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WO2000059670A1 - Soldering frame - Google Patents

Soldering frame Download PDF

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Publication number
WO2000059670A1
WO2000059670A1 PCT/CH2000/000195 CH0000195W WO0059670A1 WO 2000059670 A1 WO2000059670 A1 WO 2000059670A1 CH 0000195 W CH0000195 W CH 0000195W WO 0059670 A1 WO0059670 A1 WO 0059670A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
printed circuit
displaceable
soldering frame
hold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CH2000/000195
Other languages
German (de)
French (fr)
Inventor
Christian Lüthi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AU34145/00A priority Critical patent/AU3414500A/en
Publication of WO2000059670A1 publication Critical patent/WO2000059670A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Definitions

  • the invention relates to a soldering frame for automatically soldering electrical and electronic components on printed circuit boards according to the preamble of claim 1.
  • Assembly or soldering frames for the automatic soldering of electrical and electronic components on printed circuit boards are known for example from DE-U-93 16 1 26.3.
  • Such soldering frames are used for wave soldering in commercially available soldering lines in which the soldering frames are guided by chain conveyors or rollers.
  • individual components protruding beyond the circuit board such as plug connections, switches or the like, hinder an optimal fastening of the circuit board in the soldering frame belonging to a specific soldering line.
  • special solder masks are used for each circuit board, as in the assembly or soldering frame specified above, so that the different variants can be soldered to circuit boards.
  • the installation and removal of the inner mask in an original soldering frame often presents problems.
  • the solder mask must be made individually for each specific circuit board. This makes the wave soldering of different circuit boards much more expensive.
  • the present invention is based on the object of developing a soldering frame which can be used universally for different types of printed circuit boards and which enables rapid replacement of the printed circuit boards.
  • the soldering frame according to the invention has the great advantage that it is suitable for almost any printed circuit board with any configuration of the electrical and electronic components without the use of any soldering masks.
  • the sliding bridge allows the frame size to be individually adapted to the dimensions of the respective circuit board.
  • Fastening elements are also provided which hold the circuit board at individual locations on the frame and others which are suitable for holding down the components. This means that the expensive manufacture of solder masks can be dispensed with, which further simplifies the manufacture of printed circuit boards.
  • a round insert is provided, by means of which the clamped circuit board can be rotated at a sharp angle to the direction of soldering. This can prevent bridging when soldering the connections of integrated circuits or the like.
  • FIG. 1 is a perspective view of a soldering frame according to the invention
  • Fig. 6 shows a variant of the soldering frame, the circuit board being rotated at an angle of approximately 450 relative to the direction of soldering.
  • a square soldering frame 1 which has an outer border 2 and an inner support 3 with an inwardly stepped edge 4.
  • the exterior Border 2 is provided on the two long sides 5 in the area of the corners 6 with a support 7, which is provided for a chain conveyor - not shown here.
  • the outer border 2 with the supports 7 are part of an original soldering frame as supplied by the manufacturer for a wave soldering device.
  • Parallel to the transverse sides 8 of the soldering frame 1 on the inner support 3 are arranged two longitudinal guides 9 in the form of slots, in which two displaceable webs 10 and 11 provided with a groove 12 are fastened at a certain point on the frame 1 by means of knurled screws 14 can (see Figure 4).
  • the displaceable web 10 are arranged on the displaceable web 10 .
  • two hold-down means 16 designed as spring tensioners with variable clamping height, which are displaceable in the groove 12 and can be fixed by means of a knurled screw 17.
  • the webs 10 and 1 1 are formed to form the groove 12 with a U-shaped profile bar.
  • the design of the hold-down means 16 mentioned is very crucial for the invention. This can be clearly seen from FIGS. 1, 3, 4 and 5. Since almost any and any printed circuit boards are to be placed in the soldering frame on the stepped edges 4, 18 of the inner supports 18, they have to be pressed down slightly on the stepped edges. This pressure must be able to counteract the solder wave pressure. Printed circuit boards and electronic components are often very different in height above the soldering area.
  • the hold-down means with their elements 16 ', 17, 11 19, 19' are now designed so that they can be placed on the most insensitive places on the circuit boards. For this purpose, they are designed so that they can be moved in at least two, but possibly even in three dimensions.
  • the hold-down devices 16 can be moved in a direction X parallel to the web by means of the knurled screws 17 in the displaceable web 11 and locked at a suitable location.
  • the hold-down means 16 have an arm 16 'which can be locked on the web 10 by means of the knurled screw 17. And they each have a leg 19 which is arranged on the end of the arm opposite the knurled screw 17 and is therefore always spaced from the knurled screw and the web 10.
  • the arm 16 ' is designed to be pivotable as possible as a pivot arm about the knurled screw 17.
  • the leg 19 which comes to rest on the printed circuit board, can be moved in the X and Y direction on the radial path around the knurled screw 17.
  • the leg 19 can thus on a most suitable location on the circuit board be put on.
  • the third adjustable dimension comes about by changing the length of the leg 19. It is also possible to provide the leg 19 with a thread which is rotatably received in a corresponding counterpart in the swivel arm 16 '. This allows the third dimension, i.e. the support height, to be set very precisely. So that the pressing forces can be kept within reasonable limits, the pivot arm 16 'is advantageously designed as a leaf spring. As a result, it limits the forces that can be exercised to an innocuous level. Alternatively, a spiral spring can also be arranged between the foot 19 'and the swivel arm 16' around the leg 19.
  • two fixed webs 20 and 21, each provided with a groove 22, are arranged, on which a transverse web 23 can be displaced and fixed by means of knurled screws 24.
  • the displaceable crossbar 23 also has a slot 26, in which two further support elements 28 are displaceable and can be fixed thereon by means of knurled screws 29.
  • the support elements 28 are provided with stepped support elements 30 projecting below.
  • the schematically indicated circuit board 31 with - not shown here - electronic components and with electrical components 32, such as the plug contact 34, the signal lamp 35, the switch 36 and the plug contact 37 for the energy supply.
  • the electrical components 32 protrude beyond the edge 38 of the guide plate 31.
  • FIG. 2 which represents a section along the line AA through the web 10, which is provided on both sides with a stepped edge 18, as a result of which the projecting electrical components 32 no longer represent an obstacle when clamping the printed circuit board 31.
  • the displaceable web 11 is only provided with a stepped edge 18 on one side (cf. FIG. 5).
  • the support 3 is also provided with a stepped edge 18, as can be seen from FIG. 3, which shows a section along the line BB in FIG.
  • the circuit board 31 with the electrical components 32 is sufficiently clamped by the hold-down means 16 used.
  • the hold-down means 16 used.
  • the conventional soldering frames with clamping springs or the like which are arranged at a regular fixed distance on the long sides, such projecting components provide some problems during clamping. Either the clamping spring must then be broken off at certain points or specifically manufactured inner frames must be provided.
  • FIG. 4 shows the soldering frame 1 equipped with the printed circuit board 31, arrow A indicating the direction of soldering. It goes without saying that other original soldering frames can also be fitted with the inner support or insert 3 described above. It is also largely possible to dispense with the border 2 of the original soldering frame if 3 fixed webs, such as webs 20 and 21, are arranged all around on the support.
  • the hold-down means 16 can also be provided with a longer leg 19 in order to hold the printed circuit board 31 in place. If the printed circuit board 31 has a smaller dimension than shown in FIG. 4, an additional printed circuit board can be arranged between the webs 1 0 and 1 1.
  • a further embodiment of the soldering frame 1 shown in FIG. 6 consists in that the inner support 3 is used to carry a second round insert 50, which in turn has fixed webs 51 and a displaceable and fixable web 52 and a displaceable crossbar 53 is provided similarly to the configuration in FIG. 4.
  • This configuration primarily serves to ensure that specially designed circuit boards 31, in which the electronic components, in particular integrated circuits, are arranged, for example, perpendicular to one another and parallel to the edges of the circuit board 31. With such an arrangement of the integrated circuits, bridges would form between the electrical connections (“pins”) during soldering.
  • any circuit board 31 is now completely unproblematic, in that the circuit board 31 on the one hand on two adjacent sides 40 and 41 on the stepped edge 4 of the inner support 3 and on the other hand another side 42 of the circuit board 31 on the stepped edge 18 of one of the webs 10 or 1 1 is supported. Furthermore, the remaining side 43 of the circuit board 31 is clamped by means of the support elements 30 of the crossbar 16.
  • the hold-down means 16 and the clamping elements 46 provided on the inner edge 4 of the soldering frame 1, such as the above clamping plate 47 and the spring clip 48 the printed circuit board 1 in the soldering frame 1 is pressed down sufficiently so that the electronic and electrical components are fitted
  • Printed circuit board 1 can be soldered in an automatic soldering line by means of wave soldering or the like. It is understood by the person skilled in the art that the hold-down means 16 and the clamping elements 46 can be arranged in any number and at any place.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The invention relates to a soldering frame (1) for soldering electronic and electrical components (32) by machine onto printed circuit boards (31). Said soldering frames comprise at least two struts which lie opposite each other and which have clamping elements for clamping the printed circuit boards (31). Longitudinal guides (9) are provided on the border (2) of the assembly frame (1) to guide at least one displaceable strut (10; 11) which can be fixed using fixing elements (14), in order to accommodate printed circuit boards (31) of different dimensions.

