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WO2000002730A9 - Materiau adhesif ameliore convenant pour des imprimantes thermiques a jet d'encre - Google Patents

Materiau adhesif ameliore convenant pour des imprimantes thermiques a jet d'encre

Info

Publication number
WO2000002730A9
WO2000002730A9 PCT/US1999/015701 US9915701W WO0002730A9 WO 2000002730 A9 WO2000002730 A9 WO 2000002730A9 US 9915701 W US9915701 W US 9915701W WO 0002730 A9 WO0002730 A9 WO 0002730A9
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
ink jet
accordance
group
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/015701
Other languages
English (en)
Other versions
WO2000002730A1 (fr
Inventor
Girish Shivaji Patil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lexmark International Inc
Original Assignee
Lexmark International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark International Inc filed Critical Lexmark International Inc
Priority to AU52111/99A priority Critical patent/AU5211199A/en
Publication of WO2000002730A1 publication Critical patent/WO2000002730A1/fr
Publication of WO2000002730A9 publication Critical patent/WO2000002730A9/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17559—Cartridge manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used

Definitions

  • the present invention relates to an improved adhesive suitable for use in ink jet printers, and more particularly, to an improved adhesive for attaching ink jet printheads to print cartridge containers.
  • a printhead is bonded to a print cartridge container.
  • the printhead includes an ink-receiving opening and ink supply channels through which ink travels to a plurality of bubble chambers.
  • Each bubble chamber includes a resistor which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet.
  • the printhead typically comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein.
  • the container serves as a reservoir for the ink and includes a fluid supply opening which communicates with the ink-receiving opening of the printhead for supplying ink to the bubble chambers in the printhead.
  • an adhesive is used to bond the two elements together.
  • the adhesive also "fixes" the printhead to the print cartridge container such that its location relative to the print cartridge container is known and does not shift during processing or use. Further, the adhesive provides an additional function in serving as a fluid gasket against leakage of ink.
  • the printhead and the print cartridge container typically have dissimilar coefficients of thermal expansion, since the surface of the printhead bonded to the print cartridge container most commonly is silicon and the print cartridge container is, for example, a polymeric material such as a modified phenylene oxide.
  • the adhesive must accommodate both the dissimilar expansions and contractions of the printhead and the print cartridge container and be impermeable to attack by the ink, which is commonly in a vehicle of water and at least one glycol and/or glycol ether plus a colorant, plus substances such as pH modifiers, biocides, etc.
  • Typical adhesive materials comprise an epoxy resin, such as a bisphenol-A based epoxy resin, a cross-linking agent and an initiator. They may also include pigments and modifiers to alter their physical properties. Some conventional adhesives offer good adhesive properties and others offer good chemical resistance to inks. However, none of these conventional adhesives exhibit good adhesion properties while at the same time exhibiting good chemical resistance to inks. Additionally, conventional adhesive materials often comprise anhydride cross-linkers which typically absorb water and result in voids (air pockets) in the adhesive upon curing. Such voids are not desirable because they can, for example, result in a non-homogeneous adhesive having poor adhesion characteristics. They may also cause mixing of inks as a result of channel formation in the adhesive layer. Further, adhesive materials comprising anhydrides typically have poor shelf lives and poor pot lives, and, therefore, are often difficult to work with and store.
  • the present invention is directed to an adhesive composition
  • an adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and (b) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent capable of becoming a nucleophile, with the proviso that the adhesive composition does not comprise an anhydride.
  • the present invention is directed to an adhesive composition
  • an adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; (b) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent capable of becoming a nucleophile; and (c) an initiator, with the proviso that the adhesive composition does not comprise an anhydride.
