[go: up one dir, main page]

WO1999006612A1 - Etamage a deux couches se pretant au soudage - Google Patents

Etamage a deux couches se pretant au soudage Download PDF

Info

Publication number
WO1999006612A1
WO1999006612A1 PCT/US1998/015755 US9815755W WO9906612A1 WO 1999006612 A1 WO1999006612 A1 WO 1999006612A1 US 9815755 W US9815755 W US 9815755W WO 9906612 A1 WO9906612 A1 WO 9906612A1
Authority
WO
WIPO (PCT)
Prior art keywords
tin
layer
substrate
bright
matte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1998/015755
Other languages
English (en)
Inventor
I-Yuan Wei
Joseph Haimovich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Priority to AU86707/98A priority Critical patent/AU8670798A/en
Publication of WO1999006612A1 publication Critical patent/WO1999006612A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Definitions

  • the present invention is directed towards a tin layer and a plating process which reduces the amount of tin needed on a substrate while still maintaining good solderability of the substrate.
  • Tin and certain tin alloys are used in the electronics industry as a plated finish on separable electrical connectors or as coatings to aid soldering or as solders. Tin and certain tin alloy plating is often used on electrical contacts or other items which are made from copper alloys to provide corrosion resistance for the electrical contact or for the underlying substrate metal of the electrical contact.
  • the underlying metal is protected from corrosion because the tin forms an oxide layer on the outer surface.
  • the oxide layer protects the tin from corrosion.
  • the ability of a tin layer to protect an underlying substrate depends on the tin layer remaining intact. If the tin layer cracks, unprotected substrate can corrode. If the oxide layer cracks, the exposed tin layer will reoxidize.
  • the underlying substrate can be oxidized or corroded.
  • the substrate will be protected from oxidation and corrosion as long as the tin does not crack to the base of the tin layer.
  • Electrodeposited bright tin can be extremely brittle depending on the plating conditions and can crack all the way down to the substrate.
  • the solder tail is covered with an adequate layer of tin or tin- lead alloy to provide a good coverage over the solderable portion of the electrical contact.
  • the layer of tin or tin-lead alloy is typically 150-250 microinches ( ⁇ in) (3.8 to 8.3 ⁇ m) thick for a two year shelf life. It is necessary to provide such a thick layer of tin or tin-lead alloy because of the growth of copper/tin intermetallic compounds between the inner surface of the tin or tin-lead alloy layer and the outer surface of the solderable portion of the contact.
  • the intermetallic compounds can grow to be quite thick, and if the tin or tin-lead alloy layer is too thin, the intermetallic compounds can reach the surface of the tin or tin-lead alloy. Presence of the intermetallic compounds on the surface of tin or tin-lead alloy degrades the ability of the surface to be soldered.
  • the layer of tin or tin- lead alloy it makes the surface unwettable by the solder. Therefore, it is necessary for the layer of tin or tin- lead alloy to be sufficiently thick to ensure that the intermetallic compounds do not grow to the surface of the tin or tin-lead alloy.
  • solder tail of the electrical contact must provide a good solderable surface so that the electrical contact can be soldered to a wire or some other conductive surface, such as a surface mount pad or a through hole. Failure of the solder joint occurs when only 5% of the surface area is unwettable by molten solder, by definition of the Solderability Test, Joint Industry Standard, J-STD-002, April 1992, "Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires," page 5. The surface is considered unsolderable when the intermetallic compounds replaces tin at the surface. Therefore, the plating might fail even when average intermetallic compound thickness is far below the plating thickness.
  • a further disadvantage of the thick matte tin or tin-lead alloy layer is the cost of the tin itself and the costs of running the tin plating process. As the tin plating process is expensive, it would be advantageous to provide a thinner layer of tin overall. Another type of tin plating is a brightened tin layer. Another problem that exists because of the thick bright tin or tin-lead alloy layer is the high organic content of the plating which causes embrittlement (cracking) and loss of solderability due to outgassing during the soldering process. Because of these disadvantages, it is difficult or not possible to use thick bright tin as a solderable coating.
  • the invention is directed to a substrate being made of a conductive material and having tin coating applied to the surface thereof.
  • the tin layer comprises a first layer of bright tin with a second layer of solderable tin applied thereover.