Description

Lötrahmen für LeiterplattenSoldering frames for printed circuit boards

Die Erfindung betrifft einen Lötrahmen zum automatischen Löten von elektrischen und elektronischen Komponenten auf Leiterplatten nach dem Oberbegriff des Patentanspruchs 1 .The invention relates to a soldering frame for automatically soldering electrical and electronic components on printed circuit boards according to the preamble of claim 1.

Bestückungs- oder Lötrahmen zum automatischen Löten von elektrischen und elektronischen Komponenten auf Leiterplatten sind beispielsweise aus DE-U-93 16 1 26.3 bekannt. Solche Lötrahmen werden zum Wellenlöten in handelsüblichen Lötstrassen eingesetzt, in denen die Lötrahmen von Kettenförderern oder Rollen geführt sind. Es besteht dabei das Problem, dass einzelne über die Leiterplatte hinausragende Komponenten wie Steckanschlüsse, Schalter oder dergleichen eine optimale Befestigung der Leiterplatte im zu einer bestimmten Lötstrasse gehörenden Lötrahmen behindern. Deshalb werden spezielle Lötmasken für eine jeweilige Leiterplatte eingesetzt, wie beim oben angegebenen Bestückungs- oder Lötrahmen, damit die verschiedenen Varianten an Leiterplatten gelötet werden können. Der Ein- und Ausbau der Innenmaske in einem OriginalLötrahmen bietet vielfach Probleme. Die Lötmaske muss dabei für jede spezifische Leiterplatte einzeln hergestellt werden. Dadurch wird das Wellenlöten von unterschiedlichen Leiterplatten wesentlich verteuert.Assembly or soldering frames for the automatic soldering of electrical and electronic components on printed circuit boards are known for example from DE-U-93 16 1 26.3. Such soldering frames are used for wave soldering in commercially available soldering lines in which the soldering frames are guided by chain conveyors or rollers. There is the problem that individual components protruding beyond the circuit board, such as plug connections, switches or the like, hinder an optimal fastening of the circuit board in the soldering frame belonging to a specific soldering line. For this reason, special solder masks are used for each circuit board, as in the assembly or soldering frame specified above, so that the different variants can be soldered to circuit boards. The installation and removal of the inner mask in an original soldering frame often presents problems. The solder mask must be made individually for each specific circuit board. This makes the wave soldering of different circuit boards much more expensive.

