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WO2000067944A1 - Dispositif de microcablage ultrasonore - Google Patents

Dispositif de microcablage ultrasonore Download PDF

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Publication number
WO2000067944A1
WO2000067944A1 PCT/DE2000/001434 DE0001434W WO0067944A1 WO 2000067944 A1 WO2000067944 A1 WO 2000067944A1 DE 0001434 W DE0001434 W DE 0001434W WO 0067944 A1 WO0067944 A1 WO 0067944A1
Authority
WO
WIPO (PCT)
Prior art keywords
transducer
wire bonding
ultrasonic
ultrasonic wire
clamping device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/001434
Other languages
German (de)
English (en)
Inventor
Frank Walther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hesse and Knipps GmbH
Original Assignee
Hesse and Knipps GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse and Knipps GmbH filed Critical Hesse and Knipps GmbH
Priority to AU56719/00A priority Critical patent/AU5671900A/en
Priority to DE10081207T priority patent/DE10081207D2/de
Publication of WO2000067944A1 publication Critical patent/WO2000067944A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • the invention relates to an ultrasound wire bonding device with a bond head that can be moved and rotated in the Z direction and to which an ultrasound transducer with an associated bonding tool and an ultrasound oscillation generator is attached by means of a transducer receptacle, the transducer receptacle being designed as a spring-elastic parallel in the Z direction. is formed guide and wherein a drive device is provided between the bondhead and the transducer receptacle to move the transducer receptacle in the Z direction relative to the bondhead.
  • Ultrasonic wire bonding devices of this type are required for the assembly of semiconductor components and are used to produce wire bridges, for example between bonding pads on semiconductor chips and contact pads on a carrier element on which the semiconductor component has been mounted beforehand.
  • the ultrasonic energy required for ultrasonic wire bonding is provided by an ultrasonic vibration generator and transmitted to an attached bond tool via an ultrasonic transducer.
  • This bond unit is usually attached to a rotatable and rotatable bond head in the Z direction such that the bond tool can be moved in the Z direction relative to the bond head.
  • This movement of the bonding tool is achieved in that the transducer is arranged on the bonding head so as to be pivotable about a horizontal axis. It is also possible to arrange the bonding unit in a vertical guide on the bonding head.
  • a device has become known in which a bonding unit consisting of ultrasound vibration generator, transducer and bonding tool is attached to the bonding head via a four-armed bracket.
  • This four-armed bracket is formed by an upper and a lower plate, which are extension arms of the four-armed bracket.
  • flexible, leaf spring Mige connecting elements are provided, which connect the plates with the bonding head on the one hand and with a receptacle for the transducer on the other. With this holder, the transducer can be moved in the Z direction relative to the bondhead.
  • Such a device consists of a large number of components, so that the assembly process is very complex.
  • the construction of the four-armed bracket is very complicated, which proves to be very disadvantageous in particular in the event of a necessary repair, for example if one of the springs breaks.
  • the invention is therefore based on the object of creating an ultrasonic wire bonding device with a transducer holder which has a particularly simple structure, can be produced at low cost and which allows simple and quick assembly.
  • the object on which the invention is based is achieved in an ultrasonic wire bonding device of the type mentioned at the outset in that the transducer holder is designed as a parallel guide made from one piece and a clamping device for the ultrasonic transducer, a fastening block for fastening the transducer holder on Bond head and solid joints.
  • An ultrasound wire bonding device designed in this way creates a particularly simple transducer receptacle, which, particularly in the case of servicing, enables the wire bonding device to be mounted easily and quickly on the bonding head.
  • the main advantage of this solution is, however, that the transducer can now be moved out of the rest position after being placed on the bond site, it being possible either to run through a predetermined deformation profile or to regulate the bond force.
  • the invention provides an ultrasonic wire bonding device with a completely maintenance-free transducer holder, in which it is not necessary to work on mechanical stops. The consequence of this is that the otherwise necessary calming times and repositioning movements can be dispensed with.
  • the transducer receptacle between the clamping device and the fastening block has a translating parallelogram which includes the solid-state joints, i.e. a four-link chain with solid-state joints is implemented. All movable elements, including the associated fastening elements, are thus combined in a one-piece assembly, which can be produced, for example, by eroding or laser cutting.
  • the translating parallelogram consists of two support arms running parallel to each other, in each of which a solid-state joint is incorporated at the transition to the clamping device or the fastening block.
  • the support arms are further designed so that they have a high bending stiffness between the respective solid joints.
  • the width of the transducer holder and also of the support arms is determined by the width of the transducer. This is necessary because the ultrasound transducer extends transversely through the transducer receptacle and the bonding tool is fastened to the transducer at a distance from it.
  • the bonding force required for wire bonding must under no circumstances lead to a twisting of the transducer receptacles, but it must be ensured that the bonding tool is largely only moved along the Z axis.
  • the slight parallel displacement of the transducer in the X direction which is inevitably caused by the parallel guidance, is not critical since after the touch-down of the bonding tool, no subsequent movement is required.
  • the required bonding force is only generated by the corresponding electrical control of the drive device.
  • a further development of the invention according to the invention is characterized in that the clamping device surrounds the ultrasound transducer in a positive and non-positive manner, which enables simple assembly.
  • the clamping device is preferably provided with a bore for receiving the ultrasound transducer, in which a plurality of receiving elements are regularly distributed. These receiving elements are designed as mating surfaces which at least partially enclose the ultrasound transducer in a form-fitting manner.
  • a recess running transversely to the bore and approximately to the center of the bore is machined into the clamping device.
  • the parts of the clamping device located next to the recess can thus be braced against one another with a tensioning device, which at the same time leads to the transducer being securely clamped.
  • the clamping device preferably consists of a clamping screw running parallel to the bore.
