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WO1999049996A1 - Appareil et procede de distribution de fluides pulses - Google Patents

Appareil et procede de distribution de fluides pulses Download PDF

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Publication number
WO1999049996A1
WO1999049996A1 PCT/US1999/006258 US9906258W WO9949996A1 WO 1999049996 A1 WO1999049996 A1 WO 1999049996A1 US 9906258 W US9906258 W US 9906258W WO 9949996 A1 WO9949996 A1 WO 9949996A1
Authority
WO
WIPO (PCT)
Prior art keywords
recited
fluid
processing vessel
ballast tanks
conduit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/006258
Other languages
English (en)
Inventor
Jerome C. Barton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California Berkeley
University of California San Diego UCSD
Original Assignee
University of California Berkeley
University of California San Diego UCSD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/243,191 external-priority patent/US6085762A/en
Application filed by University of California Berkeley, University of California San Diego UCSD filed Critical University of California Berkeley
Priority to JP2000540950A priority Critical patent/JP2002509800A/ja
Priority to AU35458/99A priority patent/AU3545899A/en
Priority to CA002326810A priority patent/CA2326810A1/fr
Priority to EP99917306A priority patent/EP1082182A4/fr
Publication of WO1999049996A1 publication Critical patent/WO1999049996A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/267—Heterocyclic compounds