Der vorliegenden Erfindung liegt nun die Aufgabe zugrunde, ein Lötrahmen zu entwickeln, der für verschiedenartige Leiterplatten universell einsetzbar ist und ein schneller Austausch der Leiterplatten ermöglicht.The present invention is based on the object of developing a soldering frame which can be used universally for different types of printed circuit boards and which enables rapid replacement of the printed circuit boards.

Diese Aufgabe wird durch einen Lötrahmen mit den Merkmalen des Patentanspruchs 1 gelöst.This object is achieved by a soldering frame with the features of claim 1.

Der erfindungsgemässe Lötrahmen hat den grossen Vorteil, dass er ohne die Verwendung von irgendwelchen Lötmasken für fast jede beliebige Leiterplatte mit einer beliebigen Bestückung der elektrischen und elektronischen Komponenten geeignet ist. Der verschiebbare Steg erlaubt die individuelle Anpassung der Rahmengrösse auf die Ausmassen der jeweiligen Leiterplatte. Ferner sind Befestigungselemente vorgesehen, welche die Leiterplatte an individuellen Orten auf dem Rahmen halten und weitere, die zum Niederhalten der Komponenten geeignet sind. Damit kann die teuere Herstellung von Lötmasken verzichtet werden, was die Herstellung von bestückten Leiterplatten zusätzlich vereinfacht.The soldering frame according to the invention has the great advantage that it is suitable for almost any printed circuit board with any configuration of the electrical and electronic components without the use of any soldering masks. The sliding bridge allows the frame size to be individually adapted to the dimensions of the respective circuit board. Fastening elements are also provided which hold the circuit board at individual locations on the frame and others which are suitable for holding down the components. This means that the expensive manufacture of solder masks can be dispensed with, which further simplifies the manufacture of printed circuit boards.

In einer weiteren Ausbildung des erfindungsgemässen Lötrahmens ist ein runder Einsatz vorgesehen, mittels welcher die eingespannte Leiterplatte in einem scharfen Winkel zur Lötrichtung gedreht werden kann. Damit kann die Brückenbildung beim Löten der Anschlüsse von integrierten Schaltungen oder dergleichen verhindert werden.In a further embodiment of the soldering frame according to the invention, a round insert is provided, by means of which the clamped circuit board can be rotated at a sharp angle to the direction of soldering. This can prevent bridging when soldering the connections of integrated circuits or the like.

Weitere Vorteile der Erfindung folgen aus den abhängigen Patentansprüchen und aus der nachfolgenden Beschreibung, in welcher die Erfindung anhand eines in der schematischen Zeichnung dargestellten Ausführungsbeispieles näher erläutert wird.Further advantages of the invention follow from the dependent patent claims and from the following description, in which the invention is explained in more detail using an exemplary embodiment shown in the schematic drawing.

Es zeigtIt shows

Fig. 1 einen erfindungsgemässen Lötrahmen in perspektivischer Darstellung,1 is a perspective view of a soldering frame according to the invention,

Fig. 2 einen Querschnitt längs der Linie A-A in Figur 1 ,2 shows a cross section along the line A-A in FIG. 1,

Fig. 3 einen Querschnitt längs der Linie B-B in Figur 1 ,3 shows a cross section along the line B-B in FIG. 1,

Fig. 4 denselben Lötrahmen mit einer darin befestigten Leiterplatte,4 the same soldering frame with a circuit board fastened therein,

Fig. 5 einen Querschnitt längs der Linie C-C in Figur 5, und5 shows a cross section along the line C-C in Figure 5, and

Fig. 6 eine Variante des Lötrahmens, wobei die Leiterplatte gegenüber der Lötrichtung in einem Winkel von etwa 450 gedreht ist.Fig. 6 shows a variant of the soldering frame, the circuit board being rotated at an angle of approximately 450 relative to the direction of soldering.

In den Figuren sind für dieselben Elemente jeweils dieselben Bezugszeichen verwendet worden und erstmalige Erklärungen betreffen alle Figuren, wenn nicht ausdrücklich anders erwähnt.In the figures, the same reference numerals have been used for the same elements, and first-time explanations apply to all figures, unless expressly stated otherwise.

