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WO2000040390A1 - Appareil et procede de moulage et de traitement de silicone - Google Patents

Appareil et procede de moulage et de traitement de silicone Download PDF

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Publication number
WO2000040390A1
WO2000040390A1 PCT/US1999/000323 US9900323W WO0040390A1 WO 2000040390 A1 WO2000040390 A1 WO 2000040390A1 US 9900323 W US9900323 W US 9900323W WO 0040390 A1 WO0040390 A1 WO 0040390A1
Authority
WO
WIPO (PCT)
Prior art keywords
top platen
silicone
mold plate
platen
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/000323
Other languages
English (en)
Inventor
Robert J. Styczynski, Sr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AU22155/99A priority Critical patent/AU2215599A/en
Priority to PCT/US1999/000323 priority patent/WO2000040390A1/fr
Publication of WO2000040390A1 publication Critical patent/WO2000040390A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2756—Cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B29C33/048—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam using steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C45/7337—Heating or cooling of the mould using gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material

Definitions

  • This invention relates to molding of silicone, and more particularly, to a method and apparatus for molding and curing silicone.
  • silicone is molded using a press which holds a heated top and bottom mold cavity while the liquid silicone is injected into the mold using a pump. After the silicone is cured under heat, the press is lifted, the mold is separated and the molded silicone part is removed.
  • the typical mold comprises a top mold plate which contains a mold cavity and a runner cavity. The silicone is injected under pressure into the runner cavity where it flows into the mold cavity. When the silicone cures, the silicone remaining in the runner cavity, referred to as runner silicone, must then be separated from the remaining silicone and the runner cavity.
  • runner silicone the silicone remaining in the runner cavity
  • One problem with the conventional techniques for molding silicone is that the hot mold cannot normally be handled manually. This problem has prevented the development of a molding and curing system which can be used to mold silicone onto a substrate such as fabric.
  • the apparatus for molding and curing silicone includes a press, one or more injection nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having one or more receptacles therein to receive the nozzles therein, and a mold plate having a mold cavity therein.
  • the top platen is kept at a constant elevated temperature.
  • the mold plate and top platen are also oriented for placement in an injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen wherein silicone is injected into the mold plate through the nozzles and into the mold cavity.
  • the mold plate and top platen are oriented for placement in a curing position so that the heated top platen contacts the mold plate to allow silicone injected within the mold plate to cure.
  • the nozzle When in the curing position, the nozzle is outside of the receptacle of the top platen and the top platen is uncooled by the manifold plate.
  • the top platen and mold plate are also oriented for placement in a home position. In this position, the nozzles are located outside of the receptacles of the top platen, and the mold plate is uncontacted by the top platen.
  • the mold plate is typically located on a bottom platen when in the injecting position.
  • the bottom platen is kept at a constant elevated temperature.
  • the mold plate includes a runner cavity which is in silicone flow relationship with the mold cavity when the nozzles are placed in silicone flow relationship with the runner cavity and the top platen and mold plate are in the injecting position.
  • a runner remover may be used to remove runner silicone from within the mold cavity.
  • the runner remover may include a plurality of fingers which are placed within the runner cavity when the mold plate and top platen are in the injection position. The fingers are disposed to lift the runner silicone out of the runner cavity when the top platen and mold plate are placed in the home position. This may be accomplished by orienting the fingers so that they are slidably engaged to the top platen. The fingers may be spring loaded into the top platen.
  • the runner remover may further include means for disengaging the silicone runner from the fingers, such as a plurality of tines.
  • the top platen of the apparatus may be linearly translatable relative to the nozzles and the manifold plate.
  • the mold plate may also be linearly translatable relative to the top platen and the nozzles.
  • the apparatus may also include a means for aligning the nozzles, the top platen, and the mold plate, with each other.
  • the means for aligning may include at least one pin, and preferably four pins, axially aligned through the manifold plate, the top platen and the mold plate.
  • the apparatus may further include a first biasing means between the top platen and the manifold plate, and a second biasing means between the top platen and the mold plate.
  • the first biasing means may include one or more springs located between the manifold plate and the top platen.
  • the second biasing means may include one or more springs located between the top platen and the mold plate. Preferably, four springs may be located therebetween.