Definitions

  • This invention relates to an apparatus and a method for providing pulsed fluids. It is
  • electrically conductive ion implant gates of an electrically conductive barrier layer such as
  • silicon dioxide silicon dioxide
  • silicon nitride or metal is first deposited upon a substrate such as a silicon or
  • gallium arsenide wafer by any of several suitable processes such as thermal oxidation, chemical oxidation, chemical oxidation, chemical oxidation, chemical oxidation, chemical oxidation, and physical oxidation.
  • material is applied to the wafer by any suitable means including, but not limited to, spinning of
  • the wafer to distribute liquid photoresist evenly on the surface of the wafer.
  • photoresist coated wafer are selectively exposed to high energy light such as high intensity
  • the photoresist materials are selectively removed for exposing selected portions of the barrier
  • the wafer is "hard
  • the exposed substrate and/or barrier material is then etched (removed) by any of several suitable means
  • dry etching plasma etching, sputter etching or reactive-ion etching processes may be used.
  • the wafer having on its surface the pattern of barrier layer material coated with
  • photoresist material is then treated in an aggressive step to remove the hard baked
  • photoresist material from the remaining pattern of barrier layer material. This has traditionally been
  • photoresist removal solvents are removed from the wafer surface. This photolithographic
  • reaction sites or surfaces to be treated with those fluids and, more particularly, there is a need for
  • photoresist materials used in the manufacture of integrated circuits or other electronic
  • components such as circuit boards, optical waveguides and flat panel displays.
  • to pressure vessels or reaction sites comprises: at least one reservoir for the fluid to be pulsed;
  • valved conduits connecting the reservoir to a pumping means; a conduit with at least one control
  • each of the ballast tanks to a control and injection valve which injects fluid from the conduits
  • contacted with the pulsed fluid are contacted with the fluid.
  • a conduit from the high pressure processing vessel can be used for recycling the processing fluid.
  • Conduits can be provided from the separator vessel, secondary processing vessel or
  • Figure 1 is a schematic diagram of an invention apparatus employed for contacting
  • Figure 2 is a schematic of an invention apparatus for providing pulsed fluid to a pressure
  • the present invention comprises: at least one reservoir for the fluid; valved conduits
  • ballast tanks to a control and injection valve which injects fluid from the conduits from each of
  • ballast tanks into a processing vessel where the reaction sites or material to be treated is
  • supercritical fluid mixture is used for removing photoresist materials from the surface of a substrate, then a high pressure processing vessel and pumps capable of producing and
  • the feedstock fluid, or fluid mixture, as well as any contaminants picked up are desired, as well as any contaminants picked up
  • a conduit from the processing vessel can be connected
  • separator vessel a multi-unit separator vessel, or more than one separator vessel connected
  • contaminant materials in it can be processed in any of several ways, depending upon the products
  • a single separator vessel could be used to contain the mixture while
  • a separator vessel or compartment of a separator vessel can be used
  • the dense phase fluid (then in a gas phase) is recondensed to liquid and reused in the process.
  • the dense phase fluid modifier and photoresist are described in detail below.
  • a multi-unit separator vessel is used to first adjust
  • conduits are provided whereby the dense phase fluid modifier can be directed to a
  • conduits are also provided as needed as means for the vaporized
  • ballast tanks needed is that number sufficient to render the
  • invention apparatus is particularly useful for removing hard baked photoresist materials from
  • barrier material and hard baked photoresist material which has protected the conductive barrier
  • the hard baked photoresist material is removed by contacting it
  • Dense phase fluid in a liquid state is most conveniently used as a starting component, but
  • pressure and temperature will depend upon which dense phase fluid is used.
  • Dense phase fluids which are useful for this purpose are generally those in which the
  • dense phase fluid modifiers include, but are not limited to,
  • R 1 , R 3 , and R 4 are substituents selected from the group of hydrogen, hydrocarbon
  • Rstrich R 2 , R 3 , and R 4 can be the same or different
  • R protest R 2 , R 3 , and R 4 are substituents selected from the group of hydrogen, hydrocarbon
  • R, R 2 , R 3 , and R 4 can be the same or different
  • the cyclic ethers are generally considered more useful because there is less likelihood of
  • Presently preferred dense phase fluid modifiers include, but are not limited to, propylene
  • Dense phase fluid modifiers which are completely soluble in the selected dense phase
  • photoresist polymer to the extent necessary for removal of the photoresist material is needed.
  • supercritical phase of solvent is prepared by combining selected amounts of each of the
  • propylene carbonate is selected as the dense phase fluid modifier, a pressure of at least 1080 psi
  • the substrates having patterned coatings of electrically conductive barrier material
  • hard baked photoresist material can be first contacted with the selected invention composition
  • coated substrates are then contacted by sequenced pressure driven pulses of the
  • pressure sequences are generally pulses of fluid at high pressures followed intersticially by
  • the dense phase fluid and propylene carbonate as the dense phase fluid modifier are high pressure
  • pulses of fluid in the range from about 2,000 to about 4,000 psi.
  • the photoresist removal fluid is generally at
  • supercritical fluid causes the hard baked photoresist material to soften and debond from the
  • photoresist materials are dissolved and washed away from the coated substrate by the
  • a final rinse of the substrate can be made with
  • ballast tanks is employed to remove photoresist material from coated substrates is shown
  • a conduit 14 connects the dense phase fluid reservoir J_0 with a control valve 18 which
  • control valve 18 is connected by a conduit 20 to a high pressure pump
  • control valve 18 also can be used for purposes of dispensing unmodified dense phase
  • the high pressure pump 24 has the capability of producing the desired fluid pressure
  • the wafers to be treated are positioned and held in a high pressure process vessel 54 by
  • the wafers can be attached to a shelf which is suspended in the
  • the high pressure process vessel 54 is isolated and depressurized for placing wafers into
  • a first soaking step may be employed to soften and begin dissolution of the photoresist
  • the high pressure pump 24 is used to pump an
  • the high pressure processing vessel 54 is maintained at sufficiently high
  • the wafers are allowed to soak in the static supercritical mixture in
  • the high pressure pump 24 is then employed to pump the selected invention mixture of
  • control valve 28 Three different contacts in the control valve 28 can be electronically activated to
  • Each of the three conduits 30, 32 and 34 are connected to one of three ballast tanks 36, 3 5
  • ballast tanks being fully pressurized
  • ballast tank 3_8 pressurized fluid from ballast tank 3_8 is simultaneously
  • ballast tank 40 may be getting pressurized
  • ballast tank 40 may be getting released from ballast tank 40 through conduit 46 into the multiport control valve
  • the supercritical fluid mixture is pumped at high pressure pulses alternating with low
  • the length of the pressure pulses is the time necessary to reduce the amount of
  • pressure process vessel 54 is then conducted away from the high pressure process vessel 54 after
  • the substrates with photoresist coating are treated with pulses of invention single phase
  • phase fluid modifier a period of at least about a minute generally is needed. A period of time
  • conduit 60 conducted away from the high pressure process vessel 54 through conduit 60 having thereon a
  • valve 62 is transported by conduit 64 into a separator vessel 66.
  • the separator vessel 66 can be in any suitable configuration needed to separate the dense
  • One example of a useful separator vessel 66 is a three-stage multistage separation
  • the separator vessel 66 is
  • the separator vessel 66 is maintained at a temperature in the range from about 0 °C to
  • the decrease in pressure causes the supercritical or subcritical component of the dense
  • phase fluid mixture to separate and leave the separator vessel 66 as a gas through a conduit 68.
  • the conduit 68 empties the gas phase fluid into a condenser 70 where the gas phase fluid is
  • the liquefied dense phase fluid can then be returned through conduit 72 to the dense
  • phase fluid reservoir K for reuse in the invention process if desired.
  • phase fluid can be removed from the reactor loop.
  • the dense phase fluid modifier can be incorporated in the separator vessel 66.
  • the dense phase fluid modifier can be incorporated in the separator vessel 66.
  • conduit 74 the dense phase fluid modifier with dissolved photoresist
  • the substrate with the electrically conductive pattern on it is washed with deionized water to
  • the invention apparatus and method are suitable for or easily modified for a large number
  • equipment was set up in the manner shown in the schematic of Figure 2.
  • Carbon dioxide was used as the dense phase fluid and propylene carbonate was used as the dense phase fluid.
  • conduit 17 between the syringe pump 5_ and the ballast tank 2 . had a pressure relief valve 19.
  • conduit 23 connected the ballast tank 21 to a DUR-O-LOKTM quick opening high pressure filter
  • the modified vessel was recertified to meet A.S.M.E. Code, Sec. VIII,
  • a positioning fixture was designed for holding the silicon wafers in the cleaning vessel
  • the wafer positioning fixture was a stainless steel disc of approximately 2 inches in
  • the active volume of the cleaning vessel 27 was approximately 320 cc.
  • the high pressure input through conduit 23 to the cleaning vessel 27 was positioned to
  • thermocouple 3_1 thermocouple 3_1 , pressure vent valve 33 and pressure relief
  • valve 35 were installed on the quick opening high pressure filter housing being modified to serve
  • High pressure tubing (304 stainless steel rigid tubing and SwagelokTM flexible teflon bore
  • the high pressure filter housing which was modified to serve as the surge tank 41 had a
  • the carbon dioxide and propylene carbonate mixture was flowed into the system and
  • the resulting pressure was approximately 900 psi and the fill took about two full minutes.
  • the invention apparatuses and processes can be used for removing photoresist materials
  • the invention apparatuses and processes can also be used to fabricat semiconductor chips and wafers.
  • the invention apparatuses and processes can also be used to fabricat semiconductor chips and wafers.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

