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WO2000077886A1 - Antenne - Google Patents

Antenne Download PDF

Info

Publication number
WO2000077886A1
WO2000077886A1 PCT/DE2000/001449 DE0001449W WO0077886A1 WO 2000077886 A1 WO2000077886 A1 WO 2000077886A1 DE 0001449 W DE0001449 W DE 0001449W WO 0077886 A1 WO0077886 A1 WO 0077886A1
Authority
WO
WIPO (PCT)
Prior art keywords
waveguide
resonator
antenna
substrate
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/001449
Other languages
German (de)
English (en)
Inventor
Thomas Von Kerssenbrock
Patric Heide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2000077886A1 publication Critical patent/WO2000077886A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the invention relates to an antenna for high frequencies and a method for producing such an antenna.
  • An object of the present invention is to provide an antenna with a high efficiency.
  • Another object of the present invention is to provide an antenna with a high bandwidth.
  • the present invention should also be connectable to existing feed networks or waveguides.
  • the antenna has a radiation element which contains at least one substrate and at least one planar resonator on each substrate. In the simplest case, this is a single resonator applied to a substrate. However, several resonators can also be applied to a substrate and / or several substrates can be used.
  • the antenna can, for. B. connected to a wave generator. Waves, in particular microwaves and millimeter waves, can be fed into the resonator via the waveguide.
  • the resonator is separated from the waveguide by a gap. The gap is parallel to a plane of the resonator. This condition is e.g. B. given when the resonator and the waveguide are arranged in parallel one above the other.
  • Such an antenna has the advantage that the gap creates a region of low permittivity between the waveguide and the resonator. This in turn results in a high antenna efficiency, analogous to a low power loss, and a higher bandwidth.
  • This antenna is also easy to manufacture because the radiation element and the waveguide can be manufactured separately using flip-chip technology.
  • planar waveguide is a coplanar waveguide (CPW) because, among other things, it has a low line loss and a simple one
  • a CPW has at least one center conductor (“CPW feed”) and one ground (“ground”), which are typically applied to one side of an electrically insulating substrate.
  • CPW feed center conductor
  • ground ground
  • the waveguide is a CPW
  • the central conductor is electrically connected to the resonator, advantageously in such a way that the feed impedance is optimal.
  • the waveguide is a microstrip waveguide because it has a low insertion loss and is also widespread.
  • a strip - typically a metallization - is positioned above a mass, typically separated by a substrate.
  • the substrate of the emitting element is electrically insulating and low-loss.
  • flip-chip bonding it is also favorable if this substrate withstands a temperature T 300 300 ° C. during thermocompression bonding without damage. Both advantages are obtained if the substrate is made from A1 2 0, Si 3 N 4 , SiC, Si0 2 , Teflon or Duroid.
  • the use of A1 2 0 3 or glass is particularly preferred. Glass is a little less loss-free than A1 2 0 3 , but easier to manufacture or to shape than a ceramic.
  • the resonator consists of a highly conductive material.
  • a noble metal is particularly preferred due to the good corrosion resistance.
  • the expert is familiar with, for. B. Au, Ag, Cu, Pt or an alloy containing these metals, e.g. B. AgAu or PtRd.
  • the waveguide is connected to the radiating element by means of the flip-chip technology, because this enables simple manufacture of the individual parts and inexpensive assembly.
  • the gap is also easy to manufacture.
  • the height of the gap can be adjusted in a simple manner.
  • the gap is usually exposed to the environment so that it can fill with air. Due to its low permittivity, an air gap generates a low power loss. In addition to air or vacuum, the gap can also be filled with any other gases.
  • the gap can be made with a hardening liquid with the lowest possible permittivity and with the least possible loss be filled at high frequencies, e.g. B. with a resin or a foam.
  • a hardening liquid with the lowest possible permittivity and with the least possible loss be filled at high frequencies, e.g. B. with a resin or a foam.
  • the liquid is so thin during the filling of the gap that the gap can be filled evenly.
  • the radiation element is fixed to the waveguide by means of a spacer in the form of a plurality of support bumps.
  • the resonator in the case of an electrical connection between the waveguide and the resonator by means of an RF bump with the wave feed, for. B. the center conductor of the CPW or the strip of the microstrip waveguide, the waveguide.
  • field coupling aperture coupling
  • the height db of the bumps corresponds approximately to the height of the gap. It is particularly preferred if the height db of the bumps is between 40 ⁇ m and 100 ⁇ m, in particular between 50 ⁇ m and 70 ⁇ m (“microbumps”). However, the height can easily be up to 1000 ⁇ m.
  • the antenna is shown schematically in more detail.
  • FIG. 1 shows an antenna before assembly
  • FIG. 2 shows an antenna after assembly
  • FIG. 3 shows an antenna after assembly
  • FIGS. 4a to 4c show different possibilities for wave feeding (food network) according to Zürcher et al.
  • 5 shows several embodiments of resonators according to Zürcher et al.
  • FIGS. 6a to 6f show several embodiments of antennas with different connection types according to Zürcher et al.
  • Figure 4a shows a sectional front view of a waveguide in the form of a microstrip waveguide according to J.-F. Zürcher et al. (see above), page 3.
  • a strip 15 ′ and a flat mass 15 are applied to opposite surfaces of a substrate 14.
  • the field is guided between strips 15 'and ground area 15.
  • the main part of the field is in the substrate, a smaller part in the air.