In Figur 1 ist ein viereckiger Lötrahmen 1 gezeigt, der eine äussere Umrandung 2 und eine innere Auflage 3 mit einem nach innen abgestuften Rand 4 aufweist. Die äussere Umrandung 2 ist auf den zwei Längsseiten 5 im Bereich der Ecken 6 je mit einer Auflage 7 versehen, die für einen - hier nicht weiter dargestellten Kettenförderer vorgesehen sind. Die äussere Umrandung 2 mit den Auflagen 7 sind Teil eines Original-Lötrahmens, wie er für eine Schwallöteinrichtung vom Hersteller mitgeliefert wird. Parallel zu den Querseiten 8 des Lötrahmens 1 auf der inneren Auflage 3 sind zwei als Schlitze ausgebildete Längsführungen 9 angeordnet, in welchen zwei verschiebbare, mit einer Nut 12 versehene Stege 10 und 1 1 mittels Rändelschrauben 14 an einer bestimmten Stelle auf dem Rahmen 1 befestigt werden können (vgl. Figur 4). Auf dem verschiebbaren Steg 10 sind ferner zwei als Federspanner ausgebildete Niederhaltemittel 16 mit variabler Spannhöhe angeordnet, welche in der Nut 12 verschiebbar und mittels einer Rändelschraube 17 fixierbar sind. Die Stege 10 und 1 1 sind zur Bildung der Nut 12 mit einem U-förmigen Profilstab ausgebildet.In Figure 1, a square soldering frame 1 is shown, which has an outer border 2 and an inner support 3 with an inwardly stepped edge 4. The exterior Border 2 is provided on the two long sides 5 in the area of the corners 6 with a support 7, which is provided for a chain conveyor - not shown here. The outer border 2 with the supports 7 are part of an original soldering frame as supplied by the manufacturer for a wave soldering device. Parallel to the transverse sides 8 of the soldering frame 1 on the inner support 3 are arranged two longitudinal guides 9 in the form of slots, in which two displaceable webs 10 and 11 provided with a groove 12 are fastened at a certain point on the frame 1 by means of knurled screws 14 can (see Figure 4). Also arranged on the displaceable web 10 are two hold-down means 16 designed as spring tensioners with variable clamping height, which are displaceable in the groove 12 and can be fixed by means of a knurled screw 17. The webs 10 and 1 1 are formed to form the groove 12 with a U-shaped profile bar.

Die Ausführung der erwähnten Niederhaltemittel 16 ist für die Erfindung ganz entscheidend. Dies ist aus den Figuren 1 ,3,4, und 5 gut ersichtlich. Da annähernd beliebige und beliebig bestückte Leiterplatten im Lötrahmen auf die abgestuften Ränder 4, 18 der inneren Auflagen 18 aufgelegt werden sollen , müssen sie auf die abgestuften Ränder leicht heruntergedrückt werden. Dieser Druck muss dem Lötwellendruck entgegewirken können. Leiterplatten und elektronische Bauteile sind aber häufig sehr unterschiedlich in der Höhe über der Lötflache. Die Niederhaltemittel mit ihren Elementen 16', 17, 1 1 19, 19' sind nun so ausgestaltet, dass sie an auf möglichst unempfindliche Stellen auf den Leiterplatten aufgesetzt werden können. Dazu sind sie so ausgeführt, dass sie mindestens in zwei, aber möglichst sogar in drei Dimensionen verschiebbar sind. Zum Ersten können die Niederhalter 16 mittels den Rändelschrauben 17 im verschiebbaren Steg 1 1 in einer Richtung X parallel zum Steg verschoben und am geeigneten Ort arretiert werden. Zum Zweiten weisen die Niederhaltemittel 1 6 einen Arm 16' auf, welcher mittels der Rändelschraube 17 am Steg 10 arretierbar ist. Und sie weisen je ein Bein 19 auf, welches am der Rändelschraube 17 gegenüberliegenden Ende des Armes angeordnet ist und dadurch immer von der Rändelschraube und dem Steg 10 beabstandet ist. Der Arm 16' ist möglichst als Schwenkarm um die Rändelschraube 17 schwenkbar ausgestaltet. Somit kann das Bein 1 9, welches auf der Leiterplatte zum Aufliegen kommt in X und Y Richtung auf einer radialen Bahn um die Rändelschraube 17 bewegt werden. Das Bein 19 kann so auf eine möglichst geeignete Stelle der Leiterplatte aufgelegt werden. Die dritte verstellbare Dimension kommt durch Aendern der Länge des Beines 19 zustande. Es ist auch möglich, das Bein 19 mit einem Gewinde zu versehen, welches in einem entsprechenden Gegenstück im Schwenkarm 16' drehbar aufgenommen ist. Dadurch kann die dritte Dimension, also die Auflagehöhe sehr genau eingestellt werden. Damit die Andrückkräfte in vernünftigem Rahmen gehalten werden können, wird mit Vorteil der Schwenkarm 16' als Blattfeder ausgestaltet. Sie begrenzt dadurch die ausübbaren Kräfte auf ein unschädliches Mass. Alternativ kann auch eine Spiralfeder zwischen dem Fuss 19' und dem Schwenkarm 16' um das Bein 19 angeordent sein.The design of the hold-down means 16 mentioned is very crucial for the invention. This can be clearly seen from FIGS. 1, 3, 4 and 5. Since almost any and any printed circuit boards are to be placed in the soldering frame on the stepped edges 4, 18 of the inner supports 18, they have to be pressed down slightly on the stepped edges. This pressure must be able to counteract the solder wave pressure. Printed circuit boards and electronic components are often very different in height above the soldering area. The hold-down means with their elements 16 ', 17, 11 19, 19' are now designed so that they can be placed on the most insensitive places on the circuit boards. For this purpose, they are designed so that they can be moved in at least two, but possibly even in three dimensions. First of all, the hold-down devices 16 can be moved in a direction X parallel to the web by means of the knurled screws 17 in the displaceable web 11 and locked at a suitable location. Secondly, the hold-down means 16 have an arm 16 'which can be locked on the web 10 by means of the knurled screw 17. And they each have a leg 19 which is arranged on the end of the arm opposite the knurled screw 17 and is therefore always spaced from the knurled screw and the web 10. The arm 16 'is designed to be pivotable as possible as a pivot arm about the knurled screw 17. Thus, the leg 19, which comes to rest on the printed circuit board, can be moved in the X and Y direction on the radial path around the knurled screw 17. The leg 19 can thus on a most suitable location on the circuit board be put on. The third adjustable dimension comes about by changing the length of the leg 19. It is also possible to provide the leg 19 with a thread which is rotatably received in a corresponding counterpart in the swivel arm 16 '. This allows the third dimension, i.e. the support height, to be set very precisely. So that the pressing forces can be kept within reasonable limits, the pivot arm 16 'is advantageously designed as a leaf spring. As a result, it limits the forces that can be exercised to an innocuous level. Alternatively, a spiral spring can also be arranged between the foot 19 'and the swivel arm 16' around the leg 19.