  • the present invention is directed to an ink jet print cartridge container comprising the novel adhesive compositions of this invention to bond a printhead thereto.
  • the present invention is directed to a method for attaching a printhead to an ink jet print cartridge container.
  • the adhesive compositions of this invention comprise the constituents mentioned above (e.g., the additive and coupling agent), it is within the scope of this invention for the adhesive composition to consist essentially of or consist of the same.
  • Figure 1 is a perspective view of a portion of an ink jet print cartridge
  • Figure 2 is a perspective view of the ink jet cartridge shown in Figure 1 without the printhead (ink jet print cartridge container).
  • the print cartridge 10 which is adapted for use in an ink jet printer (not shown).
  • the print cartridge 10 comprises an ink-filled container 12, a printhead 20, which is adhesively secured to the container 12, and a flexible circuit 30 (also referred to as a TAB circuit).
  • the container 12 is typically formed from a polymeric material such as polyphenylene oxide, which is commercially available from, for example, the General Electric Company under the Trademark "NORYL SE-1".
  • the ink jet print cartridge of Figure 1 before the printhead 20 and the flexible circuit 30 are assembled to the container 12.
  • the adhesive composition of the present invention is typically applied to a printhead-receiving portion 13 on the container 12, which, in the illustrated embodiment, comprises a recessed area. After the adhesive composition has been applied, for example, to the printhead- receiving portion 13, the printhead 20 is positioned in the receiving portion 13 and the adhesive composition of the present invention is typically cured by baking at about 110 degrees Celsius for approximately 45 minutes.
  • the printhead 20 includes an ink-receiving opening (not shown) and ink supply channels (not shown) through which ink travels to a plurality of bubble chambers (not shown).
  • Each bubble chamber includes a resistor (not shown) which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet.
  • the printhead comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein.
  • multifunctional compound is defined to mean any compound having a total of at least two groups, substituents (including moieties) or the like, wherein each independently can become difunctional, act as a leaving group, and/or become a nucleophile.
  • Additives comprising multifunctional compounds for use as component (a) include compounds functionalized with at least two functionalization members selected from the group consisting of an epoxy, cyclic ether, lactone, lactam and triazine group, with epoxy-functionalized compounds, such as epoxy resins, being preferred.
  • the epoxy resins which may be employed in this invention include commercially available resins like bisphenol-A based epoxy resins, including
  • Epon 828, Epon 836 and Epon 1001 all available from Shell Chemical Co., and 3,4-epoxycyclohexylmethyl- 3,4-epoxyhexane carboxylate, available from Union Carbide.
  • Other examples of the epoxy resins which may be employed are epoxy novolacs, such as D.E.N. 431 , D.E.N. 438, and D.E.N. 439, which are available from Dow Chemical.
  • the epoxy resins are often available with or without initiators mixed therein.
  • additives comprising multifunctional compounds include, for example, those, which may be made by art-recognized techniques. Such techniques include reacting functionalized precursors like epichlorohydrin and aromatic precursors like bisphenol-A in the presence of heat, a catalyst or both to thereby cause substitution reactions.
  • the average number molecular weight (M n ) of the multifunctional compounds employed in this invention is limited only to the extent that the compounds are capable of resulting in an adhesive composition. Often, the multifunctional compounds have a M n of greater than about 600, and preferably, greater than 2,000.
  • the non-acrylic silane coupling agents for use as component (b) are silane compounds having at least one difunctional group which is capable of becoming an electrophile or capable of becoming a nucleophile.
  • the non-acrylic silane coupling agents suitable for use in the present invention as component (b) include non-acrylic silane coupling agents represented by the formula: A (4 -n)-Si-[0(H)p(R) q ]n,
  • A is a monovalent organic group having an epoxy, cyclic ether, lactone, lactam, or triazine group
  • R is a CrC 6 alkyl or aryl group
  • p is 0, 1 or 2
  • q is 0, 1 or 2, with the proviso that p and q cannot simultaneously be 0, 1 , or 2