  • Figure 4b shows a sectional view m front view of a waveguide in the form of a slot guide ("Slotline wave guide") according to J.-F. Zürcher et al. (see above), page 3.
  • Slotline wave guide a slot guide
  • a left mass 16 'and a right mass 16 are applied. The field is guided between left mass 16 'and right mass 16.
  • FIG. 4c shows a sectional view in front view of a waveguide in the form of a coplanar waveguide, CPW according to J.-F. Zürcher et al. (see above), page 3.
  • a middle conductor 17 '("CPW feed") and two flat metal layers are applied as mass 17 on one side of the substrate 14. The field is guided between the center conductor 17 'and the two ground areas 17.
  • planar lines have in common that they represent an inexpensive alternative to conventional waveguides, in particular waveguides.
  • the parameters stripe width, high and permittivity of the substrate etc. determine the quality of the conductors (see also 0. Zinke et al.)
  • Figure 5 shows different types of planar resonators according to J.-F. Zürcher et al. (see above), page 20.
  • the resonators 121 are in microstrip technology on the substrate 14.
  • Figure 6a shows an antenna with microstrip waveguide according to J.-F. Zürcher et al. (see above), page 27.
  • the strip 15 ' is electrically connected to the resonator 121.
  • Figure 6b shows an antenna with microstrip waveguide according to J.-F. Zürcher et al. (see above), page 29.
  • the resonator 121 is fed by means of a field 15 applied to the same side of the substrate 14 by means of a strip 15 '.
  • the strip 15 ' is attached separately from the resonator 121.
  • Figure 6c shows an antenna with microstrip waveguide according to J.-F. Zürcher et al. (see above), page 30.
  • the strip 15 ' is attached below the resonator 121 and separated from it by an additional insulating layer 14'.
  • the resonator 121 is operated via the strip 15 'by means of field coupling.
  • FIG. 6d shows a further embodiment of an antenna in SSFIP ("strip slot foam inverted patch") design according to J.-F. Zürcher et al. (see above), page 47.
  • the strip 15 ' is separated from a layer provided with a slot by a substrate 14 and the layer is in turn separated from the resonator 121 by a layer 15' 'of hardened foam.
  • the patch is glued directly onto the foam using a flexible film.
  • Figure 1 shows an oblique view of an antenna before its assembly using flip-chip technology.
  • a coplanar waveguide 2 (CPW) consists of a substrate 21 made of A1 2 0 3 , which is coated with a central conductor 22 in the form of a metallic tongue. From this, electrically isolated, the mass 23 is applied to the substrate 21 in the form of a metallic layer. 3 support bumps 31 are applied to the mass 23 as spacers. On the wave ter is an electrically conductive HF (radio frequency) Bu p 4 attached.
  • CPW coplanar waveguide 2
  • a radiation element 1 which consists of a substrate 11, a resonator 12 mounted thereon and four metallizations 13.
  • the metallizations 13 are positioned so that they correspond to the distribution of the support bumps 31.
  • the radiating element 1 is folded onto the waveguide 2 such that the metallizations 13 rest on the support bumps 31 and then the radiating element 1 and the waveguide 2 are pressed onto one another (indicated by the arrows).
  • thermocompression bonding is done by means of thermocompression bonding at a temperature T between 250 ° C and 300 ° C. Because of its high temperature resistance, a substrate 13, 21 made of A1 2 0 3 is well suited for this.
  • Pressing creates a fixed connection between the radiating element 1 and the waveguide 2.
  • the pressing process is controlled so that the resonator 12 is at a constant distance db from the waveguide 2.
  • the center conductor 22 is also connected to the resonator 12 by means of the HF bump 4 during pressing.
  • Figure 2 shows a sectional view in front view of the antenna of Figure 1 after assembly.
  • the use of other non-conductive materials is also possible, e.g. As SiC, Si 3 N 4 , Teflon or Duroid, which also have the advantage of withstanding the temperatures necessary for thermocompression bonding.
  • the resonator 12 can also be connected to the waveguide by means of other flip-chip techniques, e.g. B. reflux bonding ("reflow bonding") or adhesive bonding.
  • the support bumps 31 rest on the mass 23 of the waveguide 2 in the form of the metallic layer and on the metallization 13 of the radiating element, the HF bump 4 on the central conductor 22 and on the resonator 12.
  • this high db can be set with an accuracy of ⁇ 1 ⁇ m, which is the case at high frequencies, e.g. B. millimeter waves with f> 20 GHz, is of great importance.
  • wire bonds or wire bonds show a significantly higher disturbance in wave propagation.
  • the use of bumps 4.31 made of gold is particularly advantageous.
  • the gap between the resonator 12 and the waveguide 2 produced by the bumps 31 is generally filled with air.
  • An electric field E forms between the resonator 12 and the metallic layer 23 within the gap.
  • This arrangement is analogous to a microstrip line in which the resonator 12 corresponds to the strip 15 '.
  • the substrate 14 then essentially consists of the contents of the gap, e.g. Air or vacuum.
  • the resonator 12 borders directly on the gap.
  • one or more layers to be additionally applied between the resonator 12 and the gap. This is easily possible with the flip-chip technology, because the radiation element 1 can be finished separately before the bonding. For example, it is possible to combine an MMIC with an antenna without any particular additional effort.
  • This antenna thus has the advantage that, due to the low dielectric constant ⁇ r of the gap content, the radiation efficiency is very high, or is optimal in the case of air.
  • Figure 3 shows a plot of the amount of adjustment or input reflection (mag Sll) in dB against the radiation frequency f in GHz. Each graph corresponds to a different height db of the bumps 4.31 and thus a different gap height.
  • the center frequency of the antenna can easily be set in a wide range of approximately 10 GHz.