Parallel zu den Längsseiten 5 zwischen der Umrandung 2 und der inneren Auflage 3 des Lötrahmens 1 sind jeweils zwei mit einer Nut 22 versehene feste Stege 20 und 21 angeordnet, auf weichen ein Quersteg 23 verschiebbar und mittels Rändelschrauben 24 darauf fixierbar ist. Der verschiebbare Quersteg 23 weist ferner einen Schlitz 26 auf, in welchem zwei weitere Stützelemente 28 verschiebbar und mittels Rändelschrauben 29 darauf fixierbar sind. Die Stützelemente 28 sind mit unten vorstehenden, gestuften Stützelementen 30 versehen.Parallel to the longitudinal sides 5 between the border 2 and the inner support 3 of the soldering frame 1, two fixed webs 20 and 21, each provided with a groove 22, are arranged, on which a transverse web 23 can be displaced and fixed by means of knurled screws 24. The displaceable crossbar 23 also has a slot 26, in which two further support elements 28 are displaceable and can be fixed thereon by means of knurled screws 29. The support elements 28 are provided with stepped support elements 30 projecting below.

Die schematisch angedeutete Leiterplatte 31 mit - hier nicht dargestellten - elektronischen Komponenten und mit elektrischen Komponenten 32, wie der Steckkontakt 34, die Signallampe 35, der Schalter 36 und der Steckkontakt 37 für die Energieversorgung. Wie ersichtlich stehen die elektrischen Komponente 32 über den Rand 38 der Leitplatte 31 vor. Wie in Figur 2 ersichtlich, die einen Schnitt längs der Linie A-A durch den Steg 10 darstellt, der beidseitig mit einem abgestuften Rand 18 versehen ist, wodurch die vorstehenden elektrischen Komponenten 32 kein Hindernis beim Einspannen der Leiterplatte 31 mehr darstellen. Der verschiebbare Steg 1 1 ist nur mit einseitig mit einem abgestuften Rand 18 versehen (vgl. Figur 5). Ebenso ist die Auflage 3 mit einem abgestuften Rand 18 versehen, wie aus Figur 3 ersichtlich, die einen Schnitt längs der Linie B-B in Figur 1 zeigt. Durch die verwendeten Niederhaltemittel 16 ist die Leiterplatte 31 mit den elektrischen Komponenten 32 ausreichend eingespannt. Bei den herkömmlichen Lötrahmen mit Klemmfedern oder dergleichen, die auf einem regelmässigen festen Abstand an den Längsseiten angeordnet sind, liefern nämlich solche vorstehende Komponente beim Einspannen einige Probleme. Entweder müssen dann die Klemmfeder an bestimmten Stellen weggebrochen werden oder spezifisch hergestellte Innenrahmen vorgesehen werden.The schematically indicated circuit board 31 with - not shown here - electronic components and with electrical components 32, such as the plug contact 34, the signal lamp 35, the switch 36 and the plug contact 37 for the energy supply. As can be seen, the electrical components 32 protrude beyond the edge 38 of the guide plate 31. As can be seen in FIG. 2, which represents a section along the line AA through the web 10, which is provided on both sides with a stepped edge 18, as a result of which the projecting electrical components 32 no longer represent an obstacle when clamping the printed circuit board 31. The displaceable web 11 is only provided with a stepped edge 18 on one side (cf. FIG. 5). The support 3 is also provided with a stepped edge 18, as can be seen from FIG. 3, which shows a section along the line BB in FIG. 1. The circuit board 31 with the electrical components 32 is sufficiently clamped by the hold-down means 16 used. In the case of the conventional soldering frames with clamping springs or the like, which are arranged at a regular fixed distance on the long sides, such projecting components provide some problems during clamping. Either the clamping spring must then be broken off at certain points or specifically manufactured inner frames must be provided.

In Figur 4 ist der mit der Leiterplatte 31 bestückte Lötrahmen 1 gezeigt, wobei Pfeil A die Lötrichtung angibt. Es versteht sich, dass auch andere Original- Lötrahmen mit der oben beschriebenen inneren Auflage oder Einsatz 3 bestückt werden kann. Auch kann weitgehend auf die Umrandung 2 des Original-Lötrahmens verzichtet werden, wenn an allen Randbereichen rundum auf der Auflage 3 feste Stege wie die Stege 20 und 21 angeordnet sind.FIG. 4 shows the soldering frame 1 equipped with the printed circuit board 31, arrow A indicating the direction of soldering. It goes without saying that other original soldering frames can also be fitted with the inner support or insert 3 described above. It is also largely possible to dispense with the border 2 of the original soldering frame if 3 fixed webs, such as webs 20 and 21, are arranged all around on the support.