  • n is 1 , 2 or 3.
  • non-acrylic silane coupling agents which may be employed in this invention are commercially available. Also, they may be prepared by, for example, reacting a trialkoxysilyl alkanol and halogenated epoxide in the presence of heat, a catalyst, or both to thereby cause a substitution reaction.
  • the most preferred non-acrylic silane coupling agents employed in this invention are those having n as 3, p as 0, q as 1 , R as methyl and A as glycidoxypropyl (3-glycidoxypropyltrimethoxysilane), referred to by the trade designation Z-6040 and commercially available from Dow Chemical.
  • the initiators which may be employed in the present invention are generally classified as low-temperature initiators (i.e., they enhance curing below 120 degrees Celsius). They typically are the resulting addition product of an epoxy and an amine and are often classified as epoxy-amine adducts, including, for example, epoxy-imidazole adducts.
  • the initiators which may be employed in this invention are commercially available.
  • a preferred initiator employed in this invention is Ajicure MY 24 which is available from Ajinomoto USA, Inc.
  • the amount of additive comprising at least one multifunctional compound employed in the adhesive compositions of this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions of this invention comprise from about 55.0 percent to about 98.5 percent, and, preferably, from about 75.0 percent to about 95.0 percent, and, most preferably, from about 80.0 percent to about 90.0 percent by weight of additive comprising at least one multifunctional compound, based on total weight of adhesive composition, and including all ranges subsumed therein.
  • the amount of non-acrylic silane coupling agent employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition.
  • the adhesive compositions of this invention comprise from about 0.5 percent to about 20.0 percent, and, preferably, from about 1.0 percent to about 10.0 percent, and most preferably, from about 2.0 percent to about 5.0 percent by weight of WOflO/02730 PCT/US99/15701 silane, based on total weight of the adhesive composition, and including all ranges subsumed therein.
  • the amount of initiator which may be employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions comprise from about 0.5 percent to about 35.0 percent, and, preferably, from about 1.0 percent to about 20.0 percent, and, most preferably, from about 5.0 percent to about 15.0 percent by weight of initiator, based on total weight of adhesive composition, and including all ranges subsumed therein.
  • the components of the adhesive compositions of this invention are combined. Typically, they are mixed, agitated or stirred via any art-recognized technique, including mixing in a mixing vessel like a beaker.
  • the adhesive composition may be mixed, for example, at atmospheric pressure and ambient temperature or any other temperature or pressure levels that result in an adhesive composition. It is important, however, that the conditions do not cause the adhesive composition to cure in the mixing vessel.
  • additives include colorants like pigments and dyes, and especially, rheology modifiers.
  • rheology modifiers include group IIA carbonates such as calcium carbonate, and transition metal oxides such as titanium dioxide. The most preferred rheology modifier is, however, fumed silica.
  • the amount of rheology modifier employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition.
  • the adhesive compositions of this invention comprise from about 1.0 percent to about 25.0 percent, and, preferably, from about 2.0 percent to about 15.0 percent, and, most preferably, from about 3.0 percent to about 10.0 percent by weight of rheology modifier, based on total weight of the adhesive composition, and including all ranges subsumed therein.
  • the viscosities of the adhesive compositions employed in this invention are often from about 5,000 cps to about 200,000 cps, and, preferably, from about 10,000 cps to about 100,000 cps, and, most preferably, from about 35,000 cps to about 50,000 cps, including all ranges subsumed therein. Such viscosities are determined with a Haake Viscometer, No. VT- 500, at ambient temperature and with a PK1-1 spindle.
  • the adhesive compositions of the instant invention may be employed in any applications requiring low-temperature curing adhesives. Often, however, the adhesive compositions of this invention are used in ink jet printer applications. Typically, the adhesive compositions are applied to the printheads or the print cartridge containers (or both) of ink jet printers. The adhesive compositions of this invention are used in ink jet printer applications to primarily bond (fix) the printhead to the print cartridge container and to serve as a barrier or gasket to prevent ink leakage and mixing from a reservoir of the print cartridge container.