  • the invention is further directed to a method of preparing a substrate with an outer tin layer wherein the outer tin layer provides good solderability.
  • the method comprising first applying a first layer of bright tin to the substrate, applying a second layer of solderable tin to the surface of the bright tin.
  • the invention is suitable for preparing contact terminal wherein the terminal includes a main body having a solderable portion and being made from a conductive material, and a tin layer disposed over the main body, the tin layer comprising a first layer of > bright tin and a second layer of solderable tin applied thereover.
  • the invention is also directed to a method of preparing a substrate having good solderability characteristics, the substrate having a tin layer, the substrate being made from copper or copper alloy.
  • the method comprising first electroplating the substrate with bright tin to a thickness of approximately 1 ⁇ in
  • the invention is further directed toward a method for preparing a substrate having good solderability characteristics.
  • the method involves the use of depositing a tin layer on the substrate in such a way as to level the growth of intermetallic compounds between the substrate and the tin layer. Then forming a matte tin layer over the first tin layer.
  • a tin plating layer is obtained on an underlying metallic substrate providing good solderability using the present invention while using a thinner layer than typically is used in the industry.
  • the invention is obtained by first providing a layer of bright tin, or bright tin which has had an alloying element added thereto, on the metallic substrate followed by a layer of solderable tin such as matte tin, or semi-bright (satin) tin.
  • the present invention is not limited to such configuration.
  • the present invention may be used on any metallic substrate which is to be formed or used in some other manner. It is shown that brighteners have a leveling affect on the intermetallic compound growth, particularly at lower temperatures (room temperature to 50°C) . Use of brighteners at higher than recommended concentrations leads to further decreases in both intermetallic compound growth rates and irregularity of the intermetallic compound layer. The effect at room temperature was the largest .
  • the substrate first has a layer of bright tin applied to the surface of the substrate.
  • Bright tin is applied to the solder tail of the contact or the substrate using commercially available plating baths.
  • Bright tin includes organic materials in the plating bath which causes the grain size of the deposited tin to be very small, typically below 40 ⁇ in (l ⁇ m) . This makes the finished surface appear shiny or bright.
  • the bright tin/copper interface typically produces a uniform layer of intermetallic compounds .
  • the organics within the bright tin tend to segregate at the grain boundaries in the layer thereby slowing down the growth of the intermetallic compound.
  • the addition of brighteners to the tin levels the intermetallic compound growth because the brighteners segregate to grain boundaries of the tin microstructure and block the growth of the intermetallic compounds which occurs at lower temperatures primarily through the grain boundaries.
  • the bright tin layer may not provide a good surface for soldering because the organics within the bright tin could form a tarnish on the surface. Also, the organics might outgass during the soldering process, causing defects, particularly in cases having a thick layer of bright tin. Furthermore, bright tin is not very ductile and would tend to crack during a forming operation. >
  • a layer of matte tin is deposited on top of the bright tin layer.
  • Matte tin is deposited using various commercially available plating baths. Matte tin produces a layer of tin having a larger grain size than that of bright tin, thereby forming the matte look or finish of the surface.
  • the grain size for matte tin typically is 40-400 ⁇ in (1-10 microns) .
  • a layer of satin tin could be deposited over the bright tin. Satin tin also provides a good, solderable surface.
  • the bright tin layer acts as a barrier to the irregular intermetallic compound growth so that the intermetallic compounds cannot rapidly reach through to the surface of the matte tin. Furthermore, the matte tin covers up the organics from the bright tin layer thereby allowing the surface to be soldered.
  • satin tin When satin tin is used, the layer of bright tin inhibits the growth of the intermetallic compounds so that the layer of satin tin can provide a good solderable surface.
  • Table I below is a table showing the soldering results from four samples after room temperature aging for two years, Table I.
  • the test for the solderability results is an industry standard and is known generally in the art, J-STD-002 and will not be further described herein.
  • the substrate In order to pass the solderability results, the substrate must have 95% coverage of solder.