Aus Figur 5 ist ersichtlich, dass das Niederhaltemittel 1 6 auch mit einem längeren Bein 19 versehen sein kann, um somit die Printplatte 31 festzuhalten. Falls die Printplatte 31 geringere Ausmasse aufweist, als in Figur 4 dargestellt, kann zwischen den Stegen 1 0 und 1 1 eine zusätzliche Printplatte angeordnet werden.It can be seen from FIG. 5 that the hold-down means 16 can also be provided with a longer leg 19 in order to hold the printed circuit board 31 in place. If the printed circuit board 31 has a smaller dimension than shown in FIG. 4, an additional printed circuit board can be arranged between the webs 1 0 and 1 1.

Eine in Figur 6 gezeigte, weitere Ausbildung des Lötrahmens 1 besteht darin, dass die innere Auflage 3 dazu benutzt wird, einen zweiten runden Einsatz 50 zu tragen, der seinerseits mit festen Stegen 51 und mit einem verschiebbaren und fixierbaren Steg 52 und mit einem verschiebbaren Quersteg 53 versehen ist ähnlich wie in der Ausbildung der Figur 4. Diese Ausbildung dient vor allem dazu, dass auch besonders ausgebildeten Leiterplatten 31 , bei welcher die elektronischen Komponenten, insbesondere integrierte Schaltungen, beispielsweise senkrecht zueinander und parallel zu den Rändern der Leiterplatte 31 angeordnet sind. Bei einer solchen Anordnung der integrierten Schaltungen würden sich beim Löten zwischen den elektrischen Anschlüssen ("Pins") Brücken bilden. Diese Brückenbildung kann nun dadurch verhindert werden, dass die Leiterplatte 31 in einem scharfen Winkel, beispielsweise 45', zur Lötrichtung A durch das Lötbad geführt wird, was mit dem runden Einsatz 50 ohne weiteres gegeben ist. Das Gewicht des mit der Leiterplatte 31 bestückten Einsatzes 50 ist ausreichend, dass eine zusätzliche Befestigung mit der Umrandung 2 nicht mehr erforderlich ist. Als Variante dieser Ausbildung könnte auch der runde Einsatz 50 in einem entsprechenden runden Öffnung in der Auflage 3 vorgesehen sein. Mit den oben beschriebenen Lötrahmen 1 ist das Einspannen von einer beliebigen Leiterplatte 31 nun völlig unproblematisch, indem die Leiterplatte 31 einerseits an zwei anliegenden Seiten 40 und 41 auf den abgestuften Rand 4 der inneren Auflage 3 und andererseits eine weitere Seite 42 der Leiterplatte 31 auf den abgestuften Rand 18 eines der Stege 10 oder 1 1 abgestützt wird. Ferner wird die verbleibende Seite 43 der Leiterplatte 31 mittels der Stützelemente 30 des Quersteges 16 eingespannt. Mit den Niederhaltemitteln 16 und den am inneren Rand 4 des Lötrahmens 1 vorgesehenen Klemmelementen 46, wie dem vorstehende Klemmplättchen 47 und der Federklammer 48, wird die Leiterplatte 1 in dem Lötrahmen 1 ausreichend nach unten gedrückt, so dass die mit den elektronischen und elektrischen Komponenten bestückte Leiterplatte 1 in einer automatischen Lötstrasse mittels Schwalllöten oder dergleichen gelötet werden kann. Es versteht sich für den Fachmann, dass die Niederhaltemittel 16 und die Klemmelemente 46 in beliebiger Anzahl und an beliebigen Stellen angeordnet werden können. A further embodiment of the soldering frame 1 shown in FIG. 6 consists in that the inner support 3 is used to carry a second round insert 50, which in turn has fixed webs 51 and a displaceable and fixable web 52 and a displaceable crossbar 53 is provided similarly to the configuration in FIG. 4. This configuration primarily serves to ensure that specially designed circuit boards 31, in which the electronic components, in particular integrated circuits, are arranged, for example, perpendicular to one another and parallel to the edges of the circuit board 31. With such an arrangement of the integrated circuits, bridges would form between the electrical connections (“pins”) during soldering. This bridging can now be prevented in that the printed circuit board 31 is guided through the solder bath at a sharp angle, for example 45 ′, to the soldering direction A, which is readily provided with the round insert 50. The weight of the insert 50 equipped with the printed circuit board 31 is sufficient that an additional fastening with the border 2 is no longer necessary. As a variant of this design, the round insert 50 could also be provided in a corresponding round opening in the support 3. With the soldering frame 1 described above, the clamping of any circuit board 31 is now completely unproblematic, in that the circuit board 31 on the one hand on two adjacent sides 40 and 41 on the stepped edge 4 of the inner support 3 and on the other hand another side 42 of the circuit board 31 on the stepped edge 18 of one of the webs 10 or 1 1 is supported. Furthermore, the remaining side 43 of the circuit board 31 is clamped by means of the support elements 30 of the crossbar 16. With the hold-down means 16 and the clamping elements 46 provided on the inner edge 4 of the soldering frame 1, such as the above clamping plate 47 and the spring clip 48, the printed circuit board 1 in the soldering frame 1 is pressed down sufficiently so that the electronic and electrical components are fitted Printed circuit board 1 can be soldered in an automatic soldering line by means of wave soldering or the like. It is understood by the person skilled in the art that the hold-down means 16 and the clamping elements 46 can be arranged in any number and at any place.