L'invention concerne un système de distribution de fluides pulsés vers des cuves sous pression (54) qui comprend au moins un réservoir (10, 12) pour le fluide à pulser, des conduits à soupapes (14, 16, 20) reliant le réservoir à au moins une pompe (24), un conduit (26) pourvu de soupapes de commande (28) à partir de la pompe (24) vers un ou plusieurs ballasts (36, 38, 40) équipés de soupapes de commande (28) capables de diriger de manière séquentielle ou intermittente un flux de fluide dans chaque ballast (36, 38, 40), des conduits (42, 44, 46) à partir de chaque ballast vers une soupape de commande (48) et une soupape d'injection (50) qui injecte du fluide en provenance des conduits (42, 44, 46) à partir de chaque ballast (36, 38, 40) dans une cuve de traitement (54) à haute pression dans laquelle les matériaux à mettre en contact avec le fluide pulsé sont effectivement mis en contact avec ledit fluide. Afin de recycler le fluide de traitement, un conduit (60, 64) s'étendant de la cuve de traitement (54) à haute pression peut être connecté à une cuve de séparation (66), à une cuve complémentaire de traitement ou à une cuve de stockage.
PCT/US1999/006258 1998-03-30 1999-03-22 Appareil et procede de distribution de fluides pulses Ceased WO1999049996A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000540950A JP2002509800A (ja) 1998-03-30 1999-03-22 脈動した流体を供給するための装置および方法
AU35458/99A AU3545899A (en) 1998-03-30 1999-03-22 Apparatus and method for providing pulsed fluids
CA002326810A CA2326810A1 (fr) 1998-03-30 1999-03-22 Appareil et procede de distribution de fluides pulses
EP99917306A EP1082182A4 (fr) 1998-03-30 1999-03-22 Appareil et procede de distribution de fluides pulses

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US7991998P 1998-03-30 1998-03-30
US60/079,919 1998-03-30
US09/243,191 1999-02-02
US09/243,191 US6085762A (en) 1998-03-30 1999-02-02 Apparatus and method for providing pulsed fluids

Publications (1)

Publication Number Publication Date
WO1999049996A1 true WO1999049996A1 (fr) 1999-10-07