  • the biasing means biases the top platen and mold plate in the home or open position.
  • the apparatus may further include a means for holding a substrate upon the bottom platen.
  • the means may include at least one pressure activated push rod.
  • the push rod may be operatively connected to a fluid, such as air cylinder.
  • the invention also includes a method of molding and curing silicone.
  • the method involves aligning one or more injection nozzles into nozzle receptacles of a top platen, cooling the nozzles using liquid, placing the nozzles relative to a mold plate using a press and injecting silicone into a mold cavity within the mold plate under pressure, curing the injected silicone by heating the top platen and contacting the mold plate with the heated top platen.
  • the heating step may include removing the nozzles from within the nozzle receptacles, and maintaining the heated top platen on the mold plate.
  • the nozzles may be located within a manifold plate and the cooling step may involve flowing cooling liquid into the manifold plate.
  • the heated top platen may be lifted off of the mold plate after the silicone within the mold cavity has cured.
  • the mold plate may include a runner cavity in silicone flow relationship to the mold cavity, and the method may further include removing runner silicone from the runner cavity.
  • the silicone may be injected onto a substrate maintained in position on a heated bottom platen during the injection step.
  • the substrate may be a fabric material, and the silicone may be injected and cured onto the fabric.
  • the method may be performed using the apparatus of the present invention.
  • Figure 1 depicts a schematic representation of the apparatus for molding and curing silicone constructed in accordance with the present invention
  • Figure 2 depicts a front view of the apparatus for molding and curing silicone constructed in accordance with the principles of the present invention in the injecting position with a substrate of fabric material placed between a mold plate and bottom platen;
  • Figure 3 depicts a front view of the apparatus depicted in Figure 2 in the curing position
  • Figure 4 depicts a front view of the apparatus of Figures 2 and 3 in home position after silicone has been injected and cured;
  • Figure 5 depicts a side view of the apparatus shown in Figures 2, 3 and 4 in the home position including the runner removal system and
  • Figure 6 depicts a block diagram depicting various components and/or systems used to operate the apparatus depicted in Figures 1-5 in order to mold and cure silicone in accordance with the principles of the present invention.
  • the apparatus includes a press 1 having a linearly translatable ram, (referred to herein as "press"). At the end of the press 1 is a manifold 3 having injection nozzles 5 therein.
  • the press 1 is connected to a top plate 6 and moves relative therethrough along its linearly translatable axis.
  • a top platen 7 Operatively connected to the manifold is a top platen 7 which is located between the manifold 3 and a mold plate 9.
  • the mold plate 9 is also operatively connected to the press 1 and top platen 7.
  • the mold plate When the press is activated, the mold plate is pushed onto the bottom platen 11.
  • the bottom platen 11 is, preferably, surrounded by a water cooled template table 12 and is adapted to support a substrate thereon for the molding of silicone rubber.
  • the apparatus further includes a means for holding the substrate onto the bottom platen. This means may include one or more pressure activated push rods 13, 13'. Referring now to Figures 2-4, the apparatus for molding and curing silicone will be more thoroughly described.
  • Attached to the top plate 6 located at the end of the press 1, is the manifold plate 3 which may be liquid cooled. Within the manifold 3 are ports which lead to silicone injection nozzles 5, 5' ("nozzles").
  • the nozzles are in fluid flow relationship with the ports within the manifold which are in fluid flow relationship with the pump (not shown) which pumps the mixed silicone constituents through conduits into the manifold plate and through ports within the plates into the nozzles 5, 5'.
  • the nozzles 5, 5' are located within chambers of the manifold plate 3 and are allowed to move in the direction of linear translation of the press 1 relative to the manifold plate 3.
  • the nozzles 5, 5' may be biased in the manifold plate 3 using springs 15, 15'. These springs are compressed between the nozzles and a portion of the manifold plate to bias the nozzle towards the lower direction, i.e., towards the bottom platen 11.
  • top platen 7 Located below the manifold plate is a top platen 7 which is linearly translatable relative to the manifold plate 3 and nozzles 5, 5' therein.
  • the top platen 7 is aligned with the nozzles 5, 5' within the manifold plate 3 so that the nozzles 5, 5' are aligned with nozzle receptacles 17, 17' along the linear axis of translation of the press 1.
  • the top platen 7 and the bottom platen 11 are heatable and may be heated by, for example, contact with a heat source, such as an electric heating element, running steam therethrough or by any other suitable means.
  • the mold plate 9 Located below the heated top platen 7 and aligned therewith is a mold plate 9.
  • the mold plate 9 contains a mold cavity 19 on the bottom side and a runner cavity 21 on the top side. Passages connect the mold cavity 19 with the runner cavity 21.