  • the approximate thicknesses of the different tin layers were deposited and then the actual total thickness of the combined tin layers were measured. The actual thickness is less than the combined approximate thicknesses because of variations in the plating process. Table I
  • a substrate having a total thickness of as little as 75 microinches passes the solderbility test, this is as opposed to the 150-250 microinches needed for pure matte tin.
  • the plating described above has the advantage that less tin can be used to plate these substrates while still creating a good surface that can be soldered.
  • Lead is often added to bright tin to prevent whisker formation or the formation of tin pest. Whisker formation occurs because of crystal growth from the tin which extends out from the surface of the bright tin. Tin pest occurs in cold temperatures wherein the tin crystalline structure undergoes a transformation that causes the disintegration of the tin layer. Lead is added to prevent both whisker growth and tin pest formation. It has been found that the use of a bright tin layer having a small amount of lead added followed by a matte layer allows easy soldering while decreasing the amount of total plating thickness necessary. The substrate is first plated in a bright tin plating bath having 10 to 40% lead added therein.
  • the total lead is about 3 wt%, and for 10 ⁇ in of bright tin and 80 ⁇ in of matte tin, the total lead content is about 1 wt%. This reduction of lead content in the deposit is important in considering that lead is toxic. >
  • a bright tin layer under a matte tin layer can be used to reduce the total plating thickness of tin on the substrate while still giving a surface that produces good solderability results.
  • These results can be achieved by either using a layer of bright tin followed by a layer of matte tin, or alternatively, using a layer of bright tin with lead followed by a layer of matte tin.
  • the use of bright tin with lead allows for less total thickness of tin while still providing good solderability.
  • the bright tin layer can be followed by a layer of se i- bright tin (satin tin) . Both matte tin and semi-bright tin form solderable surfaces.
  • the layers of tin could be applied using some other conventional method such as vacuum deposition, chemical sputtering, molten tin, electroless tin plating, or some other method for coating tin on a substrate.
  • a standard procedure in tin plating of contacts is to first apply a nickel layer before applying the layer of tin. Using the methods described above, it is not necessary to first apply a nickel layer.
  • the bright tin layer or the bright tin with lead layer can be applied directly to the copper substrate without an underlying nickel layer.
  • other elements can be added to the bright tin layer to block the formation of intermetallic compounds between the tin and the underlying substrate. Since lead is typically added to prevent tin pest and whisker formation, other elements which are added to prevent tin pests and whisker formation can be added to the bright tin layer as an additive to inhibit intermetallic compound growth and formation. Elements that are typically added to inhibit tin pests and whisker formation are Bi, Ag, Cu, Sb, Co, Ge, Au, Ni, Cd, Zn, Se, Te, Ga, Mg, and Hg.
  • the addition of a small amount of bismuth to the brightened tin layer significantly reduces the intermetallic compound growth.
  • a small amount of bismuth 0.25wt%
  • the thickness of the tin copper intermetallic compounds is reduced by more than 50% when compared to the intermetallic compounds in the substrate that was plated with semi-bright tin-lead.
  • the thickness of the tin copper intermetallic compounds is reduced by more than 60% when compared to a substrate that is plated with bright tin.
  • the intermetallic compounds' average thickness would be in the range of l ⁇ m (40 ⁇ m) to 1.6 ⁇ m (64 ⁇ in) for electroplated tin or tin-lead; it is just 0.65 ⁇ m (2 ⁇ in) for tin-bismuth (0.25wt% Bi) .
  • the layer of bright tin with bismuth can be relatively thin and the substrate can then have a relatively thin layer of matte tin applied thereover.
  • the matte tin layer will be solderable because the intermetallic compounds are prevented from reaching the surface of the matte tin layer because of the suppression of the intermetallic compounds by the bismuth within the bright tin layer.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un substrat formé d'un matériau conducteur et dont la surface est étamée. L'étamage se compose d'une première couche d'étain brillant sur laquelle est appliquée une seconde couche d'étain mat. L'invention concerne en outre un procédé permettant de produire le substrat décrit ci-dessus.
PCT/US1998/015755 1997-07-30 1998-07-30 Etamage a deux couches se pretant au soudage Ceased WO1999006612A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU86707/98A AU8670798A (en) 1997-07-30 1998-07-30 Two layer solderable tin coating

