WO2000054265A1 - Procede et appareil d'assemblage de disques optiques - Google Patents
Procede et appareil d'assemblage de disques optiques Download PDFInfo
- Publication number
- WO2000054265A1 WO2000054265A1 PCT/JP1999/001147 JP9901147W WO0054265A1 WO 2000054265 A1 WO2000054265 A1 WO 2000054265A1 JP 9901147 W JP9901147 W JP 9901147W WO 0054265 A1 WO0054265 A1 WO 0054265A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- disk
- suction
- disc
- adhesive
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
- B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7808—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
- B29C65/7811—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B2220/00—Record carriers by type
- G11B2220/20—Disc-shaped record carriers
- G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
- G11B2220/2537—Optical discs
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
Definitions
- the present invention relates to an apparatus and a method for bonding two optical disks, and more particularly, to another method in which an adhesive-applied disk placed on a disk table is sucked and held by an arm. When the disks are superimposed, a closed space is formed between the two disks, and the closed space is vacuum-sucked, so that air bubbles are not mixed into the adhesive and flat.
- the present invention relates to an optical disk bonding apparatus and a bonding method capable of bonding disks. Background art
- the first prior art shown in FIG. 7 Japanese Patent Application Laid-Open No. 8-273213 is a technology developed to prevent the outer peripheral portion of a disk from being thickened by a protective film. It is.
- a protective film is formed on the reflection film on the pit surface of each of the pair of single-sided disks 21 and 22 to be bonded, and an adhesive is applied to the bonding surface of at least one of the single-sided disks.
- the size is such that the crimping tables 25 and 26 are covered.
- a vacuum pump (not shown) vacuums the space 28 in the vacuum chamber 26 to vacuum. State.
- FIG. 8 Japanese Unexamined Patent Publication No. Hei 8-217706 removes air bubbles mixed in the adhesive of the superposed disks 31 or between the disks 31 better. This technology was developed for the purpose of doing so.
- the upper press plate fixed to the shaft portion 39 in the pressurizing device 30 in the closed space 33 formed by being covered by the chamber 132.
- this closed space 33 is formed.
- the O-ring 35 sealing the chamber 132 is deformed by the external pressure applied to the rigid body chamber 133, and the sealing interval 36 associated with the deformation of the O-ring 35 is reduced.
- the overlapping disc 31 is pressurized by the smaller amount. This is a technique in which air suction by the above-described vacuuming causes air bubbles in the adhesive of the overlapping disc 31 to be sucked out.
- the third conventional technique disclosed in Japanese Unexamined Patent Publication No. 3-245531 shown in FIG. 9 eliminates bubbles in the adhesive layer and makes the thickness of the adhesive layer uniform. This technique has been developed to maintain the flatness of the disks 43 and 44 in good manner.
- an adhesive is applied to at least one of the pair of disks 4 3, 4 4, and the pair of disks 4 3, 4 4 are opposed to each other so that the surface on which the adhesive is applied is inside.
- At least one of the discs 44 is deformed by warping so that the center portion bulges toward the other disc 43 side, and the pair of discs 43, 44 are sequentially joined from the center portion toward the outer peripheral side. Then, the above-mentioned pair of disks 43 and 44 joined over the entire surface is pressed and bonded.
- the first and second prior arts each employ a large-volume vacuum chamber 26, 32 that covers the disk plate, so that the apparatus itself is large-scale. As a result, the cost of the device increases.
- this type of vacuum chamber 26, 32 has a large internal volume, so it is necessary to increase the suction force for vacuum suction, and the suction time for achieving a predetermined pressure condition is long, and the work efficiency is high. Was also bad.
- a method is employed in which the air between the disks 43 and 44 is expelled to the outside by adopting a method in which one disk 44 is warped and the disks 43 and 44 are bonded. The effect was obtained, but in terms of effectively removing air bubbles mixed in with the adhesive, the time when the disk 44 overlaps the disk 43 is slow, and there is sufficient air around the disks 43 and 44. Due to its existence, etc., it was not sufficient.