  • the mold cavity 19 faces the bottom platen 11 and the area defined therebetween when the mold plate contacts the bottom platen 11, or a bottom mold plate (not shown), and defines the area where silicone is molded and cured.
  • the mold plate 9 is aligned along the axis of linear translation of the press 1 and is translatable along that direction relative to the press 1, relative to the heated top platen 7, and relative to the manifold plate 3.
  • top platen 7 and mold plate 9 are aligned so that when the mold plate 9 contacts the top platen 7, the nozzle receptacles 17, 17' in the top platen are aligned to allow silicone, flowing through the nozzles 5, 5' within the nozzle receptacle 17, 17', to flow into the runner cavity 21 of the mold plate 9. Since the nozzle receptacles extend through the top platen 7 when the nozzles 5, 5' are inserted into the receptacles, the nozzles are directly aligned, and exposed to, the runner cavity 21.
  • the apparatus includes a system or means for allowing each of the manifold plate 3, top platen 7 and mold plate 9 to be linearly moveable along the axis of linear translation of the press 1, relative to one another.
  • a system may include one or more, but preferably four, pins.
  • a pair of pins 25, 25' which extend through the top plate 6 of the press 1 is shown in Figures 2-4.
  • the pins extend through apertures in each of the manifold plate 3, top platen 7, and mold plate 9.
  • the pins may be locked in place by any suitable means or locking mechanisms such as a collar.
  • the pins are oriented in a direction parallel to the axis of linear translation of the press 1 and insure that the top platen and mold plate move in the same linear direction.
  • the runner removal system may include a plurality of runner lift off fingers 31, 31', 31". These runner lift off fingers may be linearly translatable along the axis of translation of the press relative to the heated top platen 7 and extend downwardly therefrom towards the mold plate 9.
  • the runner lift off fingers 31, 31', 31" are aligned with the runner cavity 21 of the mold plate 9. The runner lift off fingers are oriented to depress within the top platen 7 when the apparatus is in the closed position as shown in Figure 2.
  • Springs 33, 33', and 33" may be used to bias the runner lift off fingers 31 , 31 ', 31 ", in the open position as is shown in Figure 4
  • the springs may be placed in compression within the top platen 7 to push the runner lift off fingers 31, 31', 31", in the home or open position
  • Other means for placing the runner lift off fingers in the open position (as shown in Figure 4) and the closed position (as shown in Figure 2) and any intermediate positions therebetween may also be used and the invention is not limited to any particular means
  • means for securing the substrate to the bottom platen may be used as shown in Figure 2-4, one such means includes a one or more push rods 13, 13' extending from pressurized cylinders 39, 39'
  • the cylinders are pressurized with fluid, such as air, under controlled pressure
  • the cylinders push the push rods 13, 13' in the linear direction of translation of the press 1 to contact the substrate 35 as is shown in Figures 2 and 3, and pull the push rods in the opposite direction
  • a means for preventing the press and top plate from rotating may be used in the system As shown in Figure 4, this means may include an anti-rotation rod 41 which is affixed to the top plate 6 and extends through an aperture within any fixed structure 44
  • the apparatus is in the home position as depicted in Figure 4
  • the silicone flowing through the manifold plate 3 is cooled to approximately 70-80 °F by liquid such as water flowing through the manifold plate 3 while the top platen 7 is heated to approximately 350°F In this position, no silicone is injected through the nozzles
  • the bottom platen 11 is heated to about 350°-400°F
  • the press is actuated and the apparatus is moved into the injecting position as shown in Figure 2 In this position, the nozzles 5, 5', are inserted into the nozzle receptacles 17, 17', of the heated top platen 7 and the heated platen 7 is contacting the top of the mold plate 9 so that the nozzles are aligned with the runner cavity 21 and the runner lift off fingers are withm the runner cavity 21
  • the manifold plate 3 contacts the heated top platen 7 near the nozzles 5, 5' Silicone is then injected through the nozzle
  • top plate 6, manifold plate 3, heated platen 7, and mold plate 9 is shown
  • four sets of pins such as those depicted by reference numbers 25, 25', and 25", one on each corner of the top plates, top plate 6, manifold plate 3, heated top platen 7, and mold plate 9 may be used
  • four compression springs such as those depicted by reference numbers 27, 27', and 27" may be located between the manifold plate 3 and heated top platen 7 to bias the apparatus in the open position and push the top platen 7 away from manifold 3
  • four compression springs such as those depicted by reference numerals 29, 29, and 29" may be located between the heated top platen 7 and the mold plate 9 to push the mold plate 9 away from the heated top platen 7 and bias the apparatus in the open or home position
  • the heads of the pins such as that depicted by reference numbers 25, 25', 25" are recessed within the mold plate 9 so as to not impede with the contact between the mold plate
  • the runner remover system is also shown After the injecting and curing stages have ended and the apparatus is placed in the home position as shown in Figures 4 and 5, the runner lift off fingers will lift the runner silicone 41 out of the runner cavity 21 Located at the same horizontal plane as the runner silicone 41 are a plurality of tines 43 which may travel in a direction normal to the axis of linear translation of the press 1