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US5418197P 1997-07-30 1997-07-30
US60/054,181 1997-07-30
US12413498A 1998-07-29 1998-07-29
US09/124,134 1998-07-29

Publications (1)

Publication Number Publication Date
WO1999006612A1 true WO1999006612A1 (fr) 1999-02-11

Family

ID=26732738

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/015755 Ceased WO1999006612A1 (fr) 1997-07-30 1998-07-30 Etamage a deux couches se pretant au soudage

Country Status (2)

Country Link
AU (1) AU8670798A (fr)
WO (1) WO1999006612A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007002424A1 (fr) * 2005-06-24 2007-01-04 Technic, Inc. Couche de protection d’argent pour minimiser la croissance de points de contact dans les électrodépôts d’étain
WO2007008369A1 (fr) * 2005-07-11 2007-01-18 Technic, Inc. Dépôts électrolytiques d’étain présentant des propriétés ou des caractéristiques qui minimisent l'augmentation de barbes d'étain
EP1477587A3 (fr) * 2003-05-12 2007-04-04 Rohm and Haas Electronic Materials, L.L.C. Méthode ameliorée pour la déposition d'étain
US20100314157A1 (en) * 2008-05-19 2010-12-16 Phoenix Contact Gmbh & Co. Kg Contact unit and method for producing a contact unit
EP2738290A1 (fr) * 2011-08-30 2014-06-04 Rohm and Haas Electronic Materials LLC Promotion de l'adhérence de bronze blanc exempt de cyanure
WO2015002690A1 (fr) * 2013-07-05 2015-01-08 The Boeing Company Procédés et appareils pour atténuer la croissance de barbes d'étain sur des surfaces en étain ou plaquées à l'étain par dopage de l'étain au germanium
WO2015002691A1 (fr) * 2013-07-05 2015-01-08 The Boeing Company Procédés et appareils pour atténuer la croissance de barbe d'étain sur des surfaces d'étain et étamées par dopage de l'étain par de l'or

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3498823A (en) * 1967-07-11 1970-03-03 Itt Electroless tin plating on electroless nickel
US3652234A (en) * 1969-05-20 1972-03-28 Nat Steel Corp Silvery-tone matte-finish flash coat alloy product
US4118289A (en) * 1973-06-28 1978-10-03 Minnesota Mining And Manufacturing Company Tin/lead plating bath and method
US4661215A (en) * 1984-06-01 1987-04-28 Feindrahtwerk Adolf Edelhoff Gmbh & Co. Process for the production of tin-plated wires
DE3821073A1 (de) * 1987-07-07 1989-01-19 Orion Radio Verfahren zum galvanischen beschichten von aus aluminium oder aluminiumlegierungen gefertigten gegenstaenden mit einem vorzugsweise loetbaren metallueberzug

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3498823A (en) * 1967-07-11 1970-03-03 Itt Electroless tin plating on electroless nickel
US3652234A (en) * 1969-05-20 1972-03-28 Nat Steel Corp Silvery-tone matte-finish flash coat alloy product
US4118289A (en) * 1973-06-28 1978-10-03 Minnesota Mining And Manufacturing Company Tin/lead plating bath and method
US4661215A (en) * 1984-06-01 1987-04-28 Feindrahtwerk Adolf Edelhoff Gmbh & Co. Process for the production of tin-plated wires
DE3821073A1 (de) * 1987-07-07 1989-01-19 Orion Radio Verfahren zum galvanischen beschichten von aus aluminium oder aluminiumlegierungen gefertigten gegenstaenden mit einem vorzugsweise loetbaren metallueberzug