- an object of the present invention is to realize the vacuum suction with a simple configuration in consideration of the effectiveness of the vacuum suction technology in the disk bonding technology, and to reliably prevent air bubbles from being mixed into the adhesive.
- the optical disk bonding apparatus wherein the second disk is superimposed on the first disk on which the adhesive is applied, and the two optical disks are bonded to each other. Are curved so as to bulge in a direction opposite to the direction of the first disk facing the second disk and are sucked and held, and are superposed on the first disk. Then, the closed space formed between the first and second disks by bringing the outer regions of the first and second disks into contact with each other is evacuated.
- the second disk is arranged on the disk table while the surface of the second disk facing the first disk is curved so as to swell toward the side opposite to the first disk and is suction-held.
- a space having a dish-like shape can be formed between the first disk and the second disk.
- the second disk force comes into contact with the adhesive on the first disk very quickly, so that bubbles are mixed into the adhesive. Will not be done.
- An optical disc bonding apparatus wherein the second disc described in claim 1 is provided with a ring-shaped convex portion abutting on an outer region of the second disc, A ring-shaped second disk suction part for sucking the area near the center hole of the above is sucked and held by an arm having a disk holding part formed with a ring, and is superposed on the first disk. Then, by sucking the second disk at a position where the end surface of the second disk suction portion is pulled in from the end surface of the convex portion, the second disk suction portion bulges in the direction opposite to the first disk side direction facing the second disk. Let it.
- the disk holding portion of the arm which functions to suck and hold the second disk and overlap the first disk, expands the second disk to the side opposite to the first disk facing the second disk. It effectively acts to bend out.
- the ring-shaped convex portion provided on the disk holding portion comes into contact with the outer region of the second disk and acts to maintain the position of the outer peripheral portion of the second disk, and the disk holding portion
- the ring-shaped second disk suction portion provided on the arm serves to draw the inner area of the second disk toward the arm side and suck the second disk, thereby bending the second disk into a shape like a dish down. .
- the peripheral wall surface of the center hole of the second disk sucked and held by the disk holding portion according to claim 1 or 2 is curved.
- the closed space is formed by making contact with the outer peripheral portion of a center pin fitted into the center hole of the first disk.
- the inner peripheral wall surface of the center hole of the second disk is brought into contact with the outer peripheral portion of the center pin without any gap, so that the closed space formed between the first disk and the second disk can be reliably ensured. Seal tightly. As a result, the volume of the closed space can be reduced and the hermeticity can be ensured, so that vacuum suction can be performed quickly.
- the inner space surrounded by the second disk suction portion described in claim 3 is the inner peripheral wall surface of the center hole of the second disk. It is formed so that it is sealed when it comes into contact with the outer periphery of the pin.
- the present invention even when the inner peripheral wall surface of the center hole of the second disk held by the arm comes into contact with the outer peripheral portion of the center pin, even if a gap is formed in the corresponding contact portion, By closing the inner space that is communicated with the gap and surrounded by the second disk suction part, the hermeticity of the closed space formed between the first disk and the second disk is ensured, and the vacuum is maintained. Ensure that suction can be performed.
- the closed space described in any one of claims 1 to 4 is vacuum-evacuated from a vacuum suction hole formed in the center pin.
- the center pin whose outer peripheral surface faces the inside of the closed space formed between the first disk and the second disk is provided with a vacuum suction hole communicating with the closed space, so that the disk table is Vacuum suction can be performed by simple means using the conventional shape as it is.
- a control means for adjusting the magnitude of the vacuum suction force is provided.
- the speed, time, and speed at which the second disk facing the first disk via the closed space leaves the second disk suction part by the vacuum suction of the closed space and moves to the first disk side. It is possible to adjust the pressure applied to the adhesive on one disc by simple means. That is, the magnitude of the vacuum suction force with respect to the disk suction force can be freely changed by a simple means of changing only the vacuum suction force while keeping the disk suction force of the second disk suction portion constant.
- the second disk is placed on the first disk. It is possible to quickly make contact with the adhesive applied to the adhesive.
- the center pin of the disk table is fitted into the first disk and faces the closed space. Vacuum suction is performed through a negative pressure suction hole formed in the outer peripheral portion of the vacuum pump.
