal, d'oxydes, de fluorures et de nitrures sous vide poussé sur la couche d'agent séparateur ; et retrait des couches, déposées par évaporation, du substrat circulant en continu sous vide peu poussé. Ces couches sont par la suite présentes dans un étage sous vide, séparé de la chambre de dépôt par évaporation par des sas dynamiques sous la forme d'une suspension de paillettes fines dans un mélange de solvant et d'agent séparateur. La suspension peut continuellement ou par intermittence être transférée hors de l'étage sous vide séparé pour un traitement ultérieur. Le solvant peut être de l'eau dans un milieu sous vide supérieur à 20 mbars, ou dans des alcools secondaires ou tertiaires à plus de 0,05 mbar.
PCT/IB1999/001656 1998-09-28 1999-09-23 Appareil et procede de production de paillettes paralleles planes Ceased WO2000018978A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000572423A JP4467186B2 (ja) 1998-09-28 1999-09-23 面平行フレークを製造するための装置及び方法
CA002332900A CA2332900C (fr) 1998-09-28 1999-09-23 Appareil et procede de production de paillettes paralleles planes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19844357.9 1998-09-28
DE1998144357 DE19844357C2 (de) 1998-09-28 1998-09-28 Bandbedampfungsanlage und Verfahren zur Herstellung von planparallelen Plättchen
US09/390,297 1999-09-03
US09/390,297 US6270840B1 (en) 1998-09-28 1999-09-03 Apparatus and method for producing plane-parallel flakes

Publications (1)

Publication Number Publication Date
WO2000018978A1 true WO2000018978A1 (fr) 2000-04-06

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PCT/IB1999/001656 Ceased WO2000018978A1 (fr) 1998-09-28 1999-09-23 Appareil et procede de production de paillettes paralleles planes

Country Status (3)

Country Link
JP (1) JP4467186B2 (fr)
CA (1) CA2332900C (fr)
WO (1) WO2000018978A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398999B1 (en) 1998-10-23 2002-06-04 Avery Dennison Corporation Process for making high aspect ratio reflective metal flakes
JP2004532334A (ja) * 2001-05-21 2004-10-21 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 有機分離剤を使用することによる面平行な小板の製造方法
US6863851B2 (en) 1998-10-23 2005-03-08 Avery Dennison Corporation Process for making angstrom scale and high aspect functional platelets
WO2006021528A2 (fr) 2004-08-23 2006-03-02 Ciba Specialty Chemicals Holding Inc. Procede d'elaboration de pigments sous forme de plaquettes

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114107911B (zh) * 2021-11-11 2025-03-11 杭州四马化工科技有限公司 一种金属箔生产系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113815A (en) * 1974-07-11 1978-09-12 Yuzo Kawamura Method for manufacturing composition including fine particles dispersed therein
US4168986A (en) * 1978-07-03 1979-09-25 Polaroid Corporation Method for preparing lamellar pigments
DE4020999A1 (de) * 1990-07-02 1992-01-09 Tvg Thermo Vac Entwicklungs Gm Anlage zur beschichtung von bahnfoermigen material im vakuum

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113815A (en) * 1974-07-11 1978-09-12 Yuzo Kawamura Method for manufacturing composition including fine particles dispersed therein
US4168986A (en) * 1978-07-03 1979-09-25 Polaroid Corporation Method for preparing lamellar pigments
DE4020999A1 (de) * 1990-07-02 1992-01-09 Tvg Thermo Vac Entwicklungs Gm Anlage zur beschichtung von bahnfoermigen material im vakuum

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6398999B1 (en) 1998-10-23 2002-06-04 Avery Dennison Corporation Process for making high aspect ratio reflective metal flakes
US6863851B2 (en) 1998-10-23 2005-03-08 Avery Dennison Corporation Process for making angstrom scale and high aspect functional platelets
US7820088B2 (en) 1998-10-23 2010-10-26 Avery Dennison Corporation Process for making angstrom scale and high aspect functional platelets
JP2004532334A (ja) * 2001-05-21 2004-10-21 チバ　スペシャルティ　ケミカルズ　ホールディング　インコーポレーテッド 有機分離剤を使用することによる面平行な小板の製造方法
WO2006021528A2 (fr) 2004-08-23 2006-03-02 Ciba Specialty Chemicals Holding Inc. Procede d'elaboration de pigments sous forme de plaquettes

Also Published As

Publication number Publication date
CA2332900A1 (fr) 2000-04-06
JP4467186B2 (ja) 2010-05-26
JP2002525436A (ja) 2002-08-13
CA2332900C (fr) 2007-01-09

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