Landscapes

  • Waveguide Aerials (AREA)

Abstract

L'invention concerne une antenne présentant, d'une part, un élément de rayonnement (1) qui contient au moins un substrat (11) et au moins un résonateur (12) plat appliqué sur le (11), et, d'autre part, un guide d'ondes (2) plat. Cette antenne est caractérisée en ce que le résonateur (12) est séparé du guide d'ondes (2) par une fente qui est parallèle à un plat du résonateur (12).
PCT/DE2000/001449 1999-06-10 2000-05-09 Antenne Ceased WO2000077886A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19926465.1 1999-06-10
DE19926465 1999-06-10

Publications (1)

Publication Number Publication Date
WO2000077886A1 true WO2000077886A1 (fr) 2000-12-21

Family

ID=7910787

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001449 Ceased WO2000077886A1 (fr) 1999-06-10 2000-05-09 Antenne

Country Status (1)

Country Link
WO (1) WO2000077886A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2484704A (en) * 2010-10-21 2012-04-25 Bluwireless Tech Ltd Patch antenna structure formed with an air gap in a flip-chip assembly
WO2013138275A1 (fr) * 2012-03-12 2013-09-19 University Of South Florida Capteurs biocompatibles implantables au carbure de silicium
DE102017109740B4 (de) 2016-05-06 2023-07-13 GM Global Technology Operations LLC HF-Steckverbinderbaugruppe zum Verbinden einer koplanaren CPW-Antenne

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0388011A2 (fr) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Procédé de fabrication d'un dispositif semi-conducteur
US5757074A (en) * 1995-07-07 1998-05-26 Hughes Electronics Corporation Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements
US5898405A (en) * 1994-12-27 1999-04-27 Kabushiki Kaisha Toshiba Omnidirectional antenna formed one or two antenna elements symmetrically to a ground conductor
US5903239A (en) * 1994-08-11 1999-05-11 Matsushita Electric Industrial Co., Ltd. Micro-patch antenna connected to circuits chips

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0388011A2 (fr) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Procédé de fabrication d'un dispositif semi-conducteur
US5903239A (en) * 1994-08-11 1999-05-11 Matsushita Electric Industrial Co., Ltd. Micro-patch antenna connected to circuits chips
US5898405A (en) * 1994-12-27 1999-04-27 Kabushiki Kaisha Toshiba Omnidirectional antenna formed one or two antenna elements symmetrically to a ground conductor
US5757074A (en) * 1995-07-07 1998-05-26 Hughes Electronics Corporation Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CARVER KC AND MINK JW: "Microstrip antenna technology", IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, vol. AP-29, January 1989 (1989-01-01), New York, USA, pages 2 - 24, XP002144795 *
PETRE P ET AL: "Simulation and performance of passive microwave and millimeter wave coplanar waveguide circuit devices with flip chip packaging", ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 27 October 1997 (1997-10-27) - 29 October 1997 (1997-10-29), San Jose, CA, USA, pages 203 - 206, XP002144787 *
SIMONS R N ET AL: "COPLANAR-WAVEGUIDE/MICROSTRIP PROBE COUPLER AND APPLICATIONS TO ANTENNAS", ELECTRONICS LETTERS,GB,IEE STEVENAGE, vol. 26, no. 24, 22 November 1990 (1990-11-22), pages 1998 - 2000, XP000175613, ISSN: 0013-5194 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2484704A (en) * 2010-10-21 2012-04-25 Bluwireless Tech Ltd Patch antenna structure formed with an air gap in a flip-chip assembly
WO2013138275A1 (fr) * 2012-03-12 2013-09-19 University Of South Florida Capteurs biocompatibles implantables au carbure de silicium
US10278629B2 (en) 2012-03-12 2019-05-07 University Of South Florida Implantable biocompatible SiC sensors
DE102017109740B4 (de) 2016-05-06 2023-07-13 GM Global Technology Operations LLC HF-Steckverbinderbaugruppe zum Verbinden einer koplanaren CPW-Antenne

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