- the outer peripheral portion of the center pin of the disk table facing the closed space is effectively used, and a negative pressure suction hole is provided in the outer peripheral portion to perform vacuum suction in the closed space.
- An optical disk bonding method having the above configuration can be provided.
- the vacuum suction step according to claim 8 the vacuum suction force from the negative pressure suction hole with respect to the disk suction force of the second disk is adjusted.
- a control step for performing the control is provided.
- the second disk facing the first disk is separated from the second disk suction portion by the vacuum suction of the closed space and the first disk.
- Speed, time, and first disc when moving to the disc side It is possible to adjust the pressure applied to the adhesive on the work piece by simple means.
- the second disk adheres to the adhesive.
- the arm is moved away from the disc table.
- the interference of the arm member is avoided, and the flatness of the second disk is ensured.
- the disk table is rotated when the second disk comes into contact with the adhesive.
- the centrifugal force generated by the rotation of the disk table acts to spread the adhesive, so that the thickness of the adhesive is constant and the flatness of the disk can be ensured.
- FIG. 1 is a diagram schematically showing the flow of the optical disk laminating and bonding steps
- FIG. 2 is a longitudinal sectional view showing substantially the entire optical disk laminating apparatus 1 according to the present invention
- FIG. 2A diagram showing the periphery of an arm 3 for holding a disc and a disc plate 2 for fixing a first disc, and a diagram showing a state in which an arm 3 holds a second disc and is located above a disc plate 2.
- FIG. 4 is a partial cross-sectional view of the arm 3
- FIG. 5 is a view in which the arm 3 holds the second disk and approaches above the disk plate 2, and the outer regions of the first disk D 1 and the second disk D 2
- FIG. 4 is a partial cross-sectional view of the arm 3
- FIG. 5 is a view in which the arm 3 holds the second disk and approaches above the disk plate 2, and the outer regions of the first disk D 1 and the second disk D 2 FIG.
- FIG. 6 is a view showing a state in which a closed space 5 is formed between the two disks Dl and D2 while being in contact with each other.
- FIG. 6 shows a second disk D1 fixed to the disk plate 2 via an adhesive. Disk D 2 is superimposed and second disk D 2 Shows how the arms 3 apart is rising, it is.
- the process of manufacturing optical discs such as DVDs (digital video discs) consists of a disc molding process, a cooling process, a sputtering process (recording film and reflection film forming process), an optical disc bonding process, and a disc bonding process (adhesive curing process) ), which is performed through the inspection process.
- the present invention relates to an optical disk laminating step in the optical disk manufacturing process.
- An optical disk (not shown) that has undergone a sputtering process (not shown) is referred to as a pair of disks DO and a pair of disks DO with respect to the side-by-side disk stack poles 14a and 14b. Being stacked.
- the disk DO is a pair of upper and lower disks stacked so that the reading surfaces of the disks are both directed upward, and a small disk spacer S is interposed between the disks. .
- the spacer S plays a role of separating the superposed upper and lower disks by the thickness of the spacer S. This prevents the upper and lower disks from being damaged by contact, etc., and also makes it easier to pick up disks one by one and transfer them to the subsequent transport process (U2, T2).
- Disks stacked on stack poles 14a and 14b DO disks are placed next to stack poles 14a and 14b with the reading surface facing up. It is transferred to a transport table (not shown). Then, the disc is conveyed on a convey rail (not shown) toward the subsequent disc bonding apparatus 1 (conveying steps U2, T2).
- the disk reading surface is lowered in the middle of the step T2. (The recording surface is on the upper side) (the disk inverting process shown by reference numeral T3), and the adhesive application process T4 is reached. That is, the adhesive 4 is prevented from being applied to the reading surface side.
- the disc transported and supplied in the transport process T2 is applied to the subsequent disc bonding apparatus 1 with the adhesive 4 applied to the upper surface of the disc and waits on the lower side.
- the disc conveyed and supplied in the conveying step U2 is a second disc to be superimposed by a predetermined method (described later) from above the first disc in the bonding apparatus 1. D2.
