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WO2000062302A1 - Dispositif de refroidissement d'ordinateur - Google Patents

Dispositif de refroidissement d'ordinateur Download PDF

Info

Publication number
WO2000062302A1
WO2000062302A1 PCT/SE2000/000655 SE0000655W WO0062302A1 WO 2000062302 A1 WO2000062302 A1 WO 2000062302A1 SE 0000655 W SE0000655 W SE 0000655W WO 0062302 A1 WO0062302 A1 WO 0062302A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cover
cooling
component
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/SE2000/000655
Other languages
English (en)
Inventor
Helge Fabricius-Hansen
Niklas Jonce Olsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MULTIQ PRODUCTS AB
Original Assignee
MULTIQ PRODUCTS AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MULTIQ PRODUCTS AB filed Critical MULTIQ PRODUCTS AB
Priority to AU43224/00A priority Critical patent/AU4322400A/en
Publication of WO2000062302A1 publication Critical patent/WO2000062302A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the invention relates to a computer cooling device comprising a cover having a bottom plate, an upper part, a rear side and an opposite front side covered essentially by a flat display, at least one a large amount of heat emitting component being provided within said cover.
  • the invention relates first of all to flat electronic devices with electronic components in a compact design.
  • One embodiment includes flat display units having an embedded computer.
  • An object of the invention is to provide a cooling device that operates with a good efficiency also at a low sound level. This object is achieved by an invention having the characteristic features of claim 1. Further objects and advantages with the invention are apparent from the following description, drawings and dependent claims.
  • the invention relates to a cooling device preferably for use in connec- tion with compact computers.
  • Such computers include a cover having a bottom plate, an upper part, a rear side and an opposite front side mainly covered by a flat display, at least one component emitting a high level of heat being provided within the cover.
  • At least one section of the rear side of the cover is formed as a cooling fin.
  • a first end of a heat-conducting pipe is arranged in a heat conducting contact with the component and a second end of the heat-conducting pipe is arranged in a heat conducting contact with the cooling element.
  • a heat-conducting pipe also referred to as a heat pipe, is a completely sealed tube made of a heat conducting material, such as copper or an alloy.
  • a heat conducting material such as copper or an alloy.
  • One or a plurality of apertures or channels extend axially in the tube.
  • a wick or another material or other means that is able to transport a liquid by the capillary effect also extends axially.
  • the tube is evacuated and then filled with a liquid to such a level that vapor inside is at saturation conditions and that liquid is close to condensation. The ends of the tube are sealed.
  • One of the ends of the tube is arranged in a heat conducting contact with the object that is to be cooled and cooling of some type is provided at the other end of the tube.
  • liquid will vaporize.
  • the vapor pressure and temperature potential gradient that will de- velop in the tube vapor will flow against the cooler end of the tube where the vapor is condensed into liquid.
  • the liquid is transported through the capillary effect or a corresponding way back to the hotter end of the tube where it is evaporated again.
  • the heat transfer between the ends of the tube is very rapid and efficient. As a result of the strong forces on the liquid and the vapor within the tube the tube is essentially not influenced by gravity.
  • heat is transported away from heat generating components, mainly the processor of the computer, to a cooling element and the exterior of the computer.
  • heat is not conducted to a cooling apparatus, such a fan within the computer.
  • FIG. 1 is cross sectional view of a cooling device in accordance with the invention
  • Fig. 2 is an elevation sectional view from the line ll-ll of the cooling device in Fig. 1
  • Fig. 3 is a schematic prospective view in an inclined angle from behind of an alternative embodiment of a cooling device in accordance with the invention.
  • Fig. 1 shows schematically a so called "flat panel computer", that is a computer integrated with a flat display.
  • the computer includes a plurality of electric and electronic components, many of which generating a lot of heat.
  • At least one specifically heat emitting component 10 is provided inside a cover enclosing the computer. Normally a processor circuit constitutes the most heat emitting component.
  • the cover comprises a backside 11 and a front side 12.
  • the front side 12 is essentially covered by a display 13.
  • the cover comprises also a bottom plate and an upper part, see Fig. 1.
  • the rear side 11 comprises at least one section formed by a fined cooling plate 15. In the embodiment shown said cooling plate 15 covers the complete backside but also other embodiments are possible.
  • a vertical central section of the backside can for instance be covered by or constitute a cooling plate.
  • the heat emitting component 10 is connected to the cooling plate 15 through a heat conducting tube 14 of the type described above.
  • the heat conducting tube 14 is connected through connecting sections 20 so as to accomplish a good heat transfer from the heat conducting tube 14 to the cooling plate 15 and from the component 10 to the heat conducting tube, respectively.
  • the heat conducting tube 14 can in some em- bodiments be replaced by a block or a bar made of an extremely well heat conducting material, such as aluminum.
  • circuit board 21 In the space between the display 13 and the backside of the computer a circuit board 21 is provided.
  • the circuit board 21 is provided with a plurality of electronic and electric components 22. Also these components require cooling and in accordance with one aspect of the invention such a cooling is provided by providing an air intake section 18 in the bottom plate of the cover.
  • the air intake section 18 is formed as one larger opening, but it is possible also to provide a plurality of smaller openings.
  • the air intake section 18 extends to the backside to make an air flow formed by natural draft to pass by along the cooling plate 15 and to cool this off.
  • An air outlet section 19 is provided in the upper part 17, see Fig. 2, so as to allow the natural draft to develop.
  • Fig. 2 shows schematically the inner side of the cooling plate 15 and the connection section 20 connected to the cooling plate 15.
  • the heat- conducting tube 14 to some extent is bent down towards the connection against the heat emitting component 10. In this way the return flow of liquid after condensation in the cooler end of the heat-conducting pipe 14 will be facilitated.
  • a bottom plate 16 covers the complete lower side of the computer and is provided with apertures 18 forming the air intake section 18.
  • apertures 23 are formed in an upper part 17 covering the upper side of the computer. These apertures form the air outlet section 19.
  • the air flow passing through between said air intake section 18 and said air outlet section 19 is comparatively large and will produce a good cooling effect.
  • the total area of the air intake section 18 and the air outlet section 19, respectively, also should be comparatively large.
  • Fig. 3 shows schematically one embodiment of a computer being provided with a cooling device in accordance with the invention.
  • the entire rear side 11 of the computer is covered by a cooling plate 15.
  • the upper part 17 is made from plastic or a similar material and a plurality of apertures 23 are formed therein, said apertures forming the air outlet section 19.
  • the air intake section 18 in the bottom plate 16 is indicated by dashed lines.
  • the bottom plate 16 can be formed of plastic or a similar material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement dans un appareil électrique comprenant un couvercle incluant une plaque inférieure (16), une partie supérieure (17), une portion arrière (11), et une portion avant opposée (12) sensiblement recouverte d'un écran plat, au moins un composant (10) émettant une quantité importante de chaleur étant prévu au sein dudit couvercle, au moins une section dudit couvercle étant constituée en forme d'une plaque de refroidissement (15). Une première extrémité dudit conduit conducteur de chaleur (14) est en contact de conduction thermique avec ledit élément (10), et une deuxième extrémité du conduit conducteur de chaleur (14) est en contact de conduction thermique avec ladite plaque de refroidissement (14). L'invention concerne également un procédé de refroidissement d'un appareil électrique, dans lequel la chaleur provenant d'un composant (10) disposé au sein d'un couvercle se déplace à partir dudit composant (10) à travers un conduit conducteur de chaleur (14) vers l'extérieur du couvercle. Le déplacement de la chaleur s'effectue sans l'apport d'énergie additionnelle. Dans un ordinateur selon l'invention au moins une section du couvercle es constituée en forme de plaque de refroidissement (15). Un conduit conducteur de chaleur (14) est prévu entre ledit composant (10) et ladite plaque de refroidissement (15), en vue de refroidir ledit composant (10) sans avoir recours à des moyens de ventilation.
PCT/SE2000/000655 1999-04-13 2000-04-06 Dispositif de refroidissement d'ordinateur Ceased WO2000062302A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU43224/00A AU4322400A (en) 1999-04-13 2000-04-06 Computer cooling device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9901319A SE9901319D0 (sv) 1999-04-13 1999-04-13 Kylanordning vid dator
SE9901319-5 1999-04-13

