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WO2000003417A1 - Dispositif et procede pour mettre a disposition une pile complete de plaquettes - Google Patents

Dispositif et procede pour mettre a disposition une pile complete de plaquettes Download PDF

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Publication number
WO2000003417A1
WO2000003417A1 PCT/CH1999/000297 CH9900297W WO0003417A1 WO 2000003417 A1 WO2000003417 A1 WO 2000003417A1 CH 9900297 W CH9900297 W CH 9900297W WO 0003417 A1 WO0003417 A1 WO 0003417A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
wafer
filling
gripper
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH1999/000297
Other languages
German (de)
English (en)
Inventor
Jakob Blattner
Bernhard Strasser
Christian Balg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brooks CCS RS AG
Original Assignee
Tec Sem AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tec Sem AG filed Critical Tec Sem AG
Priority to DE19981278.0T priority Critical patent/DE19981278B4/de
Publication of WO2000003417A1 publication Critical patent/WO2000003417A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Definitions

  • the invention relates to a device for handling and providing a stack of wafers for a treatment process, which has a receiving device which has holding elements for the simultaneous arrangement and handling of a plurality of wafers arranged at predetermined distances from one another (a multiple wafer gripper which has holding elements for simultaneous holding) Handling of several wafers arranged at a predetermined distance) is provided.
  • the invention also be ⁇ meets a method of providing a complete wafer stack.
  • wafers semiconductor wafers, especially silicon wafers
  • wafers are the starting products for electronic components.
  • they go through various treatment processes, such as wet processes, in which i.a. Layers are removed.
  • wet processes in which i.a. Layers are removed.
  • the processes through which the wafers pass are often tailored to a certain number and also to a certain distance from wafers arranged next to one another. It has been shown that missing wafers can have a negative impact on the process results. In this way, for example, due to an incorrect distance between two successive wafers, changes in the flow rate of the process liquid of the wet process result, which in turn leads to a deviation in the thickness of a layer to be applied.
  • a system In order to replace missing wafers with a filling wafer even in a wafer stack, a system has therefore already been known in which empty spaces of a wafer stack are filled with filling wafers by a handling device at a time when the wafers are still in a transport container are located.
  • the filling wafers provided for this purpose are also taken from a transport container and - like the wafers of the wafer stack - are arranged horizontally.
  • this has the disadvantage that particles can settle on the surface of the wafer.
  • the invention is therefore based on the object of creating a device and a method with which it is possible to avoid negative influences due to wafers missing in a wafer stack even when handling wafers in batches (“batch handling”).
  • the invention is intended to provide a possibility, even when handling wafers in stacks, to provide a stack of wafers with the intended number of wafers for a processing process.
  • this object is achieved in the device mentioned at the outset in that it has a detection device with which a lack of at least one wafer in an existing wafer stack can be detected and with a handling device for removal that can be moved relative to the receiving device at least one filling wafer from a storage means, in which a plurality of filling wafers can be arranged, and for inserting the filling wafer into the wafer stack at a specific position in the wafer stack.
  • a second aspect of the invention relates to a method for providing a stack of wafers for a treatment process in which wafers from a stack of wafers with a receiving device are simultaneously removed from a transport container, these wafers being arranged outside the transport container in a substantially vertical orientation in a holder around which The wafer stack is subsequently fed to a process plant, based on the spacing of successive wafers of the wafer stack with a detection device, the wafer stack is detected for completeness, in the absence of wafers a corresponding signal is sent to a controller, the controller to a handling device Handling of substantially vertically arranged Golfwa- fer responsive, which then minde from a memory means ⁇ least removes a Einhellwafer and inserts in a holder a ⁇ , in which the wafer stack is arranged.
  • a sensor is used to detect whether the wafer stack is complete in a type of “scan process”. If it is determined that one or more wafers are missing, the wafer stack is filled with one or completed several so-called "filling wafers". It has been shown that this is a very efficient and uncomplicated solution, since it can thereby be avoided to change the process parameters themselves in order to adapt the treatment process to an incomplete wafer stack. Since in the devices according to the invention the filling process with filling wafers only takes place when the wafers of the wafer stack have been transferred to a vertical position, the risk of contamination of the surface of the wafers with particles is far lower than is the case with previously known devices.