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Derwent World Patents Index; *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1477587A3 (fr) * 2003-05-12 2007-04-04 Rohm and Haas Electronic Materials, L.L.C. Méthode ameliorée pour la déposition d'étain
US7695605B2 (en) 2003-05-12 2010-04-13 Rohm And Haas Electronic Materials Llc Tin plating method
WO2007002424A1 (fr) * 2005-06-24 2007-01-04 Technic, Inc. Couche de protection d’argent pour minimiser la croissance de points de contact dans les électrodépôts d’étain
WO2007008369A1 (fr) * 2005-07-11 2007-01-18 Technic, Inc. Dépôts électrolytiques d’étain présentant des propriétés ou des caractéristiques qui minimisent l'augmentation de barbes d'étain
US20100314157A1 (en) * 2008-05-19 2010-12-16 Phoenix Contact Gmbh & Co. Kg Contact unit and method for producing a contact unit
US8487183B2 (en) * 2008-05-19 2013-07-16 Phoenix Contact Gmbh & Co. Kg Contact unit and method for producing a contact unit
EP2738290A1 (fr) * 2011-08-30 2014-06-04 Rohm and Haas Electronic Materials LLC Promotion de l'adhérence de bronze blanc exempt de cyanure
US9145617B2 (en) 2011-08-30 2015-09-29 Rohm And Haas Electronic Materials Llc Adhesion promotion of cyanide-free white bronze
WO2015002690A1 (fr) * 2013-07-05 2015-01-08 The Boeing Company Procédés et appareils pour atténuer la croissance de barbes d'étain sur des surfaces en étain ou plaquées à l'étain par dopage de l'étain au germanium
WO2015002691A1 (fr) * 2013-07-05 2015-01-08 The Boeing Company Procédés et appareils pour atténuer la croissance de barbe d'étain sur des surfaces d'étain et étamées par dopage de l'étain par de l'or
US10260159B2 (en) 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold

Also Published As

Publication number Publication date
AU8670798A (en) 1999-02-22

Similar Documents

Publication Publication Date Title
CA1218201A (fr) Alliages de cuivre a duree utile accrue de soudabilite apres stockage
JP3880877B2 (ja) めっきを施した銅または銅合金およびその製造方法
US5780172A (en) Tin coated electrical connector
US6646330B2 (en) Lead frame for semiconductor device, process for producing the same and semiconductor device using the same
US6495001B2 (en) Method for manufacturing a metallic composite strip
US7808109B2 (en) Fretting and whisker resistant coating system and method
US6083633A (en) Multi-layer diffusion barrier for a tin coated electrical connector
EP2045362A1 (fr) Matériau plaqué, son procédé de fabrication et pièce électronique l'utilisant
US6613451B1 (en) Metallic material
JP2726434B2 (ja) ＳｎまたはＳｎ合金被覆材料
JPH11350188A (ja) 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
JP2009057630A (ja) Ｓｎメッキ導電材料及びその製造方法並びに通電部品
JP4086949B2 (ja) 金属被覆部材
JP2801793B2 (ja) 錫めっき銅合金材およびその製造方法
US6641930B2 (en) Electrically conductive metal tape and plug connector
US8389854B2 (en) Metal strip, connector, and method of manufacturing metal strip
WO1999006612A1 (fr) Etamage a deux couches se pretant au soudage
US9520347B2 (en) Lead frame construct for lead-free solder connections
US20080261071A1 (en) Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components
JP2670348B2 (ja) ＳｎまたはＳｎ合金被覆材料
US7189630B2 (en) Layer sequence for producing a composite material for electromechanical components
US20210218171A1 (en) Copper strip for making electrical contacts and process for producing a copper strip and connector
KR100467896B1 (ko) 구리기판,주석피복층및전기도금된차단층을포함하는피복재
JP2006161127A (ja) 嵌合型接続端子に適した電子材料とその製造方法
JP2798512B2 (ja) 錫めっき銅合金材およびその製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM HR HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: KR

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: CA

122 Ep: pct application non-entry in european phase