BezugszeichenlisteReference list

1 viereckiger Lötrahmen1 square soldering frame

2 äussere Umrandung2 outer border

3 innere Auflage3 inner pad

4 abgestufter Rand4 graded edge

5 Längsseite5 long side

6 Ecke6 corner

7 Auflage7th edition

8 Querseite8 short side

9 Längsführung; Schlitz9 longitudinal guide; slot

10 verschiebbarer Steg10 sliding web

1 1 verschiebbarer Steg1 1 sliding bridge

1 2 Nut1 2 groove

14 Rändelschraube14 knurled screw

16 Niederhaltemittel; Federspanner16 hold-down means; Spring tensioner

16' Arm16 'arm

17 Rändelschraube17 knurled screw

18 abgestufter Rand18 graduated edge

19 Bein19 leg

19' Fuss19 'feet

20 fester Steg20 fixed bridge

21 fester Steg21 fixed bridge

22 Nut22 groove

23 verschiebbarer Quersteg23 movable crossbar

24 Rändelschraube24 knurled screw

26 Schlitz26 slot

28 Stützelement28 support element

29 Rändelschraube29 Knurled screw

30 abgestuftes Stützungselement30 graded support element

31 Leiterplatte31 printed circuit board

32 elektrische Komponente32 electrical component

34 Steckkontakt34 plug contact

35 Signallampe35 signal lamp

36 Schalter36 switches

37 Steckkontakt37 plug contact

38 Rand38 margin

40 Seite40 page

41 Seite41 page

42 Seite42 page

43 Seite43 page

50 runder Einsatz50 round stakes

51 fester Steg51 fixed bridge

52 verschiebbarer Steg52 sliding bridge

53 verschiebbarer Quersteg53 sliding crossbar

A Lötrichtung A direction of soldering

Claims

Patentansprüche claims 1 . Lötrahmen (1 ) zum maschinellen Löten von elektronischen und elektrischen Komponenten (32) auf Leiterplatten (31 ), mit mindestens zwei sich gegen-überliegenden Stegen, die Klemmelemente zum Einspannen der Leiterplatten (31 ) vorweisen, mit in der Umrandung (2) des Lötrahmens (1 ) angeordneten Längsführungen (9), in welchen zumindest ein verschiebbarer Steg (10; 1 1 ) geführt und mittels Befestigungsmitteln (14) fixierbar ist, um Leiterplatten (31 ) von unterschiedlichen Ausmassen aufzunehmen, wobei die Umrandung (2) auf der Innenseite eine Auflage (18) zur Abstützung der Leiterplatte (31 ) aufweist, welche mindestens teilweise einen nach unten abgestuften Rand (3,4) aufweist, und mit mindestens einem Niederhaltemittel (16), dadurch gekennzeichnet, dass das mindestens eine Niederhaltemittel (16) einen Arm (1 6') mit einem Bein (1 9) an seinem einen Ende und mit Mitteln zum Arretiern am verschiebbaren Steg (10, 1 1 ) an seinem anderen Ende umfasst.1 . Soldering frame (1) for the mechanical soldering of electronic and electrical components (32) on printed circuit boards (31), with at least two opposing webs, which have clamping elements for clamping the printed circuit boards (31), with in the border (2) of the soldering frame (1) arranged longitudinal guides (9) in which at least one displaceable web (10; 1 1) is guided and can be fixed by means of fastening means (14) in order to accommodate printed circuit boards (31) of different dimensions, the border (2) on the inside has a support (18) for supporting the printed circuit board (31), which at least partially has a downwardly stepped edge (3, 4), and with at least one hold-down means (16), characterized in that the at least one hold-down means (16) has a Arm (1 6 ') with a leg (1 9) at one end and means for locking on the displaceable web (10, 1 1) at its other end. 2. Lötrahmen nach Anspruch 1 , dadurch gekennzeichnet, dass die Niederhaltemittel (1 6) am verschiebbaren Steg (10,1 1 ) in Richtung (X) parallel dazu verschiebbar und arretierbar sind.2. Soldering frame according to claim 1, characterized in that the hold-down means (1 6) on the displaceable web (10, 1) in the direction (X) can be displaced and locked parallel to it. 3. Lötrahmen nach Anspruch 1 , dadurch gekennzeichnet, dass der Arm (16') der Niederhaltemittel (16) ein Schwenkarm ist, welcher um eine Rändelschraube (17), mittels welcher das Niederhaltemittel (1 6) am verschiebbaren Steg (10, 1 1 ) arretierbar ist, drehbar ist.3. Soldering frame according to claim 1, characterized in that the arm (16 ') of the hold-down means (16) is a swivel arm which is about a knurled screw (17) by means of which the hold-down means (1 6) on the displaceable web (10, 1 1 ) can be locked, is rotatable. 4. Lötrahmen nach Anspruch 2 oder 3, dadurch gekennzeichnet, dass die Auflagehöhe wählbar oder verstellbar ist.4. Soldering frame according to claim 2 or 3, characterized in that the support height is selectable or adjustable. 5. Lötrahmen nach Anspruch 1 , dadurch gekennzeichnet, dass die Niederhaltemittel (1 6) eine Feder aufweisen.5. Soldering frame according to claim 1, characterized in that the hold-down means (1 6) have a spring. 6. Lötrahmen (1 ) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der verschiebbare Steg (10; 1 1 ) eine Nut (1 2) in der Form eines U-förmigen Profils aufweisen.6. soldering frame (1) according to any one of claims 1 to 5, characterized in that the displaceable web (10; 1 1) has a groove (1 2) in the form of a U-shaped profile. 7. Lötrahmen nach Anspruch 6, dadurch gekennzeichnet, dass die verschiebbare Niederhaltemittel (1 6) für die Leiterplatte (31 ) und/oder deren elektronische und elektrische Komponenten (32) am U-förmigen Profil (12) verschiebbar und arretierbar sind.7. Soldering frame according to claim 6, characterized in that the displaceable hold-down means (1 6) for the printed circuit board (31) and / or its electronic and electrical components (32) on the U-shaped profile (12) are displaceable and lockable. 8. Lötrahmen (1 ) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass senkrecht zum verschiebbaren Steg (10; 1 1 ) ein verschiebbarer Quersteg (23) mit Abstützungselementen (28) für die Leiterplatte (31 ) vorgesehen ist.8. Soldering frame (1) according to one of claims 1 to 5, characterized in that a displaceable transverse web (23) with support elements (28) for the printed circuit board (31) is provided perpendicular to the displaceable web (10; 1 1). 9. Lötrahmen nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass ein auf der inneren Auflage (3) abgestützter runder Einsatz (5) vorgesehen ist, auf weichem die Längsführungen (9) und die verschiebbaren Stege (10, 1 Dangeordnet sind. 9. Soldering frame according to one of claims 1 to 8, characterized in that a round insert (5) supported on the inner support (3) is provided, on which the longitudinal guides (9) and the displaceable webs (10, 1) are arranged.
PCT/CH2000/000195 1999-04-06 2000-04-04 Soldering frame Ceased WO2000059670A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU34145/00A AU3414500A (en) 1999-04-06 2000-04-04 Soldering frame