  • the filling wafers are also arranged in a substantially vertical position and both the wafer stack and the filling wafers are located in a clean room in which a vertical air flow is usually present, which largely prevents particles from accumulating of the wafer surface.
  • Filled wafers can actually be treated wafers that are later used for the production of electronic components.
  • the filling wafers are used exclusively for filling up wafer stacks and, after the treatment processes have been completed, are reused in another wafer stack as the filling wafer.
  • the filling wafers are removed from the stack of wafers again after the end of a treatment process and inserted into the storage means, which is expediently achieved by the appropriate handling device happens.
  • the dimensions of the filling wafers - and possibly also their surface properties - should essentially correspond to the wafers in order to be able to simulate as well as possible one of the wafers actually to be treated.
  • a gripper of a handling device removes a filling wafer from a storage medium and transports it to the wafer stack. Since the controller knows from the detection process at which position or at which position the filling wafer is to be inserted, the same gripper preferably inserts the filling wafer at the empty position in the wafer stack by placing it at the corresponding position of the receiving device .
  • the handling device has a two-armed gripper, which can be moved along at least two translational axes, removes already vertically oriented filling wafers from a storage device and inserts them into the receiving device, wherein the storage device can be part of the handling device. Since this handling device for filling wafers preferably performs all the functions that are required for filling a wafer stack, it can be integrated particularly easily into an already existing system for providing wafer stacks. To further facilitate this, it is therefore preferred that the handling device is designed as an independent handling module, namely as a so-called "stand-alone solution".
  • Fig. 1 is a perspective view of a
  • Figure 2 is a side view of that shown in Figure 1
  • Fig. 3 is a front view of that shown in Fig. 1
  • Figure 4 is a top view of that shown in Figure 1
  • Fig. 5 is a perspective view of a handling module and part of a
  • FIG. 6 shows a front view of the two components according to the invention shown in FIG. 5.
  • a loading and unloading station for wafer transport containers 2 which has a lockable lock opening 3 arranged in a lock wall, through which a stack of wafers 4 located in a magazine of a transport container 2 into a clean room can be infiltrated.
  • Such stations are known per se, which is why the structure and functions of the loading and unloading station need not be discussed in detail.
  • Figs. 1 - 4 also a multiple wafer is partially shown ⁇ claws 5, with a complete stack of wafers 4 can be removed from the transport container and SAmT ⁇ Liche 25 wafers of the stack at the same time from a horizonta- len alignment in a substantially vertical orientation can be pivoted.
  • the wafer gripper 5 is provided here to ⁇ with two rows of gripper fingers 6, at their free ends a slotted retaining member is attached. For the sake of clarity, only the first and the last gripper fingers 6 of a row of gripper fingers are shown in the figures.
  • the gripper fingers 6, which are located opposite each other in the two rows, are provided for removing a wafer from the transport container 2, all wafers of a wafer stack 4 being removed from the transport container 2 at the same time.
  • the gripping device is also provided with a two-part holding rake 7, between the two halves of which the two rows of gripper fingers are arranged.
  • two gripper fingers 6 are arranged under each wafer in such a way that the holding elements engage behind the wafer.
  • the wafer is then pushed into the two slots (not shown) of the holding elements by a suitable movement and arranged on its opposite side in a slot of the holding rake 7.
  • the multiple wafer gripper 5 moves with the wafers held by the gripper fingers 6 out of the transport container 2 in a horizontal movement along a Y axis.
  • the wafer gripper 5 then executes a pivoting movement about an axis of rotation, the rotary shaft of which is designated by 8.
  • the rotation moves the wafers from their horizontal position to a vertical position.
  • FIGS. 1-4 also show two parallel arms 10, 10 'attached to the multiple wafer gripper 5.
  • the arms are aligned vertically to the gripper fingers 6.
  • a light detector is arranged at a free end of one arm 10 and a light source is arranged at the free end of the other arm 10 ', both of which belong to a light barrier sensor (not shown in more detail).
  • the length and the distance between the two arms 10, 10 ' is matched to the opening width of a front side of the transport container 2 and the diameter of the wafers.
  • the light barrier sensor can be positioned so that a wafer with a portion of its peripheral edge is between the light detector and the light source.
  • the multiple wafer gripper and thus the light barrier sensor can be moved vertically along a Z axis, the travel area corresponding at least to the height of a magazine of a transport container 2.