Family

ID=26762567

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/006258 Ceased WO1999049996A1 (fr) 1998-03-30 1999-03-22 Appareil et procede de distribution de fluides pulses

Country Status (7)

Country Link
EP (1) EP1082182A4 (fr)
JP (1) JP2002509800A (fr)
KR (1) KR100557247B1 (fr)
CN (1) CN1127381C (fr)
AU (1) AU3545899A (fr)
CA (1) CA2326810A1 (fr)
WO (1) WO1999049996A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001066214A1 (fr) * 2000-03-03 2001-09-13 Boehringer Ingelheim Pharmaceuticals, Inc. Procedure d'extraction et reaction avec utilisation de fluides supercritiques
US6602349B2 (en) 1999-08-05 2003-08-05 S.C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces
US6612317B2 (en) 2000-04-18 2003-09-02 S.C. Fluids, Inc Supercritical fluid delivery and recovery system for semiconductor wafer processing
US7195676B2 (en) 2004-07-13 2007-03-27 Air Products And Chemicals, Inc. Method for removal of flux and other residue in dense fluid systems
US7211553B2 (en) 2003-08-05 2007-05-01 Air Products And Chemicals, Inc. Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols
US7267727B2 (en) 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI270626B (en) * 2002-04-23 2007-01-11 Display Mfg Service Co Ltd Wet processing bath and fluid supplying system for liquid crystal display manufacturing equipment
KR100831402B1 (ko) * 2006-05-08 2008-05-22 주식회사 지에스하이텍 기판 세정용 고압의 세정액 공급장치
US8224481B2 (en) * 2009-01-19 2012-07-17 Access Business Group International Llc Method and apparatus for dispensing fluid compositions

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* Cited by examiner, † Cited by third party
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US3175569A (en) * 1961-12-28 1965-03-30 Sperry Rand Corp Pure fluid pulse generator
US3302398A (en) * 1963-06-25 1967-02-07 Bendix Corp Fluid pulse control
US3437099A (en) * 1965-10-22 1969-04-08 Sperry Rand Corp Pulse generator
US3568702A (en) * 1969-03-07 1971-03-09 Nasa Pneumatic oscillator
US3576294A (en) * 1969-02-26 1971-04-27 Bendix Corp Fluidic cleansing device
US3799205A (en) * 1966-07-18 1974-03-26 Us Army Fluid oscillators
US3885591A (en) * 1973-06-14 1975-05-27 Automatic Switch Co Tunable fluidic oscillator
US4570675A (en) * 1982-11-22 1986-02-18 General Electric Company Pneumatic signal multiplexer
US4622996A (en) * 1985-03-14 1986-11-18 Donaldson Company, Inc. Aspirator for pulse-jet air cleaner
US4874016A (en) * 1989-02-28 1989-10-17 Allied-Signal Inc. Method for improving signal-to-noise ratios in fluidic circuits and apparatus adapted for use therewith
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US4923374A (en) * 1986-11-28 1990-05-08 Svenska Rotor Maskiner Ab Method for producing pressure pulses in a mass of gas and a device for performing the method
US5082502A (en) * 1988-09-08 1992-01-21 Cabot Corporation Cleaning apparatus and process
US5195560A (en) * 1992-04-27 1993-03-23 Muchlis Achmad Adjustable low frequency hydrofluidic oscillator
US5273590A (en) * 1991-12-18 1993-12-28 The Babcock & Wilcox Company Pressure pulse cleaning for adsorption tower distributors
US5507305A (en) * 1986-04-21 1996-04-16 Franklin; Robert V. Cleaning apparatus and method
US5514220A (en) * 1992-12-09 1996-05-07 Wetmore; Paula M. Pressure pulse cleaning
US5595201A (en) * 1994-12-05 1997-01-21 Dober Chemical Co. Apparatus and methods for automatically cleaning multiple pieces of equipment
US5647386A (en) * 1994-10-04 1997-07-15 Entropic Systems, Inc. Automatic precision cleaning apparatus with continuous on-line monitoring and feedback
US5819801A (en) * 1995-12-22 1998-10-13 Festo Kg Method and device for producing periodical impulse changes in a fluid flow
US5882589A (en) * 1994-06-03 1999-03-16 Leon Shipper Sealed endoscope decontamination, disinfection and drying device