  • a further embodiment of the invention is characterized in that a coupling element protruding inwards between the support arms for coupling the drive device protrudes from the clamping device.
  • the drive device preferably consists of a voice coil drive with which the required actuating forces in the Z direction can be exerted in a finely metered manner on the clamping device.
  • the base part of the voice coil drive which is provided with a coil, is fastened to the bonding head and its actuator, which is designed as a magnetic actuator, is connected to the coupling element.
  • a distance sensor is furthermore arranged on the bonding head, which is directed towards the clamping device.
  • An ultrasonic wire bonding device designed according to the invention has further advantages over the solutions known from the prior art. This means that the otherwise necessary repositioning movement after the bonding tool has been placed on the bonding point can be dispensed with. The deformation path required for bonding can be traversed from the rest position of the transducer. The electrical control of the Voce-Coil drive is used for this. This means an additional time saving per bonding process, which is approx. 20 ms.
  • FIG. 1 shows a front view of the ultrasonic wire bonding device with a transducer holder according to the invention arranged on a bonding head;
  • FIG. 2 shows a side view, partly in section, of the ultrasonic wire bonding device according to FIG. 1;
  • Fig. 3 is a perspective view of the transducer holder with a transducer attached to it with an ultrasonic vibration generator and a bonding tool.
  • Fig. 5 is a plan view of the transducer holder.
  • a bonding head 1 which is fastened to an ultrasonic wire bonder so that it can be rotated and displaced vertically in the Z direction.
  • a cantilever 2 which projects vertically downward outside the axis of rotation and which is firmly connected to the bondhead 1.
  • This cantilever 2 serves to receive a transducer receptacle 3, to which a transducer 4 with a bonding tool 5 attached thereto and an associated ultrasonic oscillator 6 are detachably attached.
  • the transducer receptacle 3 contains a clamping device 7 for receiving the transducer 4 and a fastening block 8 with which the transducer receptacle 3 is fastened to the bracket 2 with the aid of a screw connection 9. Between the clamping device 7 and the fastening block 8, the transducer receptacle 3 contains a parallel guide, consisting of two support arms 10 arranged at a distance from one another. These support arms 10 are each connected to the clamping device 7 or the fastening block 8 via a solid-state joint 11. The attachment of the transducer receptacle 3 with the mounting block 8 to the arm 2 is carried out in such a way that the clamping device 7 can be moved up or down in the Z direction against the spring force of the solid body joints 11.
  • transducer holder 3 The special characteristic of the transducer holder 3 can be seen in the fact that it includes the clamping device 7, the Support arms 10, the solid joints 11 and the mounting block 8 is integrally formed. This assembly can be mounted on the cantilever 2 in a few simple steps and without any special adjustment effort, which significantly increases the ease of servicing of the entire bond head.
  • the clamping device 7 contains a bore 12 for receiving the ultrasound transducer 4.
  • this bore 12 three receiving elements 13 are arranged regularly distributed on the surface of the bore, which are each formed as a mating surface 14. These mating surfaces 14 enclose the ultrasound transducer 4 at least partially in a form-fitting manner.
  • the clamping device 7 is provided with a recess 15 which extends transversely to the bore 12 and approximately to the center of the bore, as can be seen clearly from FIGS. 3, 5.
  • the clamping parts 16, 17 of the clamping device 7 located next to the recess 15 can thus be clamped against one another with the aid of a clamping device.
  • the clamping device used in the exemplary embodiment consists of a clamping screw 18 arranged parallel to the bore 12.
  • This clamping screw 18 is screwed into a threaded bore in the left part 16 of the clamping device 7 next to the recess 15 and extends through a bore in the other part 18, so that through Turning the clamping screw 18 can produce a clamping force acting on the transducer 4. It is understood that only a slight tensioning of the clamping parts 16, 17 in the elastic range is required for a sufficient clamping force. A prerequisite for this, however, is a sufficiently precise fit between the transducer 4 and the receiving elements 13, so that the transducer 4 can be pushed tightly into the tensioning device when it is relaxed.
  • a drive device which in the present exemplary embodiment consists of a voce-coil drive 19.
  • This voice coil drive 18 contains a base part 20, which is fastened to the bondhead 1 directly above the clamping device 7 and a magnetic actuator 21.
  • This magnetic actuator 21 acts directly on the clamping device 7, which thus acts with the magnetic actuator 21 in the Z direction can be moved away from or in the direction of the bondhead 1.
  • a coupling element 22 protrudes inward from the latter, to which the actuator 21 is laterally attached by a screw connection 23.
  • a distance sensor 24 is also provided, which is directed towards an outer surface of the clamping device 7. The relative position of the transducer 4 relative to the bonding head 1 can thus be measured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un dispositif de microcâblage ultrasonore comprenant une tête de câblage (1) rotative et déplaçable dans le sens des Z, sur laquelle est fixé un transducteur (4) ultrasonore au moyen d'une cavité de réception appropriée (3) et qui comporte un outil de câblage (5) associé et un générateur de vibrations (6) ultrasonores. La cavité de réception (3) du transducteur se présente sous forme de guide parallèle articulé en quatre points à déformation dans le sens des Z. Il est prévu entre la tête de câblage (3) et la cavité de réception (1) du transducteur un dispositif d'entraînement (21) pour déplacer ladite cavité de réception (3) du transducteur dans le sens des Z par rapport à la tête de câblage (1). L'invention vise à mettre au point un dispositif de câblage ultrasonore avec une cavité de réception du transducteur, de structure particulièrement simple, de fabrication économique et dont le montage soit rapide et aisé. Selon l'invention, la cavité de réception du transducteur (3) est réalisée à partir d'une pièce et comprend un dispositif de serrage (7) pour le transducteur ultrasonore (4), un bloc de fixation (8) pour fixer la cavité de réception du transducteur (3) sur la tête de câblage (1), ainsi que des joints à corps plein (11).
PCT/DE2000/001434 1999-05-07 2000-05-08 Dispositif de microcablage ultrasonore Ceased WO2000067944A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU56719/00A AU5671900A (en) 1999-05-07 2000-05-08 Ultrasonic wire bonding device
DE10081207T DE10081207D2 (de) 1999-05-07 2000-05-08 Ultraschall-Drahtbondeinrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19921177A DE19921177A1 (de) 1999-05-07 1999-05-07 Ultraschall-Drahtbondeinrichtung
DE19921177.9 1999-05-07