  • a handling device 20 can be seen, which is used to handle filling wafers.
  • the handling device 20 has a housing 21, on the front surface 22 of which two gripping arms 23, 23 'are arranged which are essentially parallel to one another. The distance between the gripper arms 23, 23 'is greater than the diameter of a wafer.
  • a prismatic slotted gripping element 24, 24 ' is arranged at the free ends of the gripper arms 23, 23'.
  • the two gripping elements 24, 24 ' together form a single wafer gripper 25.
  • the single wafer gripper 25 is for handling individual inputs.
  • the gripping elements 24, 24 'are at a distance from one another which is less than the diameter of a wafer.
  • the individual wafer gripper 25 is preferably provided in each gripping element 24, 24 'with a light barrier sensor, not shown, with which the presence of a wafer in the gripper can be detected.
  • the light barrier sensors are designed as reflection sensors whose light beam from the respective light transmitter is reflected from the peripheral edge of a wafer to the light receiver.
  • the gripper arms 23, 23 'of the single wafer gripper 25 can be moved along two translatory axes Y and Z.
  • the servo motors provided for this are not shown in the figures.
  • Both axes can be equipped with two inductive proximity sensors to define the two end positions of each axis.
  • Each axis can also have a third proximity sensor, which is used to define a reference position. This measure makes it possible for each axis to be able to recognize its reference position again, even if it should have lost it - for example due to a power failure.
  • the third sensor is preferably arranged in the vicinity of a rear end stop in the Y-axis and in the region of an upper end stop in the Z-axis.
  • the Y axis of the exemplary embodiment of the handling module 20 shown is designed such that it can move to a further 85 positions in addition to the reference position.
  • positions 1 to 60 are provided for receiving and depositing filler wafers in a storage means for filler wafers 26.
  • Positions 61 to 85 are used to classify filling wafers 26 in the multiple wafer gripper 5 or in another suitable receptacle for a wafer stack 4.
  • the storage means for filler wafers 26 is provided between the two gripper arms on the housing, in which a total of 60 filler wafers can be arranged in a vertical orientation (cf. FIGS. 5 and 6).
  • the storage means has two holding arms 27, 27 'aligned parallel to the gripper arms 23, 23'.
  • the holding arms each have an inclined support surface, which are provided with slots for receiving the wafers.
  • the two holding arms 27, 27 ' can be moved along the Y axis.
  • the spacing between adjacent wafer receptacles of the holding arms 27, 27 ' are always identical and are H of the spacing between the wafers in the magazine of the transport container (so-called “pitch spacing”).
  • the two holding arms 27, 27 ' can be moved simultaneously from a parking position into a filling position - in a direction parallel to the gripper arms 23, 23' and away from the housing 21.
  • the holding arms 27, 27 ' are driven by a drive in the form of an AC motor.
  • the individual wafer gripper 25 removes filling wafers 26 from the storage means or resets them. Due to the movability of the storage means, the space in front of the housing 21 can also be used for purposes other than the filling of filling wafers, for example for moving the multiple wafer gripper 5. This advantageously reduces the base area required by a handling device according to the invention.
  • the storage means can be provided with a light barrier, not shown, with which the presence of filling wafers 26 between the holding arms 27, 27 'can be determined.
  • the light barrier is arranged tel preferably before the first and after the last A ⁇ chirllwafer on Speichermit-.
  • the light barrier sensor arranged on the two arms 10, 10 ′ scans the wafers arranged in the magazine of the transport container 2 (cf. FIGS. 1-4).
  • the multiple wafer gripper 5 is first arranged opposite the transport container 2 in a position as shown in FIG. 2, in which the two arms 10, 10 'are located below a lowermost receiving slot (not shown) of the magazine.
  • the multiple wafer gripper 5 then moves vertically upwards along the Z axis until the arms 10, 10 'are located above the top slot of the magazine.
  • the light beam of the light barrier sensor is interrupted by each of the wafers in the magazine. Since the arms move at a constant speed and the control also knows the spacing of successive slot receptacles of the magazine, it can be determined which slot receptacles are empty.
  • a second light barrier sensor could be provided on the arms, which is located behind the first light barrier sensor in the direction of travel.
  • the distance in the direction of travel of these two light barrier sensors should be smaller than the distance between two wafers which are arranged in successive slot receptacles.
  • the distance between the two sensors is preferably at most half the distance between two such wafers.
  • instead of the two ⁇ th photoelectric sensor is provided to measure the time, in which the light beam is interrupted of a photoelectric sensor un ⁇ .
