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WO2000062585A1 - Circuit board with arrangement for cooling power components - Google Patents

Circuit board with arrangement for cooling power components Download PDF

Info

Publication number
WO2000062585A1
WO2000062585A1 PCT/FI2000/000311 FI0000311W WO0062585A1 WO 2000062585 A1 WO2000062585 A1 WO 2000062585A1 FI 0000311 W FI0000311 W FI 0000311W WO 0062585 A1 WO0062585 A1 WO 0062585A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cooling layer
heat
power components
primary cooling
Prior art date
Application number
PCT/FI2000/000311
Other languages
French (fr)
Inventor
Gösta BAARMAN
Björn HOLMSTRÖM
Markku JÄMSÄ
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Priority to AU39686/00A priority Critical patent/AU3968600A/en
Publication of WO2000062585A1 publication Critical patent/WO2000062585A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Definitions

  • the invention relates to a circuit board with an arrangement for cooling power components, the circuit board having at least one conductive layer for supplying signals and/or current to the active and other components installed on the circuit board, a primary cooling layer, and insulation material insulating the conductive layers and the primary cooling layer from each other and binding the circuit board, whereby one or more heat-generating power components having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer in order to cool the heat- generating power components on the circuit board.
  • Cooling in itself is an old and known problem.
  • electronics for instance, its significance has continuously grown with the increase in integration densities and power, because all electronic components generate heat whose dissipation is necessary for optimum and reliable operation of the components.
  • electronics continuously moves towards using higher and higher power in smaller and smaller volume, the temperature control of electronic components has become a conclusive criterion in design.
  • Many of today's electronic equipment require cooling which cannot be achieved by conventional metal cooling fins.
  • the object of the invention is achieved by a circuit board characterized in that it has at least one secondary cooling layer which is galvanically insulated from the primary cooling layer and that one or more heat-generating power components having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer in order to cool the heat-generating power components on the circuit board.
  • the invention is based on the idea that one or more heat- generating power components having the same electric potential are attached to a primary cooling layer which is galvanically insulated from a secondary cooling layer to which one or more heat-generating power components having the same electric potential are attached, which results in that one power component cannot conduct current to another power component having a different electric potential.
  • a preferred embodiment of the circuit board of the invention provides the advantage that since the surface area of the primary cooling layer substantially corresponds to the surface area of the circuit board, cooling is efficient, because one component to be cooled can have a cooling layer of the size of the circuit board.
  • the circuit board of the invention provides the further advantage that it can be made of any ordinary, inexpensive circuit board material, such as copper metal, glass fibre and epoxy, making the manufacturing costs of the circuit board low.
  • Figure 1 is a side-view schematic of a six-layer circuit board, the circuit board having a primary cooling layer and one secondary cooling layer,
  • Figure 2 is a side-view schematic of a six-layer circuit board, the circuit board having a primary cooling layer and one secondary cooling layer
  • Figure 3 is a side-view schematic of an eight-layer circuit board, the circuit board having a primary cooling layer and three secondary cooling layers
  • Figure 4 is a side-view schematic of an eight-layer circuit board, the circuit board having a primary cooling layer and three secondary cooling layers.
  • Figures 1 to 4 show schematics of circuit boards with an arrangement for cooling heat-generating power components 1.
  • the circuit board has at least one conductive layer 2 for supplying signals and/or current to the power components 1 and other components (not shown) installed on the circuit board, and one primary cooling layer 3.
  • the number of conductive layers 2 depends, for instance, on the purpose of use of the circuit board.
  • One or more heat-generating power components 1 having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer 3 in order to cool the heat-generating power components 1 on the circuit board.
  • an power component 1 refers to a component whose operation generates so much thermal energy that cooling is required.
  • the circuit board is layered which means that it is made of several layers having substantially the same surface area.
  • the thickness of the layers may vary from one layer to another.