- each disk DO is connected to a dedicated spacer stack pole 13 disposed at an equal distance from the stack poles 14a and 14b, and an arm (not shown). , And are sequentially stacked (steps indicated by reference numerals U 1 and T 1).
- the adhesive 4 is circumferentially applied to the upper surface (recording surface) of the first disk D1 while the first disk D1 is slowly rotated by the predetermined nozzle 15. Applied.
- the adhesive 4 can be appropriately selected, but in the present embodiment, an adhesive made of an ultraviolet curable resin is used.
- the first disk D 1 to which the adhesive 4 has been applied is placed on a disk table 2 constituting the disk bonding apparatus 1 by a transfer arm (not shown) (a disk transfer step indicated by reference numeral T5). Wait for the second disk D2 to come.
- the second disk D 2 is sucked and held in a predetermined shape (described later) by an arm 3 constituting the disk bonding apparatus 1 through a disk transport step U 2 performed by a transport rail (not shown). It moves onto the disk table 2 on which 1 is placed.
- the disc D 3 is pressed against each other while maintaining the flatness of the disc, so that the adhesive 4 interposed between the discs D 1 and D 2 is spread, and the disc D 3 is irradiated with ultraviolet rays by the lamp 17.
- the adhesive 4 is hardened and bonded and fixed (ultraviolet irradiation step indicated by reference P3).
- the disc D4 on which the two discs are bonded and fixed is inverted so that the reading surface faces upward (inversion step indicated by reference numeral P4), and enters the inspection step P5.
- the inspection process P5 the degree of adhesion and flatness of the two disks Dl and D2 are determined, and the quality is determined.
- the non-defective disk D 6 and the defective disk D 7 are distributed to the mounting tables 18a and 18b, respectively.
- FIG. 2 shows a vertical cross-sectional view of the entire configuration of the disc bonding apparatus 1.
- the apparatus 1 includes a disc table 2 disposed on the lower side and having a substantially T-shaped cross section, and And an arm 3 arranged above the table 2.
- a flat, substantially cylindrical center pin 201 projects in the center of the flat table upper surface 202 of the disk table 2.
- the center pin 201 is positioned by being inserted into the center hole 300 of the first disk D 1 to which the adhesive 4 is applied and transferred, and the first disk D is placed on the upper surface 202 of the table. 1 is placed.
- the lower portion of the outer peripheral portion 201 1 of the center pin 201 specifically, the lower portion of the outer peripheral portion 201 1 is opened at least in a portion facing the upper side of the thickness of the first disk D1 so as to open.
- a plurality of vacuum suction holes 23 are provided at equal intervals in the circumferential direction (four in FIGS. 2, 3, and 5). Each of the vacuum suction holes 23 communicates with a suction path 7 formed in a vertical direction inside the shaft 10 that supports the disk table 2.
- reference numeral 8 denotes a suction member connected to the suction path 7
- reference numeral 9 denotes a suction member for sucking air from a disk fixing suction hole 204 opened in the table upper surface 202.
- the vacuum suction of the closed space 5 via the vacuum suction holes 23 and the suction from the disk fixing suction holes 204 are configured to measure the degree of vacuum by a separate vacuum sensor (not shown). It is designed so that the vacuum suction force can be easily adjusted independently.
- Reference numeral 12 denotes a housing that holds the shaft 10
- reference numeral 11 denotes a bearing that rotatably supports the shaft 10
- reference numeral 205 denotes a table mounting screw.
- FIG. 3 is an enlarged view showing a state where the arm 3 sucks and holds the second disk D2 and faces above the disk plate 2 on which the first disk D1 is placed.
- the arm 3 has a substantially inverted T-shape.
- the lower surface of the lower end 304 of the arm 3 that spreads in a substantially disk shape has a disk holding portion that functions to suck and hold the second disk D 2.
- the plate 106 is formed so as to face the disk mounting surface 202 of the disk plate 2.
- a ring-shaped convex portion 301 is provided so as to project downward.
- a second disk suction part 302 projecting in a ring shape is formed inside the center of the disk holding part 303.