  • the print cartridge containers that may be used with the adhesive compositions of this invention include those, for example, having one to three ink reservoirs and molded from commercially available polyphenylene ether compositions.
  • An illustrative example of the print cartridge container which may be employed in the invention is described in United States Patent No. 5,576,750, assigned to Lexmark International, Inc., and incorporated herein by reference.
  • Examples 6 and 7 demonstrate the unexpected and superior adhesion properties of the adhesive compositions of this invention when compared with a commercially available adhesive composition (Example 1 - the "control composition"), as well as other non- inventive compositions (Examples 2-5). Fumed silica was added to all adhesion compositions, where needed, to bring the viscosity to about 40,000 cps.
  • Example 8 demonstrates that the adhesive compositions of this invention cure substantially free of voids.
  • Examples 9-14 demonstrate that while adhesion properties improve when employing the adhesive compositions in accordance with the present invention, resistance to chemical degradation remains substantially unchanged as compared with the control composition.
  • a commercially available adhesive composition having an epoxy-resin (Uniset LA 3032-78 commercially available from Emerson & Cuming) was dispensed onto five flat Noryl SE-1 plates (2"x2").
  • the dispensing was achieved with a dispensing apparatus that forced the adhesive composition out of a tube by delivering compressed air to the tube.
  • the amount of adhesive composition dispensed onto the plates was enough to cover substantially the entire bottom of the silicon chips capable of being used on ink jet print cartridges.
  • On top of the dispensed adhesive composition were placed the ink jet silicon chips. After baking in an oven at 110 degrees Celsius for about 45 minutes, the adhesive composition cured and the silicon chips were bonded to the plates.
  • the plates having the bonded silicon chips were soaked in boiling water for about two hours to test and observe the quality of the bonds. After the soaking, all silicon chips fell off the plates either immediately or with the mere touch of a finger.
  • Example 2 The five flat Noryl SE-1 plates (2"x2") of Example 2 had silicon chips bonded to them in a manner similar to the one described in Example 1 except that 3-(trimethoxysilyl) propyl methacrylate (a commercially available adhesion promoter) was coated onto the sides of the silicon chips that interfaced with the commercially available adhesive. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • 3-(trimethoxysilyl) propyl methacrylate a commercially available adhesion promoter
  • Example 3 The five flat Noryl SE-1 plates (2"x2") of Example 3 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that 3-glycidoxypropyltrimethoxysilane was used in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • Example 4 The five flat Noryl SE-1 plates (2"x2 M ) of Example 4 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that the adhesion promoter was added directly to the adhesive composition (1:99 weight ratio with mixing). After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • EXAMPLE 5
  • Example 5 The five flat Noryl SE-1 plates (2"x2") of Example 5 had silicon chips bonded to them in a manner similar to the one described in Example 4 except that 3-glycidoxypropyltrimethoxysilane was used as the adhesion promoter (1 :99 weight ratio with mixing) in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, some silicon chips (about 50 percent) were removable when reasonable force was applied with a screwdriver. EXAMPLE 6
  • Example 6 The five flat Noryl SE-1 plates (2"x2") of Example 6 had silicon chips bonded to them in a manner similar to the one describe in Example 5 except that the weight ratio of adhesion promoter to the adhesive composition was 3:97. After soaking in boiling water for about two hours, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby demonstrating the superior properties of the adhesive compositions of this invention.
  • EXAMPLE 7 EXAMPLE 7
  • Example 7 The five flat Noryl SE-1 plates (2"x2") of Example 7 had silicon chips bonded to them in a manner similar to the one described in Example 6 except that the plates with the silicon chips bonded thereon were soaked in boiling water for about eight hours. After the soaking, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby further demonstrating the superior properties of the adhesive compositions of this invention.