  • the circuit board has an insulating material 4 which insulates the conductive layers 2 and the primary cooling layer 3 from each other and binds the circuit board. With a thin insulating layer, the thermal resistance between two conducting layers or one conducting layer and one cooling layer is smaller.
  • the circuit board also has at least one secondary cooling layer 5 which is galvanically insulated from the primary cooling layer 3.
  • One or more heat-generating power components 1 having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer 5 in order to cool the heat-generating power components 1 on the circuit board.
  • the insulating material 4 preferably insulates the primary cooling layer 3 from the secondary cooling layer 5.
  • circuit board has a primary cooling layer 3 and one secondary cooling layer 5, for instance, as in Figures 1 and 2, two heat-generating power components 1 having a different electric potential or two groups of power components formed by heat-generating power components 1 having substantially the same electric potential can thus be cooled without the power components 1 having different electric potentials conducting current to each other.
  • the circuit boards in Figures 3 and 4 comprise a primary cooling layer 3 and three secondary cooling layers 5. The arrangements in Figures 3 and 4 can thus cool four heat-generating power components 1 having different electric potentials or four groups of power components formed by heat- generating power components 1 having substantially the same electric potential without the power components 1 having different electric potentials conducting current to each other.
  • the thickness of the conductive layers 2 can be 60 to 110 ⁇ m, for instance, and that of the cooling layers 3 and 5 can be 100 to 200 ⁇ m, for instance.
  • the primary cooling layer 3 and the secondary cooling layers 5 are preferably made of copper metal. Alternatively these can be made of another material with a good heat transmission property.
  • the layers 3 and 5 can also be used for supplying signals and/or current.
  • the insulating material 4 preferably comprises epoxy and glass fibre. Alternatively, these layers can be made of some other insulating material binding the cooling layers 3 and 5 and the conductive layers 2 together.
  • the conductive layers 2 are preferably made of copper metal. Alternatively, these layers can be made of another electrically conductive material.
  • the circuit board preferably comprises first heat transmission elements 6 which are arranged to transmit thermal energy from the heat- generating power component 1 to the primary cooling layer 3 and/or the secondary cooling layer 5.
  • the heat transmission elements can be lead- throughs.
  • the first heat transmission elements 6 are made of first dummy holes which are between the surface of the circuit board and the primary cooling layer 3 and arranged to transmit thermal energy from the heat- generating power component 1 to the primary cooling layer, and of such first dummy holes which are between the surface of the circuit board and the secondary cooling layer 5 and arranged to transmit thermal energy from the heat-generating power component 1 to the secondary cooling layer 5.
  • the circuit board preferably has second heat transmission elements 7 which are arranged to transmit thermal energy from the primary cooling layer 3 and/or the secondary cooling layer 5 to the surrounding area.
  • Figure 2 shows a circuit board whose first heat transmission elements 6 and second heat transmission elements 7 are combined so that the first dummy holes and the second dummy holes form a unified structure running through the circuit board.
  • the first dummy holes and the second dummy holes are preferably at least partly filled with the insulating material 4.
  • the primary cooling layer 3 and/or one secondary cooling layer 5 can form a part of the circuit board surface so that the heat- generating power component 1 is attached directly to the surface of the primary cooling layer 3 and/or one secondary cooling layer 5.
  • the primary cooling layer 3 and the secondary cooling layers 5 can be made up of the windings of an inductive component integrated to the circuit board.
  • the primary cooling layer 3 and the secondary cooling layers 5 can form the winding of an inductive component.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a circuit board with an arrangement for cooling power components (1), which circuit board has at least one conductive layer (2) for supplying signals and/or current to the active and other components installed on the circuit board, one primary cooling layer (3), and an insulating material (4) which insulates the conductive layers (2) and the primary cooling layer (3) from each other and binds the circuit board, whereby one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer (3) in order to cool the heat-generating power components (1) on the circuit board. The circuit board has at least one secondary cooling layer (5) which is galvanically insulated from the primary cooling layer (3), and one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer (5) in order to cool the heat-generating power components (1) on the circuit board.