- a ring-shaped suction hole 303 for sucking a negative pressure on the upper surface D2b of the second disk D2 in the slightly outer area is provided in the vertical direction. It is formed through.
- the end surface 3002 of the second disk suction portion 302 is moved from the same height position H0 as the end surface 3101 of the convex portion 301 to a position H1 which is further drawn upward.
- the arm 3 is provided so as to be movable.
- the height of each of the end faces 3101, 31 is such that a step corresponding to the length indicated by the symbol L is formed. Become.
- the setting of the length of the code L can be appropriately selected.
- the length is set to L21.5 mm. This is suitable for preventing excessive deformation of the second disk D2, preventing deformation of the disk D2 as much as possible, and forming a closed space 5 (described later) having an appropriate volume. Because it is length.
- the vertical movement of the second disk suction part 302 (see the arrow indicated by the symbol Y in FIG. 4) is configured so that the length of the symbol L can be secured up to 3 mm, and the volume of the closed space 5 is adjusted. It is devised so that it can be done.
- the second disk D 2 bulges in the direction opposite to the first disk D 1 facing the second disk D 2 (the direction of arrow X shown in FIG. 3).
- the disk is held by suction in the disk holding part 303 in a curved shape.
- the upper surface D2a of the outermost surface D2a of the second disk D2 is brought into contact with the convex portion 301, and the upper surface D2b of the center hole 305 of the second disk D2 is slightly outside. Is sucked by the second disk sucking section 302, so that the inside of the second disk D2 The side area is sucked upward and is primarily transformed into a dish-like shape.
- the second disk D2 used in the present invention can be applied to both a disk having a recording film formed thereon and a non-recording film.
- an ultraviolet curable resin-based adhesive 4 is circumferentially applied to the upper surface of the first disk D 1 placed on the disk staple 2 and waiting.
- the second disk D 2 comes into contact with the adhesive 4, the surrounding air is entrapped and air bubbles are mixed in, so that obstruction of reading of the recording surface by a single laser beam may occur.
- the invention employs the disc bonding method described below.
- the second disk D 2 swelled upward and held by the arm 3 is overlapped with the center position of the first disk D 1, and both disks D 1, D 2 Only the outer portions D1a and D2a are brought into contact with each other, and a closed space in the shape of a dish shown by reference numeral 5 is formed in the disk inner region.
- the inner peripheral wall surface 310 of the center hole 305 of the second disk is in close contact with the outer peripheral portion 201 of the center pin 201 so that no gap is formed.
- the second disk D2 maintains the flatness, so that the center pin 201 holds the second disk D2.
- the center hole 3 0 5 will be mounted while maintaining the perfect circular shape. As a result, there is a gap between the inner peripheral wall 3 0 5 1 and the outer peripheral portion 2 0 1 1 of the center pin 2 0 1. Is not formed.
- the closed space 5 When the closed space 5 is formed, the space 6 formed in the area above the center pin 201 so as to be surrounded by the second disk suction portion 302 is closed, so Even if a gap may be formed between the inner peripheral wall 3 0 5 of the hole 3 0 5 and the outer peripheral portion 2 0 1 1 of the center pin 2 0 1, the closed space 5 is eventually sealed. It is secured to maintain its sexuality.
- the bonding apparatus 1 Since vacuum suction is performed through the vacuum suction holes 203 formed in the lower part of the center pin 201 that faces the inside of the closed space 201, the inside of the closed space 200 immediately becomes a negative pressure state. To form a vacuum. Then, when the vacuum suction force by the vacuum suction holes 203 overcomes the suction force of the second disk suction part 302, the second disk is attracted to the first disk D1 side, and the adhesive 4 Contact the upper surface of the Here, the bonding apparatus 1 has a regulation (not shown) for adjusting the magnitude of the vacuum suction force of the negative pressure suction hole 23 with respect to the disk suction force of the second disk suction portion 302 of the arm 3. One unit is provided.
- the adhesive 4 tends to gather toward the center of the adhesive 4 due to its own surface tension. Failure to do so may hinder the flatness of the disk. Therefore, from the moment when the second disk D 2 separates from the second disk suction part 302 and comes into contact with the adhesive 4, the disk table 2 is rotated at a high speed, and the centrifugal force causes the adhesive 4 to be removed as shown in FIG. Spread it to the area of a certain width as shown, and make the thickness of the adhesive 4 constant.
