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WO2000004582A8 - Temperature control of electronic devices using power following feedback - Google Patents

Temperature control of electronic devices using power following feedback

Info

Publication number
WO2000004582A8
WO2000004582A8 PCT/US1999/015846 US9915846W WO0004582A8 WO 2000004582 A8 WO2000004582 A8 WO 2000004582A8 US 9915846 W US9915846 W US 9915846W WO 0004582 A8 WO0004582 A8 WO 0004582A8
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
heat exchanger
power
temperature control
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/015846
Other languages
French (fr)
Other versions
WO2000004582A9 (en
WO2000004582A1 (en
Inventor
Thomas P Jones
Jonathan E Turner
Mark F Malinoski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger Technologies Inc
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Priority to JP2000560611A priority Critical patent/JP4703850B2/en
Priority to AU49917/99A priority patent/AU4991799A/en
Priority to DE19983379T priority patent/DE19983379B4/en
Publication of WO2000004582A1 publication Critical patent/WO2000004582A1/en
Publication of WO2000004582A8 publication Critical patent/WO2000004582A8/en
Publication of WO2000004582A9 publication Critical patent/WO2000004582A9/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Control Of Temperature (AREA)

Abstract

A method for controlling a device temperature measures a parameter related to device power consumption and utilizes the parameter to control the device temperature. This can be achieved with a system including a heat exchanger, a power monitor, and a circuit which controls the temperature setting of the heat exchanger. The circuit uses as inputs the power level, heat exchanger temperature, and set point. The system thus eliminates the need for temperature sensing devices in or connected to a chip, responds to the temperature of the device and not the package, can be used for high volume chip manufacturing, does not require significant surface area of a device for temperature sensing, and eliminates the need for chip power profiles. Significantly, the system allows a set point to be maintained with minimal overshoot or undershoot.
PCT/US1999/015846 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback Ceased WO2000004582A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000560611A JP4703850B2 (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback action
AU49917/99A AU4991799A (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback
DE19983379T DE19983379B4 (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power train feedback

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9272098P 1998-07-14 1998-07-14
US60/092,720 1998-07-14

Publications (3)

Publication Number Publication Date
WO2000004582A1 WO2000004582A1 (en) 2000-01-27
WO2000004582A8 true WO2000004582A8 (en) 2000-05-18
WO2000004582A9 WO2000004582A9 (en) 2000-07-20

Family

ID=22234752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/015846 Ceased WO2000004582A1 (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback

Country Status (5)

Country Link
JP (1) JP4703850B2 (en)
KR (1) KR100755295B1 (en)
AU (1) AU4991799A (en)
DE (1) DE19983379B4 (en)
WO (1) WO2000004582A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794620B1 (en) * 2001-11-07 2004-09-21 Advanced Micro Devices, Inc. Feedforward temperature control of device under test
DE10203790A1 (en) * 2002-01-31 2003-06-26 Siemens Ag Method for operating a semiconductor component avoids temperature fluctuations by actively boosting temperature under low electrical load so as to match temperature level to that under high load
US6825681B2 (en) 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US7313500B2 (en) 2004-11-05 2007-12-25 Schweitzer Engineering Labortories, Inc. Method to increase the maximum allowable ambient temperature rating of an electronic device
DE102005001163B3 (en) 2005-01-10 2006-05-18 Erich Reitinger Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
US9570643B2 (en) 2013-10-28 2017-02-14 General Electric Company System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices
WO2017218791A1 (en) 2016-06-15 2017-12-21 Watlow Electric Manufacturing Company Power converter for a thermal system
US10514416B2 (en) 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN109932630B (en) * 2017-12-15 2021-08-03 朋程科技股份有限公司 Over-temperature detection circuit and test method thereof
JP7266481B2 (en) * 2019-07-19 2023-04-28 東京エレクトロン株式会社 Temperature control device, temperature control method, and inspection device
JP7534047B2 (en) * 2020-12-07 2024-08-14 東京エレクトロン株式会社 Inspection device control method and inspection device
KR20250138715A (en) * 2024-03-11 2025-09-22 주식회사 히타치하이테크 plasma treatment device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330809A (en) * 1979-12-31 1982-05-18 Crown International, Inc. Thermal protection circuit for the die of a transistor
US4637020A (en) * 1983-08-01 1987-01-13 Fairchild Semiconductor Corporation Method and apparatus for monitoring automated testing of electronic circuits
US4686627A (en) * 1984-12-24 1987-08-11 Honeywell Inc. Electrical test apparatus
WO1987001813A1 (en) * 1985-09-23 1987-03-26 Sharetree Limited An oven for the burn-in of integrated circuits
DE3536098A1 (en) * 1985-10-09 1987-04-09 Siemens Ag Device for monitoring the temperature of an electrical component
US4713612A (en) * 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
US5324916A (en) * 1991-11-01 1994-06-28 Hewlett-Packard Company System and method for dynamic power compensation
US5287292A (en) * 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
JPH07263526A (en) * 1994-03-17 1995-10-13 Hitachi Ltd Wafer chuck and method for cooling semiconductor element
JP2986381B2 (en) * 1994-08-16 1999-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Electronic chip temperature control device and method
JPH09264647A (en) * 1996-03-27 1997-10-07 Nec Corp Electronic apparatus cooling circuit
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing

Also Published As

Publication number Publication date
DE19983379B4 (en) 2011-08-18
KR100755295B1 (en) 2007-09-05
JP4703850B2 (en) 2011-06-15
WO2000004582A9 (en) 2000-07-20
JP2002520630A (en) 2002-07-09
AU4991799A (en) 2000-02-07
WO2000004582A1 (en) 2000-01-27
KR20010071917A (en) 2001-07-31
DE19983379T1 (en) 2001-09-13

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