Publications (1)

Publication Number Publication Date
WO2000062302A1 true WO2000062302A1 (fr) 2000-10-19

Family

ID=20415202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2000/000655 Ceased WO2000062302A1 (fr) 1999-04-13 2000-04-06 Dispositif de refroidissement d'ordinateur

Country Status (3)

Country Link
AU (1) AU4322400A (fr)
SE (1) SE9901319D0 (fr)
WO (1) WO2000062302A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042724B2 (en) 2002-11-22 2006-05-09 Contec Steuerungstechnik Und Automation Gesellschaft M.B.H. Cooled computer casing display frame
EP1962570A1 (fr) * 2007-02-26 2008-08-27 Siemens Aktiengesellschaft Appareil électrique et procédé de refroidissement pour appareil électrique
DE102014017914A1 (de) * 2014-12-04 2016-06-09 Audi Ag Kombiinstrument für ein Kraftfahrzeug und Kraftfahrzeug
CN111708415A (zh) * 2020-05-29 2020-09-25 苏州浪潮智能科技有限公司 一种调整入风口径降低噪声的方法、系统、设备及介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions
US5875095A (en) * 1996-03-01 1999-02-23 Compaq Computer Corporation Computer having a heat sink structure incorporated therein

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5875095A (en) * 1996-03-01 1999-02-23 Compaq Computer Corporation Computer having a heat sink structure incorporated therein
US5781409A (en) * 1996-12-19 1998-07-14 Compaq Computer Corporation Heat dissipating lid hinge structure with laterally offset heat pipe end portions

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7042724B2 (en) 2002-11-22 2006-05-09 Contec Steuerungstechnik Und Automation Gesellschaft M.B.H. Cooled computer casing display frame
EP1962570A1 (fr) * 2007-02-26 2008-08-27 Siemens Aktiengesellschaft Appareil électrique et procédé de refroidissement pour appareil électrique
DE102014017914A1 (de) * 2014-12-04 2016-06-09 Audi Ag Kombiinstrument für ein Kraftfahrzeug und Kraftfahrzeug
DE102014017914B4 (de) * 2014-12-04 2021-06-24 Audi Ag Kombiinstrument für ein Kraftfahrzeug und Kraftfahrzeug
CN111708415A (zh) * 2020-05-29 2020-09-25 苏州浪潮智能科技有限公司 一种调整入风口径降低噪声的方法、系统、设备及介质

Also Published As

Publication number Publication date
AU4322400A (en) 2000-11-14
SE9901319D0 (sv) 1999-04-13

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