- the optical disk laminating apparatus and the laminating method according to the present invention do not allow air bubbles to enter the adhesive and can ensure the flatness of the disk. It is possible to provide a high-quality optical disk with high reading accuracy by light.
- the closed space to be vacuum-sucked has an extremely small volume, a vacuum suction effect can be quickly generated in the closed space, so that the entire process time of the optical disc bonding process can be greatly reduced. Therefore, it contributes to the improvement of optical disk manufacturing efficiency.
- the adhesive applied to the first disk is expanded with a certain thickness without intervening air bubbles, and is interposed between the two disks. It also contributes to lower manufacturing costs.
- the optical disk laminating apparatus and the laminating method according to the present invention contribute to the development of the optical disk manufacturing industry and the provision of a high-quality optical disk.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Optical Record Carriers (AREA)
Description
Claims
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019997008870A KR100327834B1 (ko) | 1999-03-10 | 1999-03-10 | 광디스크 부착합체 장치 및 부착합체 방법 |
| US09/380,755 US6312549B1 (en) | 1999-03-10 | 1999-03-10 | Optical disk pasting apparatus and method for pasting optical disks |
| PCT/JP1999/001147 WO2000054265A1 (fr) | 1999-03-10 | 1999-03-10 | Procede et appareil d'assemblage de disques optiques |
| JP53819299A JP3281390B2 (ja) | 1999-03-10 | 1999-03-10 | 「光ディスク貼り合わせ装置及び貼り合わせ方法」 |
| EP99907891A EP1182655A4 (en) | 1999-03-10 | 1999-03-10 | METHOD AND APPARATUS FOR ASSEMBLING OPTICAL DISCS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1999/001147 WO2000054265A1 (fr) | 1999-03-10 | 1999-03-10 | Procede et appareil d'assemblage de disques optiques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000054265A1 true WO2000054265A1 (fr) | 2000-09-14 |
Family
ID=14235139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1999/001147 Ceased WO2000054265A1 (fr) | 1999-03-10 | 1999-03-10 | Procede et appareil d'assemblage de disques optiques |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6312549B1 (ja) |
| EP (1) | EP1182655A4 (ja) |
| JP (1) | JP3281390B2 (ja) |
| KR (1) | KR100327834B1 (ja) |
| WO (1) | WO2000054265A1 (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW527590B (en) * | 2000-04-25 | 2003-04-11 | Matsushita Electric Industrial Co Ltd | Compact disk, and the manufacturing method of the same, and the manufacturing device of compact disk |
| DE10317886B4 (de) * | 2003-04-17 | 2005-05-04 | Singulus Technologies Ag | Vorrichtung und Verfahren zum Herstellen von Verbundsubstraten |
| ATE393694T1 (de) * | 2003-08-22 | 2008-05-15 | Oerlikon Trading Ag | Verfahren zum verkleben von scheibenförmigen substraten und vorrichtung zur durchführung des verfahrens |
| CN100483525C (zh) * | 2003-12-05 | 2009-04-29 | 芝浦机械电子装置股份有限公司 | 贴合装置及贴合方法 |
| FR2883984B1 (fr) | 2005-04-04 | 2007-06-22 | Essilor Int | Appareil pour conformer un film plan sur une lentille optique, procedes de fonctionnalisation d'une lentille optique au moyen dudit appareil, et lentille ainsi obtenue |