Description

CIRCUIT BOARD WITH ARRANGEMENT FOR COOLING POWER COMPONENTS
BACKGROUND OF THE INVENTION
The invention relates to a circuit board with an arrangement for cooling power components, the circuit board having at least one conductive layer for supplying signals and/or current to the active and other components installed on the circuit board, a primary cooling layer, and insulation material insulating the conductive layers and the primary cooling layer from each other and binding the circuit board, whereby one or more heat-generating power components having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer in order to cool the heat- generating power components on the circuit board.
Cooling in itself is an old and known problem. In electronics, for instance, its significance has continuously grown with the increase in integration densities and power, because all electronic components generate heat whose dissipation is necessary for optimum and reliable operation of the components. Since electronics continuously moves towards using higher and higher power in smaller and smaller volume, the temperature control of electronic components has become a conclusive criterion in design. Many of today's electronic equipment require cooling which cannot be achieved by conventional metal cooling fins.
Various arrangements for cooling the power components on a circuit board are previously known.
Article "Metal Core Boards - an alternative for cooling critical components" in the Circuits Manufacturing publication, September 1980, pages 74 to 80, discloses a circuit board with an arrangement for cooling power components, which circuit board uses a metal core as a cooling layer to transmit the thermal energy generated by the power components to the circuit board. The power components are cooled as the thermal energy is transmitted from them to the cooling layer. A problem with the above arrangement is that it is not possible to attach several power components having a different electric potential to one and the same cooling layer, because the power components also conduct current to the cooling layer. If several power components having a different electric potential were attached to the same cooling layer, this would result in having the current conducted from one power component also conducted to the other components installed on the cooling layer. This would cause disruption in the operation of the power components and possible damage to the components.
BRIEF DESCRIPTION OF THE INVENTION It is thus an object of the invention to develop a circuit board with an arrangement for cooling the power components, which arrangement solves the above problem.
The object of the invention is achieved by a circuit board characterized in that it has at least one secondary cooling layer which is galvanically insulated from the primary cooling layer and that one or more heat-generating power components having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer in order to cool the heat-generating power components on the circuit board.
Preferred embodiments of the circuit board of the invention are disclosed in the dependent claims.
The invention is based on the idea that one or more heat- generating power components having the same electric potential are attached to a primary cooling layer which is galvanically insulated from a secondary cooling layer to which one or more heat-generating power components having the same electric potential are attached, which results in that one power component cannot conduct current to another power component having a different electric potential.
A preferred embodiment of the circuit board of the invention provides the advantage that since the surface area of the primary cooling layer substantially corresponds to the surface area of the circuit board, cooling is efficient, because one component to be cooled can have a cooling layer of the size of the circuit board.
The circuit board of the invention provides the further advantage that it can be made of any ordinary, inexpensive circuit board material, such as copper metal, glass fibre and epoxy, making the manufacturing costs of the circuit board low.
BRIEF DESCRIPTION OF THE FIGURES
In the following, the invention will be described by means of preferred embodiments and with reference to the attached drawings, in which Figure 1 is a side-view schematic of a six-layer circuit board, the circuit board having a primary cooling layer and one secondary cooling layer,
Figure 2 is a side-view schematic of a six-layer circuit board, the circuit board having a primary cooling layer and one secondary cooling layer, Figure 3 is a side-view schematic of an eight-layer circuit board, the circuit board having a primary cooling layer and three secondary cooling layers, and
Figure 4 is a side-view schematic of an eight-layer circuit board, the circuit board having a primary cooling layer and three secondary cooling layers.
DETAILED DESCRIPTION OF THE INVENTION
Figures 1 to 4 show schematics of circuit boards with an arrangement for cooling heat-generating power components 1. As shown in Figures 1 to 4, the circuit board has at least one conductive layer 2 for supplying signals and/or current to the power components 1 and other components (not shown) installed on the circuit board, and one primary cooling layer 3. The number of conductive layers 2 depends, for instance, on the purpose of use of the circuit board.
One or more heat-generating power components 1 having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer 3 in order to cool the heat-generating power components 1 on the circuit board.