  • Example 6 The adhesive composition used in Example 6 was dispensed onto nine flat Noryl SE-1 plates (about 2"x2"). The adhesive composition was dispensed on the plates in a manner similar to the way the adhesive compositions were dispensed in Examples 1 through 7.
  • Nine transparent polyetherimide (ULTEM ® ) windows (about the size of an ink jet printhead) were placed on top of the adhesive composition on each plate, and, thereafter, each plate was placed in an oven at about 110 degrees Celsius for approximately 45 minutes to cure the adhesive compositions. After removing the plates from the oven, the cured adhesive compositions were visually inspected through the transparent polyetherimide windows and all 9 cured adhesive compositions had substantially no voids present.
  • EXAMPLE 9-14 Nine transparent polyetherimide (ULTEM ® ) windows (about the size of an ink jet printhead) were placed on top of the adhesive composition on each plate, and, thereafter, each plate was placed in an oven at about 110 degrees Celsius for approximately 45 minutes to cure the adhesive compositions. After removing the plates from the oven
  • test bars dog bones were prepared from the adhesive composition described in Example 1 and three test bars were prepared from the adhesive composition described in Example 6 (all test bars made according to ASTM Standards).
  • the test bars were submerged in sealed vessels filled with water or commercially available dye-based or pigment-based inks.
  • the test bars were placed in an oven set at 60 degrees Celsius for eight weeks. The results are compiled in the table below.
  • the percent decrease in hardness and the percent increase in weight reflect the superior properties of the adhesive compositions of this invention; particularly, their ability to resist chemical degradation caused by ink to a degree similar to that of the control not having a non-acrylic silane coupling agent.
  • a 0.0% change in hardness and weight means a 100.0% resistance to chemical degradation.
  • test bars of Examples 9-11 were prepared from the adhesive composition in Example 1 and the test bars of Examples 12-14 were prepared from the adhesive composition in Example 6.
  • B p commercially available pigment-based black ink
  • W deionized water.
  • D Weight was determined by weighing the test bars on a scale. The values depict an approximate percent average of the increase in weight after eight weeks in comparison to the test bars prior to being exposed to ink.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une nouvelle composition adhésive qui résiste à la dégradation chimique provoquée par les composants de l'encre. Cette composition adhésive est appliquée entre une tête (20) d'impression à jet d'encre et un boîtier (20) de cartouche d'encre pour système à jet d'encre. Elle contient un composé multifonctions comprenant une résine époxy au bisphénol-A, un agent de couplage au silane non acrylique comprenant un groupe glycidopropyle, un initiateur amine époxy et un modificateur de rhéologie.
PCT/US1999/015701 1998-07-10 1999-07-09 Materiau adhesif ameliore convenant pour des imprimantes thermiques a jet d'encre Ceased WO2000002730A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU52111/99A AU5211199A (en) 1998-07-10 1999-07-09 Improved adhesive material for use with thermal ink jet printers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11324998A 1998-07-10 1998-07-10
US09/113,249 1998-07-10

Publications (2)

Publication Number Publication Date
WO2000002730A1 WO2000002730A1 (fr) 2000-01-20
WO2000002730A9 true WO2000002730A9 (fr) 2000-06-02

Family

ID=22348395

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/015701 Ceased WO2000002730A1 (fr) 1998-07-10 1999-07-09 Materiau adhesif ameliore convenant pour des imprimantes thermiques a jet d'encre

Country Status (2)

Country Link
AU (1) AU5211199A (fr)
WO (1) WO2000002730A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20111011A1 (it) 2011-06-06 2012-12-07 Telecom Italia Spa Testina di stampa a getto d'inchiostro comprendente uno strato realizzato con una composizione di resina reticolabile
CN105934346B (zh) * 2014-01-29 2017-09-08 惠普发展公司，有限责任合伙企业 流体引导组件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013383A (en) * 1989-07-11 1991-05-07 Hewlett-Packard Company Epoxy adhesive for use with thermal ink-jet printers
DE69318369T2 (de) * 1992-10-22 1999-01-28 Ajinomoto Co., Inc., Tokio/Tokyo Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit

Also Published As

Publication number Publication date
AU5211199A (en) 2000-02-01
WO2000002730A1 (fr) 2000-01-20

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