  • the tines 43 may be linearly translated from a first position directly in the rear of the runner silicone 41 to a second position in front of the mold plate 9 While the tines travel from the first position to the second position, they will contact the runner silicone 41 and separate the same from the lift off fingers 31, 31', 31"
  • the metal plate 45 also moves with the tines so that when the runner silicone 41 is separated it will fall on the metal plate 45 which also translates along with tines 43 from a first position near the second position.
  • FIG. 6 depicts a schematic block diagram of various components which may be used with the apparatus depicted in Figures 2-5.
  • the apparatus is coupled to a control system 51.
  • the control system controls the pumping of the silicone from a pump and injector 53 which mixes the silicone components 55 and feeds controlled amounts of the same into the nozzles 5, 5', as shown in Figures 2-5.
  • the control system 51 may also control the coolant from a coolant supply 57 which flows through the manifold 3.
  • control system may also control the heating of the bottom and top platens 11, 7, respectively, as well as the positioning of the press 1, the push rods 13, 13', various valve and fluid control mechanisms for the control of the components used to mix silicone, silicone pumped from the pump through the nozzles, various coolants (such as water) used to cool the manifold 3, and/or heating elements or agents (such as steam) used to heat the top platen 7 and bottom platen 11.
  • various coolants such as water
  • heating elements or agents such as steam
  • the control system includes various sensors which sense the position of the press 1, top platen 7 and mold plate 9. Based upon the sensed positions, valves controlling the flow of silicone, coolant and/or heating fluid may be opened and/or closed.
  • control system may control the position of the push rods 13, 13', and the pressurization of fluid used to control the positions of the same.
  • control system may be used to control the positioning of these items of the apparatus to ensure proper positioning in the home, curing and injecting positions.
  • hydraulic or pneumatic means are used to control the position of the top platen 7 and/or mold plate 9, the control system may be used to control the same.
  • the control system will comprise a computer or other microprocessor control system.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un appareil et un procédé de moulage et de traitement de silicone comportant une presse (1), des buses d'injection (5) fichées de manière fonctionnelle sur la presse, une plaque de collecteur (3) refroidie par un liquide et servant à refroidir les buses, un plateau supérieur chauffable (7) comportant des réceptacles pour buse (17, 17') destinés à recevoir les buses et une plaque de fond (9) comprenant une cavité de moulage (19). La plaque de moulage (9) et le plateau supérieur (7) sont orientés afin d'être placés en position d'injection. De cette façon, pendant que le plateau supérieur vient en contact avec la plaque de moulage, les buses (5) s'insèrent dans les réceptacles pour buse (17, 17') du plateau supérieur de sorte que la silicone est injectée dans la plaque de moulage et la cavité de moulage (19). Cet appareil peut être mis en position de traitement lorsque le plateau supérieur (7) est chauffé et vient en contact avec la plaque de moulage (9), de sorte que la silicone injectée dans la plaque de moulage puisse durcir. Par ailleurs, cet appareil peut être mis en position de repos, dans laquelle la plaque de moulage (9) n'entre pas en contact avec le plateau supérieur chauffé (7) qui n'est pas refroidi par la plaque de collecteur (3) en position de repos.
PCT/US1999/000323 1999-01-07 1999-01-07 Appareil et procede de moulage et de traitement de silicone Ceased WO2000040390A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU22155/99A AU2215599A (en) 1999-01-07 1999-01-07 Apparatus and method for molding and curing silicone
PCT/US1999/000323 WO2000040390A1 (fr) 1999-01-07 1999-01-07 Appareil et procede de moulage et de traitement de silicone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/000323 WO2000040390A1 (fr) 1999-01-07 1999-01-07 Appareil et procede de moulage et de traitement de silicone

Publications (1)

Publication Number Publication Date
WO2000040390A1 true WO2000040390A1 (fr) 2000-07-13

Family

ID=22271950

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/000323 Ceased WO2000040390A1 (fr) 1999-01-07 1999-01-07 Appareil et procede de moulage et de traitement de silicone

Country Status (2)

Country Link
AU (1) AU2215599A (fr)
WO (1) WO2000040390A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4238181A (en) * 1978-12-21 1980-12-09 Hooker Chemicals & Plastics Corp. Method and apparatus for runnerless injection-compression molding thermosetting materials
US4298332A (en) * 1978-04-08 1981-11-03 Katashi Aoki Nozzle device for molding plastics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4298332A (en) * 1978-04-08 1981-11-03 Katashi Aoki Nozzle device for molding plastics
US4238181A (en) * 1978-12-21 1980-12-09 Hooker Chemicals & Plastics Corp. Method and apparatus for runnerless injection-compression molding thermosetting materials

Also Published As

Publication number Publication date
AU2215599A (en) 2000-07-24

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