Because supplying signals and current to the power components 1 and other components on the circuit board is a technique known per se and not the object of the present invention, it is not presented in greater detail in this context.
In this context, an power component 1 refers to a component whose operation generates so much thermal energy that cooling is required.
The circuit board is layered which means that it is made of several layers having substantially the same surface area. The thickness of the layers may vary from one layer to another.
The circuit board has an insulating material 4 which insulates the conductive layers 2 and the primary cooling layer 3 from each other and binds the circuit board. With a thin insulating layer, the thermal resistance between two conducting layers or one conducting layer and one cooling layer is smaller.
The circuit board also has at least one secondary cooling layer 5 which is galvanically insulated from the primary cooling layer 3. One or more heat-generating power components 1 having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer 5 in order to cool the heat-generating power components 1 on the circuit board.
The insulating material 4 preferably insulates the primary cooling layer 3 from the secondary cooling layer 5.
Having the primary cooling layer 3 and the secondary cooling layer 5 galvanically insulated from each other means here that electric current cannot be conducted between them. If the circuit board has a primary cooling layer 3 and one secondary cooling layer 5, for instance, as in Figures 1 and 2, two heat-generating power components 1 having a different electric potential or two groups of power components formed by heat-generating power components 1 having substantially the same electric potential can thus be cooled without the power components 1 having different electric potentials conducting current to each other. The circuit boards in Figures 3 and 4 comprise a primary cooling layer 3 and three secondary cooling layers 5. The arrangements in Figures 3 and 4 can thus cool four heat-generating power components 1 having different electric potentials or four groups of power components formed by heat- generating power components 1 having substantially the same electric potential without the power components 1 having different electric potentials conducting current to each other.
The thickness of the conductive layers 2 can be 60 to 110μm, for instance, and that of the cooling layers 3 and 5 can be 100 to 200 μm, for instance. The primary cooling layer 3 and the secondary cooling layers 5 are preferably made of copper metal. Alternatively these can be made of another material with a good heat transmission property. The layers 3 and 5 can also be used for supplying signals and/or current.
The insulating material 4 preferably comprises epoxy and glass fibre. Alternatively, these layers can be made of some other insulating material binding the cooling layers 3 and 5 and the conductive layers 2 together. The conductive layers 2 are preferably made of copper metal. Alternatively, these layers can be made of another electrically conductive material.
The circuit board preferably comprises first heat transmission elements 6 which are arranged to transmit thermal energy from the heat- generating power component 1 to the primary cooling layer 3 and/or the secondary cooling layer 5. The heat transmission elements can be lead- throughs.
In Figure 1 , the first heat transmission elements 6 are made of first dummy holes which are between the surface of the circuit board and the primary cooling layer 3 and arranged to transmit thermal energy from the heat- generating power component 1 to the primary cooling layer, and of such first dummy holes which are between the surface of the circuit board and the secondary cooling layer 5 and arranged to transmit thermal energy from the heat-generating power component 1 to the secondary cooling layer 5.
The circuit board preferably has second heat transmission elements 7 which are arranged to transmit thermal energy from the primary cooling layer 3 and/or the secondary cooling layer 5 to the surrounding area.
Figure 2 shows a circuit board whose first heat transmission elements 6 and second heat transmission elements 7 are combined so that the first dummy holes and the second dummy holes form a unified structure running through the circuit board.
The first dummy holes and the second dummy holes are preferably at least partly filled with the insulating material 4. Alternatively, the primary cooling layer 3 and/or one secondary cooling layer 5 can form a part of the circuit board surface so that the heat- generating power component 1 is attached directly to the surface of the primary cooling layer 3 and/or one secondary cooling layer 5.
If a circuit board winding (not shown) is integrated to the circuit board, the primary cooling layer 3 and the secondary cooling layers 5 can be made up of the windings of an inductive component integrated to the circuit board. Correspondingly, the primary cooling layer 3 and the secondary cooling layers 5 can form the winding of an inductive component. This arrangement provides for two purposes with the same circuit board parts. It is obvious to a person skilled in the art that while technology advances, the basic idea of the invention can be implemented in many different ways. The invention and its embodiments are thus not restπcted to the examples described above, but can vary within the scope of the claims.