Publications (1)

Publication Number Publication Date
WO2000067944A1 true WO2000067944A1 (fr) 2000-11-16

Family

ID=7907361

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/001434 Ceased WO2000067944A1 (fr) 1999-05-07 2000-05-08 Dispositif de microcablage ultrasonore

Country Status (3)

Country Link
AU (1) AU5671900A (fr)
DE (2) DE19921177A1 (fr)
WO (1) WO2000067944A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3269492A1 (fr) 2016-07-15 2018-01-17 Telsonic Holding AG Dispositif de soudure par ultrasons et sonotrodes pour un tel dispositif
DE212017000184U1 (de) 2016-07-15 2019-02-19 Telsonic Holding Ag Vorrichtung zum Ultraschallschweißen und Sonotrode für eine solche Vorrichtung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716786A1 (de) * 1986-05-20 1987-11-26 Shinko Denshi Kk Waage mit einem kraft-frequenzumsetzer als lastfuehler
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
US5685476A (en) * 1995-08-03 1997-11-11 Kaijo Corporation Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus
EP0864392A1 (fr) * 1997-03-13 1998-09-16 F & K Delvotec Bondtechnik GmbH Tête de jonction

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29510274U1 (de) * 1995-06-24 1995-09-14 Schunk Ultraschalltechnik GmbH, 35435 Wettenberg Vorrichtung zum Verschweißen von Metallteilen mittels Ultraschall

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
DE3716786A1 (de) * 1986-05-20 1987-11-26 Shinko Denshi Kk Waage mit einem kraft-frequenzumsetzer als lastfuehler
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
US5685476A (en) * 1995-08-03 1997-11-11 Kaijo Corporation Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus
EP0864392A1 (fr) * 1997-03-13 1998-09-16 F & K Delvotec Bondtechnik GmbH Tête de jonction

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Also Published As

Publication number Publication date
DE19921177A1 (de) 2000-11-16
DE10081207D2 (de) 2001-10-18
AU5671900A (en) 2000-11-21

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