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* Cited by examiner, † Cited by third party
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US3175569A (en) * 1961-12-28 1965-03-30 Sperry Rand Corp Pure fluid pulse generator
US3302398A (en) * 1963-06-25 1967-02-07 Bendix Corp Fluid pulse control
US3437099A (en) * 1965-10-22 1969-04-08 Sperry Rand Corp Pulse generator
US3799205A (en) * 1966-07-18 1974-03-26 Us Army Fluid oscillators
US3576294A (en) * 1969-02-26 1971-04-27 Bendix Corp Fluidic cleansing device
US3568702A (en) * 1969-03-07 1971-03-09 Nasa Pneumatic oscillator
US3885591A (en) * 1973-06-14 1975-05-27 Automatic Switch Co Tunable fluidic oscillator
US4570675A (en) * 1982-11-22 1986-02-18 General Electric Company Pneumatic signal multiplexer
US4622996A (en) * 1985-03-14 1986-11-18 Donaldson Company, Inc. Aspirator for pulse-jet air cleaner
US5507305A (en) * 1986-04-21 1996-04-16 Franklin; Robert V. Cleaning apparatus and method
US4923374A (en) * 1986-11-28 1990-05-08 Svenska Rotor Maskiner Ab Method for producing pressure pulses in a mass of gas and a device for performing the method
US4921662A (en) * 1988-04-19 1990-05-01 Westinghouse Electric Corp. Pressure pulse cleaning method
US5082502A (en) * 1988-09-08 1992-01-21 Cabot Corporation Cleaning apparatus and process
US4874016A (en) * 1989-02-28 1989-10-17 Allied-Signal Inc. Method for improving signal-to-noise ratios in fluidic circuits and apparatus adapted for use therewith
US5273590A (en) * 1991-12-18 1993-12-28 The Babcock & Wilcox Company Pressure pulse cleaning for adsorption tower distributors
US5195560A (en) * 1992-04-27 1993-03-23 Muchlis Achmad Adjustable low frequency hydrofluidic oscillator
US5514220A (en) * 1992-12-09 1996-05-07 Wetmore; Paula M. Pressure pulse cleaning
US5882589A (en) * 1994-06-03 1999-03-16 Leon Shipper Sealed endoscope decontamination, disinfection and drying device
US5647386A (en) * 1994-10-04 1997-07-15 Entropic Systems, Inc. Automatic precision cleaning apparatus with continuous on-line monitoring and feedback
US5595201A (en) * 1994-12-05 1997-01-21 Dober Chemical Co. Apparatus and methods for automatically cleaning multiple pieces of equipment
US5819801A (en) * 1995-12-22 1998-10-13 Festo Kg Method and device for producing periodical impulse changes in a fluid flow

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1082182A4 *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294194B1 (en) 1997-10-14 2001-09-25 Boehringer Ingelheim Pharmaceuticals, Inc. Method for extraction and reaction using supercritical fluids
US6610624B2 (en) 1997-10-14 2003-08-26 Boehringer Ingelheim Pharmaceuticals, Inc. Method for enhancing catalytic activity with supercritical fluids
US6602349B2 (en) 1999-08-05 2003-08-05 S.C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces
WO2001066214A1 (fr) * 2000-03-03 2001-09-13 Boehringer Ingelheim Pharmaceuticals, Inc. Procedure d'extraction et reaction avec utilisation de fluides supercritiques
CZ300371B6 (cs) * 2000-03-03 2009-05-06 Boehringer Ingelheim Pharmaceuticals, Inc. Zpusob extrakce
US6612317B2 (en) 2000-04-18 2003-09-02 S.C. Fluids, Inc Supercritical fluid delivery and recovery system for semiconductor wafer processing
US7267727B2 (en) 2002-09-24 2007-09-11 Air Products And Chemicals, Inc. Processing of semiconductor components with dense processing fluids and ultrasonic energy
US7211553B2 (en) 2003-08-05 2007-05-01 Air Products And Chemicals, Inc. Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols
US7195676B2 (en) 2004-07-13 2007-03-27 Air Products And Chemicals, Inc. Method for removal of flux and other residue in dense fluid systems

Also Published As

Publication number Publication date
KR100557247B1 (ko) 2006-03-07
JP2002509800A (ja) 2002-04-02
EP1082182A1 (fr) 2001-03-14
CN1127381C (zh) 2003-11-12
CA2326810A1 (fr) 1999-10-07
AU3545899A (en) 1999-10-18
CN1295503A (zh) 2001-05-16
EP1082182A4 (fr) 2005-04-27
KR20010074464A (ko) 2001-08-04

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