| US8885251B2 (en) | 2005-04-04 | 2014-11-11 | Essilor International (Compagnie Generale D'optique) | Apparatus for conforming a planar film on an optical lens, method for functionalizing an optical lens by means of said apparatus, the optical lens so-obtained |
| DE102005029502A1 (de) * | 2005-06-24 | 2006-12-28 | Steag Hamatech Ag | Substrataufnahme |
| FR2897693B1 (fr) | 2006-02-23 | 2008-11-21 | Essilor Int | Element optique polarisant comprenant un film polariseur et procede de farbrication d'un tel element |
| WO2013120082A1 (en) | 2012-02-10 | 2013-08-15 | Kassab Ghassan S | Methods and uses of biological tissues for various stent and other medical applications |
| WO2014124356A2 (en) | 2013-02-11 | 2014-08-14 | Cook Medical Technologies Llc | Expandable support frame and medical device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520713A (ja) * | 1991-07-11 | 1993-01-29 | Sharp Corp | 光デイスクの製造方法 |
| JPH08293131A (ja) * | 1995-04-20 | 1996-11-05 | Kitano Eng Kk | 光ディスクの製造方法 |
| JPH0944917A (ja) * | 1995-05-20 | 1997-02-14 | Kitano Eng Kk | 光ディスクの製造方法およびその製造方法に使用される載置基台 |
| JPH09198720A (ja) * | 1996-01-12 | 1997-07-31 | Horon:Kk | 光学式記録情報媒体の貼り合わせ方法及びその装置 |
| JPH09320132A (ja) * | 1996-05-31 | 1997-12-12 | Ricoh Co Ltd | 光ディスクメディアの製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02308444A (ja) * | 1989-05-23 | 1990-12-21 | Seiko Epson Corp | 光記録媒体の製造方法 |
| JPH03245331A (ja) | 1990-02-22 | 1991-10-31 | Sony Corp | ディスク貼合わせ方法 |
| JPH0520714A (ja) | 1991-07-15 | 1993-01-29 | Matsushita Electric Ind Co Ltd | 光デイスク製造方法及び製造装置 |
| JP2777552B2 (ja) | 1995-03-31 | 1998-07-16 | 東芝イーエムアイ株式会社 | 貼り合わせディスクの製造方法およびその装置 |
| US5744193A (en) * | 1995-05-20 | 1998-04-28 | Kitano Engineering Co., Ltd. | Method of manufacturing an optical disc and a placing platform to be used by the same |
| EP0866450B1 (en) * | 1997-03-17 | 1999-06-30 | TAPEMATIC S.p.A. | Device and process for gluing disc halves for manufacturing data-storage optical discs |
| JP4068187B2 (ja) | 1997-08-25 | 2008-03-26 | 松下電器産業株式会社 | 光ディスク製造方法 |
| JPH1166645A (ja) | 1997-08-25 | 1999-03-09 | Origin Electric Co Ltd | 光ディスク貼り合わせ方法及び装置 |
-
1999
- 1999-03-10 KR KR1019997008870A patent/KR100327834B1/ko not_active Expired - Fee Related
- 1999-03-10 US US09/380,755 patent/US6312549B1/en not_active Expired - Fee Related
- 1999-03-10 JP JP53819299A patent/JP3281390B2/ja not_active Expired - Fee Related
- 1999-03-10 EP EP99907891A patent/EP1182655A4/en not_active Withdrawn
- 1999-03-10 WO PCT/JP1999/001147 patent/WO2000054265A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520713A (ja) * | 1991-07-11 | 1993-01-29 | Sharp Corp | 光デイスクの製造方法 |
| JPH08293131A (ja) * | 1995-04-20 | 1996-11-05 | Kitano Eng Kk | 光ディスクの製造方法 |
| JPH0944917A (ja) * | 1995-05-20 | 1997-02-14 | Kitano Eng Kk | 光ディスクの製造方法およびその製造方法に使用される載置基台 |
| JPH09198720A (ja) * | 1996-01-12 | 1997-07-31 | Horon:Kk | 光学式記録情報媒体の貼り合わせ方法及びその装置 |
| JPH09320132A (ja) * | 1996-05-31 | 1997-12-12 | Ricoh Co Ltd | 光ディスクメディアの製造方法 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP1182655A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3281390B2 (ja) | 2002-05-13 |
| EP1182655A1 (en) | 2002-02-27 |
| KR20010005797A (ko) | 2001-01-15 |
| US6312549B1 (en) | 2001-11-06 |
| KR100327834B1 (ko) | 2002-03-09 |
| EP1182655A4 (en) | 2003-01-29 |
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