Claims

1. A circuit board with an arrangement for cooling power components (1), which circuit board comprises at least one conductive layer (2), one primary cooling layer (3), and an insulating material (4) which insulates the conductive layers (2) and the primary cooling layer (3) from each other and binds the circuit board, whereby one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the primary cooling layer (3) in order to cool the heat-generating power components (1 ) on the circuit board, characterized in that it has at least one secondary cooling layer (5) which is galvanically insulated from the primary cooling layer (3), and one or more heat-generating power components (1) having substantially the same electric potential are in thermal and electrical contact with the secondary cooling layer (5) in order to cool the heat-generating power components (1) on the circuit board.
2. A circuit board as claimed in claim 1, characterized in that the surface area of the primary cooling layer (3) corresponds substantially to the surface area of the circuit board.
3. A circuit board as claimed in claim 1, characterized in that the surface area of the secondary cooling layer (5) corresponds substantially to the surface area of the circuit board.
4. A circuit board as claimed in claim 1, characterized in that the primary cooling layer (3) and the secondary cooling layer (5) are made of copper metal.
5. A circuit board as claimed in claim 1, characterized in that the insulating material (4) comprises epoxy and glass fibre.
6. A circuit board as claimed in claim 2, characterized in that it has first heat transmission elements (6) which are arranged to transmit thermal energy from the heat-generating power component (1) to the primary cooling layer (3) and/or the secondary cooling layer (5).
7. A circuit board as claimed in claim 1, characterized in that it has second heat transmission elements (7) which are arranged to transmit thermal energy from the primary cooling layer (3) and/or the secondary cooling layer (5) to the surrounding area.
8. A circuit board as claimed in claims 6 and 7, characterized in that the first heat transmission elements (6) and the second heat transmission elements (7) are combined so that they form a unified structure running through the circuit board.
9. A circuit board as claimed in claim 1, characterized in that the primary cooling layer (3) and/or the secondary cooling layer (5) form a part of the surface of the circuit board and that the heat-generating power component (1) is attached directly to the surface of the primary cooling layer (3) and/or the secondary cooling layer (5).
10. A circuit board as claimed in any one of the claims 1 to 9, characterized in that the primary cooling layer (3) and the secondary cooling layers (5) are made up of the windings of an inductive component integrated to the circuit board.
PCT/FI2000/000311 1999-04-14 2000-04-13 Circuit board with arrangement for cooling power components WO2000062585A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU39686/00A AU3968600A (en) 1999-04-14 2000-04-13 Circuit board with arrangement for cooling power components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI990829A FI990829A0 (en) 1999-04-14 1999-04-14 Circuit boards showing an arrangement for cooling power components
FI990829 1999-04-14

Publications (1)

Publication Number Publication Date
WO2000062585A1 true WO2000062585A1 (en) 2000-10-19

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ID=8554423

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Country Status (3)

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AU (1) AU3968600A (en)
FI (1) FI990829A0 (en)
WO (1) WO2000062585A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005063281A1 (en) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper
DE102009058914A1 (en) * 2009-12-17 2011-06-22 Conti Temic microelectronic GmbH, 90411 High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer
DE102010039550A1 (en) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag control module
DE102011077206A1 (en) * 2011-06-08 2012-12-13 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
DE102012223287A1 (en) * 2012-12-14 2014-06-18 Hella Kgaa Hueck & Co. Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper
CN105955437A (en) * 2016-04-21 2016-09-21 浪潮电子信息产业股份有限公司 Position placing method of power via hole and PCB
CN113490325A (en) * 2015-11-13 2021-10-08 舍弗勒技术股份两合公司 Multilayer circuit board with printed coils and method for producing same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339519A (en) * 1992-06-15 1994-08-23 Eaton Corporation Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels
EP0741504A2 (en) * 1995-05-05 1996-11-06 Robert Bosch Gmbh Metal core circuit board and method of making

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339519A (en) * 1992-06-15 1994-08-23 Eaton Corporation Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels
EP0741504A2 (en) * 1995-05-05 1996-11-06 Robert Bosch Gmbh Metal core circuit board and method of making

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005063281A1 (en) * 2005-12-30 2007-07-05 Robert Bosch Gmbh Integrated electronic component, has printed circuit board, and electronic power components that are arranged on board, where board has inner layer, which is made of heat conducting material e.g. solid copper
DE102009058914A1 (en) * 2009-12-17 2011-06-22 Conti Temic microelectronic GmbH, 90411 High density interconnect-multi layered printed circuit board, has upper and lower board layers with conducting layers, where total surface of conducting layer of upper layer is larger than total surface of conducting layer of lower layer
DE102010039550A1 (en) * 2010-08-20 2012-02-23 Zf Friedrichshafen Ag control module
DE102011077206A1 (en) * 2011-06-08 2012-12-13 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
US9265148B2 (en) 2011-06-08 2016-02-16 Zf Friedrichshafen Ag Printed circuit board and control device for a vehicle transmission comprising the printed circuit board
DE102011077206B4 (en) * 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
DE102012223287A1 (en) * 2012-12-14 2014-06-18 Hella Kgaa Hueck & Co. Printed circuit board for accommodating electronic element i.e. LED, has electrically insulated layer comprising openings for guiding connection unit, where core and/or connection unit and/or conductors are partially made from copper
CN113490325A (en) * 2015-11-13 2021-10-08 舍弗勒技术股份两合公司 Multilayer circuit board with printed coils and method for producing same
CN105955437A (en) * 2016-04-21 2016-09-21 浪潮电子信息产业股份有限公司 Position placing method of power via hole and PCB

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