  • this additional measurement variable can also be used to determine whether a particular interruption of the light beam is due to one or more wafers. It is in fact possible that there is more than one wafer in a slot receptacle. Finally, the controller counts the number of light beam interruptions in order to determine the number of wafers present, their positions and the positions of any empty spaces in the magazine, together with the detection variables discussed previously.
  • the multiple gripper 5 moves out of the magazine with the arms 10, 10 ′.
  • the gripper fingers 6 can be moved into an approximately horizontal position by a pivoting movement of approximately 90 °.
  • the gripper fingers 6 then take the wafers out of the magazine in the manner previously described.
  • the multiple wafer gripper 5 has been pivoted back again by 90 °, it is in a filling position in which all wafers of the wafer stack 4 are arranged vertically.
  • the filling process now begins, in which the individual wafer gripper 25 fills the empty positions in the multiple wafer gripper 5 with filling wafers.
  • the individual wafer gripper 25 travels beneath the filling wafer under a specific filling wafer 26 arranged in the holding arms. This is preferably the foremost and thus the filling wafer 26 positioned closest to the multiple wafer gripper 5.
  • the individual wafer gripper 25 is moved vertically upward along the Z-axis, so that the gripping elements below the widest point of the corresponding filling wafer 26 - seen in the vertical direction - on its circumferential edge with its two slots take up.
  • the gripping elements are moved along the Y axis and positioned over the empty position of the multiple wafer gripper 5 to be filled.
  • the gripping elements are then lowered by actuating the Z axis and the filling wafer 26 is inserted into the empty position of the wafer stack 4. So that the gripping elements release the filling wafer, they are moved vertically downward beyond the position in which the filling wafer 26 has already been picked up by the multiple wafer gripper 5.
  • the gripper 25 moves back along the wafer stack 4 to the stack of filling wafers.
  • the filler wafer closest to the multiple wafer gripper 5 is preferably taken from the stack of filler wafers.
  • the wafer stack is ready for the next processing process.
  • the wafer stack can be arranged in a manner known per se in a further magazine or another holder for wafers, which is then transferred to a processing system. After finishing the machining process, the process described above takes place in reverse order.
  • the wafer stack is ⁇ so again placed back into the multiple wafer gripper whose gripper fingers are aligned vertically to this essentially comparable.
  • the filling wafers are then individually removed from the stack of wafers arranged in the multiple wafer gripper and inserted into the stack of the filling wafers held by the holding arms.
  • the individual wafer gripper is first positioned under the corresponding filling wafer by movement along the Y axis, in order then to pick it up along the Z axis in the region of the lower half of the filling wafer with the slots of the gripping means.
  • the single wafer gripper then moves vertically upwards along the Z axis without interrupting the movement.
  • the filling wafer has been removed from the stack of wafers in this way, it is positioned by the individual wafer gripper along the Y-axis above a receptacle of the holding arms and lowered and inserted into the latter.
  • the handling device is ready for manipulating the next filler wafer.
  • the stack of filling wafers preferably enters the storage medium by first removing it from a transport container with the multiple wafer gripper 5, just like the wafer to be actually treated.
  • the filling wafers with the multiple wafer gripper 5 are then pivoted out of their hitherto horizontal orientation into a vertical position, in order then to be inserted individually into the storage means with the single wafer gripper 25.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention vise à éviter, lors de la manipulation de plaquettes sous forme de piles, les influences négatives de plaquettes manquantes dans une pile de plaquettes. A cet effet, il est prévu un dispositif pour manipuler et mettre à disposition une pile de plaquettes pour un processus de traitement. Ce dispositif présente une unité de réception comportant des éléments de maintien pour placer simultanément plusieurs plaquettes disposées verticalement avec un écart entre elles prédéterminé. Ce dispositif présente également une unité de détection permettant de détecter l'absence d'au moins une plaquette dans une pile de plaquettes (4) existante, et une unité de manipulation (20) qui peut se déplacer par rapport à l'unité de réception et sert à prélever au moins une plaquette de remplissage (26) pratiquement verticale, dans un élément de stockage où peuvent être placées plusieurs plaquettes de remplissage (26), et servant à insérer la plaquette de remplissage (26) dans la pile (4) dans une position déterminée.
PCT/CH1999/000297 1998-07-09 1999-07-06 Dispositif et procede pour mettre a disposition une pile complete de plaquettes Ceased WO2000003417A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19981278.0T DE19981278B4 (de) 1998-07-09 1999-07-06 Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1467/98 1998-07-09
CH01467/98A CH693726A5 (de) 1998-07-09 1998-07-09 Vorrichtung und Verfahren zur Bereitstellung eines vollständigen Waferstapels.