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH641/99 1999-04-06
CH64199 1999-04-06

Publications (1)

Publication Number Publication Date
WO2000059670A1 true WO2000059670A1 (en) 2000-10-12

Family

ID=4191754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2000/000195 Ceased WO2000059670A1 (en) 1999-04-06 2000-04-04 Soldering frame

Country Status (2)

Country Link
AU (1) AU3414500A (en)
WO (1) WO2000059670A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1252961A3 (en) * 2001-04-03 2004-01-14 Techni Print Modifiable brazing mask
GB2399310A (en) * 2003-03-11 2004-09-15 Hi Key Ltd A pallet for supporting a printed circuit board during soldering
CN105328295A (en) * 2015-11-20 2016-02-17 苏州光韵达光电科技有限公司 BGA (Ball Grid Array) component fixture
CN105328384A (en) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 Locating clamp for laser cutting of circuit boards
CN105666568A (en) * 2016-04-14 2016-06-15 吉林大学 Positioning device for sound absorption soft material cutting
CN106475690A (en) * 2016-10-31 2017-03-08 东莞市北扬工业设计有限公司 A precise positioning circuit board cutting and clamping device
CN108188535A (en) * 2018-03-20 2018-06-22 镭射沃激光科技(深圳)有限公司 A kind of mobile phone camera module group welding fixture and its welding charging method
CN113038733A (en) * 2021-03-10 2021-06-25 梁健玲 Welding equipment for assembling printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3826483A (en) * 1972-09-05 1974-07-30 W Siegel Planar work holder
EP0492912A2 (en) * 1990-12-24 1992-07-01 Ford Motor Company Limited Adjustable brazing fixture
US5820013A (en) * 1996-07-01 1998-10-13 Innovative Soldering Technologies Adjustable support apparatus for wave soldering of printed circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3826483A (en) * 1972-09-05 1974-07-30 W Siegel Planar work holder
EP0492912A2 (en) * 1990-12-24 1992-07-01 Ford Motor Company Limited Adjustable brazing fixture
US5820013A (en) * 1996-07-01 1998-10-13 Innovative Soldering Technologies Adjustable support apparatus for wave soldering of printed circuit boards

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1252961A3 (en) * 2001-04-03 2004-01-14 Techni Print Modifiable brazing mask
GB2399310A (en) * 2003-03-11 2004-09-15 Hi Key Ltd A pallet for supporting a printed circuit board during soldering
CN105328384A (en) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 Locating clamp for laser cutting of circuit boards
CN105328384B (en) * 2015-11-14 2017-07-04 苏州光韵达光电科技有限公司 A kind of positioning fixture for being cut by laser circuit board
CN105328295A (en) * 2015-11-20 2016-02-17 苏州光韵达光电科技有限公司 BGA (Ball Grid Array) component fixture
CN105666568A (en) * 2016-04-14 2016-06-15 吉林大学 Positioning device for sound absorption soft material cutting
CN106475690A (en) * 2016-10-31 2017-03-08 东莞市北扬工业设计有限公司 A precise positioning circuit board cutting and clamping device
CN108188535A (en) * 2018-03-20 2018-06-22 镭射沃激光科技(深圳)有限公司 A kind of mobile phone camera module group welding fixture and its welding charging method
CN108188535B (en) * 2018-03-20 2024-02-20 镭射沃激光科技(深圳)有限公司 Mobile phone camera module welding jig and welding feeding method thereof
CN113038733A (en) * 2021-03-10 2021-06-25 梁健玲 Welding equipment for assembling printed circuit board

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