Publications (1)

Publication Number Publication Date
WO2000003417A1 true WO2000003417A1 (fr) 2000-01-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1999/000297 Ceased WO2000003417A1 (fr) 1998-07-09 1999-07-06 Dispositif et procede pour mettre a disposition une pile complete de plaquettes

Country Status (3)

Country Link
CH (1) CH693726A5 (fr)
DE (1) DE19981278B4 (fr)
WO (1) WO2000003417A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002005320A1 (fr) * 2000-07-09 2002-01-17 Brooks-Pri Automation (Switzerland) Gmbh Dispositif de stockage, en particulier pour le stockage intermediaire de tranches de semi-conducteur d'essai
US8002511B2 (en) * 2005-10-28 2011-08-23 Tokyo Electron Limited Batch forming apparatus, substrate processing system, batch forming method, and storage medium
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPS5797622A (en) * 1980-12-11 1982-06-17 Toshiba Corp Diffusion heat treating jig of semiconductor substrate
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
JPS6273631A (ja) * 1985-09-27 1987-04-04 Oki Electric Ind Co Ltd 半導体製造装置
JPS62132321A (ja) * 1985-12-04 1987-06-15 Anelva Corp ドライエツチング装置
US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
JPH1098088A (ja) * 1996-09-20 1998-04-14 Tokyo Electron Ltd 縦型熱処理装置
US5829969A (en) * 1996-04-19 1998-11-03 Tokyo Electron Ltd. Vertical heat treating apparatus

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Publication number Priority date Publication date Assignee Title
US4886412A (en) * 1986-10-28 1989-12-12 Tetron, Inc. Method and system for loading wafers
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
WO1998015971A1 (fr) * 1996-10-09 1998-04-16 Stäubli Ag Pfäffikon Dispositif de prehension pour tranches

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Publication number Priority date Publication date Assignee Title
JPS5797622A (en) * 1980-12-11 1982-06-17 Toshiba Corp Diffusion heat treating jig of semiconductor substrate
US4513430A (en) * 1982-05-24 1985-04-23 Varian Associates, Inc. Missing or broken wafer sensor
US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
JPS6273631A (ja) * 1985-09-27 1987-04-04 Oki Electric Ind Co Ltd 半導体製造装置
JPS62132321A (ja) * 1985-12-04 1987-06-15 Anelva Corp ドライエツチング装置
US5829969A (en) * 1996-04-19 1998-11-03 Tokyo Electron Ltd. Vertical heat treating apparatus
JPH1098088A (ja) * 1996-09-20 1998-04-14 Tokyo Electron Ltd 縦型熱処理装置

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Title
PATENT ABSTRACTS OF JAPAN vol. 11, no. 275 5 September 1987 (1987-09-05) *
PATENT ABSTRACTS OF JAPAN vol. 11, no. 355 19 November 1987 (1987-11-19) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 6, no. 182 18 September 1982 (1982-09-18) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002005320A1 (fr) * 2000-07-09 2002-01-17 Brooks-Pri Automation (Switzerland) Gmbh Dispositif de stockage, en particulier pour le stockage intermediaire de tranches de semi-conducteur d'essai
US8002511B2 (en) * 2005-10-28 2011-08-23 Tokyo Electron Limited Batch forming apparatus, substrate processing system, batch forming method, and storage medium
US9257319B2 (en) 2011-06-03 2016-02-09 Tel Nexx, Inc. Parallel single substrate processing system with alignment features on a process section frame
US9293356B2 (en) 2011-06-03 2016-03-22 Tel Nexx, Inc. Parallel single substrate processing system
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
US9508582B2 (en) 2011-06-03 2016-11-29 Tel Nexx, Inc. Parallel single substrate marangoni module

Also Published As

Publication number Publication date
DE19981278B4 (de) 2020-01-09
DE19981278D2 (de) 2001-05-31
CH693726A5 (de) 2003-12-31

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